Printed Wiring Board Build-up Printed Wiring Board which consists
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Series: Build-up Type:
Printed Wiring Board Build-up
Printed Wiring Board which consists piling insulating layers conductive layers onto base board interconnects them copper plated hole formed laser drilling.
Features
Smaller, lighter, higher density wiring Halogen-free available RoHS Compliant
Recommended Applications
Cellular phones Digital video cameras Digital still cameras Digital appliances, etc.
Properties
Item Base Material Thickness Board (Standard) Hole Size Size (Standard) Line/Space (Standard) Build-up Printed Wiring Board Glass-epoxy resin (2+4+2) 75/75
Recognized Standards
Standard (File No.E107496)
Build-up Printed Wiring Board (Halogen-Free)
Base Production site Japan Type Flammability ANSI Grade FR-4
Conductor min. Width min. Edge (mm) Width (mm) 0.03 0.03 max. Width (mm) 25.4 Soldering Limits (°C), 260, Rated Temp. (°C)
NTP-GMK-T
94V-0
These values designing.
Structure
Type:Build-up
Base board Build-up Layers
Design specifications each subject change without notice. factory current technical specifications before purchase and/or use. Should safety concern arise regarding this product, please sure contact immediately.
Feb. 2007
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