Long Networks General Description AMIS-42675 transceiver interfac

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AMIS-42675 High-Speed Power Transceiver
Long Networks General Description
AMIS-42675 transceiver interface between controller area network (CAN) protocol controller physical bus. used both systems. transceiver provides differential transmit capability differential receive capability controller. AMIS-42675 power member high-speed transceiver family offers following additional features: Ideal passive behaviour when supply voltage removed Wake-up over Extremely current standby mode
wide common-mode voltage range receiver inputs, AMIS-42675 able reach outstanding levels electromagnetic susceptibility (EMS). Similarly, extremely electromagnetic emission (EME) achieved excellent matching output signals. AMIS-42675 industrial version AMIS-42665 primarily applications where long network lengths mandatory. Examples elevators, in-building networks, process control trains. cope with long delay communication speed needs low. AMIS-42675 allows transmit data rates down Kbit/s lower.
Features
Compatible with 11898 standard (ISO 11898-2, 11898-5 J2284) Wide range communication speed Mbit/s) Ideally suited industrial automotive applications Allows transmit data rate networks exceeding Extremely current standby mode with wake-up electromagnetic emission (EME): common-mode choke longer required Differential receiver with wide common-mode range (+/- 35V) high Voltage source VSPLIT stabilizing recessive level (further improvement) disturbance lines with un-powered node Thermal protection pins protected against transients Power down mode which transmitter disabled VSPLIT pins short circuit proof supply voltage ground Logic level inputs compatible with 3.3V devices least nodes connected same
Ordering Information
Table Ordering Information Ordering Code (Tubes) 0ICAA-001-XTD
Ordering Code (Tape) 0ICAA-001-XTP
Marketing Name AMIS 42675AGA
Package SOIC-8 GREEN
Temp. Range -40°C.125°C
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AMIS-42675 High-Speed Power Transceiver
Long Networks Technical Characteristics
Table Technical Characteristics Symbol Parameter Power supply voltage VSTB voltage VTxD voltage VRxD voltage VCANH voltage CANH VCANL voltage CANL VSPLIT voltage VSPLIT VO(dif)(bus_dom) Differential output voltage dominant state CM-range Input common-mode range comparator VCM-peak Cload tpd(rec-dom) pd(dom-rec) VCM-step Tjunc Common-mode peak Load capacitance outputs Propagation delay Propagation delay Common-mode step Junction temperature
Conditions
5.25V; time limit 5.25V; time limit 5.25V; time limit 42.5 Guaranteed differential receiver threshold leakage current Note Figure Figure Note
Min. 4.75 -0.3 -0.3 -0.3 -500 -150
Max. 5.25
Unit
Note: parameters VCM-peak VCM-step guarantee EME.
Block Diagram
AMIS- 42675
CANH VSPLIT CANL
Thermal shutdown
SPLIT
Mode wake control
Driver control
Wake Filter
COMP
COMP
PC20071005.2
Figure Block Diagram
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AMIS-42675 High-Speed Power Transceiver
Long Networks Typical Application
Application Schematic
VBAT
5V-reg
CANH
controller
AMIS42675
VSPLIT
CANL
PC20071005.3
Figure Application Diagram
Description
CANH CANL VSPLIT
AMIS42675
Figure Configuration
PC20071005.1
Table Name VSPLIT CANL CANH
Description Transmit data input; input dominant driver; internal pull-up current Ground Supply voltage Receive data output; dominant transmitter output Common-mode stabilization output Low-level line (low dominant mode) High-level line (high dominant mode) Stand-by mode control input
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AMIS-42675 High-Speed Power Transceiver
Long Networks Functional Description
Operating Modes AMIS-42675 provides modes operation illustrated Table These modes selectable through STB.
