AN01022 TP97036.2/F5.5 Philips Semiconductors OM5808 de
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OM5808 demo board negative supply Gb/s TZA3014 TZA3019 with HBCC package
AN01022
TP97036.2/F5.5
Philips Semiconductors
OM5808 demo board negative supply Gb/s TZA3014 TZA3019 with HBCC package
Application Note AN01022
Abstract
This application note describes demo board OM5808. This demo board designed customer demonstration Philips Semiconductors' TZA3014 TZA3019 with negative supply voltage HBCC32 package (SOT560AA1). application note limited information described data sheets. Application information includes schematics layouts.
Philips Electronics N.V. 2001 rights reserved. Reproduction whole part prohibited without prior written consent copyright owner. information presented this document does form part quotation contract, believed accurate reliable changed without notice. liability will accepted publisher consequence use. Publication thereof does convey imply license under patent- other industrial intellectual property rights.
Philips Semiconductors
OM5808 demo board negative supply Gb/s TZA3014 TZA3019 with HBCC package
Application Note AN01022
OM5808 demo board negative supply Gb/s TZA3014/ TZA3019 with HBCC package
AN01022
Author: Marc Laer Philips Semiconductors Systems Laboratory Eindhoven, Netherlands
Keywords Telecom Optical networks SDH, SONET STM16, OC48 CML, PECL Cross point Switch
Number pages:
Date: 01-05-31
Philips Semiconductors
OM5808 demo board negative supply Gb/s TZA3014 TZA3019 with HBCC package
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Philips Semiconductors
OM5808 demo board negative supply Gb/s TZA3014 TZA3019 with HBCC package
Application Note AN01022
Introduction
This Application note short description OM5808 demo board. OM5808 demo board used evaluate functionality TZA3014 TZA3019 Gb/s with negative supply voltage HBCC32 package (SOT560AA1). demo board OM5809 used evaluate functionality TZA3014 TZA3019 Gb/s with positive supply voltage HBCC32 package (SOT560AA1). This demo board described separate application note. Table gives overview possible options demo board OM5808.
TABLE Options demo board OM5808 Datarate Gb/s type number Type Remark TZA3014 Single amplifier output, RSSI output mute function TZA3019A Dual amplifier RSSI outputs TZA3019B TZA3019C Dual amplifier Dual amplifier output RSSI output outputs
application note consists following sections: Getting started (Block schematic, test possibilities) General (used acronyms, cross section) Schematics, descriptions Measurements Bill materials Layout component placement
Philips Semiconductors
OM5808 demo board negative supply Gb/s TZA3014 TZA3019 with HBCC package
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Philips Semiconductors
OM5808 demo board negative supply Gb/s TZA3014 TZA3019 with HBCC package
Application Note AN01022
TABLE CONTENTS
Getting started Block diagram Overview OM5808 Demo board. 1.3.1 What check?
General Acronyms Cross section multi layer Schematics. TZA3014 3.1.1 TZA3014 general 3.1.2 Power supply 3.1.3 Input output 3.1.4 RSSI 3.1.5 settings 3.1.6 settings 3.1.7 Mute Option with TZA3019 3.2.1 Option General 3.2.2 Power supply 3.2.3 Inputs outputs 3.2.4 settings 3.2.5 RSSI1 RSSI2 Option with TZA3019 3.3.1 Option General 3.3.2 Description application 3.3.3 Power supply 3.3.4 Inputs outputs 3.3.5 settings 3.3.6 LOS1 RSSI2 Option with TZA3019 3.4.1 Option General 3.4.2 Power supply 3.4.3 Inputs outputs 3.4.4 settings 3.4.5 LOS1 LOS2.
Measurements Measurement testboard with semirigid connections Measurement OM5808 demo board Crosstalk demo board OM5808 between Ch2. Output waveforms measured OM5808 demo board Waveforms 4.5.1 TZA3019, output: 4.5.2 TZA3019, output: pattern
Philips Semiconductors
OM5808 demo board negative supply Gb/s TZA3014 TZA3019 with HBCC package
4.6.1 4.6.2
Application Note AN01022
Input signal Output signal,
Bill materials TZA3014 TZA3019 option TZA3019 option TZA3019 option. Layout considerations Thermal considerations
Layout Silk screen (top) layer component placement layer copper, inverted First inner layer copper, inverted Second inner layer copper, inverted Bottom layer copper, inverted Bottom component placement (bottom view) Silk screen (bottom view)
Philips Semiconductors
OM5808 demo board negative supply Gb/s TZA3014 TZA3019 with HBCC package
Application Note AN01022
LIST TABLES
TABLE TABLE TABLE TABLE TABLE TABLE TABLE TABLE TABLE TABLE TABLE TABLE Options demo board OM5808 Demo board options TZA3014 TZA3019 described this application note. Other demo board TZA3014 TZA3019 Settings switch Settings switch Settings switch Settings switch Settings switch Bill materials TZA3014, sorted reference. Bill materials TZA3019A, sorted reference. Bill materials TZA3019B, sorted reference. Bill materials TZA3019C, sorted reference.
