Complies with 89/336/EEC directive protection 1000-4-2 (801-2) Contact

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Complies with 89/336/EEC directive protection 1000-4-2 (801-2) Contact

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EMI/EMC-Compliant, ESDProtected, RS-232 Line Drivers/Receivers
Complies with 89/336/EEC directive protection 1000-4-2 (801-2) Contact discharge: Air-gap discharge: Human body model: EFT/burst immunity (IEC 1000-4-4) emissions 55022) Eliminates need TransZorb® suppressors kbps data rate guaranteed Single power supply Shutdown mode Plug-in upgrade MAX2xxE Space saving TSSOP package available
0.1µF
CONNECTION DIAGRAM
INPUT
+10V VOLTAGE DOUBLER +10V -10V VOLTAGE INVERTER
0.1µF 6.3V 0.1µF
0.1µF
0.1µF T1IN T2IN T3IN T4IN R1OUT R2OUT TTL/CMOS OUTPUTS R3OUT R4OUT R5OUT (ADM211E) (ADM213E)
T1OUT T2OUT T3OUT T4OUT R1IN R2IN R3IN R4IN R5IN SHDN (ADM211E) SHDN (ADM213E) RS-232 INPUTS2 RS-232 OUTPUTS
TTL/CMOS INPUTS1
APPLICATIONS
Laptop computers Notebook computers Printers Peripherals Modems
GENERAL DESCRIPTION
ADM2xxE family robust RS-232 V.28 interface devices that operate from single power supply. These products suitable operation harsh electrical environments compliant with directive electromagnetic compatibility (EMC) (89/336/EEC). level emissions immunity both compliance. immunity includes protection excess lines (IEC 1000-4-2), fast transient burst protection (IEC 100044), radiated immunity (IEC 1000-4-3). emissions include radiated conducted emissions required Information Technology Equipment 55022, CISPR devices fully conform EIA-232-E CCITT V.28 specifications operate data rates kbps. Shutdown enable control pins provided some products (see Table shutdown function ADM211E disables charge pump transmitters receivers. ADM213E Table Selection Table
Model ADM206E ADM207E ADM208E ADM211E ADM213E
ADM211E/ ADM213E
INTERNAL INTERNAL
400k PULL-UP RESISTOR EACH TTL/CMOS INPUT. PULL-DOWN RESISTOR EACH RS-232 INPUT.
Figure
charge pump, transmitters, three five receivers disabled. remaining receivers remain active, thereby allowing monitoring peripheral devices. This feature allows device shut down until peripheral device begins communication. active receivers alert processor, which then take ADM213E shutdown mode. Operating from single supply, four external capacitors required. ADM207E ADM208E available 24-lead PDIP, SSOP, available 28-lead SSOP, TSSOP, SOIC_W packages. products backward compatible with earlier ADM2xx products, facilitating easy upgrading older designs.
Shutdown (SHDN)1 Enable (EN) Packages RW-24 N-24-1, RW-24, RS-24, RU-24 N-24-1, RW-24, RS-24, RU-24 RW-28, RS-28, RU-28 RW-28, RS-28, RU-28
Supply Voltage
Drivers
Receivers
Protection
receivers active.
Rev.
Information furnished Analog Devices believed accurate reliable. However, responsibility assumed Analog Devices use, infringements patents other rights third parties that result from use. Specifications subject change without notice. license granted implication otherwise under patent patent rights Analog Devices. Trademarks registered trademarks property their respective owners.
Technology Way, P.O. 9106, Norwood, 02062-9106, U.S.A. Tel: 781.329.4700 www.analog.com Fax: 781.461.3113 ©2006 Analog Devices, Inc. rights reserved.
00068-001
TABLE CONTENTS
Features Applications. General Description Connection Diagram Revision History Specifications. Absolute Maximum Ratings. Caution. Configurations Function Descriptions Typical Performance Characteristics Theory Operation Circuit Description. Enable Shutdown High Baud Rate. ESD/EFT Transient Protection Scheme Testing (IEC 100042) EFT/Burst Testing (IEC 100044). 1000-4-3 Radiated Immunity Emissions/Interference Conducted Emissions Radiated Emissions Outline Dimensions Ordering Guide
REVISION HISTORY
9/06-Rev. Rev. Updated Format.Universal Changes Figure Table Changes Table Changes Figure Figure Figure Changes Figure Figure Changes Figure Changes Figure Updated Outline Dimensions Changes Ordering Guide 4/05-Rev. Rev. Changes Specifications Section. Changes Ordering Guide Updated Outline Dimensions 3/01-Rev. Rev. Changes Features Section Changes Specifications Table Changes Absolute Maximum Ratings.3 Changes Figure Changes Typical Performance Characteristics Section Changes Table
Rev. Page
SPECIFICATIONS
10%, specifications TMIN TMAX, unless otherwise noted. Table
Parameter CHARACTERISTICS Operating Voltage Range Power Supply Current SHUTDOWN SUPPLY CURRENT LOGIC Input Pull-Up Current Input Logic Threshold Low, VINL Input Logic Threshold High, VINH Input Logic Threshold High, VINH TTL/CMOS Output Voltage Low, TTL/CMOS Output Voltage High, TTL/CMOS Output Leakage Current RS-232 RECEIVER Input Voltage Range Input Threshold Input Threshold High Input Hysteresis Input Resistance RS-232 TRANSMITTER Output Voltage Swing Output Resistance Output Short-Circuit Current TIMING CHARACTERISTICS Maximum Data Rate Receiver Propagation Delay, TPHL, TPLH Receiver Output Enable Time, Receiver Output Disable Time, Transmitter Propagation Delay, TPHL, TPLH Transition Region Slew Rate IMMUNITY Protection (I/O Pins) +0.05 0.65 ±9.0 Unit kbps Test Conditions/Comments
load
TIN, SHDN, SHDN SHDN, SHDN IOUT IOUT VCC, GND, ROUT
±5.0
85°C transmitter outputs loaded with ground VOUT
2500
2500 2500 measured from Human body model 1000-4-2 air-gap discharge 1000-4-2 contact discharge 1000-4-3
Radiated Immunity
Guaranteed design.
