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Thermal Interface Material Comparison:
Thermal Pads Thermal Grease
Publication 26951 Revision: 3.00 Issue Date: April 2004
2004 Advanced Micro Devices, Inc.
rights reserved.
contents this document provided connection with Advanced Micro Devices, Inc. ("AMD") products. makes representations warranties with respect accuracy completeness contents this publication reserves right make changes specifications product descriptions time without notice. license, whether express, implied, arising estoppel, otherwise, intellectual property rights granted this publication. Except forth AMD's Standard Terms Conditions Sale, assumes liability whatsoever, disclaims express implied warranty, relating products including, limited implied warranty merchantability, fitness particular purpose, infringement intellectual property right. AMD's products designed, intended, authorized warranted components systems intended surgical implant into body, other applications intended support sustain life, other application which failure AMD's product could create situation where personal injury, death, severe property environmental damage occur. reserves right discontinue make changes products time without notice.
Trademarks
AMD, Arrow logo, Athlon, Duron, Opteron combinations thereof, trademarks Advanced Micro Devices, Inc. Other product names used this publication identification purposes only trademarks their respective companies.
26951 Rev. 3.00 April 2004
Thermal Interface Material Comparison: Thermal Pads Thermal Grease
Contents
Revision History Chapter Chapter 2.1.1 2.1.2 2.1.3 2.1.4 2.1.5 2.2.1 2.2.2 2.4.1 2.4.2 Introduction.7 Interface Materials.9 Thermal Conductivity Material Electrical Conductivity Material.9 Spreading Characteristics Material.10 Long-Term Stability Reliability Material Ease Application.10 Comparing Types Interface Materials Thermal Pads (Phase-Change Materials).10 Thermal Grease.11 Thermal Material Handling Guidelines Heatsink Installation Guidelines.13 Installation with Thermal Pads (Phase-Change Material) Installation with Thermal Grease.14 Additional Information
Guidelines Thermal Interface Materials.9
Contents
Thermal Interface Material Comparison: Thermal Pads Thermal Grease
26951 Rev. 3.00 April 2004
List Figures
Figure Figure Thermal Interface Material Comparison AthlonMP, Athlon DuronProcessors Thermal Interface Material Comparison Athlon OpteronProcessors
List Figures
26951 Rev. 3.00 April 2004
Thermal Interface Material Comparison: Thermal Pads Thermal Grease
Revision History
Date April 2004 Revision 3.00 Initial public release. Description
Revision History
Thermal Interface Material Comparison: Thermal Pads Thermal Grease
26951 Rev. 3.00 April 2004
Revision History
26951 Rev. 3.00 April 2004
Thermal Interface Material Comparison: Thermal Pads Thermal Grease
Chapter
Introduction
This document compares different materials used thermal interface between processor heatsink. When installing heatsinks Athlon64, Athlon Athlon DuronTM, Opteronprocessors, suitable thermal interface material must used. This thermal material significantly aids transfer heat from processor heatsink. optimum heat transfer, recommends high-performance thermal interface materials only. lidless processors, such Athlon Athlon Duron processors, surface silicon chip contacts bottom heatsink. lidded processors, such Athlon Opteron processors, contacts heatsink. surfaces types processors, lidless lidded, different sizes, recommends different type thermal material long-term with each type processor. Processor-in-a-Box solutions include heatsinks with pre-applied, high-performance thermal interface materials. High-performance thermal interface material needed because even largest heatsink cannot effectively cool processor unless there good physical contact between base heatsink processor. surfaces both heatsink processor absolutely smooth. This surface roughness observed when examined microscopic level. Because this surface roughness reduces effective contact area, attaching heatsink without thermal interface material sufficient inadequate surface contact. shown exaggerated form) Figure page Figure page tiny gaps exist between nearly flat surfaces. thermal compound such phase-change material thermal grease fills these gaps allows effective heat transference between processor heatsink.
Chapter
Introduction
Thermal Interface Material Comparison: Thermal Pads Thermal Grease
26951 Rev. 3.00 April 2004
Figure
Thermal Interface Material Comparison AthlonMP, Athlon DuronProcessors
Figure
Thermal Interface Material Comparison Athlon64 OpteronProcessors
Introduction
Chapter
26951 Rev. 3.00 April 2004
Thermal Interface Material Comparison: Thermal Pads Thermal Grease
Chapter
Interface Materials
types thermal interface material (TIM) commonly used computer industry: Thermal pads, also called phase-change materials. Thermal grease, also called thermal paste. Phase-change materials usually thin pads approximately (2.5 size have protective films attached both surfaces. color vendor-specific usually gray pink. Thermal grease usually comes syringe, tube, small plastic sachet. Thermal grease similar consistency ordinary toothpaste typically gray white.