Philips Semiconductors
OM5808 demo board negative supply Gb/s TZA3014 TZA3019 with HBCC package
Application Note AN01022
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OM5808 demo board negative supply Gb/s TZA3014 TZA3019 with HBCC package
Application Note AN01022
LIST FIGURES
Fig.1 Fig.2 Fig.3 Fig.4 Fig.5 Fig.6 Fig.7 Fig.8 Fig.9 Fig.10 OM5808 demo board block diagram OM5808 demo board Cross section multi layer Schematic OM5808 demo board with options, negative supply Schematic OM5808 demo board with TZA3014 Schematic OM5808 demo board with TZA3019A Schematic OM5808 demo board with TZA3019B Schematic OM5808 demo board with TZA3019C Measurement setup gain transfer characteristic Measurement setup output waveforms
Philips Semiconductors
OM5808 demo board negative supply Gb/s TZA3014 TZA3019 with HBCC package
Application Note AN01022
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OM5808 demo board negative supply Gb/s TZA3014 TZA3019 with HBCC package
Getting started Block diagram
Application Note AN01022
Power connection, decoupling over voltage protection
TZA3014
VEE1A
Local decoupling Local decoupling
VEE1B
LOSTH1
LOS1
RSSI1 INV1
output level adjustment LEVEL1
VREF
OUT1
VREF
OUT2 output level LEVEL2 adjustment
INV2
RSSI2
LOS2
LOSTH2
Local VEE2A decoupling
TZA3019
Local decoupling
VEE2B
Fig.1 OM5808 demo board block diagram
Philips Semiconductors
OM5808 demo board negative supply Gb/s TZA3014 TZA3019 with HBCC package
Overview
Application Note AN01022
Table shows options demo board OM5808 described this application note. TABLE Demo board options TZA3014 TZA3019 described this application note. Demo board type Package Supply Remark note OM5808 TZA3014 HBCC32 -3.3 Volt single limiter RSSI AN01022 OM5808 TZA3019A HBCC32 -3.3 Volt dual limiter RSSI AN01022 OM5808 TZA3019B HBCC32 -3.3 Volt dual limiter RSSI AN01022 OM5808 TZA3019C HBCC32 -3.3 Volt dual limiter AN01022
Table shows options demo board OM5809. This demo board described separate application note. TABLE Other demo board TZA3014 TZA3019 Demo board type Package Supply OM5809 TZA3014 HBCC32 +3.3 Volt OM5809 TZA3019A HBCC32 +3.3 Volt OM5809 TZA3019B HBCC32 +3.3 Volt OM5809 TZA3019C HBCC32 +3.3 Volt
Remark single limiter RSSI dual limiter RSSI dual limiter RSSI dual limiter
note AN01023 AN01023 AN01023 AN01023
Philips Semiconductors
OM5808 demo board negative supply Gb/s TZA3014 TZA3019 with HBCC package
OM5808 Demo board
Application Note AN01022
Power -3.3 Volt
OM5808
OUT1
INQ1
Solder jumpers
OUTQ1
OUT2
INQ2 Option check
TZA3014 TZA3019
OUTQ2
Fig.2 OM5808 demo board
1.3.1
What check?
First check "option check box" demo board type application. Connecting power: check polarity power supply, adjust current limit 400mA. Although demo board protected against over voltage wrong polarity, supply current limited. Check solder jumper configured follows: TZA3014: default mute function used, connected using Solder jumper left open (S1-1 switched must switched on). TZA3019A: both solder jumpers left open. TZA3019B: default "auto switch" function used, connected using Solder jumper left open (S1-1 S1-2 switched off). TZA3019C: Default LEDs, used observe outputs. LEDs have connected using
Philips Semiconductors
OM5808 demo board negative supply Gb/s TZA3014 TZA3019 with HBCC package
Application Note AN01022
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Philips Semiconductors
OM5808 demo board negative supply Gb/s TZA3014 TZA3019 with HBCC package
General Acronyms
2,488,320 kbps 2,488,320 Copper Ground Plastic, exposed diepad Bump Chip Carrier Plastic, exposed diepad Thin Quad Flat Package Integrated Circuit Loss Signal Loss Signal Threshold Multiplexer Printed Circuit Board Identification label pins, buses connectors indication inverted signal Receive Signal Strength Indicator Synchronous Digital Hierarchy connector system impedance Small outline connectors Surface Mounted Device Synchronous Optical Networks Synchronous Transport Module Type number indication
Application Note AN01022
Gbps HBCC HTQFP LOSTH Pxxx RSSI SONET
Philips Semiconductors
OM5808 demo board negative supply Gb/s TZA3014 TZA3019 with HBCC package
Cross section multi layer
Application Note AN01022
Material: FR4, Microstrip: Units:
Signal: microstrip single (not coupled): width microstrip differential (coupled, mode): width 400, Clearance
Layer
GND, Signal
Layer
Layer
Layer
GND, Signal
BOTTOM
Fig.3 Cross section multi layer
Philips Semiconductors
OM5808 demo board negative supply Gb/s TZA3014 TZA3019 with HBCC package
Schematics
Application Note AN01022
reading convenience schematics printed opposite description, therefore some information will duplicated.