Table ADM211E Truth Table
SHDN
Table ADM213E Truth Table
TOUT Enabled Enabled Disabled ROUT Enabled Disabled Disabled SHDN Status Shutdown Shutdown Normal operation Normal operation TOUT Disabled Disabled Enabled Enabled ROUT Disabled Disabled Disabled Enabled ROUT Disabled Enabled Disabled Enabled
Status Normal operation Normal operation Shutdown
don't care.
Rev. Page
ABSOLUTE MAXIMUM RATINGS
25°C, unless otherwise noted. Table
Parameter Input Voltages Output Voltages TOUT ROUT Short-Circuit Duration TOUT Power Dissipation N-24-1 PDIP (Derate 13.5 mW/°C above 70°C) RW-24 SOIC_W (Derate mW/°C above 70°C) RS-24 SSOP (Derate mW/°C above 70°C) RU-24 TSSOP (Derate mW/°C above 70°C) RW-28 SOIC_W (Derate mW/°C above 70°C) RS-28 SSOP (Derate mW/°C above 70°C) RU-28 TSSOP (Derate mW/°C above 70°C) Operating Temperature Range Storage Temperature Range Lead Temperature, Soldering sec) Rating MIL-STD-883B (I/O Pins) 1000-4-2 Air-Gap (I/O Pins) 1000-4-2 Contact (I/O Pins) Rating -0.3 (VCC +0.3 -0.3 -0.3 (VCC Continuous
Stresses above those listed under Absolute Maximum Ratings cause permanent damage device. This stress rating only; functional operation device these other conditions above those indicated operational section this specification implied. Exposure absolute maximum rating conditions extended periods affect device reliability.
CAUTION
1000 -40°C +85°C -65°C +150°C 300°C
Rev. Page
CONFIGURATIONS FUNCTION DESCRIPTIONS
T3OUT T1OUT T2OUT R1IN R1OUT T2IN T1IN
T4OUT R2IN R2OUT SHDN
T3OUT T1OUT T2OUT R1IN R1OUT T2IN T1IN
T4OUT R2IN R2OUT T5IN T5OUT
VIEW T4IN (Not Scale) T3IN
R3OUT R3IN
00068-002
ADM206E
VIEW T4IN (Not Scale) T3IN
ADM207E
R3OUT R3IN
00068-004
Figure ADM206E Configuration
INPUT 0.1µF 6.3V 0.1µF T1IN T2IN T3IN T4IN R1OUT TTL/CMOS OUTPUTS R2OUT R3OUT
Figure ADM207E Configuration
INPUT 0.1µF 0.1µF T1IN
+10V VOLTAGE DOUBLER +10V -10V VOLTAGE INVERTER
0.1µF 6.3V 0.1µF
0.1µF
+10V VOLTAGE DOUBLER +10V -10V VOLTAGE INVERTER
0.1µF 6.3V 0.1µF
0.1µF
T1OUT T2OUT T3OUT T4OUT T5OUT R1IN R2IN R3IN RS-232 INPUTS2 RS-232 OUTPUTS
T1OUT
T2IN
TTL/CMOS INPUTS1
T2OUT T3OUT T4OUT RS-232 OUTPUTS
TTL/CMOS INPUTS1
T3IN T4IN
T5IN
R1IN
R1OUT
R2IN R3IN
RS-232 INPUTS2
TTL/CMOS OUTPUTS
R2OUT R3OUT
ADM206E
SHDN
ADM207E
00068-003
INTERNAL INTERNAL
400k PULL-UP RESISTOR EACH TTL/CMOS INPUT. PULL-DOWN RESISTOR EACH RS-232 INPUT.
INTERNAL INTERNAL
400k PULL-UP RESISTOR EACH TTL/CMOS INPUT. PULL-DOWN RESISTOR EACH RS-232 INPUT.
