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Features Complete programmable control I2CTM-bus Selectable CMOS
Top Searches for this datasheetFS6131-01/FS6131-01g Programmable Line Lock Clock Generator Features Complete programmable control I2CTM-bus Selectable CMOS PECL compatible outputs External feedback loop capability allows genlocking Tunable VCXO loop jitter attenuation Description FS6131-01 monolithic CMOS clock generator/regenerator designed minimize cost component count variety electronic systems. I2C-bus interface, FS6131-01 adapted many clock generation requirements. ability tune on-board voltage-controlled crystal oscillator (VCXO), length reference feed-back dividers, their granularity, flexibility post divider make FS6131-01 most flexible stand-alone phase-locked loop (PLL) clock generator available. Applications Frequency synthesis Line-locked genlock applications Clock multiplication Telecom jitter attenuation ADDR XOUT XTUNE CLKN CLKP EXTLF LOCK/IPRG FS6131 16-pin 0.150" SOIC Figure Configuration Semiconductor Rev. 2.0, Jun. www.amis.com FS6131-01/FS6131-01g Programmable Line Lock Clock Generator LFTC XTUNE (optional) XCT[3:0], XLVTEN Control VCXO Divider XLROM[2:0] XLPDEN, XLSWAP CRYSTAL LOOP XLCP[1:0] VCXO XOUT (optional) Internal Loop Filter EXTLF STAT[1:0] PhaseFrequency Detector EXTLF (optional) Charge Pump DOWN Lock Detect REFDIV[11:0] CMOS POST3[1:0] POST2[1:0] POST1[1:0] LOCK/ IPRG (optional) REFDSRC (fREF) Reference Divider (NR) MLCP[1:0] PDREF VCOSPD, OSCTYPE PDFBK PhaseFrequency Detector Charge Pump DOWN Voltage Controlled Oscillator Clock Gobbler Post Divider (NPx) CMOS/PECL Output CLKP (fCLK) CLKN OUTMUX[1:0] ADDR Feedback Divider (NF) Interface Registers FBKDIV[13:0] FBKDSRC[1:0] (fVCO) MAIN LOOP FS6131 Figure Block Diagram Table Descriptions Key: analog input; analog output; digital input; input with internal pull-up; input with internal pull-down; digital input/output; DI-3 three-level digital input, digital output; power/ground; active Type Name ADDR XOUT XTUNE LOCK/IPRG EXTLF CLKP CLKN Description Serial interface clock (requires external pull-up) Serial interface data input/output (requires external pull-up) Address select (see Section 5.2.1) Ground VCXO feedback VCXO drive VCXO tune Power supply (+5V) Lock indicator/PECL current drive programming External loop filter Ground Reference frequency input Feedback input Power supply (+5V) Differential clock output Differential clock output Semiconductor Rev. 2.0, Jun. www.amis.com FS6131-01/FS6131-01g Programmable Line Lock Clock Generator Functional Block Description Main Loop main loop phase locked loop (ML-PLL) standard phase- frequency- locked loop architecture. shown Figure ML-PLL consists reference divider, phase-frequency detector (PFD), charge pump, internal loop filter, voltage-controlled oscillator (VCO), feedback divider, post divider. During operation, reference frequency (fREF), generated either on-board crystal oscillator external frequency source, first reduced reference divider. integer value that frequency divided called modulus, denoted reference divider. divided reference then into PFD. controls frequency (fVCO) through charge pump loop filter. provides high-speed, noise, continuously variable frequency clock source ML-PLL. output back through feedback divider (the modulus denoted close loop. will drive down frequency until divided reference frequency divided frequency appearing inputs equal. input/output relationship between reference frequency frequency fVCO frequency used output frequency (fCLK) then basic equation rewritten 4.1.1 Reference Divider reference divider designed phase jitter. divider accepts either output either crystal loop (the VCXO output) external reference frequency, provides divided-down frequency PFD. reference divider 12-bit divider, programmed modulus from 4095. both Table Table additional programming information. 4.1.2 Feedback Divider feedback divider based dual-modulus pre-scaler technique. technique allows same granularity fully programmable feedback divider, while still allowing programmable portion operate speed. high-speed pre-divider (also called prescaler) placed between programmable feedback divider because high speeds which operate. dual-modulus technique insures reliable operation speed that achieve reduces overall power consumption divider. example, fixed divide-by-eight could used feedback divider. Unfortunately, divide-by-eight would limit effective modulus feedback divider path multiples eight. limitation would restrict ability achieve desired ratio without making both reference feedback divider values comparatively large. Large divider moduli generally undesirable increased phase jitter. fvco DualModulus Prescaler Counter Counter Figure Feedback Divider Semiconductor Rev. 2.0, Jun. www.amis.com FS6131-01/FS6131-01g Programmable Line Lock Clock Generator understand operation, refer Figure M-counter (with modulus cascaded with dual-modulus pre-scaler. prescaler modulus were fixed overall modulus feedback divider chain would MXN. However, A-counter causes pre-scaler modulus altered first outputs pre-scaler. A-counter then causes dual-modulus prescaler revert modulus until M-counter reaches terminal state resets entire divider. overall modulus expressed where which simplifies 4.1.3 Feedback Divider Programming requirement that means that feedback divider only programmed certain values below divider modulus selection divider values listed Table desired feedback divider less than find divider value table. Follow column find A-counter program value. Follow left find M-counter value. Above modulus feedback divider programmed value 16383. both Table Table additional programming information. Table Feedback Modulus Below M-Counter: FBKDIV[13:1] 00000000001 00000000010 00000000011 00000000100 00000000101 00000000110 00000000111 A-Counter; FBKDIV[2:0] Feedback Divider Modulus 4.1.4 Post Divider post divider consists three individually programmable dividers, shown Figure POST1[1:0] POST2[1:0] POST3[1:0] fGBL Post Divider (NP1) Post Divider (NP2) POST DIVIDER (NPx) Post Divider (NP3) fout Figure Post Divider moduli individual dividers denoted NP1, NP3, together they make array modulus NPx. Semiconductor Rev. 2.0, Jun. www.amis.com FS6131-01/FS6131-01g Programmable Line Lock Clock Generator post divider performs several useful functions. First, allows operated narrower range speeds compared variety output clock speeds that device required generate. Second, changes basic equation extra integer denominator permits more flexibility programming loop many applications where frequencies must achieved exactly. Note that nominal 50/50 duty factor preserved selections which have modulus. Phase Adjust Sampling line-locked genlocked applications, necessary know exact phase relation output clock relative input clock. Since included within feedback loop simple structure, output exactly phase aligned with input clock. Every cycle input clock equals NR/NF cycles clock. Reference Divider (NR) Phase Frequency Detect fOUT fOUT Feedback Divider (NF) Figure Simple addition post divider, while adding flexibility, makes phase relation between input output clock unknown because post divider outside feedback loop. Reference Divider Phase Frequency Detect Post Divider fOUT fVCO fOUT Feedback Divider fVCO Figure with Post Divider 4.2.1 Clock Gobbler (Phase Adjust) clock gobbler circuit takes advantage unknown relationship between input output clocks permit adjustment CLKP/CLKN output clock phase relative input. clock gobbler circuit removes clock pulse before pulse clocks post divider. this way, phase output clock slipped until output phase aligned with input clock phase. adjust phase relationship, switch feedback divider source post divider input FBKDSRC bit, toggle register bit. clock gobbler output clock delayed clock period each transition from zero one. Semiconductor Rev. 2.0, Jun. www.amis.com FS6131-01/FS6131-01g Programmable Line Lock Clock Generator 4.2.2 Phase Alignment maintain fixed phase relation between input output clocks, post divider must placed inside feedback loop. source feedback divider obtained from output post divider FBKDSRC switch. addition, feedback divider must dividing multiple post divider. Reference Divider Phase Frequency Detect Post Divider fOUT fOUT Feedback Divider Figure Aligned Phase 4.2.3 