VEE=-3,3V
-3.3V
BD8.9_3_3-4S2 10nF
LOS1
GREEN LOS1 RSSI2
BZX79C 100uF 6.3V
BLM11P300S 100nF
Supply diepad
10nF
LOS1
RSSI2
10nF BLM11P300S 10nF
10nF BLM11P300S
INV1
INV2
LOS1/RSSI1
LOS2/RSSI2
10nF
OUT1
IN1Q
OUT1Q
TZA3014 TZA3019
OUT2
LOSTH1
LEVEL1
VREF
BLM11P300S 10nF
TEST
10nF
LEVEL2
LOSTH2
IN2Q
OUT2Q BLM11P300S 10nF
10nF
RSSI2 10nF
100k
100k
100k
100k
Fig.4 Schematic OM5808 demo board with options, negative supply
Philips Semiconductors
OM5808 demo board negative supply Gb/s TZA3014 TZA3019 with HBCC package
TZA3014
VEE=-3,3V
-3.3V
Application Note AN01022
BD8.9_3_3-4S2 10nF
Solder joint "mute" function
BZX79C 100uF 6.3V Supply diepad
BLM11P300S 100nF 10nF
RSSI
BLM11P300S INV1 RSSI 10nF 10nF BLM11P300S
10nF 10nF
OUT1
IN1Q
OUT1Q
TZA3014
LOSTH1 LEVEL1 VREF
100k decision level adjustment
100k output level adjustment
Fig.5 Schematic OM5808 demo board with TZA3014
Philips Semiconductors
OM5808 demo board negative supply Gb/s TZA3014 TZA3019 with HBCC package
3.1.1 TZA3014 general
Application Note AN01022
TZA3014 Gb/s postamplifier with digital Loss Signal detector Received Signal Strength Indicator.
3.1.2
Power supply
P11-1: -3.3 volt, P11-2: GND, P11-3: connected. C41, C12, C23, decoupling networks power supply. added protect circuit against over voltage. local decoupling networks.
3.1.3
Input output
TZA3014 differential input which coupled (C19 C22). input signal connected connectors output TZA3014 differential coupled, output connected connectors With (LEVEL1) output level adjusted.
3.1.4
RSSI
TZA3014, digital Loss Signal output (LOS) available Received Signal Strength Indicator (RSSI) available These outputs observed connectors (LOS) (RSSI). LOS: input signal level below threshold level, LOS1 (pin will high. When connected ground, using solder joint green will extinguish. used, resistor connected ground (J1) load
3.1.5
settings
When mute function used, switch S1-1 switched off, S1-1 switched TZA3014 muted permanently. With switch S1-3 possible invert output1.
3.1.6
settings
With switch Loss Signal detector Received Signal Strength Indicator switched active power down mode. switched active mode, decision level input level detector adjusted resistor network Note: when RSSI outputs used switched off), removed otherwise TZA3014 muted permanently.
3.1.7
Mute
TZA3014 mute function. output (pin connected (pin When input signal below LOSTH1, output (pin will high. which forces (pin high. When (pin high TZA3014 muted. Note: when mute function used, switch S1-1 switched RSSI (S3) must active mode.
Philips Semiconductors
OM5808 demo board negative supply Gb/s TZA3014 TZA3019 with HBCC package
Option with TZA3019
VEE=-3,3V
-3.3V
Application Note AN01022
BD8.9_3_3-4S2 10nF
BZX79C 100uF 6.3V
RSSI1
BLM11P300S 100nF
supply diepad
10nF
RSSI2
BLM11P300S INV1 RSSI2 RSSI1 INV2 10nF 10nF BLM11P300S
10nF 10nF
OUT1
IN1Q
OUT1Q
TZA3019A
10nF 10nF
OUT2
IN2Q LEVEL1 LEVEL2 RSSI1 RSSI2 VREF TEST
OUT2Q
BLM11P300S 10nF
BLM11P300S 10nF
100k
100k
output level adjustment
Fig.6 Schematic OM5808 demo board with TZA3019A
Philips Semiconductors
OM5808 demo board negative supply Gb/s TZA3014 TZA3019 with HBCC package
3.2.1 Option General
Application Note AN01022
TZA3019 Gb/s dual postamplifier. Option Received Signal Strength Indicators.
