Long Networks AMIS-42671 transceiver with autobaud interface betw

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AMIS-42671 High-Speed Transceiver
Long Networks
AMIS-42671 transceiver with autobaud interface between controller area network (CAN) protocol controller physical bus. used both systems. transceiver provides differential transmit capability differential receive capability controller. wide common-mode voltage range receiver inputs, AMIS42671 able reach outstanding levels electromagnetic susceptibility (EMS). Similarly, extremely electromagnetic emission (EME) achieved excellent matching output signals. AMIS-42671 primarily intended industrial network applications where long network lengths mandatory. Examples elevators, in-building networks, process control trains. cope with long delay communication speed needs low. AMIS-42671 allows transmit data rates down Kbit/s lower. autobaud function allows controller determine incoming baud rate without influencing communication bus.
Features
Fully compatible with 11898-2 standard Autobaud function Wide range communication speed Mbit/s) Allows transmit data rate networks exceeding Ideally suited industrial automotive applications electromagnetic emission (EME) common-mode choke longer required Differential receiver with wide common-mode range (+/- 35V) high disturbance lines with un-powered node Thermal protection pins protected against transients Silent mode which transmitter disabled Short circuit proof supply voltage ground Logic level inputs compatible with 3.3V devices protection
Technical Characteristics
Table Technical Characteristics Symbol Parameter VCANH voltage CANH VCANL voltage CANL Vi(dif)(bus_dom) Differential output voltage dominant state tpd(rec-dom) Propagation delay tpd(dom-rec) Propagation delay CM-range Input common-mode range comparator VCM-peak VCM-step Common-mode peak Common-mode step
Conditions 5.25V; time limit 5.25V; time limit 42.5 Figure Figure Guaranteed differential receiver threshold leakage current Figure Figure (Notes) Figure Figure (Notes)
Min. -500 -150
Max.
Unit
Note: parameters VCM-peak VCM-step guarantee electromagnetic emission.
Ordering Information
Ordering Code (Tubes) 0ICAB-001-XTD Ordering Code (Tape) 0ICAB-001-XTP Marketing Name AMIS 42671AGA Package SOIC-8 GREEN Temp. Range -40°C.125°C
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AMIS-42671 High-Speed Transceiver
Long Networks
Block Diagram
AUTB
Thermal shutdown
Slope Control
Driver control
CANH CANL
Autobaud Control
AMIS-42671
COMP
VREF
Ri(cm)
Vcc/2
Ri(cm)
PC20070930.2
Figure Block Diagram
Typical Application
Application Schematic
VBAT
5V-reg
AUTB
CANH VREF CANL
controller
AMIS42671
PC20071001.1
Figure Application Diagram
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AMIS-42671 High-Speed Transceiver
Long Networks
Description 6.2.1. (Top View)
AUTB CANH CANL VREF
AMIS42671
Figure Configuration
PC20070929.1
Description
Table Name VREF CANL CANH AUTB
Description Transmit data input; input dominant driver; internal pull-up current Ground Supply voltage Receive data output; dominant transmitter output Reference voltage output Low-level line (low dominant mode) High-level line (high dominant mode) Autobaud mode control input; internal pull-down current
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AMIS-42671 High-Speed Transceiver
Long Networks
Functional Description
Operating Modes behavior AMIS-42671 under various conditions illustrated Table below. case device powered, operating modes selected through AUTB.
Table Functional table AMIS-42671 when connected bus; don't care
AUTB CANH CANL state
4.75 5.25.V 4.75 5.25.V 4.75 5.25.V VCC<PORL (unpowered) PORL<VCC<4.75V
floating)
floating)
High VCC/2 VCC/2 0V<CANH<VCC 0V<CANH<VCC
VCC/2 VCC/2 0V<CANL<VCC 0V<CANL<VCC
Dominant Recessive Recessive Recessive Recessive
7.1.1. High-Speed Mode AUTB pulled left floating), transceiver high-speed mode able communicate lines. signals transmitted received controller pins RxD. slopes line outputs optimized give extremely electromagnetic emissions. 7.1.2. Autobaud Mode AUTB pulled high, AMIS-42671 Autobaud mode. transmitter disabled while receiver remains active. other functions also continue operate. Normal activity monitored transmit data looped back without influencing communication.
