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NPN/NPN double resistor-equipped transistor; Rev. June 2007 Produ


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PIMN31
NPN/NPN double resistor-equipped transistor;
Rev. June 2007 Product data sheet
General description
NPN/NPN double Resistor-Equipped Transistor (RET) small SOT457 (SC-74) Surface-Mounted Device (SMD) plastic package.
Features
output current capability Built-in bias resistors Simplifies circuit design Reduces component count Reduces pick place costs AEC-Q101 qualified
Applications
Digital application automotive industrial segments Switching loads
Quick reference data
Table Symbol VCEO R2/R1 Quick reference data Parameter collector-emitter voltage output current bias resistor (input) bias resistor ratio Conditions open base Unit
transistor
Semiconductors
PIMN31
NPN/NPN double RET;
Pinning information
Table Pinning Description (emitter) input (base) output (collector) (emitter) input (base) output (collector)
Simplified outline
Symbol
sym063
Ordering information
Table Ordering information Package Name PIMN31 SC-74 Description plastic surface-mounted package (TSOP6); leads Version SOT457 Type number
Marking
Table PIMN31 Marking codes Marking code Type number
Limiting values
Table Limiting values accordance with Absolute Maximum Rating System (IEC 60134). Symbol VCBO VCEO VEBO Parameter collector-base voltage collector-emitter voltage emitter-base voltage input voltage positive negative Ptot output current total power dissipation Tamb
Conditions open emitter open base open collector
Unit
transistor
PIMN31_1
B.V. 2007. rights reserved.
Product data sheet
Rev. June 2007
Semiconductors
PIMN31
NPN/NPN double RET;
Table Limiting values .continued accordance with Absolute Maximum Rating System (IEC 60134). Symbol device Ptot Tamb Tstg
Parameter total power dissipation junction temperature ambient temperature storage temperature
Conditions Tamb
+150 +150
Unit
Device mounted Printed-Circuit Board (PCB), single-sided copper, tin-plated standard footprint.
Ptot (mW)
006aab054
Tamb (°C)
PCB, standard footprint
Power derating curve
Thermal characteristics
Table Symbol Rth(j-a) Rth(j-sp) device Rth(j-a)
Thermal characteristics Parameter thermal resistance from junction ambient thermal resistance from junction solder point thermal resistance from junction ambient free
Conditions free
Unit
transistor
Device mounted PCB, single-sided copper, tin-plated standard footprint.
PIMN31_1
B.V. 2007. rights reserved.
Product data sheet
Rev. June 2007
Semiconductors
PIMN31
NPN/NPN double RET;
Zth(j-a) (K/W) 0.20 0.10 0.05 0.02 0.01 0.75 0.50 0.33
006aaa494
10-5 10-4 10-3 10-2 10-1
PCB, standard footprint
Transient thermal impedance from junction ambient function pulse duration SOT457 (SC-74); typical values
Characteristics
Table Characteristics Tamb unless otherwise specified. Symbol ICBO ICEO IEBO VCEsat VI(off) VI(on) R2/R1 Parameter collector-base cut-off current collector-emitter cut-off current emitter-base cut-off current current gain collector-emitter saturation voltage off-state input voltage on-state input voltage bias resistor (input) bias resistor ratio collector capacitance Conditions 0.72 Unit transistor
PIMN31_1
B.V. 2007. rights reserved.
Product data sheet
Rev. June 2007
Semiconductors
PIMN31
NPN/NPN double RET;
006aaa314
10-1
006aaa315
VCEsat
10-1
(mA)
10-2
(mA)
Tamb Tamb Tamb
IC/IB Tamb Tamb Tamb
current gain function collector current; typical values
Collector-emitter saturation voltage function collector current; typical values
006aab055
VCEsat
10-1
10-2
(mA)
IC/IB Tamb Tamb Tamb
Collector-emitter saturation voltage function collector current; typical values
PIMN31_1
B.V. 2007. rights reserved.
Product data sheet
Rev. June 2007
Semiconductors
PIMN31
NPN/NPN double RET;
006aaa316
006aaa317
VI(on)
VI(off)
10-1 10-1
(mA)
10-1 10-1
(mA)
Tamb Tamb Tamb
Tamb Tamb Tamb
On-state input voltage function collector current; typical values
Off-state input voltage function collector current; typical values
Test information
Quality information
This product been qualified accordance with Automotive Electronics Council (AEC) standard Q101 (Stress qualification discrete semiconductors) suitable automotive critical applications.
PIMN31_1
B.V. 2007. rights reserved.