Table Operating Modes
Mode High recessive wake-up request detected
Normal Standby
High
dominant Wake-up request detected
7.1.1. Normal Mode normal mode, transceiver able communicate lines. signals transmitted received controller pins RxD. slopes lines outputs optimized give extremely EME. 7.1.2. Stand-by Mode stand-by mode both transmitter receiver disabled very low-power differential receiver monitors lines activity. lines terminated ground supply current reduced minimum, typically 10µA. When wake-up request detected low-power differential receiver, signal first filtered then verified valid wake signal after time period tBUS, driven transceiver inform controller wake-up request. Split Circuit VSPLIT operational only normal mode. standby mode this floating. VSPLIT connected shown Figure purpose provide stabilized voltage avoiding possible steps common-mode signal therefore reducing EME. These unwanted steps could caused un-powered node network with excessive leakage current from that shifts recessive voltage from nominal voltage. Wake-up Once valid wake-up (dominant state longer than tBUS) been received during standby mode driven low. Over-temperature Detection thermal protection circuit protects from damage switching transmitter junction temperature exceeds value approximately 160°C. Because transmitter dissipates most power, power dissipation temperature reduced. other functions continue operate. transmitter off-state resets when goes high. thermal protection circuit particularly needed when line short circuits. High Communication Speed Range transceiver primarily intended industrial applications. allows very baud rates needed long length applications. also high speed communication possible 1Mbit/s. Fail Safe Features current-limiting circuit protects transmitter output stage from damage caused accidental short circuit either positive negative supply voltage, although power dissipation increases during this fault condition. pins CANH CANL protected from automotive electrical transients (according 7637; Figure Pins pulled high internally should input become disconnected. Pins TxD, will floating, preventing reverse supply should supply removed.
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AMIS-42675 High-Speed Power Transceiver
Long Networks Electrical Characteristics
Definitions
voltages referenced (pin Positive currents flow into Sinking current means current flowing into pin; sourcing current means current flowing pin. Absolute Maximum Ratings Stresses above those listed following table cause permanent device failure. Exposure absolute maximum ratings extended periods affect device reliability.
Table Absolute Maximum Ratings Symbol Parameter Supply voltage voltage CANH VCANH voltage CANL VCANL voltage VSPLIT VSPLIT voltage VTxD voltage VRxD voltage VSTB Transient voltage CANH Vtran(CANH) Transient voltage CANL Vtran(CANL) Transient voltage VSPLIT Vtran(VSPLIT)
Conditions Min. -0.3 -0.3 -0.3 -0.3 -300 -300 -300 Max. +300 +300 +300 Unit
5.25V; time limit 5.25V; time limit 5.25V; time limit
Note Note Note Note Note Note
Vesd(
Latch-up
Electrostatic discharge voltage pins Static latch-up pins Storage temperature Ambient temperature Maximum junction temperature
-750
Tstg Tamb Tjunc
+750 +150 +125 +170
Notes: Applied transient waveforms accordance with 7637 part test pulses (see Figure Standardized human body model electrostatic discharge (ESD) pulses accordance MIL883 method 3015.7. Static latch-up immunity: Static latch-up protection level when tested according EIA/JESD78. Standardized charged device model pulses when tested according EOS/ESD DS5.3-1993.
Thermal Characteristics
Table Thermal Characteristics Symbol Parameter Thermal resistance from junction ambient package Rth(vj-a) Thermal resistance from junction substrate bare Rth(vj-s)
Conditions free free
Value
Unit
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AMIS-42675 High-Speed Power Transceiver
Long Networks
Characteristics 4.75 5.25V; Tjunc +150°C; unless specified otherwise.
Table Characteristics Symbol Parameter Supply (pin VCC) Supply current Supply current standby mode Transmitter Data Input (pin TxD) High-level input voltage Low-level input voltage High-level input current Low-level input current Input capacitance Transmitter Mode Select (pin STB) High-level input voltage Low-level input voltage High-level input current Low-level input current Input capacitance Receiver Data Output (pin RxD) High-level output voltage Low-level output voltage High-level output current Low-level output current Lines (pins CANH CANL) Recessive voltage Vo(reces) (norm)
Conditions Min. Typ. Max.
