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Long Networks Introduction AMIS-42673 transceiver interface betwe


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AMIS-42673 High Speed Transceiver
Long Networks Introduction
AMIS-42673 transceiver interface between controller area network (CAN) protocol controller physical bus. used both systems. digital interface level powered from 3.3V supply providing true voltage levels 3.3V controllers. transceiver provides differential transmit capability differential receive capability controller. wide common-mode voltage range receiver inputs, AMIS-42673 able reach outstanding levels electromagnetic susceptibility (EMS). Similarly, extremely electromagnetic emission (EME) achieved excellent matching output signals. AMIS-42673 primarily intended applications where long network lengths mandatory. Examples elevators, in-building networks, process control trains. cope with long delay communication speed needs low. AMIS-42673 allows transmit data rates down kbit/s lower.
Features
True 3,3V 5,0V logic level interface Fully compatible with "ISO 11898-2" standard Wide range communication speed 1Mbit/s) Allows transmit data rate networks exceeding Ideally suited applications electromagnetic emission (EME). Common-mode-choke longer required Differential receiver with wide common-mode range (+/- 35V) high electromagnetic susceptibility (EMS) disturbance lines with un-powered node Thermal protection pins protected against transients Short circuit proof supply voltage ground protection
Technical Characteristics
Table Technical Characteristics Symbol Parameter voltage CANH VCANH voltage CANL VCANL Differential output voltage Vi(dif)(bus_dom) dominant state tpd(rec-dom) Propagation delay Propagation delay tpd(dom-rec) Input common-mode range CM-range comparator
Conditions 5.25V; time limit 5.25V; time limit 42.5 Figure Figure Guaranteed differential receiver threshold leakage current Figure Figure (Note Figure Figure (Note
-500 -150
Unit
VCM-peak VCM-step
Common-mode peak Common-mode step
Note parameters VCM-peak VCM-step guarantee EME.
Ordering Information
Ordering Code (Tubes) 0ICAG-001-XTD Ordering Code (Tape) 0ICAG-001-XTP Marketing Name AMIS 42673AGA Package SOIC-8 GREEN Temp. Range -40°C.125°C
Semiconductor October Rev. www.amis.com
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AMIS-42673 High Speed Transceiver
Long Networks Block Diagram
AMIS-42673
Thermal shutdown
Driver control
CANH CANL
VREF
COMP
Ri(cm)
Vcc/2
Ri(cm)
PC20071003.2
Figure Block Diagram
Typical Application
Application Schematic
VBAT
5V-reg
3.3Vreg
CANH VREF CANL
controller
PC20071003.3
AMIS42673
Figure Application Diagram
Semiconductor October Rev. www.amis.com
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AMIS-42673 High Speed Transceiver
Long Networks
Description 6.2.1. (top view)
CANH CANL VREF
AMIS42673
Figure Configuration
PC20071003.1
6.2.2. Description
Table Name VREF CANL CANH
Description Transmit data input; input dominant driver; internal pull-up current Ground Supply voltage Receive data output; dominant transmitter output Reference voltage output LOW-level line (low dominant mode) HIGH-level line (high dominant mode) 3.3V supply digital
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AMIS-42673 High Speed Transceiver
Long Networks Functional Description
General
AMIS-42673 interface between protocol controller physical bus. intended industrial automotive applications requiring baud rates 1Mbit/s. provides differential transmit capability differential receiver capability protocol controller. fully compatible "ISO 11898-2" standard. Operating Modes AMIS-42673 only operates high-speed mode illustrated Table transceiver able communicate lines. signals transmitted received controller pins RxD. slopes lines outputs optimised give extremely EME.