CANH CANL
AUTB
PC20071002.4
Figure Simplified Schematic Diagram Autobaud Function
Autobaud mode local controller able detect used communication speed other transmitting network nodes. communication received sent controller. controller operates wrong baud rate, will transmit error frame. This message will looped back controller which will increment error counter. controller will reset with another baud rate. When error-free message received, correct baud rate detected. logic applied AUTB, returning High-Speed Mode. Over-temperature Detection thermal protection circuit protects from damage switching transmitter junction temperature exceeds value approximately 160°C. Because transmitter dissipates most power, power dissipation temperature reduced. other functions continue operate. transmitter off-state resets when goes high. thermal protection circuit particularly necessary when line short-circuits.
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AMIS-42671 High-Speed Transceiver
Long Networks
High Communication Speed Range
transceiver primarily intended industrial applications. allows very baud rates needed long length applications. also high speed communication possible 1Mbit/s. Fail-safe Features current-limiting circuit protects transmitter output stage from damage caused accidental short-circuit either positive negative supply voltage, although power dissipation increases during this fault condition. pins CANH CANL protected from automotive electrical transients (according "ISO 7637"; Figure pulled high internally should input become disconnected.
Electrical Characteristics
Definitions voltages referenced (pin Positive currents flow into Sinking current means current flowing into pin; sourcing current means current flowing pin. Absolute Maximum Ratings Stresses above those listed following table cause permanent device failure. Exposure absolute maximum ratings extended periods affect device reliability.
Table Absolute Maximum Ratings Symbol Parameter Supply voltage VCANH voltage CANH VCANL voltage CANL VTxD voltage VRxD voltage VAUTB voltage AUTB VREF voltage VREF Vtran(CANH) Transient voltage CANH Vtran(CANL) Transient voltage CANL Vesd Latch-up Tstg Tamb Tjunc
Notes:
Conditions
5.25V; time limit 5.25V; time limit
Electrostatic discharge voltage pins Static latch-up pins Storage temperature Ambient temperature Maximum junction temperature
Note Note Note Note Note
Min. -0.3 -0.3 -0.3 -0.3 -0.3 -150 -150 -500
Max. +150 +150 +500 +155 +125 +150
Unit
Applied transient waveforms accordance with 7637 part test pulses (see Figure Standardized human body model pulses accordance MIL883 method 3015.7. Static latch-up immunity: static latch-up protection level when tested according EIA/JESD78. Standardized charged device model pulses when tested according EOS/ESD DS5.3-1993.
Thermal Characteristics
Table Thermal Characteristics Symbol Parameter Rth(vj-a) Thermal resistance from junction ambient package Rth(vj-s) Thermal resistance from junction substrate bare
Conditions free free
Value
Unit
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AMIS-42671 High-Speed Transceiver
Long Networks
Timing Characteristics 4.75 5.25V; Tjunc +150°C; unless specified otherwise.
Table Timing Characteristics Symbol Parameter Supply (Pin VCC) Supply current
Transmitter Data Input (Pin TxD) High-level input voltage Low-level input voltage High-level input current Low-level input current Input capacitance Mode Select (Pin AUTB) High-level input voltage Low-level input voltage High-level input current Low-level input current Receiver Data Output (Pin RxD) High-level output voltage Conditions Min. Typ. Max.
