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Altera Device Package Information


Document Revision History

Altera Device Package Information
May 2007 version 14.7 Data Sheet
Document Revision History
Table 1 shows the revision history for this document.
Table 1. Document Revision History (1) Date and Document Version
May 2007 v14.7
Changes Made
Added Arria GX information Added Cyclone III tables Revised D2 and E2 dimensions for 144-Pin EQFP Revised 100-Pin MBGA - Wire Bond and 256-Pin MBGA - Wire Bond Added 780-Pin FBGA option 2 - Wire Bond, 256-Pin UBGA - Wire Bond, 68-Pin MBGA - Wire Bond, and 144-Pin MBGA - Wire Bond Updated 144-Pin Plastic Thin Quad Flat Pack (TQFP) Data Sheet to correct title and ordering code reference Added revision history
Summary of Changes
Changes and additions as described in "Changes Made" section.
February 2007 v14.6
Revised one data sheet (144-Pin Plastic Thin Quad Flat Pack (TQFP) Data Sheet), added revision history.
December 2006 v14.5
Table 2 was added for Stratix III Device and Package Added Tables for Stratix III, updated other data sheets. Cross-Reference Tables 16, 17, and 18 were added for Stratix III Thermal Resistance information 1517-Pin FineLine Ball-Grid Array (FBGA) - Flip Chip data sheet was added 1760-Pin FineLine Ball-Grid Array (FBGA) - Flip Chip data sheet was added "Wire Bond" and "Flip Chip" was added to title of each data sheet, as appropriate "BGA" was spelled out as "Ball-Grid Array" in all titles Some package outline drawings were reformatted Weights were updated for many packages
Note to Table 1:
(1) Formal revision history for this document began with version 14.5.
Altera Corporation
DS-PKG-14.7
Altera Device Package Information Data Sheet
Introduction
This data sheet provides package information for Altera® devices. It includes these sections:
Device & Package Cross Reference (below) Thermal Resistance (starting on page 19) Package Outlines (starting on page 41)
In this data sheet, packages are listed in order of ascending pin count.
Device & Package Cross Reference
Tables 2 through 18 show the devices available in Ball-Grid Array (BGA), FineLine BGA® (FBGA), Ultra FineLine BGA (UBGA), Micro FineLine BGA (MBGA), Pin-Grid Array (PGA), Plastic J-Lead Chip Carrier (PLCC), Thin Quad Flat Pack (TQFP), Plastic Quad Flat Pack (PQFP), Ceramic Dual In-Line Package (CerDIP), and Hybrid FineLine BGA (HBGA):
Arria GX FPGAs Stratix® series FPGAs Cyclone® series FPGAs MAX® series CPLDs HardCopy® series Structured ASICs APEX series FPGAs ACEX® 1K FPGAs Mercury FPGAs FLEX® series FPGAs Excalibur FPGA Enhanced configuration devices
Table 2. Arria GX Devices in FineLine Ball Grid Array (FBGA) - Flip Chip Packages (Part 1 of 2) Device
EP1AGX20 Flip-chip FBGA Flip-chip FBGA EP1AGX35 Flip-chip FBGA Flip-chip FBGA EP1AGX50 Flip-chip FBGA Flip-chip FBGA Flip-chip FBGA
Package
Altera Corporation
Altera Device Package Information Data Sheet
Table 2. Arria GX Devices in FineLine Ball Grid Array (FBGA) - Flip Chip Packages (Part 2 of 2) Device
EP1AGX60 Flip-chip FBGA Flip-chip FBGA Flip-chip FBGA EP1AGX90 Flip-chip FBGA
Package
Table 3. Stratix III Devices in FineLine Ball-Grid Array (FBGA) - Flip Chip Packages Device
EP3SL50
Package
FBGA, Flip Chip FBGA, Flip Chip FBGA, Flip Chip FBGA, Flip Chip FBGA, Flip Chip FBGA, Flip Chip FBGA, Flip Chip FBGA, Flip Chip FBGA, Flip Chip FBGA, Flip Chip FBGA, Flip Chip FBGA, Flip Chip FBGA, Flip Chip FBGA, Flip Chip FBGA, Flip Chip FBGA, Flip Chip FBGA, Flip Chip FBGA, Flip Chip FBGA, Flip Chip FBGA, Flip Chip
EP3SL70
EP3SL110
EP3SL150
EP3SL200
EP3SL340
EP3SE50
EP3SE80
EP3SE110
EP3SE260
Altera Corporation
Altera Device Package Information Data Sheet
Table 4. Stratix II Devices Device
EP2S15
Package
FBGA, Flip Chip FBGA, Flip Chip
EP2S30
FBGA, Flip Chip FBGA, Flip Chip
EP2S60
FBGA, Flip Chip FBGA, Flip Chip FBGA, Flip Chip
EP2S90
FBGA, Flip Chip FBGA, Flip Chip FBGA, Flip Chip FBGA, Flip Chip
EP2S130
FBGA, Flip Chip FBGA, Flip Chip FBGA, Flip Chip
EP2S180
FBGA, Flip Chip FBGA, Flip Chip
Table 5. Stratix II GX Devices Device
EP2SGX30 EP2SGX60
Package
FBGA, Flip Chip FBGA, Flip Chip FBGA, Flip Chip
EP2SGX90
FBGA, Flip Chip FBGA, Flip Chip
EP2SGX130
FBGA, Flip Chip
Table 6. Stratix GX Devices (Part 1 of 2) Device
EP1SGX10C EP1SGX10D
Package
FBGA, Flip Chip FBGA, Flip Chip
Altera Corporation
Altera Device Package Information Data Sheet
Table 6. Stratix GX Devices (Part 2 of 2) Device
EP1SGX25C EP1SGX25D
Package
FBGA, Flip Chip FBGA, Flip Chip FBGA, Flip Chip
EP1SGX25F EP1SGX40D EP1SGX40G
FBGA, Flip Chip FBGA, Flip Chip FBGA, Flip Chip
Table 7. Stratix Devices (Part 1 of 2) Device
EP1S10
Package
FBGA, Flip Chip BGA, Wirebond FBGA, Wirebond (Option 2) FBGA, Flip Chip
EP1S20
FBGA, Flip Chip BGA, Wirebond FBGA, Wirebond (Option 2) FBGA, Flip Chip
EP1S25
BGA, Wirebond FBGA, Wirebond (Option 2) FBGA, Flip Chip FBGA, Flip Chip
EP1S30
FBGA, Flip Chip BGA, Flip Chip FBGA, Flip Chip
EP1S40
BGA, Flip Chip FBGA, Flip Chip FBGA, Flip Chip FBGA, Flip Chip
EP1S60
BGA, Flip Chip FBGA, Flip Chip FBGA, Flip Chip
Altera Corporation
Altera Device Package Information Data Sheet
Table 7. Stratix Devices (Part 2 of 2) Device
EP1S80
Package
BGA, Flip Chip FBGA, Flip Chip FBGA, Flip Chip
Table 8. Cyclone III Device Package Options (Part 1 of 2) Device
EP3C5
Package (2)
Plastic Enhanced Quad Flat Pack (EQFP) - Wire Bond FineLine Ball-Grid Array (FBGA) - Option 2 - Wire Bond Ultra FineLine Ball-Grid Array (UBGA) - Wire Bond
EP3C10
Plastic Enhanced Quad Flat Pack (EQFP) - Wire Bond FineLine Ball-Grid Array (FBGA) - Option 2 - Wire Bond Ultra FineLine Ball-Grid Array (UBGA) - Wire Bond
EP3C16
Plastic Enhanced Quad Flat Pack (EQFP) - Wire Bond Plastic Quad Flat Pack (PQFP) - Wire Bond FineLine Ball-Grid Array (FBGA) - Option 2 - Wire Bond Ultra FineLine Ball-Grid Array (UBGA) - Wire Bond FineLine Ball-Grid Array (FBGA) - Option 3 - Wire Bond Ultra FineLine Ball-Grid Array (UBGA) - Wire Bond
EP3C25
Plastic Enhanced Quad Flat Pack (EQFP) - Wire Bond Plastic Quad Flat Pack (PQFP) - Wire Bond FineLine Ball-Grid Array (FBGA) - Option 2 - Wire Bond Ultra FineLine Ball-Grid Array (UBGA) - Wire Bond FineLine Ball-Grid Array (FBGA) - Wire Bond
EP3C40
Plastic Quad Flat Pack (PQFP) - Wire Bond FineLine Ball-Grid Array (FBGA) - Wire Bond FineLine Ball-Grid Array (FBGA) - Option 3 - Wire Bond Ultra FineLine Ball-Grid Array (UBGA) - Wire Bond FineLine Ball-Grid Array (FBGA) - Option 2 - Wire Bond
EP3C55
FineLine Ball-Grid Array (FBGA) - Option 3 - Wire Bond Ultra FineLine Ball-Grid Array (UBGA) - Wire Bond FineLine Ball-Grid Array (FBGA) - Option 2 - Wire Bond
Altera Corporation
Altera Device Package Information Data Sheet
Table 8. Cyclone III Device Package Options (Part 2 of 2) Device
EP3C80
Package (2)
FineLine Ball-Grid Array (FBGA) - Option 3 - Wire Bond Ultra FineLine Ball-Grid Array (UBGA) - Wire Bond FineLine Ball-Grid Array (FBGA) - Option 2 - Wire Bond
EP3C120 FineLine Ball-Grid Array (FBGA) - Option 3 - Wire Bond FineLine Ball-Grid Array (FBGA) - Option 2 - Wire Bond Note to Table 8:
The E144 package has an exposed pad at the bottom of the package. This exposed pad is a ground pad that must be connected to the ground plane on your PCB. This exposed pad is used for electrical connectivity and not for thermal purposes. The package type entries with "Option #" refer to instances where multiple package options exist for a given package type and pin count. The Option number identifies the specific type used by the corresponding device density.