Figure ADM206E Typical Operating Circuit
Figure ADM207E Typical Operating Circuit
Rev. Page
00068-005
T3OUT T1OUT
T2OUT T1OUT R2IN R2OUT T1IN R1OUT R1IN
T3OUT R3IN R3OUT T4IN
T4OUT R3IN R3OUT SHDN
T2OUT R2IN R2OUT T2IN T1IN
VIEW T3IN (Not Scale) T2IN
R4OUT R4IN
00068-006
ADM208E
T4OUT
VIEW R4OUT R1OUT (Not Scale) T4IN R1IN
T3IN R5OUT R5IN
00068-008
ADM211E
R4IN
Figure ADM208E Configuration
Figure ADM211E Configuration
INPUT
INPUT 0.1µF 0.1µF T1IN T2IN T3IN T4IN R1OUT R2OUT R3OUT R4OUT
+10V VOLTAGE DOUBLER +10V -10V VOLTAGE INVERTER
0.1µF 6.3V 0.1µF
0.1µF
0.1µF
+10V VOLTAGE DOUBLER +10V -10V VOLTAGE INVERTER
0.1µF 6.3V
0.1µF
0.1µF
0.1µF
T1IN
T1OUT T2OUT T3OUT T4OUT R1IN R2IN R3IN R4IN R5IN SHDN
RS-232 INPUTS2 RS-232 OUTPUTS
T1OUT T2OUT T3OUT T4OUT R1IN R2IN R3IN R4IN RS-232 INPUTS2 RS-232 OUTPUTS
TTL/CMOS INPUTS1
T2IN T3IN T4IN R1OUT R2OUT
TTL/CMOS INPUTS1
TTL/CMOS OUTPUTS
TTL/CMOS OUTPUTS
R3OUT R4OUT R5OUT
ADM208E
00068-007
ADM211E
00068-009
INTERNAL INTERNAL
400k PULL-UP RESISTOR EACH TTL/CMOS INPUT. PULL-DOWN RESISTOR EACH RS-232 INPUT.
INTERNAL INTERNAL
400k PULL-UP RESISTOR EACH TTL/CMOS INPUT. PULL-DOWN RESISTOR EACH RS-232 INPUT.
Figure ADM208E Typical Operating Circuit
Figure ADM211E Typical Operating Circuit
Rev. Page
INPUT
T3OUT T1OUT T2OUT R2IN R2OUT T2IN T1IN
T4OUT R3IN R3OUT
0.1µF
+10V VOLTAGE DOUBLER +10V -10V VOLTAGE INVERTER
0.1µF 6.3V 0.1µF
0.1µF
SHDN
0.1µF
T1IN T2IN T3IN T4IN R1OUT
00068-010
VIEW R4OUT1 R1OUT (Not Scale) T4IN R1IN
T3IN R5OUT1 R5IN1
ADM213E
R4IN1
T1OUT T2OUT T3OUT T4OUT R1IN R2IN R3IN R4IN3 R5IN3
TTL/CMOS INPUTS1
RS-232 OUTPUTS
ACTIVE SHUTDOWN.
R2OUT
Figure ADM213E Configuration
TTL/CMOS OUTPUTS
R3OUT R4OUT3 R5OUT3
RS-232 INPUTS2
ADM213E
SHDN
Figure ADM213E Typical Operating Circuit
Table Function Descriptions
Mnemonic C1+, C2+, TOUT ROUT EN/EN Function Power Supply Input 10%). Internally Generated Positive Supply nominal). Internally Generated Negative Supply nominal). Ground Pin. Must connected External Capacitor connected between these pins. capacitor recommended, larger capacitors used. External Capacitor connected between these pins. capacitor recommended, larger capacitors used. Transmitter (Driver) Inputs. These inputs accept TTL/CMOS levels. internal pull-up resistor connected each input. Transmitter (Driver) Outputs. These RS-232 signal levels (typically Receiver Inputs. These inputs accept RS-232 signal levels. internal pull-down resistor connected each input. Receiver Outputs. These TTL/CMOS output logic levels. Receiver Enable (active high ADM213E, active ADM211E). This input used enable/disable receiver outputs. With ADM211E high ADM213E), receiver outputs enabled. With high ADM211E ADM213E), receiver outputs placed high impedance state. (See Table Table Shutdown Control (active ADM213E, active high ADM211E). When ADM211E shutdown, charge pump disabled, transmitter outputs turned off, receiver outputs placed high impedance state. When ADM213E shutdown, charge pump disabled, transmitter outputs turned off, Receiver Receiver placed high impedance state; Receiver Receiver ADM213E continue operate normally during shutdown. (See Table Table Power consumption parts reduces shutdown.
SHDN/SHDN
Rev. Page
00068-011
INTERNAL 400k PULL-UP RESISTOR EACH TTL/CMOS INPUT. INTERNAL PULL-DOWN RESISTOR EACH RS-232 INPUT. ACTIVE SHUTDOWN.
