medium power transistors Rev. June 2007 Product data sheet G
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Top Searches for this datasheet
BC637; BCP55; BCX55
medium power transistors
Rev. June 2007 Product data sheet
General description
medium power transistor series.
Table Product overview Package BC637[2] BCP55 BCX55
Type number[1]
complement JEITA SC-43A SC-73 SC-62 JEDEC TO-92 TO-243 BC638 BCP52 BCX52
SOT54 SOT223 SOT89
Valid available selection groups. Also available SOT54A SOT54 variant packages (see Section
Features
High current current gain selections High power dissipation capability
Applications
Linear voltage regulators Low-side switches MOSFET drivers Amplifiers
Quick reference data
Table Symbol VCEO Quick reference data Parameter collector-emitter voltage collector current peak collector current current gain selection selection single pulse; Conditions open base Unit
Semiconductors
BC637; BCP55; BCX55
medium power transistors
Pinning information
Table SOT54 base collector emitter
001aab347
Pinning Description Simplified outline Symbol
sym056
SOT54A base collector emitter
001aab348
sym056
SOT54 variant base collector emitter
001aab447
sym056
SOT223 base collector emitter collector
sym016
SOT89 emitter collector base
sym042
BC637_BCP55_BCX55_7
B.V. 2007. rights reserved.
Product data sheet
Rev. June 2007
Semiconductors
BC637; BCP55; BCX55
medium power transistors
Ordering information
Table Ordering information Package Name BC637[2] BCP55 BCX55
Type number[1]
Description plastic single-ended leaded (through hole) package; leads plastic surface-mounted package with increased heatsink; leads
Version SOT54 SOT223
SC-43A SC-73 SC-62
plastic surface-mounted package; collector good SOT89 heat transfer; leads
Valid available selection groups. Also available SOT54A SOT54 variant packages (see Section Section
Marking
Table BC637 BC637-16 BCP55 BCP55-10 BCP55-16 BCX55 BCX55-10 BCX55-16 Marking codes Marking code C637 C63716 BCP55 BCP55/10 BCP55/16 Type number
BC637_BCP55_BCX55_7
B.V. 2007. rights reserved.
Product data sheet
Rev. June 2007
Semiconductors
BC637; BCP55; BCX55
medium power transistors
Limiting values
Table Limiting values accordance with Absolute Maximum Rating System (IEC 60134). Symbol VCBO VCEO VEBO Ptot Parameter collector-base voltage collector-emitter voltage emitter-base voltage collector current peak collector current peak base current total power dissipation BC637 BCP55 BCX55 single pulse; single pulse; Tamb
Conditions open emitter open base open collector
Unit
0.83 0.64 0.96 0.85 1.25 +150 +150
Tamb Tstg
junction temperature ambient temperature storage temperature
Device mounted Printed-Circuit Board (PCB), single-sided copper, tin-plated standard footprint. Device mounted PCB, single-sided copper, tin-plated, mounting collector cm2. Device mounted PCB, single-sided copper, tin-plated, mounting collector cm2.
BC637_BCP55_BCX55_7
B.V. 2007. rights reserved.
Product data sheet
Rev. June 2007
Semiconductors
BC637; BCP55; BCX55
medium power transistors
Ptot
006aaa085
Ptot
006aaa086
Tamb (°C)
Tamb (°C)
PCB, standard footprint
PCB, mounting collector PCB, standard footprint
Power derating curve SOT54
Ptot
Power derating curves SOT223
006aaa087
Tamb (°C)
PCB, mounting collector PCB, mounting collector PCB, standard footprint
Power derating curves SOT89
BC637_BCP55_BCX55_7
B.V. 2007. rights reserved.
Product data sheet
Rev. June 2007
Semiconductors
BC637; BCP55; BCX55
medium power transistors
Thermal characteristics
Table Symbol Rth(j-a) Thermal characteristics Parameter thermal resistance from junction ambient BC637 BCP55 BCX55 Conditions free
Unit
Rth(j-sp)
thermal resistance from junction solder point BC637 BCP55 BCX55
Device mounted PCB, single-sided copper, tin-plated standard footprint. Device mounted PCB, single-sided copper, tin-plated, mounting collector cm2. Device mounted PCB, single-sided copper, tin-plated, mounting collector cm2.
Zth(j-a) (K/W)
006aaa088
duty cycle 0.75 0.33
0.05 0.02 0.01
10-5
10-4 10-3 10-2 10-1
PCB, standard footprint
Transient thermal impedance from junction ambient function pulse duration SOT54; typical values
BC637_BCP55_BCX55_7
B.V. 2007. rights reserved.