Table Functional table AMIS-42673; don't care CANH 4.75 5.25.V High 4.75 5.25.V floating) VCC/2 VCC<PORL (unpowered) 0V<CANH<VCC PORL<VCC<4.75V 0V<CANH<VCC
CANL VCC/2 0V<CANL<VCC 0V<CANL<VCC
state Dominant Recessive Recessive Recessive
Over-temperature Detection thermal protection circuit protects from damage switching transmitter junction temperature exceeds value approximately 160°C. Because transmitter dissipates most power, power dissipation temperature reduced. other functions continue operate. transmitter off-state resets when goes HIGH. thermal protection circuit particularly needed when line short circuits. High Communication Speed Range transceiver primarily intended industrial applications. allows very baud rates needed long length applications. also high speed communication possible 1Mbit/s. Fail-safe Features current-limiting circuit protects transmitter output stage from damage caused accidental short-circuit either positive negative supply voltage although power dissipation increases during this fault condition. pins CANH CANL protected from automotive electrical transients (according "ISO 7637"; Figure Should become disconnected, this pulled high internally. When supply removed, pins will floating. This prevents AMIS-42673 from being supplied controller through pins. 3.3V Interface AMIS-42673 used interface with 3.3V controllers pin. This supplied with 3.3V have corresponding digital interface voltage levels. When supplied 2.5V, even interfacing with 2.5V controllers possible. also Digital Output Characteristics 2.5V, Table this case pull-up resistor from necessary.
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AMIS-42673 High Speed Transceiver
Long Networks Electrical Characteristics
Definitions
voltages referenced (pin Positive currents flow into Sinking current means that current flowing into pin. Sourcing current means that current flowing pin. Absolute Maximum Ratings Stresses above those listed Table cause permanent device failure. Exposure absolute maximum ratings extended periods effect device reliability.
Table Absolute Maximum Ratings Symbol Parameter Supply voltage interface voltage voltage CANH VCANH voltage CANL VCANL voltage VTxD voltage VRxD VREF voltage VREF Transient voltage CANH Vtran(CANH) Transient voltage CANL Vtran(CANL) Transient voltage VREF Vtran(VREF) Electrostatic discharge voltage Vesd(CANL/CANH) CANH CANL Electrostatic discharge voltage Vesd other pins Latch-up Static latch-up pins Storage temperature Tstg Ambient temperature Tamb Maximum junction temperature Tjunc
Notes: Applied transient waveforms accordance with "ISO 7637 part test pulses (see Figure Standardized human body model system pulses accordance 1000.4.2. Standardized human body model pulses accordance MIL883 method 3015. Supply ±4kV. Static latch-up immunity: static latch-up protection level when tested according EIA/JESD78. Standardized charged device model pulses when tested according EOS/ESD DS5.3-1993.
Conditions
5.25V; time limit 5.25V; time limit
Note Note Note Note Note Note Note Note
Min. -0.3 -0.3 -0.3 -0.3 -0.3 -150 -150 -150 -500 -250
Max. +150 +150 +150 +500 +250 +155 +125 +150
Unit
Thermal Characteristics
Table Thermal Characteristics Symbol Parameter Thermal resistance from junction ambient package Rth(vj-a) Thermal resistance from junction substrate bare Rth(vj-s)
Conditions free free
Value
Unit
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AMIS-42673 High Speed Transceiver
Long Networks
Characteristics
4.75 5.25V; 2.9V 3.6V; Tjunc +150 unless specified otherwise Table Characteristics Symbol Parameter Supply (pin V33)
Conditions
Min.
Typ.
Max.