TYPICAL PERFORMANCE CHARACTERISTICS
LIMIT
(dBµV)
(dBµV)
00068-012
LIMIT
0.33
FREQUENCY (MHz)
START 30.0MHz
STOP 200.0MHz
Figure Conducted Emissions
00068-013
Figure Radiated Emissions
LOADED
LOADED
1000 1500 2000 LOAD CAPACITANCE (pF)
2500
3000
Figure Transmitter Output Voltage High/Low Load Capacitance (230 kbps)
Figure Transmitter Output Voltage Power Supply Voltage
SHDN
00068-017
00068-014
LOAD CURRENT (mA)
5.00V 5.00V
5.00V
50.0µs
3.1V
EXITING SHDN
Figure Transmitter Output Voltage Load Current
Figure Charge Pump Exiting Shutdown
Rev. Page
00068-016
00068-015
IMPEDANCE
V+/V-
00068-018
00068-019
LOAD CURRENT (mA)
Figure Charge Pump Impedance Power Supply Voltage
Figure Charge Pump Load Current
Rev. Page
THEORY OPERATION
ruggedized RS-232 line drivers/receivers that operate from single supply. Step-up voltage converters coupled with level shifting transmitters receivers allow RS-232 levels developed while operating from single supply. Features include power consumption, high transmission rates, compliance with directive EMC, which includes protection against radiated conducted interfereence, including high levels electrostatic discharge. RS-232 inputs outputs contain protection against electrostatic discharges electrical fast transients This ensures compliance 100042 100044 requirements. devices ideally suited operation electrically harsh environments where RS-232 cables plugged/unplugged frequently. They also immune high field strengths without special shielding precautions. Emissions also controlled within very strict limits. TTL/CMOS technology used keep power dissipation absolute minimum, allowing maximum battery life portable applications. ADM2xxE modification, enhancement, improvement ADM2xx family derivatives. essentially plug-in compatible does have materially different applications.
INTERNAL OSCILLATOR
2VCC
00068-020
Figure Charge Pump Voltage Doubler
FROM VOLTAGE DOUBLER
INTERNAL OSCILLATOR
-(V+)
00068-021
Figure Charge Pump Voltage Inverter
Transmitter (Driver) Section
drivers convert logic input levels into EIA-232 output levels. With driving EIA-232 load, output voltage swing typically Unused inputs left unconnected, internal pull-up resistor pulls them high, forcing outputs into state. input pull-up resistors typically source when grounded, unused inputs should either connected left unconnected order minimize power consumption.
CIRCUIT DESCRIPTION
internal circuitry consists four main sections: charge pump voltage converter. logic EIA-232 transmitters. EIA-232 logic receivers. Transient protection circuit lines.
Receiver Section
receivers inverting level shifters that accept EIA-232 input levels translate them into logic output levels. inputs have internal pull-down resistors ground protected against overvoltages guaranteed switching thresholds minimum maximum. Unconnected inputs pulled internal pulldown resistor. This, therefore, results Logic output level unconnected inputs inputs connected GND. receivers have Schmitt trigger inputs with hysteresis level 0.65 This ensures error-free reception both noisy inputs inputs with slow transition times.
Charge Pump DC-to-DC Voltage Converter
charge pump voltage converter consists oscillator switching matrix. converter generates supply from input level. This done stages using switched capacitor technique illustrated Figure Figure First, input supply doubled using Capacitor charge storage element. level then inverted generate using storage element. Capacitor Capacitor used reduce output ripple. desired, larger capacitors used Capacitor Capacitor This facilitates direct substitution with older generation charge pump RS-232 transceivers. supplies also used power external circuitry, current requirements small (see Typical Performance Characteristics section).
ENABLE SHUTDOWN
Table Table truth tables enable shutdown control signals. enable function intended facilitate data connections where desirable tristate receiver outputs. disabled mode, receiver outputs placed high impedance state. shutdown function intended shut down device, thereby minimizing quiescent current. shutdown, transmitters disabled receivers ADM211E tristated.
Rev. Page
ADM213E, Receiver Receiver remain enabled shutdown. Note that transmitters disabled tristated shutdown; permitted connect multiple (RS-232) driver outputs together. shutdown feature very useful battery-operated systems since reduces power consumption During shutdown, charge pump also disabled. shutdown control input active high ADM211E, active ADM213E. When exiting shutdown, charge pump restarted, takes approximately reach steady state operating condition. protection structure shown Figure Figure Each input output contains back-to-back high speed clamping diodes. During normal operation, with maximum RS232 signal levels, diodes have effect because other reverse biased, depending polarity signal. however, voltage exceeds about reverse breakdown occurs, voltage clamped this level. diodes large junctions designed handle instantaneous current surges that exceed several amperes. transmitter outputs receiver inputs have similar protection structure. receiver inputs also dissipate some energy through internal resistor well through protection diodes. protection structure achieves protection protection RS-232 lines. methods used test protection scheme discussed Testing (IEC 100042) EFT/Burst Testing (IEC 100044) sections.