Guidelines Thermal Interface Materials
Five factors affect choice, use, performance interface material used between processor heatsink. Thermal conductivity material Electrical conductivity material Spreading characteristics material Long-term stability reliability material Ease application
2.1.1
Thermal Conductivity Material
Thermal conductivity quantified ability material transfer heat. thermal conductivity interface material significant impact thermal performance. higher thermal conductivity, more efficient material transferring heat. Materials that have lower thermal conductivity less efficient transferring heat, causing higher temperature differential exist across interface. overcome this less efficient heat transfer, better cooling solution (typically, more costly solution) must used achieve desired heat dissipation.
2.1.2
Electrical Conductivity Material
Some metal-based compounds electrically conductive, whereas ceramic-based compounds typically not. Manufacturers produce metal-based compounds with electrical conductivity, some these materials completely electrically inert. Metal-based thermal compounds hazardous processor itself, other elements
Chapter
Interface Materials
Thermal Interface Material Comparison: Thermal Pads Thermal Grease
26951 Rev. 3.00 April 2004
processor motherboard risk they become contaminated compound. this reason, does recommend electrically conductive thermal interface material.
2.1.3
Spreading Characteristics Material
spreading characteristics thermal interface material determine ability, under pressure mounted heatsink, spread fill eliminate gaps between processor heatsink. Because very poor thermal conductor, more completely interface material fills gaps, greater heat transference.
2.1.4
Long-Term Stability Reliability Material
long-term stability reliability thermal interface material ability provide sufficient thermal conductance even after extended time extensive computer (for example, servers personal computers that work hours day, days week). Low-quality compounds harden leak over time (the pump-out effect), leading overheating premature failure processor. High-quality compounds provide stable reliable thermal interface material throughout lifetime processor. Thermal greases with higher viscosities typically more resistant pump effects lidless processors.
2.1.5
Ease Application
spreadable thermal grease requires installer carefully appropriate amount material. much little material cause problems. fixed size therefore easier apply consistent manner.
Comparing Types Interface Materials
types thermal interface materials share many characteristics, they also quite different.
2.2.1
Thermal Pads (Phase-Change Materials)
feature thermal pads their ability change their physical characteristics. room temperature these materials firm easy handle. This allows more control when applying solid pads heatsink surface. thermal material softens reaches componentoperating temperatures. With heat from operating processor light clamping pressure, phase-change material readily conforms both surfaces. This ability completely fill interfacial gaps surface voids that typical between component packages heatsinks allows performance comparable thermal grease. list recommended thermal pads, Thermal, Mechanical, Chassis Cooling Design Guide, order# 23794. Interface Materials Chapter
26951 Rev. 3.00 April 2004
Thermal Interface Material Comparison: Thermal Pads Thermal Grease
Thermal pads solution recommends AthlonMP, Athlon Duron processors. advantages thermal pads these processors include: They handled more easily than thermal grease. thermal interface material less likely pumped space between processor heatsink surface. thermal compound distributed uniform manner thermal interface pads. pads contain appropriate dosage needed achieve optimal heat dissipation heatsink. After installation, some phase-change pads create strong adhesive bond between processor heatsink. Exercise care when removing heatsink from processor. slight twisting rotating movement should help remove heatsink. Using strong force remove heatsink damage processor. Note: Thermal Pads recommended with lidded processors.
2.2.2
Thermal Grease
Thermal grease normally packaged syringe, tube, small plastic sachet (pouch package). correct amount material must applied designated area. most important point remember that because heat transfer inversely proportional thickness interface material layer, better heat transfer achieved with thinner layer. important ensure that proper amount paste grease dispensed only prior installation heatsink. little material leave gaps between heatsink processor; much material cause some material leak outside designated area, causing mess possibly contaminating other components processor. High-performance thermal greases pastes recommended solution lidded processors, such Athlon Opteronprocessors. list recommended greases lidded parts, Athlon Opteron Processors Thermal Design Guide, order# 26633. These greases also suitable testing short-term lidless processors, such Athlon Athlon Duron, Mobile Athlon processors. long-term lidless processors, recommends phasechange materials thermal solution.