Product data sheet
Rev. June 2007
Semiconductors
BC637; BCP55; BCX55
medium power transistors
Zth(j-a) (K/W) duty cycle 0.75 0.33 0.05 0.02 0.01
006aaa814
10-1 10-5
10-4
10-3
10-2
10-1
PCB, standard footprint
Transient thermal impedance from junction ambient function pulse duration SOT223; typical values
Zth(j-a) (K/W) duty cycle 0.75 0.33 0.05 0.02 0.01 10-5 10-4 10-3 10-2 10-1
006aaa089
PCB, mounting collector
Transient thermal impedance from junction ambient function pulse duration SOT223; typical values
BC637_BCP55_BCX55_7
B.V. 2007. rights reserved.
Product data sheet
Rev. June 2007
Semiconductors
BC637; BCP55; BCX55
medium power transistors
duty cycle Zth(j-a) (K/W) 0.75 0.33 0.05 0.02 0.01 10-5 10-4 10-3 10-2 10-1
006aaa815
PCB, standard footprint
Transient thermal impedance from junction ambient function pulse duration SOT89; typical values
Zth(j-a) (K/W)
006aaa090
duty cycle 0.75 0.33
0.05 0.02 0.01 10-4 10-3 10-2 10-1
10-5
PCB, mounting collector
Transient thermal impedance from junction ambient function pulse duration SOT89; typical values
BC637_BCP55_BCX55_7
B.V. 2007. rights reserved.
Product data sheet
Rev. June 2007
Semiconductors
BC637; BCP55; BCX55
medium power transistors
Zth(j-a) (K/W) duty cycle
006aaa816
0.75 0.33 0.05 0.02 0.01
10-1 10-5
10-4
10-3
10-2
10-1
PCB, mounting collector
Transient thermal impedance from junction ambient function pulse duration SOT89; typical values
Characteristics
Table Characteristics Tamb unless otherwise specified. Symbol ICBO Parameter collector-base cut-off current emitter-base cut-off current current gain Conditions current gain selection selection VCEsat
Unit
IEBO
collector-emitter saturation voltage base-emitter voltage collector capacitance transition frequency
Pulse test: 0.02.
BC637_BCP55_BCX55_7
B.V. 2007. rights reserved.
Product data sheet
Rev. June 2007
Semiconductors
BC637; BCP55; BCX55
medium power transistors
006aaa080
(mA)
006aaa084
10-1
(mA)
Tamb Tamb Tamb
Tamb
current gain function collector current; typical values
Collector current function collector-emitter voltage; typical values
006aaa082
006aaa081
VCEsat
10-1
10-1
(mA)
10-2 10-1
(mA)
Tamb Tamb Tamb
IC/IB Tamb Tamb Tamb
Base-emitter voltage function collector current; typical values
Collector-emitter saturation voltage function collector current; typical values
BC637_BCP55_BCX55_7
B.V. 2007. rights reserved.
Product data sheet
Rev. June 2007
Semiconductors
BC637; BCP55; BCX55
medium power transistors
Package outline
0.45 0.38
0.45 0.38 0.48 0.40
0.48 0.40 2.54 1.27
5.08 2.54
Dimensions
14.5 12.7 04-11-16
Dimensions
14.5 12.7 04-06-28
Package outline SOT54 (SC-43A/TO-92)
0.45 0.38 1.27
Package outline SOT54A
0.48 0.40 2.54 1.27 05-01-10 Dimensions
Dimensions
14.5 12.7
0.32 0.22 04-11-10
Package outline SOT54 variant
Package outline SOT223 (SC-73)
4.25 3.75 0.48 0.35 0.44 0.23 06-08-29
0.53 0.40 Dimensions
Package outline SOT89 (SC-62/TO-243)
BC637_BCP55_BCX55_7
B.V. 2007. rights reserved.
Product data sheet
Rev. June 2007
Semiconductors
BC637; BCP55; BCX55
medium power transistors
Packing information
Table Packing methods indicated -xxx last three digits 12NC ordering code.[1] Type number[2] Package BC637 SOT54 SOT54A SOT54 variant BCP55 BCX55 SOT223 SOT89 Description bulk, straight leads tape reel, wide pitch tape ammopack, wide pitch bulk, delta pinning pitch, tape reel pitch, tape reel; pitch, tape reel;
further information availability packing methods, Section Valid available selection groups. normal taping rotated taping
Packing quantity 1000 -115 -115 -120 4000 -135 -135 5000 -412 -112 10000 -116 -126
BC637_BCP55_BCX55_7
B.V. 2007. rights reserved.