HIGH BAUD RATE
ADM2xxE feature high slew rates, permitting data transmission rates well excess EIA-232-E specifications. RS-232 levels maintained data rates kbps, even under worst-case loading conditions. This allows high speed data links between terminals, making suitable generation modem standards that require data rates kbps. slew rate controlled internally less than minimize interference.
INPUT
RECEIVER INPUT
00068-024
-0.1V
Figure Receiver Input Protection Scheme
RECEIVER OUTPUT +0.1V NOTES COMPLEMENT ADM213E.
00068-022
TOUT
TRANSMITTER OUTPUT
Figure Receiver Disable Timing
INPUT
Figure Transmitter Output Protection Scheme
TESTING (IEC 1000-4-2)
+3.5V
RECEIVER OUTPUT +0.8V
NOTES COMPLEMENT ADM213E.
Figure Receiver Enable Timing
ESD/EFT TRANSIENT PROTECTION SCHEME
ADM2xxE protective clamping structures inputs outputs that clamp voltage safe level dissipate energy present (electrostatic) (electrical fast transient) discharges. simplified schematic
1000-4-2 (previously 801-2) specifies compliance testing using coupling methods, contact discharge airgap discharge. Contact discharge calls direct connection unit being tested. Air-gap discharge uses higher test voltage does make direct contact with unit under test. With air-gap discharge, discharge moved toward unit under test, developing across gap. This method influenced humidity, temperature, barometric pressure, distance, rate closure discharge gun. contact discharge method, while less realistic, more repeatable gaining acceptance preference air-gap method. Although very little energy contained within pulse, extremely fast rise time, coupled with high voltages, cause failures unprotected semiconductors. Catastrophic
Rev. Page
00068-023
00068-025
destruction occur immediately because arcing heating. Even catastrophic failure does occur immediately, device suffer from parametric degradation that result degraded performance. cumulative effects continuous exposure eventually lead complete failure. lines particularly vulnerable damage. Simply touching plugging cable result static discharge that damage destroy interface product connected port. Traditional test methods, such MIL-STD-883B method 3015.7, fully test product susceptibility this type discharge. This test intended test product susceptibility damage during handling. Each tested with respect other pins. There some important differences between traditional test test: test much more stringent terms discharge energy. peak current injected over four times greater. current rise time significantly faster test. test carried while power applied device.
IPEAK
00068-028
0.1ns 30ns 60ns
TIME
Figure 1000-4-2 Current Waveform
ADM2xxE products tested using both previously mentioned test methods. Pins tested with respect other pins MIL-STD-883B specification. addition, pins tested test specification. products tested under following conditions: Power (normal operation). Power (shutdown mode). Power off.
possible that discharge could induce latch-up device being tested. This test, therefore, more representtative real-world discharge, where equipment operating normally with power applied. However, both tests should performed ensure maximum protection both during handling later during field service.
HIGH VOLTAGE GENERATOR DEVICE UNDER TEST
There four levels compliance defined 1000-4-2. ADM2xxE products meet most stringent compliance level both contact air-gap discharge. This means that products able withstand contact discharges excess air-gap discharges excess Table 1000-4-2 Compliance Levels
Level Contact Discharge (kV) Air-Gap Discharge (kV)
TEST METHOD BODY MIL-STD-883B 1000-4-2
1.5k
100pF 150pF
00068-026
Table ADM2xxE Test Results
Test Method MIL-STD-883B 1000-4-2 Contact Air-Gap (kV)
Figure Test Standards
IPEAK
EFT/BURST TESTING (IEC 1000-4-4)
1000-4-4 (previously 801-4) covers EFT/burst immunity. Electrical fast transients occur because arcing contacts switches relays. tests simulate interference generated when, example, power relay disconnects inductive load. spark generated well-known back effect. fact, spark consists
36.8
TIME
Figure Human Body Model Current Waveform
00068-027
Rev. Page
burst sparks relay contacts separate. voltage appearing line, therefore, consists burst extremely fast transient impulses. similar effect occurs when switching fluorescent lights. fast transient burst test defined 1000-4-4 simulates this arcing; waveform illustrated Figure consists burst transients repeating intervals. specified both power data lines.
Classification Temporary degradation loss function performance that requires operator intervention system reset. Classification Degradation loss function that recoverable damage.
ADM2xxE products meet Classification have been tested under worst-case conditions using unshielded cables. Data transmission during transient condition corrupted, resume immediately following event without user intervention.