Chapter
Interface Materials
Thermal Interface Material Comparison: Thermal Pads Thermal Grease
26951 Rev. 3.00 April 2004
quality compound also very important. Manufacturers thermal grease paste various components achieve good thermal conductivity proper spreading characteristics. These components have direct effect consistency durability compound. following should noted: Ensure that proper amount compound used. little thermal compound reduces thermal conductivity. compound prevent adequate heat transference heatsink. This cause damage processor. excessive amount thermal compound cause some material leak operational temperatures, potentially causing contamination failure other components motherboard. Low-quality compounds often harden quickly. When they out, they longer adequate thermal conductors. Low-quality compounds become fluid leak operating temperatures system. Does currently recommend using thermal compounds that electrically conductive. Electrically conductive thermal compounds include most silver gold pastes. These types thermal compounds leak contact vulnerable elements processor motherboard (such capacitors, resistors, pins, etc.), which cause shortcircuits damage processor other components. Before use, ensure that thermal compound reached expiration date.
Thermal Material Handling Guidelines
heatsink your processor should: Include appropriate thermal interface material. recommended site recommended processor wish use. included Processor-in-a-Box solution available retail shops.
familiar with installing heatsink processor, seek assistance professional system builder. Incorrect handling assembling computer components damage parts, void warranty, lead disappointing results. heatsink does include thermal interface material, inexperienced users should request assistance help from electronics supplier computer product supplier where heatsink purchased. Before applying interface material, always make sure that surfaces clean free foreign materials. surface heatsink processor becomes soiled greasy, lint-free wipe cloth mild solvent such denatured alcohol clean Interface Materials Chapter
26951 Rev. 3.00 April 2004
Thermal Interface Material Comparison: Thermal Pads Thermal Grease
System Configuration Information http://www.amd.com/systemconfig more guidance. Note: Never reuse thermal interface material. case want reuse your heatsink, remove residue previously used thermal material with nonmetallic object like plastic spatula then lint-free wipe cloth mild solvent such denatured alcohol fully cleanse surface. Reapply thermal interface material.
Heatsink Installation Guidelines
Follow installation guidelines either thermal pads (see Section 2.4.1) thermal grease (see Section 2.4.2). Before reusing heatsink, remove previously applied thermal interface material apply fresh layer thermal interface material. Caution: Never both thermal thermal grease same time!
2.4.1
Installation with Thermal Pads (Phase-Change Material)
Follow these guidelines install heatsink processor, using thermal thermal interface material. Thermal pads should used with Athlon Athlon Duron processors only. These processors lidless, that processor comes into direct contact with heatsink. Verify that heatsink thermal attached. heatsink does have thermal attached, locate area heatsink that will directly contact processor, apply thermal this area only. Remove protective film(s) from thermal pad. Mount heatsink onto processor. Always follow AMD-recommended procedures install heatsink onto processor avoid damaging processor motherboard. Socket Processor Heatsink Installation Guide, order# 23986 re-use thermal pads. Before re-using heatsink remove thermal interface material reapply thermal pad. Caution: thermal Athlon Opteron processors!
Chapter
Interface Materials
Thermal Interface Material Comparison: Thermal Pads Thermal Grease
26951 Rev. 3.00 April 2004
2.4.2
Installation with Thermal Grease
Follow these guidelines install heatsink processor, using thermal grease thermal interface material. Thermal grease recommended long-term usage lidded parts, such Athlon Opteron processors. These processors lidded, that processor covered with lid, lid, processor die, that comes into direct contact with heatsink. Verify that heatsink does have thermal attached. Spread thin layer thermal compound processor only. guideline, quantity required Athlon Athlon Duron processors about same volume small grains rice placed center processor die. quantity required Athlon Opteron processors about same volume five small grains rice placed center lid. either case, make sure that entire processor surface covered evenly spread, thin layer thermal material. Verify that thermal grease covers processor only, other components. Mount heatsink onto processor. Always follow AMD-recommended procedures install heatsink onto processor avoid damaging processor motherboard. Caution: lidless processors, such Athlon Athlon Duron processors, thermal grease recommended only short-term use; long-term recommends thermal pads.
Interface Materials
Chapter
26951 Rev. 3.00 April 2004
Thermal Interface Material Comparison: Thermal Pads Thermal Grease
Additional Information
Socket Processor Heatsink Installation Guide, order# 23986 describes procedure installing heatsinks with either thermal pads, thermal grease, thermal paste found under Build Installation Guides System Configuration Information screen Several videos available guide through phases installation. There available
Chapter
Interface Materials
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