Unit
ICCS
Dominant; VTxD Recessive; VTxD Tjunc,max 100°C Output recessive Output dominant -0.3 -0.3 -100 -2.5 -2.5 -120 0.40
-200
+0.8 -350 +0.8 0.75 0.45 +2.5 +2.5 4.25 1.75 -120 1.00
VTxD =VCC VTxD
tested Standby mode Normal mode
VSTB =VCC VSTB
tested
IRXD -10mA IRXD VTxD VCC; load normal mode VTxD VCC; load standby mode -35V <VCANH< +35V; <VCC 5.25V -35V <VCANL +35V; <VCC 5.25V VTxD VTxD VTxD dominant; 42.5 VTxD VCC; recessive; load VCANH VTxD VCANL 36V; VTxD <VCANL +12V; <VCANH +12V; -35V <VCANL +35V; -35V <VCANH +35V; -35V <VCANL +35V; -35V <VCANH +35V;
0.25 2.25 3.75
Vo(reces) (stby) Io(reces) (CANH) Io(reces) (CANL) Vo(dom) (CANH) Vo(dom) (CANL) Vo(dif) (bus_dom) Vo(dif) (bus_rec) Io(sc) (CANH) Io(sc) (CANL) Vi(dif) (th) Vihcm(dif) (th) Vi(dif) (hys) Ri(cm) (CANH) Ri(cm) (CANL) Ri(cm) Ri(dif) Ci(CANH) Ci(CANL) Ci(dif)
Recessive voltage Recessive output current CANH Recessive output current CANL Dominant output voltage CANH Dominant output voltage CANL Differential output voltage (VCANH VCANL) Differential output voltage (VCANH VCANL) Short circuit output current CANH Short circuit output current CANL Differential receiver threshold voltage (see Figure Differential receiver threshold voltage high common-mode (see Figure Differential receiver input voltage hysteresis (see Figure Common-mode input resistance CANH Common-mode input resistance CANL Matching between CANH CANL common mode input resistance Differential input resistance Input capacitance CANH Input capacitance CANL Differential input capacitance
VCANH VCANL VTxD VCC; tested VTxD VCC; tested VTxD VCC; tested
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AMIS-42675 High-Speed Power Transceiver
Long Networks
Table Characteristics (continued) Symbol Parameter Common-mode Stabilization (pin VSPLIT) Reference output voltage VSPLIT VSPLIT VSPLIT leakage current VSPLIT limitation current Power-on-Reset (POR) PORL level
Conditions
Min.
Typ.
Max.
Unit
ISPLIT(i) ISPLIT(lim)
Normal mode; -500µA ISPLIT 500µA Stand-by mode Normal mode CANH, CANL, Vref tristate below level
Thermal Shutdown Shutdown junction temperature Tj(sd) Timing Characteristics (see Figure Figure Delay active td(TxD-BUSon)
td(TxD-BUSoff) td(BUSon-RXD) td(BUSoff-RXD) tpd(rec-dom) td(dom-rec) td(stb-nm) tdbus
Delay inactive Delay active Delay inactive Propagation delay from recessive dominant Propagation delay from dominant recessive Delay standby mode normal mode Dominant time wake-up
100pF between CANH CANL 100pF between CANH CANL Crxd 15pF Crxd 15pF 100pF between CANH CANL 100pF between CANH CANL
0.75
Measurement Set-ups Definitions
CANH VSPLIT
AMIS42675
Transient Generator
CANL
PC20071006.1
Figure Test Circuit Transients
VRxD High
Hysteresis PC20040829.7
Figure Hysteresis Receiver
Vi(dif)(hys)
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AMIS-42675 High-Speed Power Transceiver
Long Networks
CANH VSPLIT
AMIS42675
CANL
PC20071006.2
Figure Test Circuit Timing Characteristics
HIGH
CANH
CANL
dominant
Vi(dif) VCANH VCANL
0,9V
0,5V recessive
td(TxD-BUSon) tpd(rec-dom)
td(TxD-BUSoff) td(BUSon-RxD) tpd(dom-rec) td(BUSoff-RxD)
PC20040829.6
Figure Timing Diagram Characteristics
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AMIS-42675 High-Speed Power Transceiver
Long Networks
CANH
Active Probe
Generator
AMIS42675
CANL
Spectrum Anayzer
VSPLIT
PC20071006.3
Figure Basic Test Set-up
Figure Measurements
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AMIS-42675 High-Speed Power Transceiver
Long Networks Package Outline
SOIC-8: Plastic small outline; leads; body width 150mil. AMIS reference: SOIC150
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AMIS-42675 High-Speed Power Transceiver
Long Networks 10.0 Soldering
10.1 Introduction Soldering Surface Mount Packages
This text gives very brief insight complex technology. more in-depth account soldering found AMIS "Data Handbook IC26; Integrated Circuit Packages" (document order number 9398 90011). There soldering method that ideal surface mount packages. Wave soldering always suitable surface mount ICs, printed-circuit boards (PCBs) with high population densities. these situations re-flow soldering often used.
