Japan Taiwan Type: ALIVH G-Type Properties Item Ba
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Series: ALIVHType: ALIVHAny Layer structure Multilayer Printed Wiring Board adopts base material made nonwoven aramid interconnects between arbitrary layers filling small hole formed laser drilling filled with copper paste. Industrial Property Pending Application Registered Patents
Japan Taiwan
Type: ALIVH
G-Type
Properties
Item Base Material Thickness Board Layer (standard) Hole Size Size Line/Space Dielectric Constant (1GHz) Density g/mL ALIVHALIVHG-Type
Non-woven aramid Glass-epoxy resin fabric-epoxy resin
Layer structure with Halogen-free glass-epoxy material.
Features
Smaller, lighter, higher density wiring. Easier design with, which creates shorter total design time. RoHS Compliant
0.75 0.95
0.60 1.00
min. min. min. 60/70
Recommended Applications
Cellular phones Digital still cameras Personal Digital Assistants cards
Recognized Standards
Standard (File E36779) Type ALIVH Production site Japan Type EBKN2 EBKN1 Flammability 94V-0 94V-0 Base ANSI Grade Conductor min. Width min. Edge (mm) Width (mm) 0.025 0.025 0.05 0.05 max. Width (mm) 19.8 19.8 Soldering Limits (°C), 270, 260, Rated Temp. (°C)
These values designing.
Type ALIVH G-Type Production site Japan, Taiwan Type EBKN7 Flammability 94V-0 Base ANSI Grade FR-4 Conductor min. Width min. Edge (mm) Width (mm) 0.025 0.05 max. Width (mm) 19.8 Soldering Limits (°C), 270, Rated Temp. (°C)
These values designing.
Benefit Layer Structure
Conventional Through-hole Structure
Solder
ALIVH Layer Structure
Device
Through-hole Interstitial hole
Unable package through-hole
Enable package almost surface
Design specifications each subject change without notice. factory current technical specifications before purchase and/or use. Should safety concern arise regarding this product, please sure contact immediately.
Feb. 2006
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