Unit
Supply current interface current interface current
Dominant; VTXD Recessive; VTXD 3.3V; 20pF; recessive 3.3V; 20pF; 1Mbps Output recessive Output dominant VTxD VTxD -0.3 0.45 0.40 -2.5 -2.5 -120
Transmitter Data Input (pin TxD) HIGH-level input voltage LOW-level input voltage HIGH-level input current LOW-level input current Input capacitance Receiver Data Output (pin RxD)
-200 0.75 0.18 0.50 0.50 2.25
+0.8 -300
HIGH-level output voltage
IRXD 10mA IRXD VRxD VRxD 0.45V
-50µA IVREF +50µA -35V VCANH +35V; -35V VCANL +35V
LOW-level output voltage HIGH-level output current LOW-level output current Reference Voltage Output (pin VREF)
0.35 0.55 0.60 +2.5 +2.5 4.25 1.75
VREF VREF_CM
Reference output voltage
Reference output voltage full commonmode range Lines (pins CANH CANL) Recessive voltage CANH Vo(reces)(CANH) Recessive voltage CANL Vo(reces)(CANL)
Io(reces) (CANH) Io(reces) (CANL) Vo(dom) (CANH) Vo(dom) (CANL) Vi(dif) (bus) Io(sc) (CANH) Io(sc) (CANL) Vi(dif)(th) Vihcm(dif) (th) Vi(dif) (hys) Ri(cm)(CANH) Ri(cm) (CANL) Ri(cm)(m) Ri(dif)
Recessive output current CANH Recessive output current CANL Dominant output voltage CANH Dominant output voltage CANL Differential input voltage (VCANH VCANL) Short circuit output current CANH Short circuit output current CANL Differential receiver threshold voltage
Differential receiver threshold voltage high common-mode Differential receiver input voltage hysteresis Common-mode input resistance CANH Common-mode input resistance CANL Matching between CANH CANL common-mode input resistance Differential input resistance
5.25V -35V VCANL +35V; 5.25V VTxD VTxD VTxD dominant; 42.5 VTxD VCC; recessive; load VCANH 0V;VTxD VCANL 36V; VTxD VCANL +12V; VCANH +12V; Figure -35V VCANL +35V; -35V VCANH +35V; Figure -35V VCANL +35V; -35V VCANH +35V; Figure
VTxD VCC; load VTxD VCC; load -35V VCANH +35V;
0.25
1.05
VCANH VCANL
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AMIS-42673 High Speed Transceiver
Long Networks
Table Characteristics (Continued) Symbol Parameter Lines (pins CANH CANL) Input capacitance CANH Ci(CANH) Input capacitance CANL Ci(CANL) Differential input capacitance Ci(dif) Input leakage current CANH ILI(CANH) Input leakage current CANL ILI(CANL) Common-mode peak during transition from VCM-peak Difference common-mode between VCM-step dominant recessive state Power Reset PORL level
Conditions Min. Typ. Max.
Unit
VTxD VCC; tested VTxD VCC; tested VTxD VCC; tested VCANH VCANL
Figure Figure Figure Figure CANH, CANL, Vref tristate below level
-500 -150
3.75
Thermal Shutdown shutdown junction temperature Tj(sd) Timing Characteristics (see Figures Delay active td(TxD-BUSon) Delay inactive td(TxD-BUSoff) Delay active td(BUSon-RxD) Delay inactive td(BUSoff-RxD) Propagation delay from tpd(rec-dom) recessive dominant Propagation delay from td(dom-rec) dominant recessive
Note: tested
4.75 5.25V; 2.5V Tjunc +150 unless specified otherwise.
Table Digital Output Characteristics 2.5V Symbol Parameter Receiver Data Output (pin RxD) HIGH-level output current LOW-level output current
Conditions Min. Typ. Max. Unit
-2.6
Measurement Set-ups Definitions
+3.3
CANH VREF
AMIS42673
Transient Generator
CANL
PC20071003.4
Figure Test Circuit Automotive Transients
Semiconductor October Rev.
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AMIS-42673 High Speed Transceiver
Long Networks
VRxD High
Hysteresis PC20040829.7
Vi(dif)(hys)
Figure Hysteresis Receiver
+3.3
CANH VREF
AMIS42673
CANL
PC20071003.5
Figure Test Circuit Timing Characteristics
HIGH
CANH
CANL
dominant
Vi(dif) VCANH VCANL
0,9V
0,5V recessive
td(TxD-BUSon) tpd(rec-dom)
td(TxD-BUSoff) td(BUSon-RxD) tpd(dom-rec) td(BUSoff-RxD)
PC20040829.6
Figure Timing Diagram Characteristics
Semiconductor October Rev.
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AMIS-42673 High Speed Transceiver
Long Networks
+3.3
CANH
Active Probe
Generator
AMIS42673
CANL
Spectrum Anayzer
VREF
PC20071003.6
Figure Basic Test Set-up Electromagnetic Measurement
CANH
CANL
recessive
Vi(com) VCANH VCANL VCM-peak
VCM-step
VCM-peak
PC20040829.7
Figure Common-mode Voltage Peaks (see measurement set-up Figure
Semiconductor October Rev.
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Specifications subject change without notice
AMIS-42673 High Speed Transceiver
Long Networks Package Outline
SOIC-8: Plastic small outline; leads; body width mil; JEDEC: MS-012
Semiconductor October Rev.