Unit
Dominant; VTXD Recessive; VTXD Output recessive Output dominant VTxD VTxD tested Autobaud mode High-speed mode =0.8V IRXD 10mA IRXD -50µA IVREF +50µA -35V <VCANH< +35V; -35V <VCANL< +35V VTxD VCC; load VTxD VCC; load -35V <VCANH< +35V; <VCC 5.25V -35V <VCANL +35V; <VCC 5.25V VTxD VTxD VTxD dominant; 42.5 VTxD =VCC; recessive; load VCANH VTxD VCANL 36V; VTxD <VCANL +10V; <VCANH +10V; Figure -35V <VCANL +35V; -35V <VCANH +35V; Figure <VCANL +10V; <VCANH +10V; Figure
-0.3 -0.3
-200 0.75 0.25 0.50 0.50 2.25
VCC+0.3 +0.8 -350 VCC+0.3 +0.8
Low-level output voltage Reference Voltage Output (Pin VREF) VREF Reference output voltage Reference output voltage full common mode range Lines (Pins CANH CANL) Vo(reces)(CANH) Recessive voltage CANH Vo(reces)(CANL) Recessive voltage CANL Io(reces) (CANH) Recessive output current CANH Io(reces) (CANL) Vo(dom) (CANH) Vo(dom) (CANL) Vi(dif) (bus) Recessive output current CANL Dominant output voltage CANH Dominant output voltage CANL Differential input voltage (VCANH VCANL) Short circuit output current CANH Short circuit output current CANL Differential receiver threshold voltage Differential receiver threshold voltage high common-mode Differential receiver input voltage hysteresis Common-mode input resistance CANH Common-mode input resistance CANL Matching between CANH CANL common-mode input resistance Differential input resistance Matching between CANH CANL common-mode input resistance Differential input resistance VREF_CM
0.45 0.55 0.60 +2.5 +2.5 4.25 1.75 1.05
0.45 0.40 -2.5 -2.5 -120 0.25
Io(sc) (CANH) Io(sc) (CANL) Vi(dif)(th) Vihcm(dif) (th) Vi(dif) (hys) Ri(cm)(CANH) Ri(cm) (CANL) Ri(cm)(m) Ri(dif) Ri(cm)(m) Ri(dif)
VCANH =VCANL VCANH =VCANL
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AMIS-42671 High-Speed Transceiver
Long Networks
Table Timing Characteristics (continued) Symbol Parameter Ci(CANH) Input capacitance CANH Ci(CANL) Input capacitance CANL Ci(dif) Differential input capacitance ILI(CANH) Input leakage current CANH ILI(CANL) Input leakage current CANL VCM-peak Common-mode peak during transition from VCM-step Difference common-mode between dominant recessive state Power-on-Reset (POR) PORL level
Thermal Shutdown Tj(sd) Shutdown junction temperature Timing Characteristics (see Figure Figure td(TxD-BUSon) Delay active td(TxD-BUSoff) Delay inactive td(BUSon-RxD) Delay active td(BUSoff-RxD) Delay inactive tpd(rec-dom) Propagation delay from recessive dominant td(dom-rec) Propagation delay from dominant recessive Conditions VTxD VCC; tested VTxD VCC; tested VTxD VCC; tested VCANH VCANL Figure Figure Min. Typ. 3.75 Max.
-500 -150
Unit
Figure Figure CANH, CANL, Vref tristate below level
Measurement Set-ups Definitions
CANH VREF
AMIS42671
Transient Generator
CANL
PC20071002.1
AUTB
Figure Test Circuit Transients
VRxD High
Hysteresis PC20040829.7
Vi(dif)(hys)
Figure Hysteresis Receiver
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AMIS-42671 High-Speed Transceiver
Long Networks
CANH VREF
AMIS42671
CANL
PC20071002.3
AUTB
Figure Test Circuit Timing Characteristics
HIGH
CANH
CANL
dominant
Vi(dif) VCANH VCANL
0,9V
0,5V recessive
td(TxD-BUSon) tpd(rec-dom)
td(TxD-BUSoff) td(BUSon-RxD) tpd(dom-rec) td(BUSoff-RxD)
PC20040829.6
Figure Timing Diagram Characteristics
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AMIS-42671 High-Speed Transceiver
Long Networks
CANH
Active Probe
Generator
AMIS42671
CANL
Spectrum Anayzer
VREF
AUTB
PC20071002.2
Figure Basic Test Set-up Electromagnetic Measurement
CANH
CANL
recessive
Vi(com) VCANH VCANL VCM-peak
VCM-step
VCM-peak
PC20040829.7
Figure Common-mode Voltage Peaks (see measurement set-up Figure
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AMIS-42671 High-Speed Transceiver
Long Networks
Package Outline
SOIC-8: Plastic small outline; eight leads; body width 150mil
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AMIS-42671 High-Speed Transceiver
Long Networks 10.0 Soldering
10.1 Introduction
This text gives very brief insight complex technology. more in-depth account soldering found AMIS "Data Handbook IC26; Integrated Circuit Packages" (document order number 9398 90011). There soldering method that ideal surface mount packages. Wave soldering always suitable surface mount ICs, printed circuit boards with high population densities. these situations reflow soldering often used.