Table 9. Cyclone II Devices Device
EP2C5
Package
TQFP, Wirebond PQFP, Wirebond FBGA, Wirebond (Option 2)
EP2C8
TQFP, Wirebond PQFP, Wirebond FBGA, Wirebond (Option 2)
EP2C20
PQFP, Wirebond FBGA, Wirebond (Option 2) FBGA, Wirebond (Option 3)
EP2C35
FBGA, Wirebond (Option 3) UBGA, Wirebond FBGA, Wirebond (Option 3)
EP2C50
FBGA, Wirebond (Option 3) UBGA, Wirebond FBGA, Wirebond (Option 3)
EP2C70
FBGA, Wirebond (Option 3) FBGA, Wirebond
Altera Corporation
Altera Device Package Information Data Sheet
Table 10. Cyclone Devices Device
EP1C3
Package
TQFP, Wirebond TQFP, Wirebond
EP1C4
FBGA, Wirebond FiBGA, Wirebond
EP1C6
TQFP, Wirebond PQFP, Wirebond FBGA, Wirebond (Option 1)
EP1C12
PQFP, Wirebond FBGA, Wirebond (Option 1) FBGA, Wirebond
EP1C20
FBGA, Wirebond FBGA, Wirebond
Table 11. MAX Series Devices (Part 1 of 3) Device MAX II Devices
EPM240 TQFP, Wirebond FBGA, Wirebond (Option 2) MBGA, Wirebond EPM570 TQFP, Wirebond TQFP, Wirebond MBGA, Wirebond FBGA, Wirebond (Option 2) FBGA, Wirebond (Option 1) MBGA, Wirebond EPM1270 TQFP, Wirebond FBGA, Wirebond (Option 1) MBGA, Wirebond EPM2210 FBGA, Wirebond (Option 1) FBGA, Wirebond 100 100 100 100 144 100 100 256 256 144 256 256 256 324
Package
MAX 9000 Devices
EPM9320 BGA, Wirebond 356
Altera Corporation
Altera Device Package Information Data Sheet
Table 11. MAX Series Devices (Part 2 of 3) Device
EPM9320A EPM9560
Package
BGA, Wirebond BGA, Wirebond
MAX 7000B Devices
EPM7032B PLCC, Wirebond PQFP, Wirebond TQFP, Wirebond UBGA, Wirebond EPM7064B TQFP, Wirebond UBGA, Wirebond FBGA, Wirebond TQFP, Wirebond EPM7128B UBGA, Wirebond TQFP, Wirebond FBGA, Wirebond TQFP, Wirebond UBGA, Wirebond FBGA, Wirebond (Option 1) EPM7256B TQFP, Wirebond TQFP, Wirebond UBGA, Wirebond PQFP, Wirebond FBGA, Wirebond (Option 1) EPM7512B TQFP, Wirebond UBGA, Wirebond PQFP, Wirebond FBGA, Wirebond (Option 1) BGA, Wirebond (Option 1) 44 44 44 49 44 49 100 100 49 100 100 144 169 256 100 144 169 208 256 144 169 208 256 256
MAX 7000AE Devices
EPM7032AE PLCC, Wirebond TQFP, Wirebond 44 44
Altera Corporation
Altera Device Package Information Data Sheet
Table 11. MAX Series Devices (Part 3 of 3) Device
EPM7064AE
Package
PLCC, Wirebond TQFP, Wirebond TQFP, Wirebond UBGA, Wirebond FBGA, Wirebond FBGA, Wirebond (Option 1)
EPM7128AE
PLCC, Wirebond TQFP, Wirebond FBGA, Wirebond UBGA, Wirebond TQFP, Wirebond FBGA, Wirebond (Option 1)
EPM7256AE
TQFP, Wirebond FBGA, Wirebond TQFP, Wirebond PQFP, Wirebond FBGA, Wirebond (Option 1)
EPM7512AE
TQFP, Wirebond PQFP, Wirebond BGA, Wirebond (Option 1) FBGA, Wirebond (Option 1)
MAX 7000A Devices
EPM7032A PLCC, Wirebond TQFP, Wirebond EPM7128A PLCC, Wirebond TQFP, Wirebond FBGA, Wirebond TQFP, Wirebond FBGA, Wirebond (Option 1) EPM7256A TQFP, Wirebond TQFP, Wirebond PQFP, Wirebond FBGA, Wirebond (Option 1) 44 44 84 100 100 144 256 100 144 208 256
Altera Corporation
Altera Device Package Information Data Sheet
Table 12. HardCopy Series Devices Device
HC20K400 HC20K600
Package
BGA, Wirebond (Option 3) BGA, Wirebond (Option 3) Flip Chip FBGA
HC220
Flip Chip FPGA Flip Chip FBGA
HC230 HC1S25
Flip Chip FPGA FBGA, Wirebond (Option 3) BGA, Wirebond
HC1S30 HC1S40 HC1S60 HC1S80
Flip Chip FBGA Flip Chip FBGA Flip Chip FBGA Flip Chip FBGA
Table 13. APEX Series Devices (Part 1 of 4) Device APEX II Devices
EP2A15 Flip Chip FBGA Flip Chip BGA EP2A25 Flip Chip FBGA Flip Chip BGA Flip Chip FBGA EP2A40 Flip Chip FBGA Flip Chip BGA Flip Chip FBGA EP2A70 Flip Chip BGA Flip Chip FBGA 672 724 672 724 1, 020 672 724 1, 020 724 1, 508
Package
APEX 20KE Devices
EP20K30E TQFP, Wirebond FBGA, Wirebond PQFP, Wirebond FBGA, Wirebond 144 144 208 324
Altera Corporation
Altera Device Package Information Data Sheet
Table 13. APEX Series Devices (Part 2 of 4) Device
EP20K60E
Package
TQFP, Wirebond FBGA, Wirebond PQFP, Wirebond PQFP, Wirebond FBGA, Wirebond BGA, Wirebond
EP20K100E
TQFP, Wirebond FBGA, Wirebond PQFP, Wirebond PQFP, Wirebond FBGA, Wirebond BGA, Wirebond
EP20K160E
TQFP, Wirebond PQFP, Wirebond PQFP, Wirebond BGA, Wirebond FBGA, Wirebond (Option 2)
EP20K200E
PQFP, Wirebond PQFP, Wirebond BGA, Wirebond FBGA, Wirebond (Option 2) BGA, Wirebond (Option 2) FBGA, Wirebond (Option 2)
EP20K300E
PQFP, Wirebond BGA, Wirebond (Option 2) FBGA, Wirebond (Option 2)
EP20K400E
BGA, Wirebond (Option 3) Flip Chip FBGA
EP20K600E
BGA, Wirebond (Option 3) Flip Chip FBGA Flip Chip FBGA
Altera Corporation
Altera Device Package Information Data Sheet
Table 13. APEX Series Devices (Part 3 of 4) Device
EP20K1000E
Package
Flip Chip BGA Flip Chip FBGA Flip Chip FBGA
EP20K1500E
Flip Chip BGA Flip Chip FBGA
APEX 20KC Devices
EP20K200C PQFP, Wirebond PQFP, Wirebond BGA, Wirebond FBGA, Wirebond (Option 2) EP20K400C BGA, Wirebond (Option 3) Flip Chip FBGA EP20K600C BGA, Wirebond (Option 3) Flip Chip FBGA Flip Chip FBGA EP20K1000C Flip Chip BGA Flip Chip FBGA Flip Chip FBGA 208 240 356 484 652 672 652 672 1, 020 652 672 1, 020
APEX 20K Devices
EP20K100 TQFP, Wirebond PQFP, Wirebond PQFP, Wirebond FBGA, Wirebond BGA, Wirebond EP20K160 PQFP, Wirebond TQFP, Wirebond EP20K200 PQFP, Wirebond PQFP, Wirebond BGA, Wirebond FBGA, Wirebond (Option 2) EP20K300 FBGA, Wirebond (Option 2) 144 208 240 324 356 240 144 208 240 356 484 672
Altera Corporation
Altera Device Package Information Data Sheet
Table 13. APEX Series Devices (Part 4 of 4) Device
EP20K400
Package
BGA, Wirebond (Option 3) PGA, Wirebond Flip Chip FBGA
Table 14. ACEX 1K Devices Device
EP1K10
Package
TQFP, Wirebond TQFP, Wirebond PQFP, Wirebond FBGA, Wirebond (Option 1)
EP1K30
TQFP, Wirebond PQFP, Wirebond FBGA, Wirebond (Option 1)
EP1K50
TQFP, Wirebond PQFP, Wirebond FBGA, Wirebond (Option 1) FBGA, Wirebond (Option 2)
EP1K100
PQFP, Wirebond FBGA, Wirebond (Option 1) FBGA, Wirebond (Option 2)
Table 15. Mercury Devices Device
EP1M120 EP1M350
Package
Flip Chip FBGA Flip Chip FBGA
Table 16. FLEX Series Devices (Part 1 of 4) Device FLEX 10KA Devices Package Pins
Altera Corporation
Altera Device Package Information Data Sheet
Table 16. FLEX Series Devices (Part 2 of 4) Device
EPF10K10A
Package
TQFP, Wirebond TQFP, Wirebond PQFP, Wirebond FBGA, Wirebond (Option 1)
EPF10K30A
TQFP, Wirebond PQFP, Wirebond PQFP, Wirebond FBGA, Wirebond (Option 1) BGA, Wirebond FBGA, Wirebond (Option 2)
EPF10K100A
RQFP, Wirebond BGA, Wirebond FBGA, Wirebond (Option 2) BGA, Wirebond
EPF10K250A
PGA, Wirebond BGA, Wirebond
FLEX 10KS Devices
EPF10K50S TQFP, Wirebond PQFP, Wirebond PQFP, Wirebond FBGA, Wirebond (Option 1) BGA, Wirebond FBGA, Wirebond (Option 2) EPF10K200S RQFP, Wirebond BGA, Wirebond FBGA, Wirebond (Option 2) BGA, Wirebond FBGA, Wirebond (Option 2) 144 208 240 256 356 484 240 356 484 600 672
FLEX 10KE Devices
EPF10K30E TQFP, Wirebond PQFP, Wirebond FBGA, Wirebond (Option 1) FBGA, Wirebond (Option 2) 144 208 256 484
Altera Corporation
Altera Device Package Information Data Sheet
Table 16. FLEX Series Devices (Part 3 of 4) Device
EPF10K50E
Package
TQFP, Wirebond PQFP, Wirebond PQFP, Wirebond FBGA, Wirebond (Option 1) BGA, Wirebond FBGA, Wirebond (Option 2)
EPF10K100E
PQFP, Wirebond PQFP, Wirebond FBGA, Wirebond (Option 1) BGA, Wirebond FBGA, Wirebond (Option 2)
EPF10K130E
PQFP, Wirebond BGA, Wirebond FBGA, Wirebond (Option 2) BGA, Wirebond FBGA, Wirebond (Option 2)
EPF10K200E
PGA, Wirebond BGA, Wirebond FBGA, Wirebond (Option 2)
EPF10K10
PLCC, Wirebond TQFP, Wirebond PQFP, Wirebond
EPF10K20
TQFP, Wirebond RQFP, Wirebond RQFP, Wirebond
EPF10K30
RQFP, Wirebond RQFP, Wirebond BGA, Wirebond
EPF10K40
RQFP, Wirebond RQFP, Wirebond
EPF10K50
RQFP, Wirebond BGA, Wirebond PGA, Wirebond
Altera Corporation
Altera Device Package Information Data Sheet
Table 16. FLEX Series Devices (Part 4 of 4) Device
EPF10K50V
Package
RQFP, Wirebond PQFP, Wirebond BGA, Wirebond FBGA, Wirebond
EPF10K70
RQFP, Wirebond PGA, Wirebond
EPF10K100 EPF10K130V
PGA, Wirebond PGA, Wirebond BGA, Wirebond
EPF6010A
TQFP, Wirebond TQFP, Wirebond PQFP, Wirebond
EPF6016
TQFP, Wirebond PQFP, Wirebond PQFP, Wirebond BGA, Wirebond (Option 2)
EPF6016A
TQFP, Wirebond FBGA, Wirebond TQFP, Wirebond PQFP, Wirebond FBGA, Wirebond (Option 1)
EPF6024A
TQFP, Wirebond PQFP, Wirebond PQFP, Wirebond BGA, Wirebond (Option 2) FBGA, Wirebond (Option 1)
EPF8282A
PLCC, Wirebond TQFP, Wirebond
EPF8452A
TQFP, Wirebond PQFP, Wirebond
Altera Corporation
Altera Device Package Information Data Sheet
Table 17. Excalibur Devices Device
EPXA1
Package
FBGA, Wirebond (Option 2) Flip Chip FBGA
EPXA4
Flip Chip FBGA Flip Chip FBGA
EPXA10
Flip Chip FBGA
Table 18. Enhanced Configuration Devices Device
Package
PDIP, Wirebond PLCC, Wirebond
PLCC, Wirebond TQFP, Wirebond
PLCC, Wirebond TQFP, Wirebond PQFP, Wirebond FPGA, Wirebond
EPC8 EPC16
PQFP, Wirebond (Option 2) UBGA, Wirebond PQFP, Wirebond (Option 2)
EPC32 EPC1441
FPGA, Wirebond PDIP, Wirebond PLCC, Wirebond TQFP, Wirebond
Altera Corporation
Altera Device Package Information Data Sheet
Thermal Resistance
Tables 19 through 41 provide JA (junction-to-ambient thermal resistance) and JC (junction-to-case thermal resistance) values for the following Altera device families:
Arria GX Stratix series FPGAs Cyclone series FPGAs MAX series CPLDs HardCopy series Structured ASICs APEX series FPGAs ACEX 1K FPGAs Mercury FPGAs FLEX series FPGAs Excalibur FPGA Classic devices
Table 19. Thermal Resistance of Arria GX Devices (Part 1 of 2) Pin Count
484 780 EP1AGX35 484 780
Device
Package
JA (° C / W) Still Air
JA (° C / W) JA (° C / W) 100 200 ft. / min. ft. / min.
JA (° C / W) 400 ft. / min.
EP1AGX20
FBGA FBGA FBGA FBGA
Altera Corporation
Altera Device Package Information Data Sheet
Table 19. Thermal Resistance of Arria GX Devices (Part 2 of 2) Pin Count
484 780 1152 EP1AGX60 484 780 1152 EP1AGX90 1152
Device
Package
JA (° C / W) Still Air
JA (° C / W) JA (° C / W) 100 200 ft. / min. ft. / min.
JA (° C / W) 400 ft. / min.
EP1AGX50
FBGA FBGA FBGA FBGA FBGA FBGA FBGA
Table 20. Thermal Resistance of Stratix III Devices (Part 1 of 2) Device (°C / W) Pin Package JA Count Still Air
484 780 484 780 780 1152 780 1152 1152 1517 1517 1760 484 780 780 1152 FBGA FBGA FBGA FBGA FBGA FBGA FBGA FBGA FBGA FBGA FBGA FBGA FBGA FBGA FBGA FBGA 12.6 11.1 12.6 11.1 10.8 9.9 10.8 9.9 9.6 8.9 7.9 7.6 12.6 11.1 10.8 9.9
JA (°C / W) JA (°C / W) JA (°C / W) JC (°C / W) JB (°C / W) 100 200 400 ft. / min. ft. / min. ft. / min.
EP3SL50
EP3SL70
EP3SL110
EP3SL150
EP3SL200
EP3SL340
EP3SE50
EP3SE80
Altera Corporation
Altera Device Package Information Data Sheet
Table 20. Thermal Resistance of Stratix III Devices (Part 2 of 2) Device (°C / W) Pin Package JA Count Still Air
780 1152 1152 1517 FBGA FBGA FBGA FBGA 10.8 9.9 9.3 8.6
JA (°C / W) JA (°C / W) JA (°C / W) JC (°C / W) JB (°C / W) 100 200 400 ft. / min. ft. / min. ft. / min.