HIGH VOLTAGE SOURCE
00068-030
300ms 15ms
OUTPUT
Figure 1000-4-4 Fast Transient Generator
50ns
00068-029
1000-4-3 RADIATED IMMUNITY
0.2ms/0.4ms
Figure 1000-4-4 Fast Transient Waveform
Table
Level Peak (kV) Peak (kV) 0.25
1000-4-3 (previously 801-3) describes measurement method defines levels immunity radiated electromagnetic fields. originally intended simulate electromagnetic fields generated portable radio transceivers other devices that generate continuous wave-radiated energy. scope since been broadened include spurious energy that radiated from fluorescent lights, thyristor drives, inductive loads, other sources. Testing immunity involves irradiating device with field. There various methods achieving this, including anechoic chamber, stripline cell, cell, GTEM cell. stripline cell consists parallel plates with electric field developed between them. device under test placed within cell exposed electric field. There three severity levels having field strengths ranging from V/m. Results classified similar fashion those 100044. Classification Normal operation. Classification Temporary degradation loss function that self recoverable when interfering signal removed. Classification Temporary degradation loss function that requires operator intervention system reset when interfering signal removed. Classification Degradation loss function that recoverable damage.
simplified circuit diagram actual generator illustrated Figure transients coupled onto signal lines using coupling clamp. clamp long surrounds cable completely, providing maximum coupling capacitance typical) between clamp cable. High energy transients capacitively coupled onto signal lines. Fast rise times ns), specified standard, result very effective coupling. Because high voltages coupled onto signal lines, this test very severe. repetitive transients often cause problems where single pulses not. Destructive latch-up induced high energy content transients. Note that this stress applied while interface products powered transmitting data. test applies hundreds pulses with higher energy than ESD. Worst-case transient current line high Test results classified according following: Classification Normal performance within specification limits. Classification Temporary degradation loss performance that self recoverable.
ADM2xxE family products easily meets Classification most stringent requirement (Level fact, field strengths showed performance degradation, errorfree data transmission continued even during irradiation.
Rev. Page
Table Test Severity Levels (IEC 1000-4-3)
Level Field Strength (V/m)
SWITCHING GLITCHES
EMISSIONS/INTERFERENCE
55022, CISPR defines permitted limits radiated conducted interference from information technology (IT) equipment. objective standard minimize level emissions, both conducted radiated. ease measurement analysis, conducted emissions assumed predominate below MHz, radiated emissions assumed predominate above MHz.
(dBµV)
Figure Switching Glitches
00068-032
LIMIT
CONDUCTED EMISSIONS
This measure noise that conducted onto line power supply. Switching transients from charge pump that magnitude that contain significant energy lead conducted emissions. Another source conducted emissions overlap switch-on times charge pump voltage converter. voltage doubler shown Figure fully turned before turns transient current glitch occurs between that results conducted emissions. Therefore, important that switches charge pump guarantee break-before-make switching under conditions instantaneous short-circuit conditions occur. ADM2xxE have been designed minimize switching transients ensure break-before-make switching, thereby minimizing conducted emissions. This results emission levels well below specified limits. Other than recommended capacitor, additional filtering/decoupling required. Conducted emissions measured monitoring line power supply. equipment used consists line impedance stabilizing network (LISN) that essentially presents fixed impedance spectrum analyzer. spectrum analyzer scans emissions MHz. plot ADM211E shown Figure
2VCC
00068-033
0.33
FREQUENCY (MHz)
Figure Conducted Emissions Plot
RADIATED EMISSIONS
Radiated emissions measured frequencies excess MHz. RS-232 outputs designed operation high baud rates while driving cables radiate high frequency energy. previously described causes conducted emissions also cause radiated emissions. Fast RS-232 output transitions radiate interference, especially when lightly loaded driving unshielded cables. Charge pump devices also prone radiating noise high frequency oscillator high voltages being switched charge pump. move toward smaller capacitors order conserve board space resulted higher frequency oscillators being employed charge pump design, resulting higher levels conducted radiated emissions. RS-232 outputs ADM2xxE products feature controlled slew rate order minimize level radiated emissions, they fast enough support data rates kbps.
INTERNAL OSCILLATOR
00068-031
Figure Charge Pump Voltage Doubler
Rev. Page
RADIATED NOISE
TURNTABLE ADJUSTABLE ANTENNA RECEIVER
(dBµV)
00068-034
LIMIT
Figure Radiated Emissions Test Setup
Figure shows plot radiated emissions frequency. levels emissions well within specifications, without need additional shielding filtering components. ADM2xxE were operated maximum baud rates configured like typical RS-232 interface. Testing radiated emissions carried shielded anechoic chamber.
START 30.0MHz
STOP 200.0MHz
Figure Radiated Emissions
Rev. Page
00068-035
OUTLINE DIMENSIONS
1.280 (32.51) 1.250 (31.75) 1.230 (31.24)
0.280 (7.11) 0.250 (6.35) 0.240 (6.10) 0.325 (8.26) 0.310 (7.87) 0.300 (7.62) 0.060 (1.52) 0.015 (0.38) 0.015 (0.38) GAUGE PLANE SEATING PLANE 0.430 (10.92) 0.195 (4.95) 0.130 (3.30) 0.115 (2.92)
0.100 (2.54) 0.210 (5.33) 0.150 (3.81) 0.130 (3.30) 0.115 (2.92) 0.022 (0.56) 0.018 (0.46) 0.014 (0.36)
0.005 (0.13) 0.070 (1.78) 0.060 (1.52) 0.045 (1.14)
0.014 (0.36) 0.010 (0.25) 0.008 (0.20)
COMPLIANT JEDEC STANDARDS MS-001-AF CONTROLLING DIMENSIONS INCHES; MILLIMETER DIMENSIONS PARENTHESES) ROUNDED-OFF INCH EQUIVALENTS REFERENCE ONLY APPROPRIATE DESIGN. CORNER LEADS CONFIGURED WHOLE HALF LEADS.