3.2.2
Power supply
P11-1: -3.3 volt, P11-2: GND, P11-3: connected C41, C12, C23, decoupling networks power supply. added protect circuit against over voltage. local decoupling networks.
3.2.3
Inputs outputs
TZA3019A differential inputs which coupled (C19, C22, C20). input signals should connected connectors outputs TZA3019A differential they coupled, outputs should connected connectors With (LEVEL1) (LEVEL2) output level each output adjusted.
3.2.4
settings
setting output configuration chosen. each output, input selected (S1-1 S1-2). also possible invert outputs (S1-3 S1-4). Table gives overview possible settings. TABLE S1-1 Settings switch OUT1 S1-2 OUT2 input input input input
S1-3
OUT1 OUT1 OUT1Q
S1-4
OUT2 OUT2 OUT2Q
3.2.5
RSSI1 RSSI2
Option Received Signal Strength Indicators. RSSI1 RSSI2 These outputs observed connectors (RSSI1) (RSSI2). With possible Received Signal Strength Indicators active power down mode, this shown table connected left open, RSSI will power down mode. above VEE, RSSI active. TABLE Settings switch LOS2 LOS1 power down power down active active
Philips Semiconductors
OM5808 demo board negative supply Gb/s TZA3014 TZA3019 with HBCC package
Option with TZA3019
VEE=-3,3V
-3.3V
Application Note AN01022
BD8.9_3_3-4S2 10nF
Solder joint "auto switch" function
LOS1
BZX79C 100uF 6.3V
BLM11P300S 100nF
supply diepad
LOS1
10nF
LOS1
RSSI2
RSSI2
BLM11P300S 10nF
10nF BLM11P300S INV1
LOS1
10nF 10nF
RSSI2
INV2
OUT1
IN1Q
OUT1Q
TZA3019B
10nF 10nF
OUT2
IN2Q LOSTH1 LEVEL1 LEVEL2 RSSI2 VREF TEST
OUT2Q
BLM11P300S 10nF
BLM11P300S 10nF
RSSI2 100k 100k
10nF
output level adjustment
Fig.7 Schematic OM5808 demo board with TZA3019B
Philips Semiconductors
OM5808 demo board negative supply Gb/s TZA3014 TZA3019 with HBCC package
3.3.1 Option General
Application Note AN01022
TZA3019 Gb/s dual postamplifier. Option digital Loss Signal detector Received Signal Strength Indicator. this application strongest input signal will switched output1 weakest output2.
3.3.2
Description application
"auto switch" function used, RSSI input2 must active mode must connected ground using solder jumper signal strength input2 sets LOSTH1 input1. When input signal above threshold level, LOS1 (pin will low. This forces (pin low. OUT1 connected OUT2 connected IN2. input signal below threshold level LOS1 will high. also high, OUT1 will connected OUT2 will connected IN1.
3.3.3
Power supply
P11-1: -3.3 volt, P11-2: GND, P11-3: connected. C41, C12, C23, decoupling networks power supply. added protect circuit against over voltage. local decoupling networks.
3.3.4
Inputs outputs
TZA3019B differential inputs which coupled (C19, C22, C20). input signals should connected connectors outputs TZA3019B differential they coupled, outputs should connected connectors With (LEVEL1) (LEVEL2) output level each output adjusted.
3.3.5
settings
setting output configuration chosen. each output, input selected (S1-1 S1-2). also possible invert outputs (S1-3 S1-4). Table gives overview possible settings. TABLE S1-1 Settings switch OUT1 S1-2 OUT2 input input input input
S1-3
OUT1 OUT1 OUT1Q
S1-4
OUT2 OUT2 OUT2Q
Note: when "auto switch" function used S1-1 S1-2 must switched off.