EP3SE110
EP3SE260
Table 21. Thermal Resistance of Stratix II Devices Device
EP2S15
Pin Count
Package
Flip Chip FBGA Flip Chip FBGA Flip Chip FBGA Flip Chip FBGA Flip Chip FBGA Flip Chip FBGA Flip Chip FBGA Flip Chip HBGA Flip Chip FBGA Flip Chip FBGA Flip Chip FBGA Flip Chip FBGA Flip Chip FBGA Flip Chip FBGA Flip Chip FBGA Flip Chip FBGA
JA (° C / W) 200 ft. / min.
EP2S30
EP2S60
EP2S90
EP2S130
EP2S180
Altera Corporation
Altera Device Package Information Data Sheet
Table 22. Thermal Resistance of Stratix II GX Devices Device
EP2SGX30 EP2SGX60
Pin Count
Package
Flip Chip FBGA Flip Chip FBGA Flip Chip FBGA Flip Chip FBGA Flip Chip FBGA Flip Chip FBGA
EP2SGX90
EP2SGX130
Table 23. Thermal Resistance of Stratix GX Devices Device
EP1SGX10C EP1SGX10D EP1SGX25C EP1SGX25D EP1SGX25D EP1SGX25F EP1SGX40D EP1SGX40G
Pin Count
Package
Flip Chip FBGA Flip Chip FBGA Flip Chip FBGA Flip Chip FBGA
JA (° C / W) Still Air
JA (° C / W) 100 ft. / min.
JA (° C / W) 400 ft. / min.
Table 24. Thermal Resistance of Stratix Devices (Part 1 of 2)
Device
EP1S10
Pin Count
Package
Flip Chip FBGA BGA FBGA Flip Chip FBGA Flip Chip FBGA BGA FBGA Flip Chip FBGA
JA (° C / W) 100 ft. / min.
EP1S20
Altera Corporation
Altera Device Package Information Data Sheet
Table 24. Thermal Resistance of Stratix Devices (Part 2 of 2)
EP1S25 672 672 780 1020 EP1S30 780 956 1020 EP1S40 780 956 1020 1508 EP1S60 956 1020 1508 EP1S80 956 1020 1508 BGA FBGA Flip Chip FBGA Flip Chip FBGA Flip Chip FBGA Flip Chip BGA Flip Chip FBGA Flip Chip FBGA Flip Chip BGA Flip Chip FBGA Flip Chip FBGA Flip Chip BGA Flip Chip FBGA Flip Chip FBGA Flip Chip BGA Flip Chip FBGA Flip Chip FBGA 2.2 2.3 0.25 0.25 0.2 0.2 0.2 0.17 0.18 0.17 0.18 0.13 0.13 0.13 0.1 0.1 0.1 14.8 15.3 10.5 10.0 10.4 9.1 9.9 10.4 9.0 9.8 9.1 8.9 9.7 8.9 8.8 9.6 8.8 11.7 12 8.5 8.0 8.4 7.1 7.9 8.3 7.0 7.8 7.1 6.9 7.7 7.0 6.8 7.6 6.9 10.0 10.4 7.1 6.6 7.0 5.8 6.5 6.9 5.7 6.4 5.8 5.6 6.3 5.6 5.5 6.2 5.5 8.7 9 6.0 5.5 5.9 4.8 5.4 5.8 4.7 5.3 4.7 4.6 5.2 4.6 4.5 5.1 4.5
Table 25. Thermal Resistance of Cyclone III Devices (Part 1 of 2) Device
EP3C5 EP3C5 EP3C5 EP3C10 EP3C10 EP3C10 EP3C16 EP3C16 EP3C16 EP3C16 EP3C16
Package
E144 F256 U256 E144 F256 U256 E144 Q240 F256 U256 U484
JA (C / W) Still Air
JA (C / W) 100 JA (C / W) 200 JA (C / W) 400 ft. / min. ft. / min. ft. / min.
Altera Corporation
Altera Device Package Information Data Sheet
Table 25. Thermal Resistance of Cyclone III Devices (Part 2 of 2) Device
EP3C16 EP3C25 EP3C25 EP3C25 EP3C25 EP3C25 EP3C40 EP3C40 EP3C40 EP3C40 EP3C40 EP3C55 EP3C55 EP3C55 EP3C80 EP3C80 EP3C80 EP3C120 EP3C120
Package
F484 E144 Q240 F256 U256 F324 Q240 F324 U484 F484 F780 U484 F484 F780 U484 F484 F780 F484 F780
JA (C / W) Still Air
JA (C / W) 100 JA (C / W) 200 JA (C / W) 400 ft. / min. ft. / min. ft. / min.
Table 26. Thermal Resistance of Cyclone II Devices (Part 1 of 2) Device
EP2C5
Pin Count
Package
TQFP PQFP FBGA TQFP PQFP FBGA
JA (° C / W) Still Air
EP2C8
Altera Corporation
Altera Device Package Information Data Sheet
Table 26. Thermal Resistance of Cyclone II Devices (Part 2 of 2) Device
EP2C20
Pin Count
Package
PQFP FBGA FBGA FBGA UBGA FBGA FBGA UBGA FBGA FBGA FBGA
JA (° C / W) Still Air
EP2C35
EP2C50
EP2C70
Table 27. Thermal Resistance of Cyclone Devices
Device
EP1C3
Pin Count
Package
TQFP TQFP TQFP PQFP FBGA PQFP FBGA FBGA FBGA FBGA
JA (° C / W) 100 ft. / min.
EP1C6
EP1C12
EP1C20
Altera Corporation
Altera Device Package Information Data Sheet
Table 28. Thermal Resistance of MAX II Devices Device
EPM240
Pin Count
Package
TQFP MBGA FBGA TQFP MBGA FBGA TQFP FBGA MBGA TQFP FBGA MBGA FBGA FBGA
JA (° C / W) 100 ft. / min.
EPM570
EPM1270
EPM2210
Table 29. Thermal Resistance of MAX 9000 Devices (Part 1 of 2) Device
EPM9320
Pin Count
Package
PLCC RQFP PGA BGA PLCC RQFP BGA PLCC RQFP RQFP RQFP RQFP
JA (° C / W) 100 ft. / min.
EPM9320A
EPM9400
EPM9480
Altera Corporation
Altera Device Package Information Data Sheet
Table 29. Thermal Resistance of MAX 9000 Devices (Part 2 of 2) Device
EPM9560
Pin Count
Package
RQFP RQFP PGA RQFP BGA RQFP RQFP BGA
JA (° C / W) 100 ft. / min.
EPM9560A
Table 30. Thermal Resistance of MAX 7000 Devices (Part 1 of 4) Device
EPM7032
Pin Count
Package
PLCC PQFP TQFP
JA (° C / W) Still Air
EPM7032B
PLCC TQFP
49 EPM7032S 44
UBGA PLCC TQFP
EPM7032V
PLCC TQFP
EPM7032AE
PLCC TQFP
EPM7064S
PLCC TQFP
Altera Corporation
Altera Device Package Information Data Sheet
Table 30. Thermal Resistance of MAX 7000 Devices (Part 2 of 4) Device
EPM7064
Pin Count
Package
PLCC TQFP
JA (° C / W) Still Air
68 84 100 EPM7064AE EPM7064B 44
PLCC PLCC PQFP PLCC TQFP
UBGA TQFP FBGA
EPM7096
PLCC PLCC PQFP PLCC TQFP FBGA
EPM7128A
144 256 EPM7128B 49 100
TQFP FBGA UBGA TQFP FBGA
144 169 256 EPM7128E 84 100 160 EPM7128S 84 100
TQFP UBGA FBGA PLCC PQFP PQFP PLCC TQFP PQFP
Altera Corporation
Altera Device Package Information Data Sheet
Table 30. Thermal Resistance of MAX 7000 Devices (Part 3 of 4) Device
EPM7128AE
Pin Count
Package
PLCC TQFP FBGA
JA (° C / W) Still Air
144 169 256 EPM7160E 84 100 160 EPM7160S 84 100 160 EPM7192S EPM7192E 160 160
TQFP UBGA FBGA PLCC PQFP PQFP PLCC TQFP PQFP PQFP PGA PQFP
EPM7256A
TQFP TQFP PQFP FBGA TQFP TQFP UBGA PQFP FBGA PGA PQFP RQFP PQFP RQFP
EPM7256B
EPM7256E
EPM7256S
Altera Corporation
Altera Device Package Information Data Sheet
Table 30. Thermal Resistance of MAX 7000 Devices (Part 4 of 4) Device
EPM7256AE
Pin Count
Package
FBGA TQFP TQFP PQFP FBGA TQFP PQFP BGA FBGA
JA (° C / W) Still Air
EPM7512AE
EPM7512B
TQFP UBGA PQFP BGA FBGA
Table 31. Thermal Resistance of MAX 3000A Devices
Device
EPM3032A
Pin Count
Package
TQFP PLCC
JA (° C / W) 100 ft. / min.
EPM3064A
TQFP PLCC
100 EPM3128A 100 144 EPM3256A 144 208 EPM3512A 208 256
TQFP TQFP TQFP TQFP PQFP PQFP FBGA
Altera Corporation
Altera Device Package Information Data Sheet
Table 32. Thermal Resistance of HardCopy Series Devices
Device
HC210
Pin Count
Package
Flip Chip FBGA FBGA Flip Chip FBGA Flip Chip FBGA Flip Chip FBGA Flip Chip FBGA Flip Chip FBGA BGA Flip Chip FBGA FBGA BGA
HC220
HC230 HC240
HC20K400 HC20K600 HC1S25
HC1S30 HC1S40 HC1S60 HC1S80
Flip Chip FBGA Flip Chip FBGA Flip Chip FBGA Flip Chip FBGA
Table 33. Thermal Resistance of APEX II Devices (Part 1 of 2)
Device
EP2A15
Pin Count
Package
Flip Chip FBGA (Cu lid) Flip Chip FBGA (AlSiC lid)
JA (° C / W) JA (° C / W) JA (° C / W) JA (° C / W) Still Air 100 ft. / min. 200 ft. / min. 400 ft. / min.
Flip Chip BGA (Cu lid) Flip Chip BGA (AlSiC lid)
EP2A25
FBGA (Cu lid) Flip Chip FBGA (AlSiC lid)
Flip Chip BGA (Cu lid) Flip Chip BGA (AlSiC lid)
Flip Chip FBGA (Cu lid) Flip Chip FBGA (AlSiC lid)
Altera Corporation
Altera Device Package Information Data Sheet
Table 33. Thermal Resistance of APEX II Devices (Part 2 of 2)
Device
EP2A40
Pin Count
Package
Flip Chip FBGA (Cu lid) Flip Chip FBGA (AlSiC lid)
JA (° C / W) JA (° C / W) JA (° C / W) JA (° C / W) Still Air 100 ft. / min. 200 ft. / min. 400 ft. / min.
Flip Chip BGA (Cu lid) Flip Chip BGA (AlSiC lid)
Flip Chip FBGA (Cu lid) Flip Chip FBGA (AlSiC lid)
EP2A70
Flip Chip BGA (Cu lid) Flip Chip BGA (AlSiC lid)
Flip Chip FBGA (Cu lid) Flip Chip FBGA (AlSiC lid)
Table 34. Thermal Resistance of APEX 20K & APEX 20KE Devices (Part 1 of 3)
Device
EP20K30E
Pin Count
Package
TQFP PQFP FBGA FBGA TQFP FBGA PQFP PQFP FBGA BGA TQFP PQFP PQFP FBGA BGA
EP20K60E
EP20K100
Altera Corporation
Altera Device Package Information Data Sheet
Table 34. Thermal Resistance of APEX 20K & APEX 20KE Devices (Part 2 of 3)
Device
EP20K100E
Pin Count
Package
TQFP FBGA PQFP PQFP FBGA BGA TQFP PQFP PQFP BGA FBGA PQFP PQFP BGA FBGA PQFP PQFP BGA FBGA BGA FBGA PQFP PQFP BGA FBGA PQFP BGA FBGA BGA PGA FBGA FBGA w / fin (1)
EP20K160E
EP20K200
EP20K200E
EP20K200C
EP20K300E
EP20K400
Altera Corporation
Altera Device Package Information Data Sheet
Table 34. Thermal Resistance of APEX 20K & APEX 20KE Devices (Part 3 of 3)
Device
EP20K400E EP20K400C
Pin Count
Package
BGA FBGA (Cu lid) FBGA (AlSiC lid)
672 EP20K600E EP20K600C 652 672
FBGA w / fin (1) BGA FBGA (Cu lid) FBGA (AlSiC lid)
FBGA w / fin (1) FBGA (Cu lid) FBGA (AlSiC lid)
1, 020 EP20K1000E EP20K1000C 652
FBGA w / fin (1) BGA (Cu lid) BGA (AlSiC lid)
FBGA w / fin (1) FBGA (Cu lid) FBGA (AlSiC lid)
1, 020 EP20K1500E 652
FBGA w / fin (1) BGA (Cu lid) BGA (AlSiC lid)
FBGA FBGA w / fin (1) FBGA (Cu lid) FBGA (AlSiC lid)
1, 020 Note to Table 34:
FBGA w / fin (1)
"fin" is an extra heat sink that customers can add to the device. Several vendors make heat sinks, and they all have different sizes. Altera performed the thermal calculations in Table 34 using the following fin specifications: width: 0.25 mm height: 7.0 mm pitch: 1.5 mm base thickness: 0.5 mm.