Figure 24-Lead Plastic Dual In-Line Package [PDIP] (N-24-1) Dimensions shown inches (millimeters)
15.60 (0.6142) 15.20 (0.5984)
7.60 (0.2992) 7.40 (0.2913)
10.65 (0.4193) 10.00 (0.3937)
0.75 (0.0295) 0.25 (0.0098)
0.30 (0.0118) 0.10 (0.0039) COPLANARITY 0.10 1.27 (0.0500) 0.51 (0.0201) 0.31 (0.0122)
2.65 (0.1043) 2.35 (0.0925)
1.27 (0.0500) 0.40 (0.0157)
SEATING PLANE
0.33 (0.0130) 0.20 (0.0079)
COMPLIANT JEDEC STANDARDS MS-013-AD CONTROLLING DIMENSIONS MILLIMETERS; INCH DIMENSIONS PARENTHESES) ROUNDED-OFF MILLIMETER EQUIVALENTS REFERENCE ONLY APPROPRIATE DESIGN.
Figure 24-Lead Standard Small Outline Package [SOIC_W] Wide Body (RW-24) Dimensions shown millimeters (inches)
Rev. Page
060706-A
18.10 (0.7126) 17.70 (0.6969)
7.60 (0.2992) 7.40 (0.2913)
10.65 (0.4193) 10.00 (0.3937)
0.30 (0.0118) 0.10 (0.0039) COPLANARITY 0.10 1.27 (0.0500) 0.51 (0.0201) 0.31 (0.0122)
2.65 (0.1043) 2.35 (0.0925)
0.75 (0.0295) 0.25 (0.0098)
SEATING PLANE
0.33 (0.0130) 0.20 (0.0079)
1.27 (0.0500) 0.40 (0.0157)
COMPLIANT JEDEC STANDARDS MS-013-AE CONTROLLING DIMENSIONS MILLIMETERS; INCH DIMENSIONS PARENTHESES) ROUNDED-OFF MILLIMETER EQUIVALENTS REFERENCE ONLY APPROPRIATE DESIGN.
Figure 28-Lead Standard Small Outline Package [SOIC_W] Wide Body (RW-28) Dimensions shown millimeters (inches)
8.50 8.20 7.90
5.60 5.30 5.00
8.20 7.80 7.40
2.00
1.85 1.75 1.65 0.38 0.22 SEATING PLANE
0.25 0.09
0.05 COPLANARITY 0.10 0.65
0.95 0.75 0.55
060106-A
COMPLIANT JEDEC STANDARDS MO-150-AG
Figure 24-Lead Shrink Small Outline Package [SSOP] (RS-24) Dimensions shown millimeters
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060706-A
10.50 10.20 9.90
5.60 5.30 5.00
8.20 7.80 7.40
2.00
1.85 1.75 1.65 0.38 0.22 SEATING PLANE
0.25 0.09
0.05 COPLANARITY 0.10 0.65
0.95 0.75 0.55
060106-A
COMPLIANT JEDEC STANDARDS MO-150-AH
Figure 28-Lead Shrink Small Outline Package [SSOP] (RS-28) Dimensions shown millimeters
7.90 7.80 7.70
4.50 4.40 4.30
6.40
0.65 0.15 0.05 0.30 0.19 0.10 COPLANARITY 1.20 0.75 0.60 0.45
SEATING PLANE
0.20 0.09
COMPLIANT JEDEC STANDARDS MO-153-AD
Figure 24-Lead Thin Shrink Small Outline Package [TSSOP] (RU-24) Dimensions shown millimeters
9.80 9.70 9.60
4.50 4.40 4.30
6.40
0.65 0.15 0.05 COPLANARITY 0.10 0.30 0.19 1.20 0.75 0.60 0.45
SEATING PLANE
0.20 0.09
COMPLIANT JEDEC STANDARDS MO-153-AE
Figure 28-Lead Thin Shrink Small Outline Package [TSSOP] (RU-28) Dimensions shown millimeters
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ORDERING GUIDE
