Printed Wiring Board YAMAVICO Processed Build-up Printed Wiring B
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Series: Build-up Type:
Printed Wiring Board YAMAVICO Processed Build-up
Printed Wiring Board which available stack holes filling them with copper plating (YAMAVICO process). Also, R-via structure, which designed place copper plating filled hole into base board, available.
Features
Smaller, lighter, thinner, higher density wiring Design flexible Halogen-Free available RoHS Compliant
Recommended Applications
Cellular phones Digital video cameras Digital still cameras Digital appliances, etc.
Properties
Item Base Material Thickness Board (Standard) Hole Size Size (Standard) Line/Space (Standard) YAMAVICO processed Build-up Printed Wiring Board Glass-epoxy resin 0.80 (3+2+3) 0.75 (3+2+3 R-via) 75/75
Recognized Standards
Standard (File No.E107496)
YAMAVICO processed Build-up Printed Wiring Board (Halogen-Free)
Base Production site Japan Type Flammability ANSI Grade FR-4
Conductor min. Width min. Edge (mm) Width (mm) 0.03 0.03 max. Width (mm) 25.4 Soldering Limits (°C), 260, Rated Temp. (°C)
NTP-GMK-T
94V-0
These values designing.
Structure
Type:YAMAVICO processed Build-up Printed Wiring Board Type:YAMAVICO processed Build-up Printed Wiring Board (R-via)
Build-up Layers
Stacked
Build-up Layers
R-via
Base board
Base board
Design specifications each subject change without notice. factory current technical specifications before purchase and/or use. Should safety concern arise regarding this product, please sure contact immediately.
Feb. 2007
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