Altera Corporation
Altera Device Package Information Data Sheet
Table 35. Thermal Resistance of ACEX 1K Devices
Device
EP1K10
Pin Count
Package
TQFP TQFP PQFP FBGA TQFP PQFP FBGA TQFP PQFP FBGA FBGA PQFP FBGA FBGA
JA (° C / W) 100 ft. / min.
EP1K30
EP1K50
EP1K100
Table 36. Thermal Resistance of Mercury Devices
Device
EP1M120
Pin Count
Package
FBGA (Cu lid) FBGA (AlSiC lid) FBGA (Cu lid) FBGA (AlSiC lid)
JA (° C / W) 200 ft. / min.
EP1M350
Table 37. Thermal Resistance of FLEX 10K Devices (Part 1 of 4)
Device
EPF10K10
Pin Count
Package
PLCC TQFP PQFP
Altera Corporation
Altera Device Package Information Data Sheet
Table 37. Thermal Resistance of FLEX 10K Devices (Part 2 of 4)
Device
EPF10K10A
Pin Count
Package
TQFP TQFP PQFP FBGA TQFP RQFP RQFP RQFP RQFP BGA TQFP PQFP PQFP FBGA BGA FBGA TQFP PQFP FBGA FBGA RQFP RQFP RQFP BGA PGA PGA (1)
EPF10K20
EPF10K30
EPF10K30A
EPF10K30E
EPF10K40
EPF10K50
EPF10K50V
PQFP RQFP BGA FBGA
Altera Corporation
Altera Device Package Information Data Sheet
Table 37. Thermal Resistance of FLEX 10K Devices (Part 3 of 4)
Device
EPF10K50E
Pin Count
Package
TQFP PQFP PQFP FBGA FBGA TQFP PQFP PQFP FBGA BGA FBGA RQFP PGA PGA PGA (1) PGA (2)
EPF10K50S
EPF10K70
EPF10K100
EPF10K100A
RQFP BGA FBGA BGA PQFP PQFP FBGA BGA FBGA PGA BGA PQFP BGA FBGA BGA FBGA
EPF10K100E
EPF10K130V
EPF10K130E
Altera Corporation
Altera Device Package Information Data Sheet
Table 37. Thermal Resistance of FLEX 10K Devices (Part 4 of 4)
Device
EPF10K200E
Pin Count
Package
PGA BGA FBGA RQFP BGA FBGA BGA FBGA PGA BGA
EPF10K200S
EPF10K250A
Notes to Table 37:
(1) (2) With attached pin-fin heat sink. With attached motor-driven fan heat sink.
Table 38. Thermal Resistance of FLEX 8000 Devices (Part 1 of 2) Device
EPF8282A
Pin Count
Package
PLCC TQFP PLCC TQFP PQFP PGA PLCC PQFP PGA PQFP RQFP
JA (° C / W) JA (° C / W) JA (° C / W) JA (° C / W) Still Air 100 ft. / min. 200 ft. / min. 400 ft. / min.
EPF8452A
EPF8636A
Altera Corporation
Altera Device Package Information Data Sheet
Table 38. Thermal Resistance of FLEX 8000 Devices (Part 2 of 2)
EPF8820A 144 160 192 208 208 225 EPF81188A 208 232 240 240 EPF81500A 240 240 280 304 TQFP PQFP PGA PQFP RQFP BGA PQFP PGA PQFP RQFP PQFP RQFP PGA RQFP 9.0 6.0 6.0 5.0 1.0 6.0 5.0 2.0 4.0 1.0 4.0 1.0 2.0 1.0 26.0 32.0 16.0 29.0 17.0 28.0 28.0 14.0 24.0 14.0 22.0 13.0 14.0 11.0 25.0 31.0 11.0 27.0 16.0 19.0 26.0 10.0 21.0 12.0 20.0 12.0 10.0 10.0 24.0 30.0 8.0 25.0 15.0 14.0 24.0 7.0 19.0 11.0 19.0 11.0 7.0 9.0 23.0 27.0 6.0 20.0 14.0 11.0 19.0 5.0 16.0 10.0 16.0 10.0 5.0 8.0
Table 39. Thermal Resistance of FLEX 6000 Devices
Device
EPF6010A
Pin Count
Package
TQFP TQFP TQFP PQFP PQFP BGA TQFP FBGA
EPF6016
EPF6016A
144 208 256 EPF6024A 144 208 240 256
TQFP PQFP FBGA TQFP PQFP PQFP BGA FBGA
Altera Corporation
Altera Device Package Information Data Sheet
Table 40. Thermal Resistance of Excalibur Embedded Processor Solutions
Device
EPXA1
Pin Count
Package
FBGA Flip Chip FBGA (Cu lid) Flip Chip FBGA (AlSiC lid) Flip Chip FBGA (Cu lid) Flip Chip FBGA (AlSiC lid) Flip Chip FBGA (Cu lid) Flip Chip FBGA (AlSiC lid) Flip Chip FBGA (Cu lid) Flip Chip FBGA (AlSiC lid)
JA (° C / W) JA (° C / W) JA (° C / W) JA (° C / W) Still Air 100 ft. / min. 200 ft. / min. 400 ft. / min.
EPXA4
EPXA10
Altera Corporation
Altera Device Package Information Data Sheet
Table 41. Thermal Resistance of Classic Devices Device
EP600I
Pin Count
Package
PDIP CerDIP
28 EP610 24
PLCC CerDIP PDIP SOIC
28 EP610I 24
PLCC CerDIP PDIP
28 EP900I 40 44 EP910 40
PLCC PDIP PLCC CerDIP PDIP
44 EP910I 40
PLCC CerDIP PDIP
44 EP1800I EP1810 68 68
PLCC PLCC JLCC PLCC PGA
Package Outlines
The package outlines on the following pages are listed in order of ascending pin count. Altera package outlines meet the requirements of JEDEC Publication No. 95.
Altera Corporation
Altera Device Package Information Data Sheet
Altera Corporation
Altera Device Package Information
8-Pin Plastic Dual In-Line Package (PDIP) - Wire Bond
All dimensions and tolerances conform to ASME Y14.5M - 1994. Controlling dimension is in inches. Pin 1 may be indicated by an ID dot, or a special feature, in its proximity on package surface. Package Outline Dimension Table Specification Symbol
Ordering Code Reference Package Acronym Leadframe Material Lead Finish (Plating) JEDEC Outline Reference Weight Moisture Sensitivity Level P PDIP Copper Regular: 85Sn:15Pb (Typ.) Pb-free: Matte Sn MS-001 Variation: BA 0.6 g Printed on moisture barrier bag A A1 A2 D E E1 L b c e 0.360 0.300 0.240 0.125 0.016 0.008
Package Information Description
Inches Min.
- - 0.130 TYP - 0.310 0.250 - 0.018 0.010 0.100 BSC
Maximum Lead Coplanarity NA
Altera Corporation
Altera Device Package Information
Package Outline
Altera Corporation
Altera Device Package Information
8-Pin Small Outline Integrated Circuit Package (SOIC) - Wire Bond
All dimensions and tolerances conform to ASME Y14.5M - 1994. Controlling dimension is in millimeters. Pin 1 may be indicated by an ID dot, or a special feature, in its proximity on package surface.
Package Information Description
Ordering Code Reference Package Acronym Leadframe Material Lead Finish (Plating) JEDEC Outline Reference Weight Moisture Sensitivity Level S SOIC Copper Regular: 85Sn:15Pb (Typ) Pb-free: NiPdAu (Preplated) MS-012 Var. AA 0.1 g Printed on moisture barrier bag
Package Outline Dimension Table Specification Symbol Minimum
Millimeters Nom.
- - - 4.90 BSC 6.00 BSC 3.90 BSC 0.40 0.31 0.17 0° - 1.04 REF - - 1.27 BSC - 8° 0.51 0.25 1.27
Maximum
Maximum Lead Coplanarity 0.1 mm
Altera Corporation
Altera Device Package Information
Package Outline
See Detail A
Detail A
0.25mm Gage Plane
Altera Corporation
Altera Device Package Information
16-Pin Small Outline Integrated Circuit Package (SOIC) - Wire Bond
All dimensions and tolerances conform to ASME Y14.5M - 1994. Controlling dimension is in millimeters. Pin 1 may be indicated by an ID dot, or a special feature, in its proximity on package surface.
Package Information Description
Ordering Code Reference Package Acronym Leadframe Material Lead Finish (Plating) JEDEC Outline Reference Weight Moisture Sensitivity Level S SOIC Copper Pb-free: NiPdAu (Preplated) MS-013 Var. AA 0.5 g Printed on moisture barrier bag
Package Outline Dimension Table Specification Symbol Minimum
Millimeters Nom.
- - - 10.30 BSC 10.30 BSC 7.50 BSC 0.40 0.31 0.20 0° - 1.40 REF - - 1.27 BSC - 8° 0.51 0.33 1.27
Maximum
Maximum Lead Coplanarity 0.1 mm
Altera Corporation
Altera Device Package Information
Package Outline
Pin 16
See Detail A
Detail A
0.25mm Gage Plane
Altera Corporation
Altera Device Package Information
20-Pin Plastic J-Lead Chip Carrier (PLCC) Wire Bond
Ordering Code Reference Package Acronym Leadframe Material Lead Finish (Plating) JEDEC Outline Reference Weight Moisture Sensitivity Level L PLCC Copper Regular: 85Sn:15Pb (Typ.) Pb-free: Matte Sn MS-018 Variation: AA 0.8 g Printed on moisture barrier bag A A1 A2 D D1 D2 E E1 E2 b c e 0.385 0.350 0.290 0.385 0.350 0.290 0.013
Package Information Description
Inches Min.
0.172 - 0.150 TYP 0.390 0.353 0.310 0.390 0.353 0.310 - 0.010 TYP 0.050 TYP
Maximum Lead Coplanarity 0.004 inches (0.10mm)
Altera Corporation
Altera Device Package Information
Package Outline
Pin 1 Pin 20
Altera Corporation
Altera Device Package Information
24-Pin Ceramic Dual In-Line Package (CerDIP) - Wire Bond
All dimensions and tolerances conform to ASME Y14.5M - 1994. Controlling dimension is in inches. Pin 1 may be indicated by an ID dot, or a special feature, in its proximity on package surface.
Package Information Description
Ordering Code Reference Package Acronym Leadframe Material Lead Finish JEDEC Outline Reference D CerDIP Alloy 42 Regular: 63Sn:37Pb (Typ.) MS-030 Variation: AF
Package Outline Dimension Table Specification Symbol Min.
A A1 D E E1 L b e - 0.015 1.240 0.290 0.280 0.125 0.015
Inches Nom.
- 0.028 1.260 0.305 0.295 - 0.018 0.100 BSC
Maximum Lead Coplanarity NA Weight 4.1 g Moisture Sensitivity Level Printed on moisture barrier bag
Altera Corporation
Altera Device Package Information
Package Outline
Pin 24
Pin 12
Altera Corporation
Altera Device Package Information
24-Pin Plastic Dual In-Line Package (PDIP) - Wire Bond
All dimensions and tolerances conform to ASME Y14.5M - 1994. Controlling dimension is in inches. Pin 1 may be indicated by an ID dot, or a special feature, in its proximity on package surface. Package Outline Dimension Table Specification Symbol
Ordering Code Reference Package Acronym Leadframe Material Lead Finish (Plating) P PDIP Copper Regular: 85Sn:15Pb (Typ.) Pb-free: Matte Sn A A1 A2 D E E1 L b c e 1.245 0.300 0.245 0.125 0.014 0.008
Package Information Description
Inches Min.
- - 0.130 TYP 1.250 0.310 - - 0.018 0.010 0.100 BSC
JEDEC Outline Reference MS-001 Variation: AF Maximum Lead Coplanarity NA Weight Moisture Sensitivity Level 1.9 g Printed on moisture barrier bag
Altera Corporation
Altera Device Package Information
Package Outline
Pin 24
Pin 12
Altera Corporation
Altera Device Package Information
24-Pin Small Outline Integrated Circuit Package (SOIC) - Wire Bond
All dimensions and tolerances conform to ASME Y14.5M - 1994. Controlling dimension is in millimeters. Pin 1 may be indicated by an ID dot, or a special feature, in its proximity on package surface.