Model ADM206EAR ADM206EAR-REEL ADM206EARZ ADM206EARZ-REEL1 ADM207EAN ADM207EANZ1 ADM207EAR ADM207EAR-REEL ADM207EARZ1 ADM207EARZ-REEL1 ADM207EARS ADM207EARS-REEL ADM207EARU ADM207EARU-REEL ADM207EARU-REEL7 ADM207EARUZ1 ADM207EARUZ-REEL71 ADM208EAN ADM208EANZ1 ADM208EAR ADM208EAR-REEL ADM208EARZ1 ADM208EARZ-REEL1 ADM208EARS ADM208EARS-REEL ADM208EARSZ1 ADM208EARSZ-REEL1 ADM208EARU ADM208EARU-REEL ADM208EARU-REEL7 ADM208EARUZ1 ADM208EARUZ-REEL1 ADM211EAR ADM211EAR-REEL ADM211EARZ1 ADM211EARZ-REEL1 ADM211EARS ADM211EARS-REEL ADM211EARSZ1 ADM211EARSZ-REEL1 ADM211EARU ADM211EARU-REEL ADM211EARU-REEL7 ADM211EARUZ1 ADM211EARUZ-REEL1 ADM211EARUZ-REEL71 Temperature Range -40°C +85°C -40°C +85°C -40°C +85°C -40°C +85°C -40°C +85°C -40°C +85°C -40°C +85°C -40°C +85°C -40°C +85°C -40°C +85°C -40°C +85°C -40°C +85°C -40°C +85°C -40°C +85°C -40°C +85°C -40°C +85°C -40°C +85°C -40°C +85°C -40°C +85°C -40°C +85°C -40°C +85°C -40°C +85°C -40°C +85°C -40°C +85°C -40°C +85°C -40°C +85°C -40°C +85°C -40°C +85°C -40°C +85°C -40°C +85°C -40°C +85°C -40°C +85°C -40°C +85°C -40°C +85°C -40°C +85°C -40°C +85°C -40°C +85°C -40°C +85°C -40°C +85°C -40°C +85°C -40°C +85°C -40°C +85°C -40°C +85°C -40°C +85°C -40°C +85°C -40°C +85°C Package Description 24-Lead SOIC_W 24-Lead SOIC_W 24-Lead SOIC_W 24-Lead SOIC_W 24-Lead PDIP 24-Lead PDIP 24-Lead SOIC_W 24-Lead SOIC_W 24-Lead SOIC_W 24-Lead SOIC_W 24-Lead SSOP 24-Lead SSOP 24-Lead TSSOP 24-Lead TSSOP 24-Lead TSSOP 24-Lead TSSOP 24-Lead TSSOP 24-Lead PDIP 24-Lead PDIP 24-Lead SOIC_W 24-Lead SOIC_W 24-Lead SOIC_W 24-Lead SOIC_W 24-Lead SSOP 24-Lead SSOP 24-Lead SSOP 24-Lead SSOP 24-Lead TSSOP 24-Lead TSSOP 24-Lead TSSOP 24-Lead TSSOP 24-Lead TSSOP 28-Lead SOIC_W 28-Lead SOIC_W 28-Lead SOIC_W 28-Lead SOIC_W 28-Lead SSOP 28-Lead SSOP 28-Lead SSOP 28-Lead SSOP 28-Lead TSSOP 28-Lead TSSOP 28-Lead TSSOP 28-Lead TSSOP 28-Lead TSSOP 28-Lead TSSOP Package Option RW-24 RW-24 RW-24 RW-24 N-24-1 N-24-1 RW-24 RW-24 RW-24 RW-24 RS-24 RS-24 RU-24 RU-24 RU-24 RU-24 RU-24 N-24-1 N-24-1 RW-24 RW-24 RW-24 RW-24 RS-24 RS-24 RS-24 RS-24 RU-24 RU-24 RU-24 RU-24 RU-24 RW-28 RW-28 RW-28 RW-28 RS-28 RS-28 RS-28 RS-28 RU-28 RU-28 RU-28 RU-28 RU-28 RU-28
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Model ADM213EAR ADM213EAR-REEL ADM213EARZ1 ADM213EARZ-REEL1 ADM213EARS ADM213EARS-REEL ADM213EARSZ1 ADM213EARSZ-REEL1 ADM213EARU ADM213EARU-REEL ADM213EARU-REEL7 ADM213EARUZ1 ADM213EARUZ-REEL1 ADM213EARUZ-REEL71
Temperature Range -40°C +85°C -40°C +85°C -40°C +85°C -40°C +85°C -40°C +85°C -40°C +85°C -40°C +85°C -40°C +85°C -40°C +85°C -40°C +85°C -40°C +85°C -40°C +85°C -40°C +85°C -40°C +85°C
Package Description 28-Lead SOIC_W 28-Lead SOIC_W 28-Lead SOIC_W 28-Lead SOIC_W 28-Lead SSOP 28-Lead SSOP 28-Lead SSOP 28-Lead SSOP 28-Lead TSSOP 28-Lead TSSOP 28-Lead TSSOP 28-Lead TSSOP 28-Lead TSSOP 28-Lead TSSOP
Package Option RW-28 RW-28 RW-28 RW-28 RS-28 RS-28 RS-28 RS-28 RU-28 RU-28 RU-28 RU-28 RU-28 RU-28
Pb-free part.
©2006 Analog Devices, Inc. rights reserved. Trademarks registered trademarks property their respective owners. C00068-0-9/06(E)
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