EMIF6-100LLFC FILTER/TVS ARRAY Cellular Phones Notebooks Per

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EMIF6-100LLFC FILTER/TVS ARRAY Cellular Phones Notebooks Per

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05247
EMIF6-100LLFC
FILTER/TVS ARRAY
Cellular Phones Notebooks Personal Digital Assistant (PDA) Ground Positioning System (GPS) SMART Card
COMPATIBILITY (EN61000-4)
61000-4-2 (ESD): 15kV, Contact 61000-4-4 (EFT): 5/50ns BUMP FLIP CHIP
FEATURES
Protection kilovolts Bidirectional Filtering/TVS Pass Filters Insertion Loss: -3db Roll-Off 150MHz Protects Six(6) Data Lines RoHS Compliant
MECHANICAL CHARACTERISTICS
Bump Flip Chip Package Weight 0.73 milligrams (Approximate) Available Lead-Free Plating Solder Reflow Temperature: Lead-Free Sn/Ag/Cu, 96/3.5/0.5: 260-270°C Consult Factory Leaded Device Availability Flammability Rating 94V-0 Tape Reel Standard
CONFIGURATION
Each Line
I/On I/On
05247.R2 2/07
www.protekdevices.com
EMIF6-100LLFC
DEVICE CHARACTERISTICS
MAXIMUM RATINGS 25°C Unless Otherwise Specified
PARAMETER
Operating Temperature Storage Temperature Power Resistor Typical Resistance
SYMBOL
TSTG
VALUE
UNITS
OHMS
ELECTRICAL CHARACTERISTICS LINE
PART NUMBER RATED STAND-OFF VOLTAGE MINIMUM BREAKDOWN VOLTAGE MAXIMUM REVERSE LEAKAGE CURRENT
25°C Unless Otherwise Specified MINIMUM ATTENUATION CUT-OFF FREQUENCY OHMS I/O) ZERO BIAS TYPICAL CAPACITANCE LINE (See Note @2.5V, 1MHz CLINE
TYPICAL FORWARD VOLTAGE
VOLTS EMIF6-100LFC Note tolerance.
V(BR) VOLTS
@10mA VOLTS
800-3000
1.100
FIGURE RESISTANCE TEMPERATURE (Normalized Resistance 25°C)
Normalized Resistance
1.060
1.020
0.980
0.940
0.900 Temperature
05247.R2 2/07
www.protekdevices.com
EMIF6-100LLFC
GRAPHS
FIGURE OVERSHOOT CLAMPING VOLTAGE
Volts Division
Test Pulse: kilovolt, 1/30ns (waveform)
FIGURE INSERTION LOSS
Gain (dB)
Frequency (MHz)
Volts
Volts
1000
10000
05247.R2 2/07
www.protekdevices.com
EMIF6-100LLFC
SOLDER RECOMMENDATIONS
PRINTED CIRCUIT BOARD RECOMMENDATIONS
PARAMETER
Size Shape Definition Solder Mask Opening Solder Stencil Thickness Solder Stencil Aperture Opening (laser cut, tapered walls) Solder Paste Type Protective Finish Tolerance Edge Corner Ball Solder Ball Side Coplanarity Maximum Dwell Time Above Liquidous (183°C) Soldering Maximum Temperature
VALUE
0.275mm Round Non-Solder Mask Defined Pads 0.325mm Round 0.150mm 0.330mm Round Clean OSP(Entek Plus 106A) ±50µm ±20µm Seconds 270°C
REQUIREMENTS
Temperature: Lead-Free (SnAgCu): 260-270°C Tin-Lead: 240-245°C Preheat time temperature depends solder paste flux activation temperature, component size, weight, surface area plating.
RECOMMENDED NON-SOLDER MASK DEFINED ILLUSTRATION
Non-Solder Mask Defined 0.275mm DIA.
Solder Mask Opening 0.325mm DIA.
Solder Stencil Opening 0.330mm DIA.
Ramp-up
Temperature
Ramp-down TSMAX 155° TSMIN 140° Preheat
25°C Peak 30-60 seconds
Ramp-up seconds
Solder Time 15-20 seconds
Ramp-down
05247.R2 2/07
www.protekdevices.com
EMIF6-100LLFC
BUMP FLIP CHIP PACKAGE OUTLINE DIMENSIONS
PACKAGE OUTLINE
BOTTOM VIEW
PACKAGE DIMENSIONS MILLIMETERS INCHES
0.1148 0.0506 0.0195 0.0096 0.0169 0.0169 0.0071 0.0071 0.0170 0.0130
0.30 DIA. 63/67 Sn/Pb Solder Bumps
SIDE VIEW
2.915 1.285 0.495 0.245 0.430 0.430 0.180 0.180 0.432 0.330
3.005 1.375 0.505 0.255 0.440 0.440 0.280 0.280 0.559 0.457
0.1183 0.0541 0.0199 0.0100 0.0173 0.0173 0.0110 0.0110 0.0220 0.0180
NOTE: Controlling dimensions millimeters.
SOLDER LAYOUT
TAPE REEL ORDERING NOMENCLATURE Surface mount product taped reeled accordance with EIA-481. Plastic Tape: Suffix-T73-1 Inch Reel 3,000 pieces reel, i.e., EMIF6-100LFC-T73-1. Suffix Lead-Free, i.e., EMIF6-100LFC-LF-T73-1. Suffix Coated Version, i.e., EMIF6-100LFC-T73C-1.
0.86
solder mask defined 0.275mm Solder mask opening 0.325mm
Solder stencil opening 0.330mm 0.50 0.25
Outline Dimensions: 8/06, 06042
Tape Reel Specifications (Dimensions millimeters)
Reel Dia. 178mm (7") Tape Width
1.78 0.05 3.35 0.05 0.76 0.05 1.50 0.10 1.75 0.10 3.50 0.05 8.00 ±0.30 4.00 ±0.10 2.00 ±0.05 4.00 ±0.10 0.20±0.025
Pitches Cumulative Tolerance Tape.
MARKING CODE DIAGRAM LLFC LLFC
cover tape
LLFC
User Direction Feed
COPYRIGHT ProTek Devices 2007 SPECIFICATIONS: ProTek reserves right change electrical mechanical characteristics described herein without notice (except JEDEC). DESIGN CHANGES: ProTek reserves right discontinue product lines without notice, that final judgement concerning selection specifications buyer's that furnishing engineering technical assistance, ProTek assumes responsibility with respect selection specifications such products.
ProTek Devices 2929 South Fair Lane, Tempe, 85282 Tel: 602-431-8101 Fax: 602-431-2288 E-Mail: sales@protekdevices.com Site: www.protekdevices.com
05247.R2 2/07
www.protekdevices.com

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