Phase Sampling Initial Alignment However, ability adjust phase useless without knowing initial relation between output input phase. initial synchronization output phase input phase, phase align "flag" makes transition (zero zero) when output clock phase becomes aligned with feedback source phase. feedback source clock definition, locked input clock phase. First, FS6131 used sample output clock with feedback source clock set/clear phase align flag when clocks match within feedback source clock period. Then, clock gobbler used delay output phase relative input phase clock time until transition flag occurs. When transition occurs, output input clocks phase aligned. enter this mode, STAT[1] clear STAT[0] zero. CMOS one, LOCK/IPRG display flag. flag always available under software control reading back STAT[1] bit, which will overwritten flag this mode. 4.2.4 Feedback Divider Monitoring feedback divider clock brought LOCK/IPRG independent output clock allow monitoring feedback divider clock. enter this mode, both STAT[1] STAT[0] bits one. CMOS must also enable LOCK/IPRG output. Loop Gain Analysis applications where external loop filter required, following analysis example used determine loop gain stability. loop gain product gains within loop. Establish basic operating parameters: charge pump current: chgpump 15kW loop filter values: 0.015 AVCO 3500 gain (VCOSPD): feedback divider: reference frequency input phase detector): 20kHz Semiconductor Rev. 2.0, Jun. www.amis.com FS6131-01/FS6131-01g Programmable Line Lock Clock Generator transfer function phase detector charge pump combination A/rad): transfer function loop filter V/A): chgpump transfer function rad/s, accounting phase integration that occurs VCO) 2pAVCO transfer function feedback divider Finally, sampling effect that occurs phase detector accounted SAMP loop gain LOOP SAMP Amplitude 0.01 0.1kHz 1kHz 10kHz 100kHz Frequency (fi) Figure Loop Gain Frequency Semiconductor Rev. 2.0, Jun. www.amis.com FS6131-01/FS6131-01g Programmable Line Lock Clock Generator loop phase angle LOOP -100° Phase -150° 0.1kHz 1kHz 10kHz 100kHz Frequency (fi) Figure Loop Phase Frequency Nyquist plot gain amplitude shown below. 135° Amplitude Gain Margin 180° Phase Margin 225° 315° 270° Phase Figure Loop Nyquist Plot Voltage-Controlled Crystal Oscillator VCXO provides tunable, low-jitter frequency reference rest FS6131 system components. Loading capacitance crystal internal device. external components (other than resonator itself) required operation VCXO. resonator loading capacitance adjustable under register control. This feature permits factory coarse tuning inexpensive resonators necessary precision digital video applications. Continuous fine-tuning VCXO frequency accomplished varying voltage XTUNE pin. total change (from extreme other) effective loading capacitance 1.5pF nominal, effect shown Semiconductor Rev. 2.0, Jun. www.amis.com FS6131-01/FS6131-01g Programmable Line Lock Clock Generator Figure oscillator operates crystal resonator parallel-resonant mode. Crystal warping, "pulling" crystal oscillation frequency, accomplished altering effective load capacitance presented crystal oscillator circuit. actual amount that changing load capacitance alters oscillator frequency will dependent characteristics crystal well oscillator circuit itself. motional capacitance crystal (usually referred crystal manufacturers C1), static capacitance crystal (C0) load capacitance (CL) oscillator determine warping capability crystal oscillator circuit. simple formula determine total warping capability crystal ppm) where extremes applied load capacitance obtained from Table Example: crystal with following parameters used with FS6131. total coarse tuning range C1=0.02pF, C0=5.0pF, CL1=10.0pF, CL2=22.66pF 4.4.1 VCXO Tuning 0.02 (22.66 22.66 VCXO coarse tuned programmable adjustment crystal load capacitance XCT[3:0] control bits. Table control code associated loading capacitance. actual amount frequency warping caused tuning capacitance will depend crystal used. VCXO tuning capacitance includes external load capacitance (12pF from ground 12pF from XOUT ground). fine tuning capability VCXO enabled setting XLVTEN one, disabled setting zero. Figure shows typical effect coarse fine tuning mechanisms. total coarse tune range about 350ppm. difference VCXO frequency parts million (ppm) shown fine tuning voltage XTUNE varies from Note that crystal load capacitance increased VCXO frequency pulled somewhat less with each coarse step, fine tuning range decreases. fine tuning range always overlaps coarse tuning ranges, eliminating possibility holes VCXO response. different crystal warping characteristics change scaling Y-axis, overall characteristic curves. VCXO Range (ppm XTUNE Voltage VCXO Range (ppm) -100 -150 -200 XTUNE Voltage 0.0V XTUNE Voltage 5.0V Coarse Tune Setting XCT[3:0] Figure VCXO Coarse Fine Tuning Semiconductor Rev. 2.0, Jun. www.amis.com FS6131-01/FS6131-01g Programmable Line Lock Clock Generator Crystal Loop crystal loop designed attenuate jitter highly jittered, low-Q, frequency reference. crystal loop also maintain constant frequency output into main loop frequency reference intermittent. crystal loop consists voltage-controllable crystal oscillator (VCXO), divider, PFD, charge pump that tunes VCXO frequency reference. frequency reference phase-locked divided frequency external, high-Q, jitter-free crystal, thereby locking VCXO reference frequency. VCXO continue crystal even frequency reference becomes intermittent. 4.5.1 Locking External Frequency Source When crystal loop synchronized external frequency source, FS6131 monitor crystal loop detect loop unlocks from external source. crystal loop tries drive zero frequency external source dropped, sets lock status error flag. crystal loop also detect VCXO dropped fine tune range, requiring change coarse tune. lock status also latches direction loop went range (high low) when loop became unlocked. 4.5.1.1 Crystal Loop Lock Status Flag enable this mode, clear STAT[1] STAT[0] bits zero. CMOS one, LOCK/IPRG will crystal loop becomes unlocked. flag always available under software control reading back STAT[1] bit, which overwritten with status flag (low unlocked) this mode (see Table 4.5.1.2 Out-Of-Range High/Low direction loop gone out-of-range determined clearing STAT[1] zero setting STAT[0] one. CMOS one, LOCK/IPRG will high crystal loop went range high. goes logic-low, loop went range low. out-of-range information also available under software control reading back STAT[1] bit, which overwritten flag (high outof-range high, out-of-range low) this mode. cleared only crystal loop loses lock (see Table 4.5.1.3 Crystal Loop Disable crystal loop disabled setting XLPDEN logic-high (1). disables charge pump circuit loop. Setting XLPDEN permits crystal loop operate control loop. Connecting FS6131 External Reference Frequency crystal oscillator used, ground shut down crystal oscillator setting XLROM[2:0]=1. pins have pull-up pull-down current, have small amount hysteresis reduce possibility extra edges. Signals AC-coupled into these inputs with external DC-bias circuit generate DC-bias 2.5V. reference feedback signal should square best results, signals should rail-to-rail. Unused inputs should grounded avoid unwanted signal injection. Differential Output Stage differential output stage supports both CMOS pseudo-ECL (PECL) signals. desired output interface chosen program registers (see Table PECL interface used, transmission line usually terminated using termination. output stage only sink current PECL mode, amount sink current programming resistor LOCK/IPRG pin. ratio IPRG current output drive current shown Figure Source current provided pull-up resistor that part termination. Semiconductor Rev. 2.0, Jun. www.amis.com FS6131-01/FS6131-01g Programmable Line Lock Clock Generator IPRG Input Current (mA) CLKP/CLKN PECL Output Current Figure IPRG CLKP/CLKN Current I2C-bus Control Interface This device read/write slave device meeting Philips I2C-bus specifications except "general call." controlled master device that generates serial clock SCL, controls access generates START STOP conditions while device works slave. Both master slave operate transmitter receiver, master device determines which mode activated. device that sends data onto defined transmitter, device receiving data receiver. I2C-bus logic levels noted herein based percentage power supply (VDD). logic-one corresponds nominal voltage VDD, while logic-zero corresponds ground (VSS). Conditions Data transfer only initiated when busy. During data transfer, data line (SDA) must remain stable whenever clock line (SCL) high. Changes data line while clock line high will interpreted device START STOP condition. following conditions defined I2C-bus protocol. 