Package Information Description
Ordering Code Reference Package Acronym Leadframe Material Lead Finish (Plating) JEDEC Outline Reference Weight Moisture Sensitivity Level S SOIC Copper Regular 85Sn:15Pb (Typ) MS-013 0.7 g Printed on moisture barrier bag Variation: AD
Package Outline Dimension Table Specification Symbol Minimum
Millimeters Nom.
- - - 15.40 BSC 10.30 BSC 7.50 BSC 0.40 0.31 0.20 0° - 1.40 REF - - 1.27 BSC - 8° 0.51 0.33 1.27
Maximum
Maximum Lead Coplanarity 0.1 mm
Altera Corporation
Altera Device Package Information
Package Outline
Pin 24
Pin 12
See Detail A
Detail A
0.25mm Gage Plane
Altera Corporation
Altera Device Package Information
28-Pin Plastic J-Lead Chip Carrier (PLCC) - Wire Bond
Ordering Code Reference Package Acronym Leadframe Material Lead Finish (Plating) JEDEC Outline Reference Weight Moisture Sensitivity Level L PLCC Copper Regular: 85Sn:15Pb (Typ.) Pb-free: Matte Sn MS-018 1.3 g Printed on moisture barrier bag Variation: AB A A1 A2 D D1 D2 E E1 E2 b c e 0.485 0.450 0.382 0.485 0.450 0.382 0.013
Package Information Description
Inches Min.
0.172 - 0.150 TYP 0.490 0.453 0.410 0.490 0.453 0.410 - 0.010 TYP 0.050 TYP
Maximum Lead Coplanarity 0.004 inches (0.10 mm)
Altera Corporation
Altera Device Package Information
Package Outline
Pin 1 Pin 28
Pin 11
Altera Corporation
Altera Device Package Information
32-Pin Plastic Thin Quad Flat Pack (TQFP) - Wire Bond
All dimensions and tolerances conform to ASME Y14.5M - 1994. Controlling dimension is in millimeters. Pin 1 may be indicated by an ID dot, or a special feature, in its proximity on package surface. Package Outline Dimension Table Specification Symbol
Ordering Code Reference Package Acronym Leadframe Material Lead Finish (Plating) T TQFP Copper Regular: 85Sn:15Pb (Typ.) Pb-free: Matte Sn A A1 A2 D D1 E E1 L L1 S b c e 0° 0.20 0.30 0.09 0.45
Package Information Description
Millimeters Min.
- - 1.00 9.00 BSC 7.00 BSC 9.00 BSC 7.00 BSC 0.60 1.00 REF - 0.37 - 0.80 BSC 3.5°
JEDEC Outline Reference MS-026 Variation: ABA Maximum Lead Coplanarity 0.004 inches (0.1mm) Weight Moisture Sensitivity Level 0.2 g Printed on moisture barrier bag
Altera Corporation
Altera Device Package Information
Package Outline
Pin32
See Detail A
Detail A
C Gage Plane
0.25mm
Altera Corporation
Altera Device Package Information
40-Pin Ceramic Dual In-Line Package (CerDIP) - Wire Bond
All dimensions and tolerances conform to ASME Y14.5M - 1994. Controlling dimension is in inches. Pin 1 may be indicated by an ID dot, or a special feature, in its proximity on package surface. Package Outline Dimension Table Specification Symbol
Ordering Code Reference Package Acronym Leadframe Material Lead Finish JEDEC Outline Reference Weight Moisture Sensitivity Level D CerDIP Alloy 42 Regular: 63Sn:37Pb (Typ.) MS-032 Variation: AD 12.8 g Printed on moisture barrier bag A A1 D E E1 L b c e
Package Information Description
Inches Min.
- 0.025 2.050 0.610 0.550 - 0.018 0.010 0.100 BSC
Maximum Lead Coplanarity N / A
Altera Corporation
Altera Device Package Information
Package Outline
Pin 40
Pin 20
Altera Corporation
Altera Device Package Information
40-Pin Plastic Dual In-Line Package (PDIP) - Wire Bond
All dimensions and tolerances conform to ASME Y14.5M - 1994. Controlling dimension is in inches. Pin 1 may be indicated by an ID dot, or a special feature, in its proximity on package surface.
Package Information Description
Ordering Code Reference Package Acronym Leadframe Material Lead Finish (Plating) JEDEC Outline Reference Weight Moisture Sensitivity Level P PDIP Copper Regular: 85Sn:15Pb (Typ.) MS-011 Variation: AC 7.0 g Printed on moisture barrier bag
Package Outline Dimension Table Specification Symbol Min.
A A1 A2 D E E1 L b c e 2.030 0.600 0.520 0.125 0.015 0.008 - 0.015
Inches Nom.
- - 0.150 BSC 2.050 - 0.540 - 0.018 - 0.100 BSC 2.070 0.625 0.560 0.135 0.022 0.012
Maximum Lead Coplanarity N / A
Altera Corporation
Altera Device Package Information
Package Outline
Pin 40
Pin 20
Altera Corporation
Altera Device Package Information
44-Pin Plastic J-Lead Chip Carrier (PLCC) - Wire Bond
Ordering Code Reference Package Acronym Leadframe Material Lead Finish (Plating) JEDEC Outline Reference Weight Moisture Sensitivity Level L PLCC Copper Regular: 85Sn:15Pb (Typ.) Pb-free: Matte Sn MS-018 2.6 g Printed on moisture barrier bag Variation: AC A A1 A2 D D1 D2 E E1 E2 b c e 0.685 0.650 0.582 0.685 0.650 0.582 0.013
Package Information Description
Inches Min.
0.172 - 0.150 TYP 0.690 0.653 0.610 0.690 0.653 0.610 - 0.010 TYP 0.050 TYP
Maximum Lead Coplanarity 0.004 inches (0.10 mm)
Altera Corporation
Altera Device Package Information
Package Outline
Pin 1 Pin 44
Pin 17
Altera Corporation
Altera Device Package Information
44-Pin Plastic Quad Flat Pack (PQFP) - Wire Bond
All dimensions and tolerances conform to ASME Y14.5M - 1994. Controlling dimension is in millimeters. Pin 1 may be indicated by an ID dot, or a special feature, in its proximity on package surface. Package Outline Dimension Table Specification Symbol
Ordering Code Reference Package Acronym Leadframe Material Lead Finish (Plating) JEDEC Outline Reference Weight Moisture Sensitivity Level Q PQFP Copper Regular: 85Sn:15Pb (Typ.) Pb-free: Matte Sn MS-022 Variation: AB 0.5 g Printed on moisture barrier bag A A1 A2 D D1 E E1 L L1 S b c e 0° 0.20 0.29 0.11 0.73
Package Information Description
Millimeters Min.
- - 2.00 13.20 BSC 10.00 BSC 13.20 BSC 10.00 BSC 0.88 1.60 REF - - - 0.80 BSC -
Maximum Lead Coplanarity 0.004 inches (0.10 mm)
Altera Corporation
Altera Device Package Information
Package Outline
Pin 44
Pin 11
See Detail A
Detail A
C Gage Plane
S L L1 0.25mm
Altera Corporation
Altera Device Package Information
44-Pin Plastic Thin Quad Flat Pack (TQFP) - Wire Bond
All dimensions and tolerances conform to ASME Y14.5M - 1994. Controlling dimension is in millimeters. Pin 1 may be indicated by an ID dot, or a special feature, in its proximity on package surface. Package Outline Dimension Table Specification Symbol
Ordering Code Reference Package Acronym Leadframe Material Lead Finish (Plating) JEDEC Outline Reference Weight Moisture Sensitivity Level T TQFP Copper Regular: 85Sn:15Pb (Typ.) Pb-free: Matte Sn MS-026 Variation: ACB 0.3 g Printed on moisture barrier bag A A1 A2 D D1 E E1 L L1 S b c e 0° 0.20 0.30 0.09 0.45
Package Information Description
Millimeters Min.
- - - 12.00 BSC 10.00 BSC 12.00 BSC 10.00 BSC 0.60 1.00 REF - 0.37 - 0.80 BSC 3.5°
Maximum Lead Coplanarity 0.004 inches (0.1mm)
Altera Corporation
Altera Device Package Information
Package Outline
Pin 44
Pin 11
See Detail A
Detail A
C Gage Plane
S L L1 0.25mm
Altera Corporation
Altera Device Package Information
49-Pin Ultra FineLine Ball-Grid Array (UBGA) - Wire Bond
All dimensions and tolerances conform to ASME Y14.5M - 1994. Controlling dimension is in millimeters. Pin A1 may be indicated by an ID dot, or a special feature, in its proximity on package surface.
Package Information Description
Ordering Code Reference Package Acronym Substrate Material Solder Ball Composition JEDEC Outline Reference Weight Moisture Sensitivity Level U UBGA BT Regular: 63Sn:37Pb (Typ.) Pb-free: Sn:3Ag:0.5Cu (Typ.) MO-216 Variation: BAB-2 0.2 g Printed on moisture barrier bag
Package Outline Dimension Table Specification Symbol Min.
Millimeters Nom.
- - - 0.70 TYP 7.00 BSC 7.00 BSC 0.50 0.80 BSC 0.60
Maximum Lead Coplanarity 0.005 inches (0.12mm)
Altera Corporation
Altera Device Package Information
Package Outline
TOP VIEW D 7 6 5 4 3 2 1 BOTTOM VIEW
Pin A1 Corner
Pin A1 ID
Altera Corporation
Altera Device Package Information
68-Pin Ceramic Pin-Grid Array (PGA) - Wire Bond
All dimensions and tolerances conform to ASME Y14.5M - 1994. Controlling dimension is in inches. Pin A1 may be indicated by an ID dot, or a special feature, in its proximity on package surface. Package Outline Dimension Table Specification Symbol
Ordering Code Reference Package Acronym Leadframe Material Lead Finish JEDEC Outline Reference Weight Moisture Sensitivity Level G PGA Alloy 42 Gold Over Nickel Plate MO-066 Variation: AC 10.4 g Printed on moisture barrier bag A A1 A2 D E L b e 0.016 0.114 1.100 1.100
Package Information Description
Inches Min.
0.177 0.050 TYP 0.127 1.120 1.120 0.130 TYP 0.018 0.100 BSC
Maximum Lead Coplanarity N / A
Altera Corporation
Altera Device Package Information
Package Outline
TOP VIEW
Pin A1 ID
BOTTOM VIEW
Altera Corporation
Altera Device Package Information
68-Pin Plastic J-Lead Chip Carrier (PLCC) - Wire Bond
Ordering Code Reference Package Acronym Lead Material Lead Finish (Plating) JEDEC Outline Reference Weight Moisture Sensitivity Level L PLCC Copper Regular: 85Sn:15Pb (Typ.) Pb-free: Matte Sn MS-018 5.5 g Printed on moisture barrier bag Variation: AE A A1 A2 D D1 D2 E E1 E2 b c e 0.985 0.950 0.882 0.985 0.950 0.882 0.013
Package Information Description
Inches Min.
0.172 - 0.150 TYP 0.990 0.954 0.910 0.990 0.954 0.910 - 0.008 TYP 0.050 TYP
Maximum Lead Coplanarity 0.004 inches (0.10 mm)
Altera Corporation
Altera Device Package Information
Package Outline
Pin 1 Pin 68
Pin 10
Pin 26
Altera Corporation
Altera Device Package Information
68-Pin Micro FineLine Ball-Grid Array (MBGA) - Wire Bond
All dimensions and tolerances conform to ASME Y14.5M - 1994. Controlling dimension is in inches. Pin A1 may be indicated by an ID dot, or a special feature, in its proximity on package surface. Package Outline Dimension Table Specification Symbol
Ordering Code Reference Package Acronym Substrate Material Solder Ball Composition JEDEC Outline Reference Weight Moisture Sensitivity Level M MBGA BT Pb-free: Sn:3Ag:0.5Cu (Typ.) MO-195 Variation: AB 0.1 g Printed on moisture barrier bag A A1 A2 A3 D E b e 0.25
Package Information Description
Inches Min.
- - - 0.60 REF 5.00 BSC 5.00 BSC 0.30 0.50 BSC
Maximum Lead Coplanarity 0.003 inch (0.08 mm)
Altera Corporation
Altera Device Package Information
Package Outline
TOP VIEW
BOTTOM VIEW
Pin A1 Corner
Pin A1 ID
Altera Corporation
Altera Device Package Information
84-Pin Plastic J-Lead Chip Carrier (PLCC) - Wire Bond
Ordering Code Reference Package Acronym Leadframe Material Lead Finish (Plating) JEDEC Outline Reference Weight Moisture Sensitivity Level L PLCC Copper Regular: 85Sn:15Pb (Typ.) Pb-free: Matte Sn MS-018 Variation: AF 7.9 g Printed on moisture barrier bag A A1 A2 D D1 D2 E E1 E2 b c e 1.185 1.150 1.082 1.185 1.150 1.082 0.013
Package Information Description
Inches Min.