3.3.6
LOS1 RSSI2
Option digital Loss Signal output Received Signal Strength Indicator. LOS1 RSSI2 These outputs observed connectors (LOS1) (RSSI2). connected left open Received Signal Strength Indicator will power down mode. above VEE, RSSI active. this application input (pin11) biased with
Philips Semiconductors
OM5808 demo board negative supply Gb/s TZA3014 TZA3019 with HBCC package
Option with TZA3019
VEE=-3,3V
-3.3V
Application Note AN01022
BD8.9_3_3-4S2 10nF
GREEN LOS1
Solder joint
BZX79C 100uF 6.3V supply diepad
BLM11P300S 100nF
Solder joint
10nF
LOS2
BLM11P300S INV1 LOS1 LOS2 INV2 10nF 10nF BLM11P300S
10nF 10nF
OUT1
IN1Q
OUT1Q
TZA3019C
10nF 10nF
OUT2
IN2Q LOSTH1 LOSTH2 LEVEL1 LEVEL2 VREF TEST
OUT2Q
BLM11P300S 10nF
BLM11P300S 10nF
100k
100k
100k
100k
decision level adjustment
output level adjustment
Fig.8 Schematic OM5808 demo board with TZA3019C
Philips Semiconductors
OM5808 demo board negative supply Gb/s TZA3014 TZA3019 with HBCC package
3.4.1 Option General
Application Note AN01022
TZA3019 Gb/s dual postamplifier. Option digital Loss Signal detectors.
3.4.2
Power supply
P11-1: -3.3 volt, P11-2: GND, P11-3: connected. C41, C12, C23, decoupling networks power supply. added protect circuit against over voltage. local decoupling networks.
3.4.3
Inputs outputs
TZA3019C differential inputs which coupled (C19, C22, C20). input signals should connected connectors outputs TZA3019C differential they coupled, outputs should connected connectors With (LEVEL1) (LEVEL2) output level each output adjusted.
3.4.4
settings
setting output configuration chosen. each output, input selected (S1-1 S1-2). also possible invert outputs (S1-3 S1-4). Table gives overview possible settings. TABLE S1-1 Settings switch OUT1 S1-2 OUT2 input1 input2 input2 input1
S1-3
OUT1 OUT1 OUT1Q
S1-4
OUT2 OUT2 OUT2Q
3.4.5
LOS1 LOS2
Option digital Loss Signal outputs. LOS1 LOS2 These outputs observed connectors (LOS1) (LOS2). When input signal level below threshold level (LOSTH1), LOS1 output will high (pin will extinguish.When input signal level below threshold level (LOSTH2), LOS2 output will high (pin will extinguish. have connected ground using solder jumpers LEDs used, resistors have connected ground J2). With possible Loss Signal detectors active power down mode, this shown table decision level input level detectors adjusted resistor networks (LOSTH1) (LOSTH2). TABLE Settings switch LOS2 LOS1 power down power down active active
Philips Semiconductors
OM5808 demo board negative supply Gb/s TZA3014 TZA3019 with HBCC package
Application Note AN01022
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OM5808 demo board negative supply Gb/s TZA3014 TZA3019 with HBCC package
Measurements
Application Note AN01022
Network Analyser 87530
Port1
Port2
IN1Q
OUT1 OUT1Q
OM5808 with TZA3019
IN2Q OUT2 OUT2Q
Fig.9 Measurement setup gain transfer characteristic
Philips Semiconductors
OM5808 demo board negative supply Gb/s TZA3014 TZA3019 with HBCC package
Measurement testboard with semirigid connections
Application Note AN01022
1999 12:32:10 14.59 2_:-16.427 676.937
REF= 1_:-13.448
START 50.000
STOP 000.000
Input: output output
Philips Semiconductors
OM5808 demo board negative supply Gb/s TZA3014 TZA3019 with HBCC package
Measurement OM5808 demo board
Application Note AN01022
1999 13:27:46 15.74 2_:-16.652 592.278
REF= 1_:-13.676
MARKER 2-ofs 1.592278224
START 50.000
STOP 000.000
Input: output output
Philips Semiconductors
OM5808 demo board negative supply Gb/s TZA3014 TZA3019 with HBCC package
Crosstalk demo board OM5808 between
Application Note AN01022
1999 12:57:34 15.68 2_:-62.634 599.936
REF= 1_:-80.621
START 50.000 STOP 000.000
same setup shown figure used measure crosstalk demo board between channel1 channel2. S1-1 "on" position measure output channel2.
Philips Semiconductors
OM5808 demo board negative supply Gb/s TZA3014 TZA3019 with HBCC package
Output waveforms measured OM5808 demo board
Application Note AN01022
Pattern generator ADVANTEST D3186
Trigger
Communication Analyser HP83480A
IN1Q
OUT1 OUT1Q
OM5808 with TZA3019
IN2Q OUT2 OUT2Q
Fig.10 Measurement setup output waveforms
Philips Semiconductors
OM5808 demo board negative supply Gb/s TZA3014 TZA3019 with HBCC package
4.5.1 Waveforms TZA3019, output:
Application Note AN01022
4.5.2
TZA3019, output:
Note: HP70841B pattern generator used these measurements.