5.1.1 Busy Both data (SDA) clock (SCL) lines remain high indicate busy. 5.1.2 START Data Transfer high transition line while in-put high indicates START condition. commands device must preceded START condition. 5.1.3 STOP Data Transfer high transition line while held high indicates STOP condition. commands device must followed STOP condition. 5.1.4 Data Valid state line represents valid data line stable duration high period line after START condition occurs. data line must changed only during period signal. There clock pulse data bit. Semiconductor Rev. 2.0, Jun. www.amis.com FS6131-01/FS6131-01g Programmable Line Lock Clock Generator Each data transfer initiated START condition terminated with STOP condition. number data bytes transferred between START STOP conditions determined master device, continue indefinitely. However, data that overwritten device after first eight bytes will overflow into first register, then second, first-in, first-overwritten fashion. 5.1.5 Acknowledge When addressed, receiving device required generate acknowledge after each byte received. master device must generate extra clock pulse coincide with acknowledge bit. acknowledging device must pull line during high period master acknowledge clock pulse. Setup hold times must taken into account. master must signal data slave generating acknowledge last byte that been read (clocked) slave. this case, slave must leave line high enable master generate STOP condition. I2C-bus Operation programmable registers accessed randomly sequentially this bi-directional wire digital interface. crystal oscillator does have communication occur. device accepts following I2C-bus commands: 5.2.1 Slave Address After generating START condition, master broadcasts seven-bit slave address followed bit. address device where controlled logic level ADDR pin. variable ADDR allows different FS6131 devices exist same bus. Note that every device I2C-bus must have unique address avoid conflicts. default address sets pull-down ADDR pin. 5.2.2 Random Register Write Procedure Random write operations allow master directly write register. initiate write procedure, that transmitted after seven-bit device address logic-low. This indicates addressed slave device that register address will follow after slave device acknowledges device address. register address written into slave's address pointer. Following acknowledge slave, master allowed write eight bits data into addressed register. final acknowledge returned device, master generates STOP condition. either STOP repeated START condition occurs during register write, data that been transferred ignored. 5.2.3 Random Register Read Procedure Random read operations allow master directly read from register. perform read procedure, that transmitted after seven-bit address logic-low, register write procedure. This indicates addressed slave device that register address will follow after slave device acknowledges device address. register address then written into slave's address pointer. Following acknowledge slave, master generates repeated START condition. repeated START terminates write procedure, until after slave's address pointer set. slave address then resent, with this time logic-high, indicating slave that data will read. slave will acknowledge device address, then transmits eight-bit word. master does acknowledge transfer does generate STOP condition. 5.2.4 Sequential Register Write Procedure Sequential write operations allow master write each register order. register pointer automatically incremented after each write. This procedure more efficient than random register write several registers must written. initiate write procedure, that transmitted after seven-bit device address logic-low. This indicates addressed slave device that register address will follow after slave device acknowledges device address. register address written into slave's Semiconductor Rev. 2.0, Jun. www.amis.com FS6131-01/FS6131-01g Programmable Line Lock Clock Generator address pointer. Following acknowledge slave, master allowed write eight bytes data into addressed register before register address pointer overflows back beginning address. acknowledge device between each byte data must occur before next data byte sent. Registers updated every time device sends acknowledge host. register update does wait STOP condition occur. Registers therefore updated different times during sequential register write. 5.2.5 Sequential Register Read Procedure Sequential read operations allow master read from each register order. register pointer automatically incremented after each read. This procedure more efficient than random register read several registers must read. perform read procedure, that transmitted after seven-bit address logic-low, register write procedure. This indicates addressed slave device that register address will follow after slave device acknowledges device address. register address then written into slave's address pointer. Following acknowledge slave, master generates repeated START condition. repeated START terminates write procedure, until after slave's address pointer set. slave address then resent, with this time logic-high, indicating slave that data will read. slave will acknowledge device address, then transmits eight bytes data starting with initial addressed register. register address pointer will overflow initial register address larger than zero. After last byte data, master does acknowledge transfer does generate STOP condition. Semiconductor Rev. 2.0, Jun. www.amis.com FS6131-01/FS6131-01g Programmable Line Lock Clock Generator DEVICE ADDRESS REGISTER ADDRESS DATA 7-bit Receive Device Address START Command Register Address Acknowledge WRITE Command From host device Data Acknowledge STOP Condition Acknowledge From device host Figure Random Register Write Procedure DEVICE ADDRESS REGISTER ADDRESS DEVICE ADDRESS DATA 7-bit Receive Device Address START Command Register Address Acknowledge WRITE Command From host device 7-bit Receive Device Address Repeat START Acknowledge From device host Data Acknowledge READ Command STOP Condition Acknowledge Figure Random Register Read Procedure DEVICE ADDRESS REGISTER ADDRESS DATA DATA DATA 7-bit Receive Device Address START Command Register Address Acknowledge WRITE Command From host device Data Acknowledge Data Acknowledge Acknowledge Data Acknowledge STOP Command From device host Figure Sequential Register Write Procedure DEVICE ADDRESS REGISTER ADDRESS DEVICE ADDRESS DATA DATA 7-bit Receive Device Address START Command Register Address Acknowledge WRITE Command From host device 7-bit Receive Device Address Repeat START Acknowledge From device host Data Acknowledge READ Command Acknowledge Data Acknowledge STOP Command Figure Sequential Register Read Procedure Semiconductor Rev. 2.0, Jun. www.amis.com FS6131-01/FS6131-01g Programmable Line Lock Clock Generator Programming Information register bits cleared zero power-up. register bits read back written except STAT[1] (Bit 63). Table Register Address STAT[1] (Bit STAT[0] (Bit XLVTEN (Bit Fine Tune Inactive Fine Tune Active CMOS (Bit PECL XCT[3] (Bit XCT[2] (Bit XCT[1] (Bit XCT[0] (Bit Crystal Loop Lock Status Byte Crystal Loop Range Main Loop Phase Status Feedback Divider Output CMOS Lock Status VCXO Coarse Tune Table XLPDEN (Bit Crystal Loop Operates Crystal Loop Powered Down XLSWAP (Bit with External VCXO with Internal VCXO XLCP[1] (Bit 1.5mA 24mA XLCP[0] (Bit XLROM[2] (Bit XLROM[1] (Bit XLROM[0] (Bit (Bit Clock Phase Adjust Clock Phase Delay Byte Crystal Loop Control Table OUTMUX[1] (Bit OUTMUX[0] (Bit OSCTYPE (Bit Phase Jitter Oscillator FS6031 Oscillator VCOSPD (Bit High Speed Range Speed Range LFTC (Bit Short Time Constant Long Time Constant EXTLF (Bit Internal Loop Filter External Loop Filter MLCP[1] (Bit 1.5mA 24mA MLCP[0] (Bit Output Byte Reference Divider Output Phase Detector Input VCXO Output FBKDSRC[1] (Bit FBKDSRC[0] (Bit