10.2 Re-flow Soldering
Re-flow soldering requires solder paste suspension fine solder particles, flux binding agent) applied printed-circuit board screen printing, stencilling pressure-syringe dispensing before package placement. Several methods exist re-flowing; example, infrared/convection heating conveyor type oven. Throughput times (preheating, soldering cooling) vary between seconds, depending heating method. Typical reflow peak temperatures range from 250°C. top-surface temperature packages should preferably kept below 230°C.
10.3 Wave Soldering
Conventional single wave soldering recommended surface mount devices (SMDs) printed circuit boards with high component density, solder bridging non-wetting present major problems. overcome these problems double-wave soldering method specifically developed. wave soldering used, following conditions must observed optimal results: double-wave soldering method, comprising turbulent wave with high upward pressure followed smooth laminar wave. packages with leads sides pitch (e): Larger than equal 1.27mm, footprint longitudinal axis preferred parallel transport direction printed-circuit board. Smaller than 1.27mm, footprint longitudinal axis must parallel transport direction printed-circuit board. footprint must incorporate solder thieves downstream end. packages with leads four sides, footprint must placed degree angle transport direction printedcircuit board. footprint must incorporate solder thieves downstream side corners. During placement before soldering, package must fixed with droplet adhesive. adhesive applied screen printing, transfer syringe dispensing. package soldered after adhesive cured. Typical dwell time four seconds 250°C. mildly-activated flux will eliminate need removal corrosive residues most applications.
10.4 Manual Soldering
component first soldering diagonally-opposite leads. voltage (24V less) soldering iron applied flat part lead. Contact time must limited seconds 300°C. When using dedicated tool, other leads soldered operation within five seconds, between 320°C.
Table Soldering
Package Soldering Method Wave suitable suitable Suitable recommended (3)(4) recommended Reflow Suitable Suitable Suitable Suitable Suitable
BGA, SQFP HLQFP, HSQFP, HSOP, HTSSOP, PLCC LQFP, QFP, TQFP SSOP, TSSOP,
Notes:
surface mount (SMD) packages moisture sensitive. Depending upon moisture content, maximum temperature (with respect time) body size package, there risk that internal external package cracks occur vaporization moisture them (the called popcorn effect). details, refer Drypack information "Data Handbook IC26; Integrated Circuit Packages; Section: Packing Methods." These packages suitable wave soldering solder joint between printed-circuit board heat sink bottom version) achieved, solder stick heatsink version). wave soldering considered, then package must placed degree angle solder wave direction. package footprint must incorporate solder thieves downstream side corners. Wave soldering only suitable LQFP, TQFP packages with pitch equal larger than 0.8mm; definitely suitable packages with pitch equal smaller than 0.65mm. Wave soldering only suitable SSOP TSSOP packages with pitch equal larger than 0.65mm; definitely suitable packages with pitch equal smaller than 0.5mm.
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AMIS-42671 High-Speed Transceiver
Long Networks 11.0 Company Product Inquiries
more information about Semiconductor's high-speed Industrial transceivers, visit site http://www.amis.com
12.0 Document History
Date October 2007 Revision Change Initial release
Devices sold AMIS covered warranty patent indemnification provisions appearing Terms Sale only. AMIS makes warranty, express, statutory, implied description, regarding information forth herein regarding freedom described devices from patent infringement. AMIS makes warranty merchantability fitness purposes. AMIS reserves right discontinue production change specifications prices time without notice. Semiconductor's products intended commercial applications. Applications requiring extended temperature range, unusual environmental requirements, high reliability applications, such military, medical life-support life-sustaining equipment, specifically recommended without additional processing AMIS such applications. Copyright ©2007 Semiconductor, Inc.
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