Philips Semiconductors
OM5808 demo board negative supply Gb/s TZA3014 TZA3019 with HBCC package
4.6.1 pattern Input signal
Application Note AN01022
4.6.2
Output signal,
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OM5808 demo board negative supply Gb/s TZA3014 TZA3019 with HBCC package
Application Note AN01022
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Philips Semiconductors
OM5808 demo board negative supply Gb/s TZA3014 TZA3019 with HBCC package
Bill materials TZA3014
Tolerance
Application Note AN01022
TABLE Bill materials TZA3014, sorted reference. Part number Comp Series Vendor B45196H1107M9 100u B45196 SIEMENS 2222-916-16736 PHILIPS 2222-916-16736 PHILIPS 2222-786-16749 100n PHILIPS 2222-916-16736 PHILIPS 2222-916-16736 PHILIPS 2222-916-16736 PHILIPS 2222-916-16736 PHILIPS HLMP6400-011 GREEN Diffused_Lens FARNELL PN-TZA3014 TZA3014 IC_Universal PHILIPS BLM11P300S BLM11P300S muRata BLM11P300S BLM11P300S muRata BLM11P300S BLM11P300S muRata 4330-030-36301 BD8.933-4S2 PHILIPS 142-0701-851 SMA_sqr COAX EF.Johnson 142-0701-851 SMA_sqr COAX EF.Johnson 142-0701-851 SMA_sqr COAX EF.Johnson 142-0701-851 SMA_sqr COAX EF.Johnson R114426 SMB_str COAX RADIALL R114426 SMB_str COAX RADIALL 3833-1-0-303 MKS3830_3p MKS3830 STOCKO 2322-702-96001 RC21 PHILIPS 2322-702-60333 RC21 PHILIPS 3006P-7-104BRN 100k 3006P BOURNS 2322-702-60563 RC21 PHILIPS 3006P-7-104BRN 100k 3006P BOURNS 2422-120-00551 DIP-SW_4 print_switch HONYWELL 09-03-201-02 SPDT print_switch SPOERLE 9331-177-20153 BZX79C BZX79C PHILIPS 8222-411-48321 PR48321 PS-SLE
Rating 6.3V
0.063W 0.75W 0.063W 0.75W
Geom B45_d C0603 C0603 C0603 C0603 C0603 C0603 C0603 SMDLED SOT560AA1 BLM11 BLM11 BLM11 CBD8.9 SMA_sqr SMA_sqr SMA_sqr SMA_sqr SMB_str SMB_str 3830_3p R0603 R0603 BO3006P R0603 BO3006P SWITCH_4 profile SOD27 BOARD
Philips Semiconductors
OM5808 demo board negative supply Gb/s TZA3014 TZA3019 with HBCC package
TZA3019 option
Application Note AN01022
TABLE Bill materials TZA3019A, sorted reference. Part number Comp Series Vendor B45196H1107M9 100u B45196 SIEMENS 2222-916-16736 PHILIPS 2222-916-16736 PHILIPS 2222-916-16736 PHILIPS 2222-916-16736 PHILIPS 2222-786-16749 100n PHILIPS 2222-916-16736 PHILIPS 2222-916-16736 PHILIPS 2222-916-16736 PHILIPS 2222-916-16736 PHILIPS 2222-916-16736 PHILIPS 2222-916-16736 PHILIPS PN-TZA3019A TZA3019A IC_Universal PHILIPS BLM11P300S BLM11P300S muRata BLM11P300S BLM11P300S muRata BLM11P300S BLM11P300S muRata BLM11P300S BLM11P300S muRata BLM11P300S BLM11P300S muRata 4330-030-36301 BD8.933-4S2 PHILIPS 142-0701-851 SMA_sqr COAX EF.Johnson 142-0701-851 SMA_sqr COAX EF.Johnson 142-0701-851 SMA_sqr COAX EF.Johnson 142-0701-851 SMA_sqr COAX EF.Johnson 142-0701-851 SMA_sqr COAX EF.Johnson 142-0701-851 SMA_sqr COAX EF.Johnson 142-0701-851 SMA_sqr COAX EF.Johnson 142-0701-851 SMA_sqr COAX EF.Johnson R114426 SMB_str COAX RADIALL R114426 SMB_str COAX RADIALL 3833-1-0-303 MKS3830_3p MKS3830 STOCKO 2322-702-96001 RC21 PHILIPS 2322-702-96001 RC21 PHILIPS 3006P-7-104BRN 100k 3006P BOURNS 3006P-7-104BRN 100k 3006P BOURNS 2422-120-00551 DIP-SW_4 print_switch HONYWELL 09-03201-02 SPDT print_switch SPOERLE 09-03201-02 SPDT print_switch SPOERLE
Tolerance
Rating 6.3V
0.75W 0.75W