FBKDIV[13] (Bit 8192 FBKDIV[12] (Bit 4096 FBKDIV[11] (Bit 2048 FBKDIV[10] (Bit 1024 FBKDIV[9] (Bit FBKDIV[8] (Bit Post Divider Output Byte Post Divider Input Counter FBKDIV[7] (Bit FBKDIV[6] (Bit FBKDIV[5] (Bit M-Counter FBKDIV[4] (Bit FBKDIV[3] (Bit FBKDIV[2] (Bit FBKDIV[1] (Bit Counter Table FBKDIV[0] (Bit Byte POST3[1] (Bit POST3[1] (Bit POST2[1] (Bit POST2[0] (Bit POST1[1] (Bit POST1[0] (Bit Divide Divide Divide Divide Divide Divide Divide Divide Divide Byte Reserved Reserved Divide Divide Divide PDFBK (Bit PDREF (Bit SHUT (Bit Main Loop Operates Main Loop Powered Down REFDSRC (Bit VXCO REFDIV[11] (Bit REFDIV[10] (Bit REFDIV[9] (Bit REFDIV[8] (Bit Byte Feedback Divider Reference Divider 2048 1024 REFDIV[7] Byte (Bit REFDIV[6] (Bit REFDIV[5] (Bit REFDIV[4] (Bit REFDIV[3] (Bit REFDIV[2] (Bit REFDIV[1] (Bit REFDIV[0] (Bit Semiconductor Rev. 2.0, Jun. www.amis.com FS6131-01/FS6131-01g Programmable Line Lock Clock Generator Table Device Configuration Bits Name REFDSRC (Bit SHUT (Bit PDREF (Bit PDFBK (Bit Description Reference Divider Source Main Loop Shut Down Select Phase Detector Reference Source Phase Detector Feedback Source Feedback Divider Source External Loop Filter Select Oscillator Type Output Multiplexer Select Clock Gobbler Control CLKP/CLKN Output Mode Crystal oscillator (VCXO) Disabled (main loop operates) Enabled (main loop shuts down) Reference divider Feedback divider Post divider output output (post divider input) Internal loop filter EXTLF phase jitter oscillator FS6031 compatible oscillator Main loop (VCO output) Reference divider output Phase detector input VCXO output clock phase adjust Clock phase adjust PECL output (positive-ECL output drive) CMOS output/ lock status indicator FBKDSRC[1:0] (Bits 39-38) EXTLF (Bit OSCTYPE (Bit OUTMUX[1:0] (Bits 47-46) (Bit CMOS (Bit Table LOCK/IPRG Configuration Bits Name Description Crystal Loop Lock STATus Mode/ Main Loop Phase Align STATus Mode (see also Table Crystal loop lock status: locked unlocked Crystal loop lock status: out-of-range high Main loop phase align status Feedback divider output STAT[1:0] (Bits 63-62) Semiconductor Rev. 2.0, Jun. www.amis.com FS6131-01/FS6131-01g Programmable Line Lock Clock Generator Table Lock Status CMOS STAT[1] STAT[0] LOCK/IPRG STAT[1] Read Status Locked Unlocked Out-of-range: Out-of-range: high Table Main Loop Tuning Bits Name VCOSPD (Bit Description SPeeD Range Select (see Table High speed range speed range Main Loop Charge Pump Current Current 1.5mA Current Current Current 24mA Loop Filter Time Constant (internal) Short time constant: 13.5ms Long time constant: 135ms MLCP[1:0] (Bits 41-40) LFTC (Bit Table Divider Control Bits Name REFDIV[11:0] (Bits 11-0) FBKDIV[13:0] (Bits 37-24) Description REFerence DIVider (NR) FeedBacK DIVider (NF) FBKDIV[2:0] FBKDIV[13:3] POST Divider (NP1) POST Divider (NP2) POST Divider (NP3) these reserved bits A-Counter value M-Counter value Divide Divide Divide Divide POST1[1:0] (Bits 17-16) Divide Divide Divide Divide POST2[1:0] (Bits 19-18) Divide Divide Divide Divide POST3[1:0] (Bits 21-20) Reserved (Bits Semiconductor Rev. 2.0, Jun. www.amis.com FS6131-01/FS6131-01g Programmable Line Lock Clock Generator Table Crystal Loop Tuning Bits Name Description Crystal Loop Charge Pump Current Current 1.5mA Current Current Current 24mA Crystal Loop Divider Select Crystal Oscillator Power-Down (see Table Crystal Loop Voltage Fine Tune ENable Crystal Loop SWAP Polarity XLSWAP (Bit Crystal Loop Power Down Enable XLPDEN (Bit XCT[3:0] (Bits 59-56) Crystal Coarse Tune (see Table Disabled (crystal loop operates) Enabled (crystal loop powered down) with external VCXO that increases frequency response increasing voltage XTUNE pin. with VCXO that increases frequency response decreasing voltage XTUNE pin. this setting internal VCXO Disabled (fine tune inactive) Enabled (fine tune active) XLCP[1:0] (Bits 53-52) XLROM[2:0] (Bits 51-49) XLVTEN (Bit Table Crystal Loop Control XLROM[2] XLROM[1] XLROM[0] VCXO Divider 3072 3156 2430 2500 4000 3375 Crystal Frequency (MHz) 24.576 25.248 19.44 20.00 32.00 27.00 Crystal oscillator power-down VCXO Coarse Tune VCXO coarse tuned programmable adjustment crystal load capacitance XCT[3:0]. actual amount frequency warping caused tuning capacitance will depend crystal used. VCXO tuning capacitance includes external load capacitance (12pF from ground 12pF from XOUT ground). fine tuning capability VCXO enabled setting XLVTEN logic-one, disabled setting logic-zero. Semiconductor Rev. 2.0, Jun. www.amis.com FS6131-01/FS6131-01g Programmable Line Lock Clock Generator Table VCXO Coarse Running Capacitance XCT[3] XCT[2] XCT[1] XCT[0] VCXO Tuning Capacitance (pf) 10.00 10.84 11.69 12.53 13.38 14.22 15.06 15.91 16.75 17.59 18.43 19.28 20.13 20.97 21.81 22.66 Electrical Specifications Table Absolute Maximum Ratings Parameter Supply voltage, (VSS ground) Input voltage, Output voltage, Input clamp current, VDD) Output clamp current, VDD) Storage temperature range (non-condensing) Ambient temperature range, under bias Junction temperature Re-flow solder profile Input static discharge voltage protection (MIL-STD 883E, Method 3015.7) Symbol Min. VSS-0.5 VSS-0.5 VSS-0.5 Max. VDD+0.5 VDD+0.5 Units IPC/JEDEC J-STD-020B Stresses above those listed under Absolute Maximum Ratings cause permanent damage device. These conditions represent stress rating only, functional operation device these other conditions above operational limits noted this specification implied. Exposure maximum rating conditions extended conditions affect device performance, functionality reliability. CAUTION: ELECTROSTATIC SENSITIVE DEVICE Permanent damage resulting loss functionality performance occur this device subjected high-energy electrostatic discharge. Table Operating Conditions Parameter Supply voltage Ambient operating temperature range Crystal resonator frequency Crystal resonator load capacitance Crystal resonator motional capacitance Serial data transfer rate PECL mode programming current (LOCK/IPRG high-level input current) Output driver load capacitance Symbol fXIN Parallel resonant, Parallel resonant, Standard mode PECL mode Conditions/Description Min. 19.44 Typ. Max. Units kb/s Semiconductor Rev. 2.0, Jun. www.amis.com FS6131-01/FS6131-01g Programmable Line Lock Clock Generator Table Electrical Specifications Parameter Overall Supply current, dynamic, (with loaded outputs) Supply current, static Serial Communication (SDA, SCL) High-level input voltage Low-level input voltage Hysteresis voltage* Input leakage current Low-level output sink current (SDA) Tristate output current Address Select Input (ADDR) High-level input voltage Low-level input voltage High-level input current (pull-down) Low-level input current Reference Frequency Input (REF, FBK) High-level input voltage Low-level input voltage Hysteresis voltage Input leakage current Loop Filter Input (EXTLF) Input leakage current Symbol IDDL Vhys Vhys EXTLF 0.8V; EXTLF 0.8V; EXTLF 0.8V; EXTLF 0.8V; EXTLF 4.2V; EXTLF 4.2V; EXTLF 4.2V; EXTLF 4.2V; EXTLF Conditions/Description fCLK 66MHz; CMOS mode, 5.5V SHUT XLROM[2:0] XLPDEN 5.5V Outputs Outputs Outputs 0.4V VSS-0.3 VSS-0.3 5.5V VSS-0.3 MLCP[1:0] MLCP[1:0] MLCP[1:0] MLCP[1:0] MLCP[1:0] MLCP[1:0] MLCP[1:0] MLCP[1:0] -1.5 VSS-0.3 -1.5 Min. Typ. Max. Units VDD+0.3 VDD+0.3 VDD+0.3 High-level output source current Low-level output sink current Crystal Oscillator Input (XIN) Threshold bias voltage High-level input current Low-level input current Crystal loading capacitance* Input loading capacitance* Crystal Oscillator Output (XOUT) High-level output source current Low-level output sink current VCXO Tuning (XTUNE) High-level input voltage Low-level input voltage Hysteresis voltage Input leakage current CL(xtal) CL(XIN) Vhys Outputs off; Outputs off; seen external crystal connected XOUT; VCXO tuning disabled seen external clock driver XOUT; unconnected, VCXO disabled float float Lock status: out-of-range HIGH Lock status: out-of-range XLPDEN 0.8V; XLDP[1:0] 0.8V; XLDP[1:0] 0.8V; XLDP[1:0] 0.8V; XLDP[1:0] 4.2V; XLDP[1:0] 4.2V; XLDP[1:0] 4.2V; XLDP[1:0] 4.2V; XLDP[1:0] VDD+0.3 High-level output source current Low-level output sink current Semiconductor www.amis.com FS6131-01/FS6131-01g Programmable Line Lock Clock Generator Table Electrical Specifications (continued) Parameter Symbol Lock Indicator/PECL Current Program (LOCK/IPRG) Low-level input current High-level output source current Low-level output sink current Output impedance* ISCH Short circuit source current* ISCL Short circuit sink current* Clock Outputs, CMOS Mode (CLKN, CLKP) High-level output source current Low-level output sink current Output impedance* Short circuit source current Short circuit sink current* Clock Outputs, PECL Mode (CLKN, CLKP) IPRG current output current ratio Low-level output sink current Tristate output current ISCH ISCL Conditions/Description PECL mode CMOS mode; 2.4V CMOS mode; 0.4V 0.5VDD; output driving high 0.5VDD; output driving shorted 30s, max. shorted 30s, max. 2.4V 0.4V 0.5VDD; output driving high 0.5VDD; output driving shorted 30s, max. shorted 30s, max. Min. Typ. Max. -100 Units IPRG input current 15mA Unless otherwise stated, 5.0V 10%, load output ambient temperature range 70°C. Parameters denoted with asterisk represent nominal characterization data production tested specific limits. Min. Max. characterization data from typical. Table Timing Specifications Parameter Overall Output frequency* Symbol Conditions/Description CMOS outputs PECL outputs phase jitter oscillator (OSCTYPE VCOSPD VCOSPD FS6031 compatible oscillator (OSCTYPE VCOSPD VCOSPD phase jitter oscillator (OSCTYPE VCOSPD VCOSPD FS6031 compatible oscillator (OSCTYPE VCOSPD VCOSPD LFTC LFTC CMOS Outputs, 0.5V 4.5V; 15pF CMOS Outputs, 4.5V 0.5V; 15pF Frequency synthesis Line locked modes (8kHz reference) From falling edge last data (SHUT output locked FBKDIV[13:0] (See also Table REFDIV[11:0] POST1[1:0] (See also Table POST2[1:0] (See also Table POST3[1:0] (See also Table Min. Typ. Max. 13.5 Units fO(max) frequency* fVCO gain* AVCO MHz/V Loop filter time constant* Rise time* Fall time* Lock time (main loop)* Disable time Divider Modulus Feedback divider Reference divider Post divider 16383 4095 Unless otherwise stated, 5.0V 10%, load output ambient temperature range 70°C. Parameters denoted with asterisk represent nominal characterization data production tested specific limits. Min. Max. characterization data from typical. Semiconductor Rev. 2.0, Jun. www.amis.com FS6131-01/FS6131-01g Programmable Line Lock Clock Generator Table Timing Specifications (Continued) Parameter Clock Output (CLKP, CLKN) Duty cycle* Ratio pulse width measured from rising edge next falling edge 2.5V) clock period Rising edges 50ms apart 2.5V, relative ideal clock, CL=15pF, fREF=8kHz, NR=1, NF=193, NPx=64, CLF=0.054mF, RLF=15.7kW, CLP=1800pF, OSCTYPE=0, MLCP=3, XLROM=7 Rising edges 50ms apart 2.5V, relative ideal clock, CL=15pF, fREF=15kHz, NR=1, NF=800, NPx=10, CLF=0.0246mF, RLF=15.7kW, CLP=820pF, OSCTYPE=0, MLCP=3, XLROM=7 Symbol Conditions/Description Clock (MHz) Min. Typ. Max. Units 1.544 12.00 Jitter, long term (sy(t)) tj(LT) rising edges apart 2.5V relative ideal clock, CL=15pF, fREF=31.5kHz, NR=1, NF=799, NPx=4, CLF=0.015mF, RLF=15.7kW, CLP=470pF, OSCTYPE=0, MLCP=3, XLROM=7 rising edges 500ms apart 2.5V relative ideal clock, CL=15pF, CMOS mode, fXIN=27MHz, NF=200, NR=27, NPx=2 rising edges 500ms apart 2.5V relative ideal clock, CL=15pF, PECL mode, fXIN=27MHz, NF=200, NR=27, NPx=1 From rising edge next rising edge 2.5V, CL=15pF, fREF=8kHz, NR=1, NF=193, NPx=64, CLF=0.054mF, RLF=15.7kW, CLP=1800pF, OSCTYPE=0, MLCP=3, XLROM=7 From rising edge next rising edge 2.5V, CL=15pF, fREF=15kHz, NR=1, NF=800, NPx=10, CLF=0.0246mF, RLF=15.7kW, CLP=820pF, OSCTYPE=0, MLCP=3, XLROM=7 25.175 1.544 12.00 Jitter, period (peak-peak)* tj(DP) From rising edge next rising edge 2.5V, CL=15pF, fREF=31.5kHz, NR=1, NF=799, NPx=4, CLF=0.015mF, RLF=15.7kW, CLP=470pF, OSCTYPE=0, MLCP=3, XLROM=7 From rising edge next rising edge 2.5V, CL=15pF, CMOS mode, fXIN=27MHz, NF=200, NR=27, NPx=2 From rising edge next rising edge 2.5V, CL=15pF, PECL mode, fXIN=27MHz, NF=200, NR=27, NPx=1 25.175 Unless otherwise stated, 5.0V 10%, load output ambient temperature range 70°C. Parameters denoted with asterisk represent nominal characterization data production tested specific limits. Min. Max. characterization data from typical. Table Serial Interface Timing Specifications Parameter Clock frequency free time between STOP START Setup time, START (repeated) Hold time, START Setup time, data input Hold time, data input Output data valid from clock Rise time, data clock Fall time, data clock High time, clock time, clock Setup time, STOP Symbol fSCL tBUF tsu:STA thd:STA tsu:DAT thd:DAT Conditions/Description Standard Mode Min. Max. Units Minimum delay bridge undefined region falling edge avoid unintended START STOP 1000 SDA, SDA, tsu:STO Unless otherwise stated, 5.0V 10%, load output ambient temperature range 70°C. Parameters denoted with asterisk represent nominal characterization data production tested specific limits. Min. Max. characterization data from typical. Semiconductor Rev. 2.0, Jun. www.amis.com FS6131-01/FS6131-01g Programmable Line Lock Clock Generator tsu:STA thd:STA tsu:STO START ADDRESS DATA VALID DATA CHANGE STOP Figure Timing Data tsu:STA thd:STA thd:DAT tsu:DAT tsu:STO tBUF Figure Data Transfer Sequence Semiconductor Rev. 2.0, Jun. www.amis.com FS6131-01/FS6131-01g Programmable Line Lock Clock Generator Table CLKP, CLKN Clock Outputs (CMOS Mode) Voltage Drive Current (mA) Min. Typ. Max. Voltage High Drive Current (mA) Min. Typ. Max. -153 -150 -148 -142 Output Current (mA) -135 -124 -119 -111 -105 -100 -150 -200 Output Voltage data this table represents nominal characterization data only. Table LOCK/IPRG Clock Output (CMOS Mode) Voltage Drive Current (mA) Min. Typ. Max. Voltage High Drive Current (mA) Min. Typ. Max. Output Current (mA) Output Voltage data this table represents nominal characterization data only. Semiconductor Rev. 2.0, Jun. www.amis.com FS6131-01/FS6131-01g Programmable Line Lock Clock Generator Package Information Both `Green'/'ROHS' `Non-Green' Table 16-pin SOIC (0.150") Package Dimensions Dimensions Inches Min. 0.230 0.010 0.016 0.061 0.004 0.055 0.013 0.0075 0.386 0.150 Max. 0.068 0.0098 0.061 0.019 0.0098 0.393 0.157 0.050 0.244 0.016 0.035 5.84 0.25 0.41 Millimeters Min. 1.55 0.102 1.40 0.33 0.191 9.80 3.81 Max. 1.73 0.249 1.55 0.49 0.249 9.98 3.99 1.27 6.20 0.41 0.89 RADII: 0.005" 0.01" RADII: 0.005" 0.01" Non-Green FS6131-01 AMERICAN MICROSYSTEMS, INC. typ. Green FS6131-01G AMERICAN MICROSYSTEMS, INC. typ. SEATING PLANE BASE PLANE Table 16-pin SOIC (0.150") Package Characteristics Parameter Thermal impedance, junction free-air Lead inductance, self Lead inductance, mutual Lead capacitance, bulk Symbol Conditions/Description flow ft./min. Corner lead Center lead lead adjacent lead lead Typ. Units °C/W Ordering Information Ordering Code 11274-001-XTP -XTD) 11274-502-XTP -XTD) Device Number FS6131-01 FS6131-01g Package Type 16-pin (0.150") SOIC (small outline package) 16-pin (0.150") SOIC (green, ROHS lead free packaging) Operating Temperature Range 70°C (Commercial) 70°C (Commercial) Shipping Configuration Tape-and-Reel (-XTP) Tube/Tray (-XTD) Tape-and-Reel (-XTP) Tube/Tray (-XTD) Semiconductor Rev. 2.0, Jun. www.amis.com FS6131-01/FS6131-01g Programmable Line Lock Clock Generator 10.0 Demonstration Software Windows® 3.1x/95/98-based software available from AMIS that illustrates capabilities FS6131. software also operate under Windows NT®. 10.1 Software Requirements running Windows 3.1x 95/98. Software also runs Windows calculation mode only 2.0MB available space hard drive 10.2 Software Installation Instructions self-expanding .exe file unzip compressed demo files directory your choice. setup.exe file install programming software. 10.3 Demo Program Operation fs6131.exe program. warning message will appear stating: "This version demo program cannot communicate with FS6131 hardware when running Windows operating system. want continue anyway, using just calculation features this program?" Clicking starts program calculation only. FS6131 demonstration hardware longer supported AMIS. opening screen shown Figure Figure Opening Screen Semiconductor Rev. 2.0, Jun. www.amis.com FS6131-01/FS6131-01g Programmable Line Lock Clock Generator 10.3.1 Device Mode device mode block presets demo program program FS6131 either frequency synthesizer stand alone clock generator) line-locked genlock clock generator. Frequency Synthesis: stand alone clock generator. Note that reference source on-chip crystal oscillator, expected crystal frequency 27MHz, voltage tune crystal oscillator (i.e. VCXO) disabled. default output frequency (CLK freq.) requested 100MHz, with maximum error 10ppm, about 100Hz. output stage defaults CMOS mode. Line-Locked/Genlock: line-lock genlock application. Note that reference source pin, that expected reference frequency 8kHz. default output frequency requested 100x multiple reference frequency. 