Product data sheet
Rev. June 2007
Semiconductors
PIMN31
NPN/NPN double RET;
Package outline
index
0.95 Dimensions
0.40 0.25 0.26 0.10 04-11-08
Package outline SOT457 (SC-74)
Packing information
Table Packing methods indicated -xxx last three digits 12NC ordering code.[1] Type number PIMN31 Package SOT457 Description pitch, tape reel; pitch, tape reel;
Packing quantity 3000 -115 -125 10000 -135 -165
further information availability packing methods, Section normal taping reverse taping
PIMN31_1
B.V. 2007. rights reserved.
Product data sheet
Rev. June 2007
Semiconductors
PIMN31
NPN/NPN double RET;
Soldering
3.45 1.95
solder lands 0.95 3.30 2.825 0.45 0.55 occupied area solder paste solder resist
1.60 1.70 3.10 3.20
msc422
Dimensions
Reflow soldering footprint SOT457 (SC-74)
5.30
solder lands 5.05 0.45 1.45 4.45 solder resist occupied area
1.40 4.30
msc423
Dimensions
Wave soldering footprint SOT457 (SC-74)
PIMN31_1
B.V. 2007. rights reserved.
Product data sheet
Rev. June 2007
Semiconductors
PIMN31
NPN/NPN double RET;
Revision history
Table PIMN31_1 Revision history Release date 20070619 Data sheet status Product data sheet Change notice Supersedes Document
PIMN31_1
B.V. 2007. rights reserved.
Product data sheet
Rev. June 2007
Semiconductors
PIMN31
NPN/NPN double RET;
Legal information
13.1 Data sheet status
Document status[1][2] Objective [short] data sheet Preliminary [short] data sheet Product [short] data sheet
Product status[3] Development Qualification Production
Definition This document contains data from objective specification product development. This document contains data from preliminary specification. This document contains product specification.
Please consult most recently issued document before initiating completing design. term `short data sheet' explained section "Definitions". product status device(s) described this document have changed since this document published differ case multiple devices. latest product status information available Internet http://www.nxp.com.
13.2 Definitions
Draft document draft version only. content still under internal review subject formal approval, which result modifications additions. Semiconductors does give representations warranties accuracy completeness information included herein shall have liability consequences such information. Short data sheet short data sheet extract from full data sheet with same product type number(s) title. short data sheet intended quick reference only should relied upon contain detailed full information. detailed full information relevant full data sheet, which available request local Semiconductors sales office. case inconsistency conflict with short data sheet, full data sheet shall prevail.
malfunction Semiconductors product reasonably expected result personal injury, death severe property environmental damage. Semiconductors accepts liability inclusion and/or Semiconductors products such equipment applications therefore such inclusion and/or customer's risk. Applications Applications that described herein these products illustrative purposes only. Semiconductors makes representation warranty that such applications will suitable specified without further testing modification. Limiting values Stress above more limiting values defined Absolute Maximum Ratings System 60134) cause permanent damage device. Limiting values stress ratings only operation device these other conditions above those given Characteristics sections this document implied. Exposure limiting values extended periods affect device reliability. Terms conditions sale Semiconductors products sold subject general terms conditions commercial sale, published including those pertaining warranty, intellectual property rights infringement limitation liability, unless explicitly otherwise agreed writing Semiconductors. case inconsistency conflict between information this document such terms conditions, latter will prevail. offer sell license Nothing this document interpreted construed offer sell products that open acceptance grant, conveyance implication license under copyrights, patents other industrial intellectual property rights.
13.3 Disclaimers
General Information this document believed accurate reliable. However, Semiconductors does give representations warranties, expressed implied, accuracy completeness such information shall have liability consequences such information. Right make changes Semiconductors reserves right make changes information published this document, including without limitation specifications product descriptions, time without notice. This document supersedes replaces information supplied prior publication hereof. Suitability Semiconductors products designed, authorized warranted suitable medical, military, aircraft, space life support equipment, applications where failure
13.4 Trademarks
Notice: referenced brands, product names, service names trademarks property their respective owners.
Contact information
additional information, please visit: http://www.nxp.com sales office addresses, send email salesaddresses@nxp.com
PIMN31_1
B.V. 2007. rights reserved.
Product data sheet
Rev. June 2007
Semiconductors
PIMN31
NPN/NPN double RET;
Contents
13.1 13.2 13.3 13.4 Product profile General description. Features Applications Quick reference data. Pinning information Ordering information Marking Limiting values. Thermal characteristics. Characteristics Test information Quality information Package outline Packing information. Soldering Revision history Legal information. Data sheet status Definitions Disclaimers Trademarks Contact information. Contents
Please aware that important notices concerning this document product(s) described herein, have been included section `Legal information'.
B.V. 2007.
rights reserved.
more information, please visit: http://www.nxp.com sales office addresses, please send email salesaddresses@nxp.com Date release: June 2007 Document identifier: PIMN31_1

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