Geom B45_d C0603 C0603 C0603 C0603 C0603 C0603 C0603 C0603 C0603 C0603 C0603 SOT560AA1 BLM11 BLM11 BLM11 BLM11 BLM11 CBD8.9 SMA_sqr SMA_sqr SMA_sqr SMA_sqr SMA_sqr SMA_sqr SMA_sqr SMA_sqr SMB_str SMB_str 3830_3p R0603 R0603 BO3006P BO3006P SWITCH_4 profile profile
Philips Semiconductors
OM5808 demo board negative supply Gb/s TZA3014 TZA3019 with HBCC package
TABLE Bill materials TZA3019A, sorted reference. Part number Comp Series Vendor 9331-177-20153 BZX79C BZX79C PHILIPS 8222-411-48321 PR48321 PS-SLE Tolerance
Application Note AN01022
Rating Geom SOD27 BOARD
Philips Semiconductors
OM5808 demo board negative supply Gb/s TZA3014 TZA3019 with HBCC package
TZA3019 option
Application Note AN01022
TABLE Bill materials TZA3019B, sorted reference. Part number Comp Series Vendor B45196H1107M9 100u B45196 SIEMENS 2222-916-16736 PHILIPS 2222-916-16736 PHILIPS 2222-916-16736 PHILIPS 2222-916-16736 PHILIPS 2222-596-16627 PHILIPS 2222-786-16749 100n PHILIPS 2222-916-16736 PHILIPS 2222-916-16736 PHILIPS 2222-916-16736 PHILIPS 2222-916-16736 PHILIPS 2222-916-16736 PHILIPS 2222-916-16736 PHILIPS PN-TZA3019B TZA3019B IC_Universal PHILIPS BLM11P300S BLM11P300S muRata BLM11P300S BLM11P300S muRata BLM11P300S BLM11P300S muRata BLM11P300S BLM11P300S muRata BLM11P300S BLM11P300S muRata 4330-030-36301 BD8.933-4S2 PHILIPS 142-0701-851 SMA_sqr COAX EF.Johnson 142-0701-851 SMA_sqr COAX EF.Johnson 142-0701-851 SMA_sqr COAX EF.Johnson 142-0701-851 SMA_sqr COAX EF.Johnson 142-0701-851 SMA_sqr COAX EF.Johnson 142-0701-851 SMA_sqr COAX EF.Johnson 142-0701-851 SMA_sqr COAX EF.Johnson 142-0701-851 SMA_sqr COAX EF.Johnson R114426 SMB_str COAX RADIALL R114426 SMB_str COAX RADIALL 3833-1-0-303 MKS3830_3p MKS3830 STOCKO 2322-702-96001 RC21 PHILIPS 2322-702-96001 RC21 PHILIPS 2322-702-96001 RC21 PHILIPS 2322-702-96001 RC21 PHILIPS 2322-702-60563 RC21 PHILIPS 3006P-7-104BRN 100k 3006P BOURNS
Tolerance
Rating 6.3V
0.063W 0.75W
Geom B45_d C0603 C0603 C0603 C0603 C0603 C0603 C0603 C0603 C0603 C0603 C0603 C0603 SOT560AA1 BLM11 BLM11 BLM11 BLM11 BLM11 CBD8.9 SMA_sqr SMA_sqr SMA_sqr SMA_sqr SMA_sqr SMA_sqr SMA_sqr SMA_sqr SMB_str SMB_str 3830_3p R0603 R0603 R0603 R0603 R0603 BO3006P
Philips Semiconductors
OM5808 demo board negative supply Gb/s TZA3014 TZA3019 with HBCC package
TABLE Bill materials TZA3019B, sorted reference. Part number Comp Series Vendor 3006P-7-104BRN 100k 3006P BOURNS 2422-120-00551 DIP-SW_4 print_switch HONYWELL 9331-177-20153 BZX79C BZX79C PHILIPS 8222-411-48321 PR48321 PS-SLE
Application Note AN01022
Geom BO3006P SWITCH_4 SOD27 BOARD
Tolerance Rating 0.75W
Philips Semiconductors
OM5808 demo board negative supply Gb/s TZA3014 TZA3019 with HBCC package
TZA3019 option
Application Note AN01022
TABLE Bill materials TZA3019C, sorted reference. Part number Comp Series Vendor B45196H1107M9 100u B45196 SIEMENS 2222-916-16736 PHILIPS 2222-916-16736 PHILIPS 2222-916-16736 PHILIPS 2222-916-16736 PHILIPS 2222-786-16749 100n PHILIPS 2222-916-16736 PHILIPS 2222-916-16736 PHILIPS 2222-916-16736 PHILIPS 2222-916-16736 PHILIPS 2222-916-16736 PHILIPS 2222-916-16736 PHILIPS HLMP6500-011 Diffused_Lens FARNELL HLMP6400-011 GREEN Diffused_Lens FARNELL PN-TZA3019C TZA3019C IC_Universal PHILIPS BLM11P300S BLM11P300S muRata BLM11P300S BLM11P300S muRata BLM11P300S BLM11P300S muRata BLM11P300S BLM11P300S muRata BLM11P300S BLM11P300S