10.2 Re-flow Soldering
Re-flow soldering requires solder paste suspension fine solder particles, flux binding agent) applied screen printing, stencilling pressure-syringe dispensing before package placement. Several methods exist re-flowing; example, infrared/convection heating conveyor type oven. Throughput times (preheating, soldering cooling) vary between seconds depending heating method. Typical re-flow peak temperatures range from 250°C. top-surface temperature packages should preferably kept below 230°C.
10.3 Wave Soldering
Conventional single wave soldering recommended surface mount devices (SMDs) PCBs with high component density, solder bridging non-wetting present major problems. overcome these problems double-wave soldering method specifically developed. wave soldering used following conditions must observed optimal results: double-wave soldering method comprising turbulent wave with high upward pressure followed smooth laminar wave. packages with leads sides pitch (e): Larger than equal 1.27mm, footprint longitudinal axis preferred parallel transport direction PCB; Smaller than 1.27mm, footprint longitudinal axis must parallel transport direction PCB. footprint must incorporate solder thieves downstream end. packages with leads four sides, footprint must placed angle transport direction PCB. footprint must incorporate solder thieves downstream side corners. During placement before soldering, package must fixed with droplet adhesive. adhesive applied screen printing, transfer syringe dispensing. package soldered after adhesive cured. Typical dwell time four seconds 250°C. mildly-activated flux will eliminate need removal corrosive residues most applications.
10.4 Manual Soldering
component first soldering diagonally-opposite leads. voltage (24V less) soldering iron applied flat part lead. Contact time must limited seconds 300°C. When using dedicated tool, other leads soldered operation within five seconds between 320°C.
Table Soldering Method
Package Soldering Method Wave suitable suitable Suitable (3)(4) recommended recommended Re-flow Suitable Suitable Suitable Suitable Suitable
BGA, SQFP HLQFP, HSQFP, HSOP, HTSSOP, PLCC LQFP, QFP, TQFP SSOP, TSSOP,
Notes: surface mount (SMD) packages moisture sensitive. Depending upon moisture content, maximum temperature (with respect time) body size package, there risk that internal external package cracks occur vaporization moisture them (the called popcorn effect). details, refer Drypack information Data Handbook IC26; Integrated Circuit Packages; Section: Packing Methods. These packages suitable wave soldering solder joint between heatsink bottom version) achieved, solder stick heatsink version). wave soldering considered, then package must placed angle solder wave direction. package footprint must incorporate solder thieves downstream side corners. Wave soldering only suitable LQFP, TQFP packages with pitch equal larger than 0.8mm; definitely suitable packages with pitch equal smaller than 0.65mm. Wave soldering only suitable SSOP TSSOP packages with pitch equal larger than 0.65mm; definitely suitable packages with pitch equal smaller than 0.5mm.
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AMIS-42675 High-Speed Power Transceiver
Long Networks 11.0 Company Product Inquiries
more information about Semiconductor, technology products, visit site http://www.amis.com.
12.0 Revision History
Date October 2007 Revision Change Initial release
Devices sold AMIS covered warranty patent indemnification provisions appearing Terms Sale only. AMIS makes warranty, express, statutory, implied description, regarding information forth herein regarding freedom described devices from patent infringement. AMIS makes warranty merchantability fitness purposes. AMIS reserves right discontinue production change specifications prices time without notice. Semiconductor's products intended commercial applications. Applications requiring extended temperature range, unusual environmental requirements, high reliability applications, such military, medical life-support life-sustaining equipment, specifically recommended without additional processing AMIS such applications. Copyright ©2007 Semiconductor, Inc.
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Long Networks General Description AMIS-42675 transceiver interfac

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