Product data sheet
Rev. June 2007
Semiconductors
BC637; BCP55; BCX55
medium power transistors
Revision history
Table Revision history Release date 20070625 Data sheet status Product data sheet Change notice Supersedes BC637_BCP55_BCX55_6 Document BC637_BCP55_BCX55_7 Modifications:
format this data sheet been redesigned comply with identity guidelines Semiconductors. Legal texts have been adapted company name where appropriate. Table "Product overview": amended Section "Features": amended Section "Applications": amended Table "Quick reference data": parameter redefined collector current Table "Quick reference data": condition added Figure amended Table "Limiting values": parameter redefined collector current Table "Limiting values": condition added Table "Limiting values": Ptot values BCP55 BCX55 adapted Table "Thermal characteristics": Rth(j-a) values BCP55 BCX55 rounded Figure redefined Zth(j-a) transient thermal impedance from junction ambient Figure parameter redefined pulse duration Figure added Figure redefined Zth(j-a) transient thermal impedance from junction ambient Figure parameter redefined pulse duration Figure added Figure redefined Zth(j-a) transient thermal impedance from junction ambient Figure parameter redefined pulse duration Figure added Figure amended Table "Packing methods": packing method BCX55 added Section "Legal information": updated Product data sheet CPCN200405029 BC635_637_639_4 BCP54_55_56_5 BCX54_55_56_4 BC635_637_639_3 BCP54_55_56_4 BCX54_55_56_3
BC637_BCP55_BCX55_6
20050218
BC635_637_639_4 BCP54_55_56_5 BCX54_55_56_4
20011010 20030206 20011010
Product specification Product specification Product specification
BC637_BCP55_BCX55_7
B.V. 2007. rights reserved.
Product data sheet
Rev. June 2007
Semiconductors
BC637; BCP55; BCX55
medium power transistors
Legal information
11.1 Data sheet status
Document status[1][2] Objective [short] data sheet Preliminary [short] data sheet Product [short] data sheet
Product status[3] Development Qualification Production
Definition This document contains data from objective specification product development. This document contains data from preliminary specification. This document contains product specification.
Please consult most recently issued document before initiating completing design. term `short data sheet' explained section "Definitions". product status device(s) described this document have changed since this document published differ case multiple devices. latest product status information available Internet http://www.nxp.com.
11.2 Definitions
Draft document draft version only. content still under internal review subject formal approval, which result modifications additions. Semiconductors does give representations warranties accuracy completeness information included herein shall have liability consequences such information. Short data sheet short data sheet extract from full data sheet with same product type number(s) title. short data sheet intended quick reference only should relied upon contain detailed full information. detailed full information relevant full data sheet, which available request local Semiconductors sales office. case inconsistency conflict with short data sheet, full data sheet shall prevail.
malfunction Semiconductors product reasonably expected result personal injury, death severe property environmental damage. Semiconductors accepts liability inclusion and/or Semiconductors products such equipment applications therefore such inclusion and/or customer's risk. Applications Applications that described herein these products illustrative purposes only. Semiconductors makes representation warranty that such applications will suitable specified without further testing modification. Limiting values Stress above more limiting values defined Absolute Maximum Ratings System 60134) cause permanent damage device. Limiting values stress ratings only operation device these other conditions above those given Characteristics sections this document implied. Exposure limiting values extended periods affect device reliability. Terms conditions sale Semiconductors products sold subject general terms conditions commercial sale, published including those pertaining warranty, intellectual property rights infringement limitation liability, unless explicitly otherwise agreed writing Semiconductors. case inconsistency conflict between information this document such terms conditions, latter will prevail. offer sell license Nothing this document interpreted construed offer sell products that open acceptance grant, conveyance implication license under copyrights, patents other industrial intellectual property rights.
11.3 Disclaimers
General Information this document believed accurate reliable. However, Semiconductors does give representations warranties, expressed implied, accuracy completeness such information shall have liability consequences such information. Right make changes Semiconductors reserves right make changes information published this document, including without limitation specifications product descriptions, time without notice. This document supersedes replaces information supplied prior publication hereof. Suitability Semiconductors products designed, authorized warranted suitable medical, military, aircraft, space life support equipment, applications where failure
11.4 Trademarks
Notice: referenced brands, product names, service names trademarks property their respective owners.
Contact information
additional information, please visit: http://www.nxp.com sales office addresses, send email salesaddresses@nxp.com
BC637_BCP55_BCX55_7
B.V. 2007. rights reserved.
Product data sheet
Rev. June 2007
Semiconductors
BC637; BCP55; BCX55
medium power transistors
Contents
11.1 11.2 11.3 11.4 Product profile General description. Features Applications Quick reference data. Pinning information Ordering information Marking Limiting values. Thermal characteristics. Characteristics Package outline Packing information. Revision history Legal information. Data sheet status Definitions Disclaimers Trademarks Contact information. Contents
Please aware that important notices concerning this document product(s) described herein, have been included section `Legal information'.
B.V. 2007.
rights reserved.
more information, please visit: http://www.nxp.com sales office addresses, please send email salesaddresses@nxp.com Date release: June 2007 Document identifier: BC637_BCP55_BCX55_7
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