muRata 4330-030-36301 BD8.933-4S2 PHILIPS 142-0701-851 SMA_sqr COAX EF.Johnson 142-0701-851 SMA_sqr COAX EF.Johnson 142-0701-851 SMA_sqr COAX EF.Johnson 142-0701-851 SMA_sqr COAX EF.Johnson 142-0701-851 SMA_sqr COAX EF.Johnson 142-0701-851 SMA_sqr COAX EF.Johnson 142-0701-851 SMA_sqr COAX EF.Johnson 142-0701-851 SMA_sqr COAX EF.Johnson R114426 SMB_str COAX RADIALL R114426 SMB_str COAX RADIALL 3833-1-0-303 MKS3830_3p MKS3830 STOCKO 3006P-7-104BRN 100k 3006P BOURNS 2322-702-60333 RC21 PHILIPS 3006P-7-104BRN 100k 3006P BOURNS 2322-702-60333 RC21 PHILIPS 2322-702-60563 RC21 PHILIPS
Tolerance
Rating 6.3V
0.75W 0.063W 0.75W 0.063W 0.063W
Geom B45_d C0603 C0603 C0603 C0603 C0603 C0603 C0603 C0603 C0603 C0603 C0603 SMDLED SMDLED SOT560AA1 BLM11 BLM11 BLM11 BLM11 BLM11 CBD8.9 SMA_sqr SMA_sqr SMA_sqr SMA_sqr SMA_sqr SMA_sqr SMA_sqr SMA_sqr SMB_str SMB_str 3830_3p BO3006P R0603 BO3006P R0603 R0603
Philips Semiconductors
OM5808 demo board negative supply Gb/s TZA3014 TZA3019 with HBCC package
TABLE Bill materials TZA3019C, sorted reference. Part number Comp Series Vendor 2322-702-60563 RC21 PHILIPS 3006P-7-104BRN 100k 3006P BOURNS 3006P-7-104BRN 100k 3006P BOURNS 2422-120-00551 DIP-SW_4 print_switch HONYWELL 09-03201-02 SPDT print_switch SPOERLE 09-03201-02 SPDT print_switch SPOERLE 9331-177-20153 BZX79C BZX79C PHILIPS 8222-411-48321 PR48321 PS-SLE Tolerance
Application Note AN01022
Rating 0.063W 0.75W 0.75W Geom R0603 BO3006P BO3006P SWITCH_4 profile profile SOD27 BOARD
Layout considerations
Decoupling networks power supply decoupling local decoupling, close impedance, input output transmission lines Clearance between transmission line ground plane impedance matching
Thermal considerations
Radiator inside board first inner layer bottom layer. location components via's were chosen epitomize heat flow from radiators.
Philips Semiconductors
OM5808 demo board negative supply Gb/s TZA3014 TZA3019 with HBCC package
Application Note AN01022
THIS PAGE INTENTIONALLY LEFT BLANK
Philips Semiconductors
OM5808 demo board negative supply Gb/s TZA3014 TZA3019 with HBCC package
Layout Silk screen (top)
Application Note AN01022
Philips Semiconductors
OM5808 demo board negative supply Gb/s TZA3014 TZA3019 with HBCC package
layer component placement
Application Note AN01022
Philips Semiconductors
OM5808 demo board negative supply Gb/s TZA3014 TZA3019 with HBCC package
layer copper, inverted
Application Note AN01022
Philips Semiconductors
OM5808 demo board negative supply Gb/s TZA3014 TZA3019 with HBCC package
First inner layer copper, inverted
Application Note AN01022
Philips Semiconductors
OM5808 demo board negative supply Gb/s TZA3014 TZA3019 with HBCC package
Second inner layer copper, inverted
Application Note AN01022
Philips Semiconductors
OM5808 demo board negative supply Gb/s TZA3014 TZA3019 with HBCC package
Bottom layer copper, inverted
Application Note AN01022
Philips Semiconductors
OM5808 demo board negative supply Gb/s TZA3014 TZA3019 with HBCC package
Bottom component placement (bottom view)
Application Note AN01022
Philips Semiconductors
OM5808 demo board negative supply Gb/s TZA3014 TZA3019 with HBCC package
Silk screen (bottom view)
Application Note AN01022
Pagina nummer tekst
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