10.3.2 Example: Frequency Synthesizer Mode default demo program assumes FS6131 configured stand alone clock generator. Note that reference source defaults on-chip crystal oscillator, expected crystal frequency 27MHz, voltage tune Crystal Oscillator block (i.e. VCXO) disabled. default output frequency (CLK freq.) requested 100MHz, with maximum error 10ppm, about 100Hz. Output Stage defaults CMOS mode. Loop Filter block internal, Check Loop Stability switch exercise, click Calculate Solutions. program takes into account screen settings calculates possible combinations reference, feedback post divider values that will generate output frequency (100MHz) from input frequency (27MHz) within desired tolerance (10ppm). will momentarily appear: "Calculating Solutions: Press cancel stop with solutions calculated far." number will increment every unique solution that found. This example will create unique solutions, which then displayed window lower right portion program screen. best performance obtained running high speed possible. last three solutions show speed 200MHz. Furthermore, good performance obtained with smallest dividers possible, which means solution should provide best results. Figure Frequency Synthesizer Screen Clicking Solution highlights row, clicking Disp/Save Register Values provides window with final values settings. click then displays second window containing register information register map. solutions saved file, formats available: text format viewing, data format loading into FS6131. Note: update this data sheet, FS6131 hardware longer available from AMIS. Semiconductor Rev. 2.0, Jun. www.amis.com FS6131-01/FS6131-01g Programmable Line Lock Clock Generator 10.3.3 Example: Line-Locked Mode Selecting line-locked/genlock option Device Mode block changes program default settings. Reference Source changes input, block appears permit entry input frequency MHz. Desired Multiple block allows entry reference frequency multiplying factor used generate output frequency. Exercise: Change frequency 0.0315MHz, alter desired multiple 800. Change loop filter block external, leave values alone. Click Calculate Solutions. program takes into account current screen settings calculates possible combinations reference, feedback post divider values that will generate output frequency from input frequency (31.5kHz) multiplied desired multiple 800. will appear: solutions were found! want retry calculations with check loop stability option turned off?" Choose Yes. Another will momentarily appear: "Calculating Solutions: Press cancel stop with solutions calculated far." number will increment every unique solution that found. This example will create eight unique solutions, which then displayed window lower right portion program screen. best results, keep PostDiv value multiplied FbkDiv value from getting larger than 5000 while running much above 70MHz possible. tradeoff must made, better faster allow divider values large. Solution provides PostDiv value FbkDiv value combined value 3200. running about 100MHz. Click Solution highlight row, then click Suggest Loop Filter have program choose loop filter values. Suggested values external loop filter 4700pF 47kW. reselect Check Loop Stability turn this feature Clicking Calculate Solutions regenerates same solutions provided earlier, only this time loop filter values were used. Figure Line-Locked Screen Clicking Solution highlights row, clicking Disp/Save Register Values provides window with final values settings. click then displays second window containing register information register map. solutions saved file, formats available: text format viewing data format loading into FS6131. Note: update this data sheet, FS6131 hardware longer available from AMIS. Semiconductor Rev. 2.0, Jun. www.amis.com FS6131-01/FS6131-01g Programmable Line Lock Clock Generator Table Sample Text Output FS6131 Solution Text File Line-Locked Genlock Mode Desired Multiple Source .0315MHz Reference External Loop Filter 47pF 4700Ohms Crystal Oscillator Voltage Tune Disabled Output Stage CMOS Reference Divider Feedback Divider Post Divider Charge Pump (uA) EXTLF XLVTEN CMOS Register Register Register Register Register Register Register Register (64) (32) (36) (23) 11.0 Applications Information signal reflection will occur point PC-board trace where impedance mismatches exist. Reflections cause several undesirable effects high-speed applications, such increase clock jitter rise electromagnetic emissions from board. Using properly designed series termination each high-speed line alleviate these problems eliminating signal reflections. 11.1 PECL Output Mode PECL interface desired, transmission line must terminated using dual, termination. output stage only sink current PECL mode, amount sink current programming resistor LOCK/IPRG pin. Source current provided pull-up resistor that part termination. PECL Mode Output CLKP CLKN from IPRG LOAD Figure termination (PECL) termination uses resistors transmission line. parallel resistance termination resistors should sized equal transmission line impedance, taking into account driver sink current, desired rise fall times, specifications load. Semiconductor Rev. 2.0, Jun. www.amis.com FS6131-01/FS6131-01g Programmable Line Lock Clock Generator 11.1.1 Example Calculation PECL mode, output driver does source current, value determined ratios terminating resistors using equation VNMH where pull-up resistor, pull-down resistor VNMH desired noise margin, VNMH resistor ratio must also match line impedance equation where line impedance. Combining these equations, solving gives VNMH load's VIH(min) 0.6, choose VNMH 0.45V. line impedance 75W, then about 82W. Substituting into equation line impedance solving gives value 880W (choose 910W). solve load's VIL, output sink current must programmed IPRG pin. desired 1.6, choose some extra margin. sink current 25mA through resistor generates 2.05V drop. sink current programmed IPRG pin, where ratio IPRG current output sink current 1:4. IPRG programming resistor 750W generates 6.6mA, about 27mA output sink current. 11.2 CMOS Output Mode CMOS interface desired, transmission line typically terminated using series termination. Series termination adds loading driver, requires less power than other resistive termination methods. addition, extra impedance exists from signal line reference voltage, such ground. DRIVER LINE RECEIVE Figure Series Termination (CMOS) shown Figure driver's output impedance (zO) series termination resistance (RS) must equal line impedance (zL). That When source impedance (zO+RS) matched line impedance, then voltage division incident wave amplitude one-half full signal amplitude. Semiconductor Rev. 2.0, Jun. www.amis.com FS6131-01/FS6131-01g Programmable Line Lock Clock Generator However, full signal amplitude take twice long propagation delay line develop, reducing noise immunity during half-amplitude period. Note that voltage receive must signal amplitude that meets receiver switching thresholds. slew rate signal reduced additional delay load capacitance line impedance. Also, note that output driver impedance will vary slightly with output logic state (high low). 