Printed Wiring Board Printed Wiring Board with Through-holes Japa
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Series: Multilayer Type: Multilayer
Printed Wiring Board Printed Wiring Board with Through-holes
Japan China Taiwan Thailand
Multilayer Both surface conductive layers internal conductive layers connected plated through-holes Industrial Property; Registered Patents Type:
Multilayer Printed Wiring Board with Through-holes IVHs
Multilayer Printed Wiring Board with IVHs electrically interconnects between layer conductors with non-through holes under chip land Industrial Property; Registered Patents Type: Build-Up Printed Wiring Board Build-up Printed Wiring Board Multilayer manufactured build-up process that piled progressively with conductor layers insulating layers using techniques such plating printing.
Features
Suitable high density surface mounting Smaller board size reducing through holes Noise reduction shortening wiring length RoHS Compliant (Except solder pre-coated with including lead one)
Recommended Applications
Notebook PCs, Cellular phones Video cameras, digital still cameras Digital TVs, STB, recorders Automotive devices
Recognized Standards
Standard (File E36779)
Multilayer Printed Wiring Board with Through-holes Multilayer Printed Wiring Board with Through-holes IVHs
Production site Japan China, Taiwan Thailand
Type EMMM1 EMMM2 EMMM4
Flammability 94V-0 94V-0 94V-0
Base ANSI Grade
max. Width (mm) FR-4 0.05 0.15 FR-4 0.05 0.15 50.8 FR-4 0.03 0.03 25.4 Please contact about specifications.
Conductor min. Width min. Edge (mm) Width (mm)
Soldering Limits (°C), 260, 288,
Rated Temp. (°C)
These values designing. Multilayer Printed Wiring Board Halogen-free
Production site Japan
Type EMMM3
Flammability 94V-0
Base ANSI Grade FR-4 Base ANSI Grade
Conductor min. Width min. Edge (mm) Width (mm) 0.05 0.15
max. Width (mm) 50.8
Soldering Limits (°C), 260,
Rated Temp. (°C)
These values designing. Build-up printed Wiring Board
Production site Japan Taiwan
Type EMMM5 EMXM1
Flammability 94V-0 94V-0
Conductor min. Width min. Edge (mm) Width (mm) 0.05 0.09 0.05 0.09
max. Width (mm) 76.2
Soldering Limits (°C), 260,
Rated Temp. (°C)
These values designing.
Construction
Type:Multilayer Printed Wiring Board with Through-holes Internal layer Plated through-hole Conductive pattern (Component hole) Type:Build-Up Printed Wiring Board hole(Laser Drilling) hole(Drilling) Conductive pattern Base Plated through-hole (Via hole) Type:Multilayer Printed Wiring Board with Through-holes IVHs Plated through-hole Interstitial hole(IVH) (Component hole) Internal layer Insulation layer
Internal layer
Conductive pattern
Design specifications each subject change without notice. factory current technical specifications before purchase and/or use. Should safety concern arise regarding this product, please sure contact immediately.
Feb. 2006
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