0.172 - 0.150 TYP 1.190 1.154 1.110 1.190 1.154 1.110 - 0.008 TYP 0.050 TYP
Maximum Lead Coplanarity 0.004 inches (0.10mm)
Altera Corporation
Altera Device Package Information
Package Outline
Pin 1 Pin 84
Pin 12 Pin 1 ID
Pin 32
Altera Corporation
Altera Device Package Information
88-Pin Ultra FineLine Ball-Grid Array (UBGA) - Wire Bond
All dimensions and tolerances conform to ASME Y14.5M - 1994. Controlling dimension is in millimeters. Pin A1 may be indicated by an ID dot, or a special feature, in its proximity on package surface. Package Outline Dimension Table Specification Symbol
Ordering Code Reference Package Acronym Substrate Material Solder Ball Composition JEDEC Outline Weight Moisture Sensitivity Level U UBGA BT Regular: 63Sn:37Pb (Typ.) Pb-free: Sn:3Ag:0.5Cu (Typ.) MO-219 0.4 g Printed on moisture barrier bag A A1 A2 D E b e 0.40
Package Information Description
Millimeters Min.
- - - 11.00 BSC 8.00 BSC 0.45 0.80 BSC
Maximum Lead Coplanarity 0.005 inches (0.12 mm)
Altera Corporation
Altera Device Package Information
Package Outline
TOP VIEW BOTTOM VIEW
Pin A1 Corner
Pin A1 ID
Altera Corporation
Altera Device Package Information
100-Pin FineLine Ball-Grid Array (FBGA) - Option 1 - Wire Bond
All dimensions and tolerances conform to ASME Y14.5M - 1994. Controlling dimension is in millimeters. Pin A1 may be indicated by an ID dot, or a special feature, in its proximity on the package surface.
Note: This POD is applicable to F100 packages of all products except MAX II, which is assembled in Option 2 package outlines.
Package Information Description
Ordering Code Reference Package Acronym Substrate Material Solder ball composition JEDEC Outline Reference Weight Moisture Sensitivity Level F FBGA BT Regular: 63Sn:37Pb (Typ.) Pb-free: Sn:3Ag:0.5Cu (Typ.) MO-192 Variation: AAC-1 0.6 g Printed on moisture barrier bag
Package Outline Dimension Table Specification Symbol Min.
Millimeters Nom.
- - - - 11.00 BSC 11.00 BSC 0.60 1.00 BSC 0.70
Maximum Lead Coplanarity 0.008 inches (0.20mm)
Altera Corporation
Altera Device Package Information
Package Outline
TOP VIEW
BOTTOM VIEW
Pin A1 Corner
Pin A1 ID
Altera Corporation
Altera Device Package Information
100-Pin FineLine Ball-Grid Array (FBGA) - Option 2 - Wire Bond
All dimensions and tolerances conform to ASME Y14.5M - 1994. Controlling dimension is in millimeters. Pin A1 may be indicated by an ID dot, or a special feature, in its proximity on package surface.
Note: This POD is applicable to F100 packages of the MAX II device only.
Package Information Description
Ordering Code Reference Package Acronym Substrate Material Solder ball composition JEDEC Outline Reference Weight Moisture Sensitivity Level F FBGA BT Regular: 63Sn:37Pb (Typ.) Pb-free: Sn:3Ag:0.5Cu (Typ.) MO-192 Variation: DAC-1 0.6 g Printed on moisture barrier bag
Package Outline Dimension Table Specification Symbol Min.
Millimeters Nom.
- - 1.05 Ref - 11.00 BSC 11.00 BSC 0.50 1.00 BSC 0.55 0.80
Maximum Lead Coplanarity 0.008 inches (0.20mm)
Altera Corporation
Altera Device Package Information
Package Outline
TOP VIEW
BOTTOM VIEW
Pin A1 Corner
Pin A1 ID
Altera Corporation
Altera Device Package Information
100-Pin Micro FineLine Ball-Grid Array (MBGA) - Wire Bond
All dimensions and tolerances conform to ASME Y14.5M - 1994. Controlling dimension is in millimeters. Pin A1 may be indicated by an ID dot, or a special feature, in its proximity on package surface. Package Outline Dimension Table Specification Symbol
Ordering Code Reference Package Acronym Substrate Material Solder Ball Composition JEDEC Outline Reference Weight Moisture Sensitivity Level M MBGA BT Pb-free: Sn:3Ag:0.5Cu (Typ.) MO-195 0.1 g Printed on moisture barrier bag Variation: AC A A1 A2 A3 D E b e 0.25
Package Information Description
Millimeters Min.
- - - 0.60 REF 6.00 BSC 6.00 BSC 0.30 0.50 BSC
Maximum Lead Coplanarity 0.003 inch (0.08mm)
Altera Corporation
Altera Device Package Information
Package Outline
TOP VIEW
BOTTOM VIEW
Pin A1 Corner
Pin A1 ID
Altera Corporation
Altera Device Package Information
100-Pin Plastic Quad Flat Pack (PQFP) - Option 1 - Wire Bond
All dimensions and tolerances conform to ASME Y14.5M - 1994. Controlling dimension is in millimeters. Pin 1 may be indicated by an ID dot, or a special feature, in its proximity on the package surface.
Note: This POD is applicable to Q100 packages of all products not noted in Option 2.
Package Information Description
Ordering Code Reference Package Acronym Leadframe Material Lead Finish (Plating) JEDEC Outline Reference Weight Moisture Sensitivity Level Q PQFP Copper Regular: 85Sn:15Pb (Typ.) Pb-free: Matte Sn MS-022 Variation: GC-1 1.9 g Printed on moisture barrier bag
Package Outline Dimension Table Specification Symbol Min.
A A1 A2 D D1 E E1 L L1 S b c e 0° 0.20 0.22 0.11 0.73 - 0.25 2.50
Millimeters Nom.
- - 2.70 17.20 BSC 14.00 BSC 23.20 BSC 20.00 BSC 0.88 1.60 REF - - - 0.65 BSC - 7° - 0.40 0.23 1.03
Maximum Lead Coplanarity 0.004 inches (0.10mm)
Altera Corporation
Altera Device Package Information
Package Outline
Pin 100
Pin 30
See Detail A
Detail A
Gage Plane b
0.25mm
Altera Corporation
Altera Device Package Information
100-Pin Plastic Quad Flat Pack (PQFP) - Option 2 - Wire Bond
All dimensions and tolerances conform to ASME Y14.5M - 1994. Controlling dimension is in millimeters. Pin 1 may be indicated by an ID dot, or a special feature, in its proximity on package surface.
Note: This POD is only applicable to Q100 packages of EPC8 & EPC16 manufactured in Japan. Refer to PCN0506 for details.
Package Information Description
Ordering Code Reference Package Acronym Leadframe Material Lead Finish (Plating) JEDEC Outline Reference Q PQFP Copper Regular: 85Sn:15Pb (Typ.) N / A
Package Outline Dimension Table Specification Symbol Min.
A A1 A2 D D1 E E1 L L1 b c e 0° 0.20 0.10 17.90 13.80 23.90 19.80 1.75 0.0
Millimeters Nom.
1.95 0.10 1.85 TYP 18.30 14.00 24.30 20.00 1.20 REF 2.15 REF 0.30 0.15 0.65 BSC - 10° 0.40 0.20 18.70 14.20 24.70 20.20
Maximum Lead Coplanarity 0.006 inches (0.15mm) Weight 1.6 g Moisture Sensitivity Level Printed on moisture barrier bag
Altera Corporation
Altera Device Package Information
Package Outline
Pin 100
Pin 30
See Detail A
Detail A
Gage Plane b L L1 0.25mm
Altera Corporation
Altera Device Package Information
100-Pin Plastic Thin Quad Flat Pack (TQFP) - Wire Bond
All dimensions and tolerances conform to ASME Y14.5M - 1994. Controlling dimension is in millimeters. Pin 1 may be indicated by an ID dot, or a special feature, in its proximity on package surface. Package Outline Dimension Table Specification Symbol
Ordering Code Reference Package Acronym Leadframe Material Lead Finish (Plating) JEDEC Outline Reference Weight Moisture Sensitivity Level T TQFP Copper Regular: 85Sn:15Pb (Typ.) Pb-free: Matte Sn MS-026 Variation: AED 0.6 g Printed on moisture barrier bag A A1 A2 D D1 E E1 L L1 S b c e 0° 0.20 0.17 0.09 0.45
Package Information Description
Millimeters Min.
- - 1.00 16.00 BSC 14.00 BSC 16.00 BSC 14.00 BSC 0.60 1.00 REF - 0.22 - 0.50 BSC 3.5°
Maximum Lead Coplanarity 0.003 inches (0.08mm)
Altera Corporation
Altera Device Package Information
Package Outline
Pin 100
Pin 25
See Detail A
Detail A
C Gage Plane
S L L1 0.25mm
Altera Corporation
Altera Device Package Information
144-Pin Plastic Enhanced Quad Flat Pack (EQFP) - Wire Bond
All dimensions and tolerances conform to ASME Y14.5M - 1994. Controlling dimension is in millimeters. Pin 1 may be indicated by an ID dot, or a special feature, in its proximity on package surface. Package Outline Figure Reference Specification Symbol
Ordering Code Reference Package Acronym Leadframe Material Lead Finish (Plating) JEDEC Outline Reference E EQFP Copper Regular: 85Sn:15Pb (Typ.) Pb-free: Matte Sn MS-026 Variation: BFB A A1 A2 D D1 D2 Maximum Lead Coplanarity 0.003 inches (0.08mm) Weight Moisture Sensitivity Level 1.1 g Printed on moisture barrier bag E E1 E2 L L1 S b c e 0° 0.20 0.17 0.09 4.00 0.45 4.00
Package Information Description
Millimeters Min.
- - 1.40 22.00 BSC 20.00 BSC
22.00 BSC 20.00 BSC 0.60 1.00 REF - 0.22 - 0.50 BSC 3.5°
Altera Corporation
Altera Device Package Information
Package Outline
TOP VIEW
Pin 144
BOTTOM VIEW
Pin 144
Pin 36
See Detail A
Detail A
C Gage Plane
S L L1 0.25mm
Altera Corporation
Altera Device Package Information
144-Pin FineLine Ball-Grid Array (FBGA) - Wire Bond
All dimensions and tolerances conform to ASME Y14.5M - 1994. Controlling dimension is in millimeters. Pin A1 may be indicated by an ID dot, or a special feature, in its proximity on package surface. Package Outline Dimension Table Specification Symbol
Ordering Code Reference Package Acronym Substrate Material Solder Ball Composition JEDEC Outline Reference Weight Moisture Sensitivity Level F FBGA BT Regular: 63Sn:37Pb (Typ.) Pb-free: Sn:3Ag:0.5Cu (Typ.) MO-192 Variation: AAD-1 0.8 g Printed on moisture barrier bag A A1 A2 A3 D E b e 0.50
Package Information Description
Millimeters Min.
- - - - 13.00 BSC 13.00 BSC 0.60 1.00 BSC
Maximum Lead Coplanarity 0.008 inches (0.20mm)
Altera Corporation
Altera Device Package Information
Package Outline
TOP VIEW
BOTTOM VIEW
Pin A1 Corner
Pin A1 ID
Altera Corporation
Altera Device Package Information
144-Pin Micro FineLine Ball-Grid Array (MBGA) - Wire Bond
All dimensions and tolerances conform to ASME Y14.5M - 1994. Controlling dimension is in millimeters. Pin A1 may be indicated by an ID dot, or a special feature, in its proximity on package surface. Package Outline Dimension Table Specification Symbol
Ordering Code Reference Package Acronym Substrate Material Solder Ball Composition JEDEC Outline Reference Weight Moisture Sensitivity Level M MBGA BT Pb-free: Sn:3Ag:0.5Cu (Typ.) MO-195 Variation: AD 0.1 g Printed on moisture barrier bag A A1 A2 A3 D E b e 0.25
Package Information Description
Millimeters Min.