11.3 Serial Communications Connection devices standard-mode implementation I2C-bus similar that shown Figure Selection pull-up resistors (RP) optional series resistors (RS) lines depends supply voltage, capacitance number connected devices with their associated input currents. Control clock data lines done through open drain/collector current-sink outputs, thus requires external pull-up resistors both lines. guideline Cbus where maximum rise time (minus some margin) Cbus total capacitance. Assuming controller eight other devices bus, including this one, results values range. series resistor provide protection against high voltage spikes will alter values (optional) (optional) (optional) (optional) Data Clock Data Clock Data Data TRANSMITTER RECEIVER Figure Connections Serial 11.3.1 More Information More information I2C-bus found document I2C-bus (Including Specifications), available from Philips Semiconductors 12.0 Device Application: Stand-Alone Clock Generation length reference feedback dividers, their granularity flexibility post divider make FS6131 most flexible monolithic stand-alone clock generation device available. effective block diagram FS6131 when programmed stand-alone mode shown Figure source feedback divider stand-alone mode output VCO. dividing input reference frequency down reference divider (NR), then multiplying main loop through feedback divider (NF), finally dividing main loop output frequency post divider (NPx), have defining relationship this mode. equation output clock frequency (fCLK) written (Eqn. where reference source frequency (fREF) either supplied VCXO applied pin. Great flexibility permitted programming FS6131 achieve exact desired output frequencies since three integers involved computation. Semiconductor Rev. 2.0, Jun. www.amis.com FS6131-01/FS6131-01g Programmable Line Lock Clock Generator 12.1 Example Calculation Visual BASIC program available completely program FS6131 based given parameters. Suppose that reference source frequency 14.318MHz desired output frequency 100MHz. First, factor 14.318MHz reference frequency (which four times NTSC television color sub-carrier) into prime numbers. exact expression 14318181.81 LFTC XTUNE (optional) XCT[3:0], XLVTEN Control VCXO Divider XLROM[2:0] XLPDEN, XLSWAP CRYSTAL LOOP XLCP[1:0] VCXO XOUT (optional) Internal Loop Filter PhaseFrequency Detector EXTLF EXTLF STAT[1:0] RIPRG Charge Pump DOWN (optional) Lock Detect REFDIV[11:0] CMOS LOCK/ IPRG (optional) (fREF) REFDSRC Reference Divider (NR) MLCP[1:0] PDREF VCOSPD, OSCTYPE POST3[1:0] POST2[1:0] POST1[1:0] PDFBK PhaseFrequency Detector Charge Pump DOWN Voltage Controlled Oscillator Clock Gobbler OM[1:0] Post Divider (NPx) CMOS/PECL Output CLKP (fCLK) CLKN ADDR Feedback Divider (NF) Interface FBKDSRC[1:0] (fVCO) Registers MAIN LOOP FBKDIV[14:0] FS6131 Figure Block Diagram: Stand-Alone Clock Generation Next, express output input frequencies ratio fCLK fREF, where fCLK also been converted product prime numbers. 100000000.00 14318181.81 Simplifying above equation yields (Eqn. Semiconductor Rev. 2.0, Jun. www.amis.com FS6131-01/FS6131-01g Programmable Line Lock Clock Generator Deciding apportion denominator integers between reference divider post divider iterative process. obtain best performance, should operated highest frequency possible without exceeding upper limit 230MHz. (see Table 15). frequency (fVCO) calculated fVCO Recall that reference divider have value between 4096, post divider limited values derived from where values NP1, found Table this example, smallest integer that removed from denominator Eqn. three. post divider NPx=3, ratio fCLK fREF becomes (from Eqn. Unfortunately, post divider modulus three requires frequency 300MHz, which greater than allowable fVCO noted Table best performance, program post divider modulus allow operate nominal frequency that least 70MHz less then 230MHz. Therefore, reference divider cannot reduced below modulus shown Eqn. However, still operated frequency higher than fCLK. Multiplying both numerator denominator does alter output frequency, does increase frequency. Eqn. shows, frequency doubled multiplying feedback divider two. post divider return output frequency desired modulus. These divider settings place frequency 200MHz. 12.2 Example Programming generate 100.000MHz from 14.318MHz, program following (refer Figure 25): reference divider input select VCXO REFDSRC=0 input select reference divider feedback divider PDREF=0 PDFBK=0 reference divider (NR) modulus REFDIV[11:0] feedback divider input select FBKDSRC=1 feedback divider (NF) modulus FBKDIV[14:0] NP1=2, NP2=1 NP3=1 combined post divider modulus NPx=2 POST1[1:0], POST2[1:0] POST3[1:0]. Select internal loop filter EXTLF=0 XLVTEN=0 XLPDEN=1 disable VCXO fine tune crystal loop phase frequency detector VCOSPD=0 select high speed range Semiconductor Rev. 2.0, Jun. www.amis.com FS6131-01/FS6131-01g Programmable Line Lock Clock Generator 13.0 Device Application: Line-Locked Clock Generation Line-locked clock generation, used here, refers process synthesizing clock frequency that some integer multiple horizontal line frequency graphics system. FS6131 easily configured perform that function, shown Figure line reference signal (fHSYNC) applied input direct application main loop PFD. feedback divider (NF) programmed desired number output clocks line. source feedback divider selected output post divider (NPx) that edges output clock maintain consistent phase alignment with line reference signal. modulus post divider should selected maintain frequency that comfortably within operating range noted Table 13.1 Example Calculation Visual BASIC program available completely program FS6131 based given parameters. Suppose that wish reconstruct pixel clock from source. This typical requirement projection panel application. First, establish total number pixel clocks desired between horizontal sync (HSYNC) pulses. number pixel clocks known horizontal total, feedback divider programmed that value. this example, choose horizontal total 800. Next, establish frequency HSYNC pulses (fHSYNC) line reference signal video mode. this case, fHSYNC=31.5kHz. output clock frequency fCLK calculated HSYNC 31.5kHz 25.175MHz LFTC XTUNE (optional) XCT[3:0], XLVTEN Control VCXO Divider XLROM[2:0] XLPDEN, XLSWAP CRYSTAL LOOP XLCP[1:0] VCXO XOUT (optional) Internal Loop Filter PhaseFrequency Detector EXTLF EXTLF STAT[1:0] RIPRG Charge Pump DOWN (optional) Reference HSYNC REFDIV[11:0] Lock Detect (fREF) REFDSRC POST3[1:0], POST2[1:0], POST1[1:0] CMOS LOCK/ IPRG (optional) Reference Divider (NR) MLCP[1:0] PDREF VCOSPD, OSCTYPE PDFBK PhaseFrequency Detector Charge Pump DOWN Voltage Controlled Oscillator Clock Gobbler OM[1:0] Post Divider (NPx) CMOS/PECL Output CLKP (fCLK) CLKN ADDR Feedback Divider (NF) Interface FBKDSRC[1:0] (fVCO) Registers MAIN LOOP FBKDIV[14:0] FS6131 Figure Block Diagram: Line-Locked Clock Generation Semiconductor Rev. 2.0, Jun. www.amis.com FS6131-01/FS6131-01g Programmable Line Lock Clock Generator However, 31.5kHz line reference signal frequency internal loop filter used. series combination 0.015mF capacitor 15kW resistor from power (VDD) EXTLF provides external loop filter. 100pF 220pF capacitor parallel with combination improve filter performance. best performance, program post divider modulus allow operate nominal frequency that least 70MHz less than 230MHz. frequency (fVCO) calculated HSYNC Setting post divider equal four (NPx=4) reasonable solution, although there number values that will work. keep 5000 avoid divider values from becoming large. These settings place frequency about 100MHz. Calculate ideal charge pump current (Ipump) pump HSYNC 15kHz AVCO where external loop filter series resistor, external loop filter series capacitor AVCO gain. gain either: AVCO=125MHz/V high range selected, AVCO=75MHz/V range selected. Table more information range. With fhsync=31.5kHz, Clf=0.015mF, Rlf=15kW, NF=800, NPx=4, AVCO=125MHz/V, charge pump current 39.3mA. 220pF across entire loop filter also helpful. 13.2 Example Programming generate pixel clocks between HSYNC pulses occurring line reference signal every 31.5kHz, program following (refer Figure 26): Clear OSCTYPE Turn crystal oscillator XLROM=7 inputs select feedback divider PDREF=1 PDFBK=0 feedback divider input select post divider FBKDSRC=0 feedback divider (NF) modulus (the desired number pixel clocks line) FBKDIV[14:0] NP1=4, NP2=1 NP3=1 combined post divider modulus NPx=4 POST1[1:0], POST2[1:0] POST3[1:0]. Select external loop filter EXTLF=1 XLVTEN=0 XLPDEN=1 disable VCXO fine tune crystal loop phase frequency detector VCOSPD=1 select speed range MLCP[1:0] select 32mA range output clock frequency fCLK 25.175MHz, with internal frequency 100.8MHz. Note that crystal loop unused this application. Semiconductor Rev. 2.0, Jun. www.amis.com FS6131-01/FS6131-01g Programmable Line Lock Clock Generator 14.0 Device Application: Genlocking Genlocking refers process synchronizing horizontal sync pulses (HSYNC) target graphics system HSYNC source graphics system. genlocked mode, FS6131 increases decreases) frequency until input frequency matched phase-aligned frequency applied input. Since feedback divider within graphics system graphics system source signal applied input FS6131, graphics system effectively synchronized input shown Figure configure FS6131 genlocking, input (pin input (pin switched directly onto feedback input PFD. reference feedback dividers used. output clock frequency HSYNC horizontal total only remaining task select post divider modulus (NPx) that allows frequency within nominal range. 