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AMIS-42673 High Speed Transceiver
Long Networks 10.0 Soldering
10.1 Introduction Soldering Surface Mount Packages
This text gives very brief insight complex technology. more in-depth account soldering found AMIS "Data Handbook IC26; Integrated Circuit Packages" (document order number 9398 90011). There soldering method that ideal surface mount packages. Wave soldering always suitable surface mount ICs, printed-circuit boards (PCB) with high population densities. these situations re-flow soldering often used. 10.2 Re-flow Soldering Reflow soldering requires solder paste suspension fine solder particles, flux binding agent) applied screen printing, stencilling pressure-syringe dispensing before package placement. Several methods exist re-flowing; example, infrared/convection heating conveyor type oven. Throughput times (preheating, soldering cooling) vary between seconds depending heating method. Typical reflow peak temperatures range from 250°C. top-surface temperature packages should preferably kept below 230°C. 10.3 Wave Soldering Conventional single wave soldering recommended surface mount devices (SMDs) PCBs with high component density, solder bridging non-wetting present major problems. overcome these problems double-wave soldering method specifically developed. wave soldering used following conditions must observed optimal results: double-wave soldering method comprising turbulent wave with high upward pressure followed smooth laminar wave. packages with leads sides pitch (e): Larger than equal 1.27mm, footprint longitudinal axis preferred parallel transport direction PCB; Smaller than 1.27mm, footprint longitudinal axis must parallel transport direction PCB. footprint must incorporate solder thieves downstream end. packages with leads four sides, footprint must placed angle transport direction PCB. footprint must incorporate solder thieves downstream side corners. During placement before soldering, package must fixed with droplet adhesive. adhesive applied screen printing, transfer syringe dispensing. package soldered after adhesive cured. Typical dwell time four seconds 250°C. mildly-activated flux will eliminate need removal corrosive residues most applications. 10.4 Manual Soldering component first soldering diagonally-opposite leads. voltage (24V less) soldering iron applied flat part lead. Contact time must limited seconds 300°C. When using dedicated tool, other leads soldered operation within five seconds between 320°C.
Table Soldering Process
Package Soldering Method Wave suitable suitable Suitable (3)(4) recommended recommended Re-flow Suitable Suitable Suitable Suitable Suitable
BGA, SQFP HLQFP, HSQFP, HSOP, HTSSOP, PLCC LQFP, QFP, TQFP SSOP, TSSOP,
Notes surface mount (SMD) packages moisture sensitive. Depending upon moisture content, maximum temperature (with respect time) body size package, there risk that internal external package cracks occur vaporization moisture them (the called popcorn effect). details, refer drypack information "Data Handbook IC26; Integrated Circuit Packages; Section: Packing Methods." These packages suitable wave soldering solder joint between heatsink bottom version) achieved, solder stick heatsink version). wave soldering considered, then package must placed angle solder wave direction. package footprint must incorporate solder thieves downstream side corners. Wave soldering only suitable LQFP, TQFP packages with pitch equal larger than 0.8mm; definitely suitable packages with pitch equal smaller than 0.65mm. Wave soldering only suitable SSOP TSSOP packages with pitch equal larger than 0.65mm; definitely suitable packages with pitch equal smaller than 0.5mm.
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AMIS-42673 High Speed Transceiver
Long Networks 11.0 Company Product Inquiries
more information about Semiconductor's Industrial Transceivers, visit site http://www.amis.com.
12.0 Revision History
Date October 2007 Revision Change Initial release
Devices sold AMIS covered warranty patent indemnification provisions appearing Terms Sale only. AMIS makes warranty, express, statutory, implied description, regarding information forth herein regarding freedom described devices from patent infringement. AMIS makes warranty merchantability fitness purposes. AMIS reserves right discontinue production change specifications prices time without notice. Semiconductor's products intended commercial applications. Applications requiring extended temperature range, unusual environmental requirements, high reliability applications, such military, medical life-support life-sustaining equipment, specifically recommended without additional processing AMIS such applications. Copyright ©2007 Semiconductor, Inc.
Semiconductor October Rev.
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Specifications subject change without notice

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