- - - 0.60 REF 7.00 BSC 7.00 BSC 0.30 1.00 BSC
Maximum Lead Coplanarity 0.003 inch (0.08mm)
Altera Corporation
Altera Device Package Information
Package Outline
TOP VIEW
BOTTOM VIEW
Pin A1 Corner
Pin A1 ID
Altera Corporation
Altera Device Package Information
144-Pin Plastic Thin Quad Flat Pack (TQFP) - Wire Bond
All dimensions and tolerances conform to ASME Y14.5M - 1994. Controlling dimension is in millimeters. Pin 1 may be indicated by an ID dot, or a special feature, in its proximity on package surface. Package Outline Figure Reference Specification Symbol
Ordering Code Reference Package Acronym Leadframe Material Lead Finish (Plating) JEDEC Outline Reference Weight Moisture Sensitivity Level T TQFP Copper Regular: 85Sn:15Pb (Typ.) Pb-free: Matte Sn MS-026 Variation: BFB 1.1 g Printed on moisture barrier bag A A1 A2 D D1 E E1 L L1 S b c e 0° 0.20 0.17 0.09 0.45
Package Information Description
Millimeters Min.
- - 1.40 22.00 BSC 20.00 BSC 22.00 BSC 20.00 BSC 0.60 1.00 REF - 0.22 - 0.50 BSC 3.5°
Maximum Lead Coplanarity 0.003 inches (0.08mm)
Altera Corporation
Altera Device Package Information
Package Outline
Pin 144
Pin 36
See Detail A
Detail A
C Gage Plane
S L L1 0.25mm
Altera Corporation
Altera Device Package Information
160-Pin Ceramic Pin-Grid Array (PGA) - Wire Bond
All dimensions and tolerances conform to ASME Y14.5M - 1994. Controlling dimension is in inches. Pin A1 may be indicated by an ID dot, or a special feature, in its proximity on package surface. Package Outline Dimension Table Specification Symbol
Ordering Code Reference Package Acronym Leadframe Material Lead Finish JEDEC Outline Reference Weight Moisture Sensitivity Level G PGA Alloy 42 Gold Over Nickel Plate MO-067 Variation: AG 19.9 g Printed on moisture barrier bag A A1 A2 D E L b e 0.016 0.120 1.540 1.540
Package Information Description
Inches Min.
0.190 0.050 TYP 0.140 1.560 1.560 0.130 TYP 0.018 0.100 BSC
Maximum Lead Coplanarity N / A
Altera Corporation
Altera Device Package Information
Package Outline
TOP VIEW
Pin A1 Corner
BOTTOM VIEW
Pin A1 ID
Altera Corporation
Altera Device Package Information
160-Pin Plastic Quad Flat Pack (PQFP) - Wire Bond
All dimensions and tolerances conform to ASME Y14.5M - 1994. Controlling dimension is in millimeters. Pin 1 may be indicated by an ID dot, or a special feature, in its proximity on package surface. Package Outline Dimension Table Specification Symbol
Ordering Code Reference Package Acronym Leadframe Material Lead Finish (Plating) JEDEC Outline Reference Weight Moisture Sensitivity Level Q PQFP Copper Regular: 85Sn:15Pb (Typ.) Pb-free: Matte Sn MS-022 Variation: DD-1 6.2 g Printed on moisture barrier bag A A1 A2 D D1 E E1 L L1 S b c e 0° 0.20 0.22 0.09 0.50
Package Information Description
Millimeters Min.
- - 3.40 31.20 BSC 28.00 BSC 31.20 BSC 28.00 BSC - 1.60 REF - - - 0.65 BSC -
Maximum Lead Coplanarity 0.004 inches (0.10mm)
Altera Corporation
Altera Device Package Information
Package Outline
Pin 160
Pin 40
See Detail A
Detail A
C Gage Plane
S L L1 0.25mm
Altera Corporation
Altera Device Package Information
169-Pin Ultra FineLine Ball-Grid Array (UBGA) - Wire Bond
All dimensions and tolerances conform to ASME Y14.5M - 1994. Controlling dimension is in millimeters. Pin A1 may be indicated by an ID dot, or a special feature, in its proximity on package surface. Package Outline Dimension Table Specification Symbol
Ordering Code Reference Package Acronym Substrate Material Solder Ball Composition JEDEC Outline Reference Weight Moisture Sensitivity Level U UBGA BT Regular: 63Sn:37Pb (Typ.) Pb-free: Sn:3Ag:0.5Cu (Typ.) MO-216 Variation: BAF-1 0.6 g Printed on moisture barrier bag A A1 A2 A3 D E b e 0.40
Package Information Description
Millimeters Min.
- - - 0.70 TYP 11.00 BSC 11.00 BSC 0.50 0.80 BSC
Maximum Lead Coplanarity 0.005 inches (0.12mm)
Altera Corporation
Altera Device Package Information
Package Outline
TOP VIEW BOTTOM VIEW
Pin A1 Corner
Pin A1 ID
Altera Corporation
Altera Device Package Information
192-Pin Ceramic Pin-Grid Array (PGA) - Wire Bond
All dimensions and tolerances conform to ASME Y14.5M - 1994. Controlling dimension is in inches. Pin A1 may be indicated by an ID dot, or a special feature, in its proximity on package surface. Package Outline Dimension Table Specification Symbol
Ordering Code Reference Package Acronym Leadframe Material Lead Finish JEDEC Outline Reference Weight Moisture Sensitivity Level G PGA Alloy 42 Gold Over Nickel Plate MO-067 Variation: AJ 21.0 g Printed on moisture barrier bag A A1 A2 D E L b e 0.016 0.127 1.740 1.740
Package Information Description
Inches Min.
0.192 0.050 TYP 0.142 1.760 1.760 0.130 TYP 0.018 0.100 BSC
Maximum Lead Coplanarity N / A
Altera Corporation
Altera Device Package Information
Package Outline
TOP VIEW
BOTTOM VIEW
Pin A1 Corner A B C D
Pin A1 ID
Altera Corporation
Altera Device Package Information
208-Pin Plastic Quad Flat Pack (PQFP) - Wire Bond
All dimensions and tolerances conform to ASME Y14.5M - 1994. Controlling dimension is in millimeters. Pin 1 may be indicated by an ID dot in its proximity on package surface.
Package Information Description
Ordering Code Reference Package Acronym Lead Material Lead Finish (Plating) JEDEC Outline Reference Weight Moisture Sensitivity Level Q PQFP Copper Regular: 85Sn:15Pb (Typ.) Pb-free: Matte Sn MS-029 Variation: FA-1 6.3 g Printed on moisture barrier bag
Package Outline Dimension Table Specification Symbol Min.
A A1 A2 D D1 E E1 L L1 S b c e 0° 0.20 0.17 0.09 0.50 - 0.25 3.20
Millimeters Nom.
- - 3.40 30.60 BSC 28.00 BSC 30.60 BSC 28.00 BSC 0.60 1.30 REF - - - 0.50 BSC 3.5° 8° - 0.27 0.20 0.75
Maximum Lead Coplanarity 0.003 inches (0.08 mm)
Altera Corporation
Altera Device Package Information
Package Outline
Pin 208
Pin 52
See Detail A
Detail A
C Gage Plane
S L L1 0.25mm
Altera Corporation
Altera Device Package Information
208-Pin Power Quad Flat Pack (RQFP) - Wire Bond
All dimensions and tolerances conform to ASME Y14.5M - 1994. Controlling dimension is in millimeters. Pin 1 may be indicated by an ID dot, or a special feature, in its proximity on package surface. Package Outline Dimension Table Specification Symbol
Ordering Code Reference Package Acronym Leadframe Material Lead Finish (Plating) JEDEC Outline Reference Weight Moisture Sensitivity Level R RQFP Copper Regular: 85Sn:15Pb (Typ.) Pb-free: Matte Sn MS-029 Variation: FA-1 6.7 g Printed on moisture barrier bag A A1 A2 D D1 E E1 L L1 S b c e 0° 0.20 0.17 0.09 0.45
Package Information Description
Millimeters Min.
- - 3.40 30.60 BSC 28.00 BSC 30.60 BSC 28.00 BSC 0.60 1.30 REF - - - 0.50 BSC 3.5°
Maximum Lead Coplanarity 0.003 inches (0.08mm)
Altera Corporation
Altera Device Package Information
Package Outline
Pin 208
Pin 52
See Detail A
Detail A
C Gage Plane
S L L1 0.25mm
Altera Corporation
Altera Device Package Information
232-Pin Ceramic Pin-Grid Array (PGA) - Wire Bond
All dimensions and tolerances conform to ASME Y14.5M - 1994. Controlling dimension is in inches. Pin A1 may be indicated by an ID dot, or a special feature, in its proximity on package surface. Package Outline Dimension Table Specification Symbol
Ordering Code Reference Package Acronym Leadframe Material Lead Finish JEDEC Outline Reference Weight Moisture Sensitivity Level G PGA Alloy 42 Gold Over Nickel Plate MO-067 Variation: AJ 25.5 g Printed on moisture barrier bag A A1 A2 D E L b e 0.016 0.134 1.740 1.740
Package Information Description
Inches Min.
0.192 0.050 TYP 0.142 1.760 1.760 0.130 TYP 0.018 0.100 BSC
Maximum Lead Coplanarity N / A
Altera Corporation
Altera Device Package Information
Package Outline
TOP VIEW
Pin A1 Corner
BOTTOM VIEW
Pin A1 ID
Altera Corporation
Altera Device Package Information
240-Pin Plastic Quad Flat Pack (PQFP) - Wire Bond
All dimensions and tolerances conform to ASME Y14.5M - 1994. Controlling dimension is in millimeters. Pin 1 may be indicated by an ID dot, or a special feature, in its proximity on package surface. Package Outline Dimension Table Specification Symbol
Ordering Code Reference Package Acronym Leadframe Material Lead Finish (Plating) JEDEC Outline Reference Weight Moisture Sensitivity Level Q PQFP Copper Regular: 85Sn:15Pb (Typ.) Pb-free: Matte Sn MS-029 Variation: GA 8.0 g Printed on moisture barrier bag A A1 A2 D D1 E E1 L L1 S b c e 0° 0.20 0.17 0.09 0.45
Package Information Description
Millimeters Min.
- - 3.40 34.60 BSC 32.00 BSC 34.60 BSC 32.00 BSC 0.60 1.30 REF - - - 0.50 BSC 3.5°
Maximum Lead Coplanarity 0.003 inches (0.08mm)
Altera Corporation
Altera Device Package Information
Package Outline
Pin 240
Pin 60
See Detail A
Detail A
C Gage Plane
0.25mm
Altera Corporation
Altera Device Package Information
240-Pin Power Quad Flat Pack (RQFP) - Wire Bond
All dimensions and tolerances conform to ASME Y14.5M - 1994. Controlling dimension is in millimeters. Pin 1 may be indicated by an ID dot, or a special feature, in its proximity on package surface. Package Outline Dimension Table Specification Symbol
Ordering Code Reference Package Acronym Leadframe Material Lead Finish (Plating) JEDEC Outline Reference Weight Moisture Sensitivity Level R RQFP Copper Regular: 85Sn:15Pb (Typ.) Pb-free: Matte Sn MS-029 Variation: GA 8.6 g Printed on moisture barrier bag A A1 A2 D D1 E E1 L L1 S b c e 0° 0.20 0.17 0.09 0.45
Package Information Description
Millimeters Min.
- - 3.40 34.60 BSC 32.00 BSC 34.60 BSC 32.00 BSC 0.60 1.30 REF - - - 0.50 BSC 3.5°
Maximum Lead Coplanarity 0.003 inches (0.08mm)
Altera Corporation
Altera Device Package Information
Package Outline
Pin 240
Pin 60
See Detail A
Detail A
C Gage Plane
S L L1 0.25mm
Altera Corporation
Altera Device Package Information
256-Pin Ball-Grid Array (BGA) - Option 1 - Wire Bond
All dimensions and tolerances conform to ASME Y14.5M - 1994. Controlling dimension is in millimeters. Pin A1 may be indicated by an ID dot, or a special feature, in its proximity on package surface. Package Outline Dimension Table Specification Symbol
Ordering Code Reference Package Acronym Substrate Material Solder Ball Composition JEDEC Outline Reference Weight Moisture Sensitivity Level B BGA BT or tape Regular: 63Sn:37Pb (Typ.) Pb-free: Sn:3Ag:0.5Cu (Typ.) MO-192 Variation: BAL-2 4.8 g Printed on moisture barrier bag A A1 A2 D E b e 0.60
Package Information Description
Millimeters Min.
- - - 27.00 BSC 27.00 BSC 0.75 1.27 BSC
Maximum Lead Coplanarity 0.008 inches (0.20 mm)
Altera Corporation
Altera Device Package Information
Package Outline
Pin A1 Corner
Pin A1 ID
Altera Corporation
Altera Device Package Information
256-Pin Plastic Ball-Grid Array (BGA) - Option 2 - Wire Bond
All dimensions and tolerances conform to ASME Y14.5M - 1994. Controlling dimension is in millimeters. Pin A1 may be indicated by an ID dot, or a special feature, in its proximity on package surface. Package Outline Dimension Table Specification Symbol
Ordering Code Reference Package Acronym Substrate Material Solder Ball Composition JEDEC Outline Reference Weight Moisture Sensitivity Level B BGA BT Regular: 63Sn:37Pb (Typ.) Pb-free: Sn:3Ag:0.5Cu (Typ.) MS-034 3.1 g Printed on moisture barrier bag Variation: BAL-2 A A1 A2 A3 D E b e 0.60
Package Information Description
Millimeters Min.