14.1 Example Calculation Visual BASIC program available completely program FS6131 based given parameters. FS6131 being used genlock projection panel system card-generated HSYNC. total number pixel clocks generated card, known horizontal total, 800. Therefore, panel graphics system that clocked FS6131 divide output clock frequency (fCLK) 800. input HSYNC reference frequency (fHSYNC) 15kHz. LFTC XTUNE (optional) XCT[3:0], XLVTEN Control VCXO Divider XLROM[2:0] XLPDEN, XLSWAP CRYSTAL LOOP XLCP[1:0] VCXO XOUT (optional) Internal Loop Filter PhaseFrequency Detector EXTLF EXTLF STAT[1:0] RIPRG Charge Pump DOWN (optional) Reference HSYNC REFDIV[11:0] Lock Detect (fCLK REFDSRC POST3[1:0], POST2[1:0], POST1[1:0] CMOS LOCK/ IPRG (optional) Reference Divider MLCP[1:0] PDREF VCOSPD, OSCTYPE PDFBK PhaseFrequency Detector Charge Pump DOWN Voltage Controlled Oscillator Clock Gobbler OM[1:0] Post Divider (NPx) CMOS/PECL Output CLKP (fCLK CLKN ADDR Feedback Divider (NF) Interface FBKDSRC[1:0] (fVCO Registers FBKDIV[14:0] MAIN LOOP FS6131 System HSYNC Video Graphics System Clock Figure Block Diagram: Genlocking Semiconductor Rev. 2.0, Jun. www.amis.com FS6131-01/FS6131-01g Programmable Line Lock Clock Generator output clock frequency calculated 15kHz 12.0MHz best performance, program post divider (NPx) modulus allow operate nominal frequency that least 70MHz less than 230MHz. frequency (fVCO) calculated Selecting post divider modulus NPx=6 reasonable solution, although there number values that will work. keep 5000 avoid divider values from becoming large. settings place frequency about 72MHz. Calculate ideal charge pump current (Ipump) pump HSYNC 15kHz AVCO where external loop filter series resistor, external loop filter series capacitor AVCO gain. gain either AVCO=125MHz/V high range selected, AVCO=75MHz/V range selected. Table more information range. With fhsync=15kHz, Clf=0.015mF, Rlf=15kW, NF=800, NPx=6, AVCO=125MHz/V, charge pump current 24mA. 220pF across entire loop filter also helpful. 14.2 Example Programming generate pixel clocks between HSYNC pulses occurring line reference signal every 15kHz, program following (refer Figure 27): Clear OSCTYPE Turn crystal oscillator XLROM=7 inputs select pins PDREF=1 PDFBK=1 NP1=2, NP2=3 NP3=1 combined post divider modulus NPx=6 POST1[1:0], POST2[1:0] POST3[1:0]. Select external loop filter EXTLF=1 XLVTEN=0 XLPDEN=1 disable VCXO fine tune crystal loop phase frequency detector VCOSPD=1 select speed range MLCP[1:0] select 32mA range output clock frequency fCLK 12MHz, with internal frequency 72MHz. Note that crystal loop unused this application. Semiconductor Rev. 2.0, Jun. www.amis.com FS6131-01/FS6131-01g Programmable Line Lock Clock Generator 15.0 Device Application: Telecom Clock Regenerator FS6131 used clock regenerator shown Figure This mode uses VCXO phase-locked loop, referred crystal loop. VCXO provides "de-jittered" multiple reference frequency (usually 8kHz telecom applications) main loop. essence, crystal loop "cleans reference signal main loop. control VCXO divider preloaded with most common ratios permit locking most standard telecommunications crystals 8kHz signal applied pin. de-jittered multiple reference frequency from VCXO then supplied reference divider main loop. reference divider, along with feedback divider, programmed achieve desired output clock frequency. 15.1 Example Calculation Visual BASIC program available completely program FS6131 based given parameters. this example, 8kHz reference frequency supplied FS6131 output clock frequency 51.84MHz desired. First, select frequency which VCXO will operate from Table table shows external crystal frequency options available choose from, since VCXO runs crystal frequency. While main loop programmed work with frequencies table, best performance will achieved with highest frequency main loop PFD. frequency main loop (fMLpfd) VCXO frequency (fVCXO) divided main loop reference divider (NR). MLpfd VCXO LFTC XTUNE (optional) XCT[3:0], XLVTEN Control VCXO Divider XLROM[2:0] XLPDEN, XLSWAP CRYSTAL LOOP XLCP[1:0] VCXO XOUT (optional) Internal Loop Filter PhaseFrequency Detector EXTLF EXTLF STAT[1:0] RIPRG Charge Pump DOWN (optional) 8kHz (typical) Lock Detect REFDIV[11:0] CMOS LOCK/ IPRG (optional) (fREF) REFDSRC Reference Divider (NR) MLCP[1:0] PDREF VCOSPD, OSCTYPE POST3[1:0], POST2[1:0], POST1[1:0] PDFBK PhaseFrequency Detector Charge Pump DOWN Voltage Controlled Oscillator Clock Gobbler OM[1:0] Post Divider (NPx) CMOS/PECL Output CLKP (fCLK) CLKN ADDR Feedback Divider (NF) Interface FBKDSRC[1:0] (fVCO) Registers MAIN LOOP FBKDIV[14:0] FS6131 Figure Block Diagram: Telecom Clock Generator Semiconductor Rev. 2.0, Jun. www.amis.com FS6131-01/FS6131-01g Programmable Line Lock Clock Generator goal choose highest crystal frequency from Table that generates smallest value equation establishing output frequency (fCLK) function input VCXO frequency VCXO where feedback divider modulus. Choose different crystal frequencies from Table factor both input VCXO output clock frequencies into prime numbers. Look factors that will give smallest modulus with largest FVCXO. output VCXO frequencies reduced factors from Eqn. Table Table Clock Regenerator Example VCXO Frequency From Table (fVCXO, MHz) VCXO 20.00 51840000 20000000 51840000 19440000 51840000 25248000 51840000 24576000 19.44 25.248 24.576 19.44MHz crystal provides smallest modulus (NR=3) with highest crystal frequency. Finally, choose post divider (NPx) modulus that keeps frequency most comfortable range. frequency (fVCO) calculated Selecting overall modulus NPx=3 sets frequency 155.52MHz when loop locked. 15.2 Example Programming generate de-jittered output frequency 51.84MHz from 8kHz reference, program following (refer Figure 28): Program VCXO control XLROM[2:0] select external 19.44MHz crystal Enable VCXO fine tune XLVTEN=1 Enable crystal loop XLPDEN=0 XLSWAP=0 reference divider input select VCXO REFDSRC input select reference divider feedback divider PDREF PDFBK reference divider (NR) modulus REFDIV[11:0] feedback divider input select FBKDSRC feedback divider (NF) modulus FBKDIV[14:0] NP1=1, NP2=3 NP3=1 combined post divider modulus NPx=3 POST1[1:0], POST2[1:0] POST3[1:0]. Semiconductor Rev. 2.0, Jun. www.amis.com FS6131-01/FS6131-01g Programmable Line Lock Clock Generator Select internal loop filter EXTLF VCOSPD=0 select high speed range These settings provide highest frequency main loop phase frequency detector 6.48MHz. 19.44MHz crystal requires that XLROM[2:0] three shown Table 16.0 Company Product Inquiries more information about Semiconductor, technology product, visit site http://www.amis.com. North America Tel: +1.208.233.4690 Fax: +1.208.234.6795 Europe Tel: 55.33.22.11 Fax: 55.31.81.12 Devices sold AMIS covered warranty patent indemnification provisions appearing Terms Sale only. AMIS makes warranty, express, statutory, implied description, regarding information forth herein regarding freedom described devices from patent infringement. AMIS makes warranty merchantability fitness purposes. AMIS reserves right discontinue production change specifications prices time without notice. Semiconductor's products intended commercial applications. Applications requiring extended temperature range, unusual environmental requirements, high reliability applications, such military, medical lifesupport life-sustaining equipment, specifically recommended without additional processing AMIS such applications. licensed trademark Philips Electronics, N.V. Windows Windows registered trademarks Microsoft Corporation. AMIS reserves right change detail specifications required permit improvements design product. Copyright ©2005 Semiconductor, Inc. Purchase components Semiconductor, sub-licensed Associated Companies conveys license under Philips Patent Rights these components system, provided that system conforms Standard Specification defined Philips. 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