- - - - 27.00 BSC 27.00 BSC 0.75 1.27 BSC
Maximum Lead Coplanarity 0.008 inches (0.20 mm)
Altera Corporation
Altera Device Package Information
Package Outline
TOP VIEW D BOTTOM VIEW
Pin A1 Corner 1 A C E Pin A1 ID
Altera Corporation
Altera Device Package Information
256-Pin FineLine Ball-Grid Array (FBGA) - Option 1 - Wire Bond
All dimensions and tolerances conform to ASME Y14.5M - 1994. Controlling dimension is in millimeters. Pin A1 may be indicated by an ID dot, or a special feature, in its proximity on package surface.
Note: This POD is applicable to F256 packages of all products except Cyclone II, which is assembled in Option 2 package outlines.
Package Information Description
Ordering Code Reference Package Acronym Substrate Material Solder Ball Composition JEDEC Outline Reference Weight Moisture Sensitivity Level F FBGA BT Regular: 63Sn:37Pb (Typ.) Pb-free: Sn:3Ag:0.5Cu (Typ.) MS-034 1. 5 g Printed on moisture barrier bag Variation: AAF-1
Package Outline Dimension Table Specification Min.
Millimeters Nom.
- - - 0.70 REF 17.00 BSC 17.00 BSC 0.60 1.00 BSC 0.70
Maximum Lead Coplanarity 0.008 inches (0.20 mm)
Altera Corporation
Altera Device Package Information
Package Outline
TOP VIEW
BOTTOM VIEW
Pin A1 Corner
Pin A1 ID
Altera Corporation
Altera Device Package Information
256-Pin FineLine Ball-Grid Array (FBGA) - Option 2 - Wire Bond
All dimensions and tolerances conform to ASME Y14.5M - 1994. Controlling dimension is in millimeters. Pin A1 may be indicated by an ID dot, or a special feature, in its proximity on the package surface.
Note: This POD is applicable to F256 packages of the Cyclone II product only.
Package Information Description
Ordering Code Reference Package Acronym Substrate Material Solder Ball Composition JEDEC Outline Reference Weight Moisture Sensitivity Level F FBGA BT Regular: 63Sn:37Pb (Typ.) Pb-free: Sn:3Ag:0.5Cu (Typ.) MO-192 1.5 g Printed on moisture barrier bag Variation: DAF-1
Package Outline Dimension Table Specification Min.
Millimeters Nom.
- - 1.05 REF - 17.00 BSC 17.00 BSC 0.50 1.00 BSC 0.55 0.80
Maximum Lead Coplanarity 0.008 inches (0.20 mm)
Altera Corporation
Altera Device Package Information
Package Outline
TOP VIEW
BOTTOM VIEW
Pin A1 Corner
Pin A1 ID
Altera Corporation
Altera Device Package Information
256-Pin Micro FineLine Ball-Grid Array (MBGA) - Wire Bond
All dimensions and tolerances conform to ASME Y14.5M - 1994. Controlling dimension is in millimeters. Pin A1 may be indicated by an ID dot, or a special feature, in its proximity on package surface.
Package Information Description
Ordering Code Reference Package Acronym Substrate Material Solder Ball Composition JEDEC Outline Reference Weight Moisture Sensitivity Level M MBGA BT Pb-free: Sn:3Ag:0.5Cu (Typ.) MO-195 0.3 g Printed on moisture barrier bag Variation: BH
Package Outline Dimension Table Specification Min.
Millimeters Nom.
- - - 0.60 REF 11.00 BSC 11.00 BSC 0.30 0.50 BSC 0.35
Maximum Lead Coplanarity 0.003 inch (0.08mm)
Altera Corporation
Altera Device Package Information
Package Outline
TOP VIEW
BOTTOM VIEW
Pin A1 Corner
Pin A1 ID
Altera Corporation
Altera Device Package Information
256-Pin Ultra FineLine Ball-Grid Array (UBGA) - Wire Bond
All dimensions and tolerances conform to ASME Y14.5M - 1994. Controlling dimension is in millimeters. Pin A1 may be indicated by an ID dot, or a special feature, in its proximity on package surface.
Package Information Description
Ordering Code Reference Package Acronym Substrate Material Solder Ball Composition JEDEC Outline Reference Weight Moisture Sensitivity Level U UBGA BT Regular: 63Sn:37Pb (Typ.) Pb-free: Sn:3Ag:0.5Cu (Typ.) MO-216 Variation: BAJ-2 (0.12mm) 0.8 g Printed on moisture barrier bag
Package Outline Dimension Table Specification Min.
Millimeters Nom.
- - - 0.80 TYP 14.00 BSC 14.00 BSC 0.50 0.80 BSC 0.60
Maximum Lead Coplanarity 0.005 inches
Altera Corporation
Altera Device Package Information
Package Outline
TOP VIEW
BOTTOM VIEW
Pin A1 Corner
Pin A1 ID
Altera Corporation
Altera Device Package Information
280-Pin Ceramic Pin-Grid Array (PGA) - Wire Bond
All dimensions and tolerances conform to ASME Y14.5M - 1994. Controlling dimension is in inches. Pin A1 may be indicated by an ID dot, or a special feature, in its proximity on package surface. Package Outline Dimension Table Specification Symbol
Ordering Code Reference Package Acronym Leadframe Material Lead Finish JEDEC Outline Reference Weight Moisture Sensitivity Level G PGA Alloy 42 Gold Over Nickel Plate MO-067 Variation: AL 29.5 g Printed on moisture barrier bag A A1 A2 D E L b e 0.016 0.125 1.940 1.940
Package Information Description
Inches Min.
0.185 0.050 TYP 0.135 1.960 1.960 0.130 TYP 0.018 0.100 BSC
Maximum Lead Coplanarity N / A
Altera Corporation
Altera Device Package Information
Package Outline
TOP VIEW
Pin A1 Corner
BOTTOM VIEW
Pin A1 ID
Altera Corporation
Altera Device Package Information
304-Pin Power Quad Flat Pack (RQFP) - Wire Bond
All dimensions and tolerances conform to ASME Y14.5M - 1994. Controlling dimension is in millimeters. Pin 1 may be indicated by an ID dot, or a special feature, in its proximity on package surface. Package Outline Dimension Table Specification Symbol
Ordering Code Reference Package Acronym Leadframe Material Lead Finish (Plating) JEDEC Outline Reference Weight Moisture Sensitivity Level R RQFP Copper Regular: 85Sn:15Pb (Typ.) Pb-free: Matte Sn MS-029 Variation: JA 14.3 g Printed on moisture barrier bag A A1 A2 D D1 E E1 L L1 S b c e 0° 0.20 0.17 0.09 0.45
Package Information Description
Millimeters Min.
- - 3.80 42.60 BSC 40.00 BSC 42.60 BSC 40.00 BSC 0.60 1.30 REF - - - 0.50 BSC 3.5°
Maximum Lead Coplanarity 0.003 inches (0.08mm)
Altera Corporation
Altera Device Package Information
Package Outline
Pin 304
Pin 76
See Detail A
Detail A
C Gage Plane
S L L1 0.25mm
Altera Corporation
Altera Device Package Information
324-Pin FineLine Ball-Grid Array (FBGA) - Wire Bond
All dimensions and tolerances conform to ASME Y14.5M - 1994. Controlling dimension is in millimeters. Pin A1 may be indicated by an ID dot, or a special feature, in its proximity on package surface. Package Outline Dimension Table Specification Symbol
Ordering Code Reference Package Acronym Substrate Material Solder Ball Composition JEDEC Outline Reference Weight Moisture Sensitivity Level F FBGA BT Regular: 63Sn:37Pb (Typ.) Pb-free: Sn:3Ag:0.5Cu (Typ.) MS-034 Variation: AAG-1 1.6 g Printed on moisture barrier bag A A1 A2 A3 D E b e 0.50
Package Information Description
Millimeters Min.
- - - 0.70 REF 19.00 BSC 19.00 BSC 0.60 1.00 BSC
Maximum Lead Coplanarity 0.008 inches (0.20mm)
Altera Corporation
Altera Device Package Information
Package Outline
TOP VIEW
BOTTOM VIEW
Pin A1 Corner
Altera Corporation
Altera Device Package Information
356-Pin Ball-Grid Array (BGA) - Wire Bond
All dimensions and tolerances conform to ASME Y14.5M - 1994. Controlling dimension is in millimeters. Pin A1 may be indicated by an ID dot, or a special feature, in its proximity on package surface. Package Outline Dimension Table Specification Symbol
Ordering Code Reference Package Acronym Substrate Material Solder Ball Composition JEDEC Outline Reference Weight Moisture Sensitivity Level B BGA BT or tape Regular: 63Sn:37Pb (Typ.) Pb-free: Sn:3Ag:0.5Cu (Typ.) MO-192 Variation: BAR-2 7.7 g Printed on moisture barrier bag A A1 A2 D E b e 0.60
Package Information Description
Millimeters Min.
- - 35.00 BSC 35.00 BSC 0.75 1.27 BSC
Maximum Lead Coplanarity 0.008 inches (0.20mm)
Altera Corporation
Altera Device Package Information
Package Outline
TOP VIEW
BOTTOM VIEW
Pin A1 Corner
Pin A1 ID
Altera Corporation
Altera Device Package Information
400-Pin FineLine Ball-Grid Array (FBGA) - Wire Bond
All dimensions and tolerances conform to ASME Y14.5M - 1994. Controlling dimension is in millimeters. Pin A1 may be indicated by an ID dot, or a special feature, in its proximity on package surface. Package Outline Dimension Table Specification Symbol
Ordering Code Reference Package Acronym Substrate Material Solder Ball Composition JEDEC Outline Reference Weight Moisture Sensitivity Level F FBGA BT Regular: 63Sn:37Pb (Typ.) Pb-free: Sn:3Ag:0.5Cu (Typ.) MS-034 Variation: AAH-1 2.3 g Printed on moisture barrier bag A A1 A2 A3 D E b e 0.50
Package Information Description
Millimeters Min.
- - - 0.80 REF 21.00 BSC 21.00 BSC 0.60 1.00 BSC
Maximum Lead Coplanarity 0.008 inches (0.20mm)
Altera Corporation
Altera Device Package Information
Package Outline
TOP VIEW
BOTTOM VIEW
Pin A1 Corner
Pin A1 ID
Altera Corporation
Altera Device Package Information
403-Pin Ceramic Pin-Grid Array (PGA) - Wire Bond
All dimensions and tolerances conform to ASME Y14.5M - 1994. Controlling dimension is in inches. Pin A1 may be indicated by an ID dot, or a special feature, in its proximity on package surface. Package Outline Dimension Table Specification Symbol
Ordering Code Reference Package Acronym Leadframe Material Lead Finish JEDEC Outline Reference Weight Moisture Sensitivity Level G PGA Alloy 42 Gold Over Nickel Plate MO-128 Variation: AL 47.7 g Printed on moisture barrier bag A A1 A2 D E L b e 0.016 0.117 1.940 1.940
Package Information Description
Inches Min.
0.180 0.050 TYP 0.130 1.960 1.960 0.130 TYP 0.018 0.100 BSC
Maximum Lead Coplanarity N / A
Altera Corporation
Altera Device Package Information
Package Outline
TOP VIEW
BOTTOM VIEW
Pin A1 Corner
Pin A1 ID
Altera Corporation
Altera Device Package Information
484-Pin FineLine Ball-Grid Array (FBGA) - Option 1 - Flip Chip
All dimensions and tolerances conform to ASME Y14.5M - 1994. Controlling dimension is in millimeters. Pin A1 may be indicated by an ID dot, or a special feature, in its proximity on the package surface. Package Outline Dimension Table Specification Symbol
Ordering Code Reference Package Acronym Substrate Material Solder Ball Composition JEDEC Outline Reference Weight Moisture Sensitivity Level F FBGA BT Regular: 63Sn:37Pb (Typ.) Pb-free: Sn:3Ag:0.5Cu (Typ.) MS-034 Variation: AAJ-1 7.1 g Printed on moisture barrier bag A A1 A2 A3 D E b e 0.50
Package Information Description
Millimeters Min.
- - - - 23.00 BSC 23.00 BSC 0.60 1.00 BSC
Maximum Lead Coplanarity 0.008 inches (0.20 mm)
Altera Corporation
Altera Device Package Information
Package Outline
TOP VIEW
BOTTOM V