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Altera Device Package Information
Document Revision History
Table shows revision history this document.
Table Document Revision History Date Document Version
2007 v14.7
Changes Made
Added ArriaGX information Added Cyclone tables Revised dimensions 144-Pin EQFP Revised 100-Pin MBGA Wire Bond 256-Pin MBGA Wire Bond Added 780-Pin FBGA option Wire Bond, 256-Pin UBGA Wire Bond, 68-Pin MBGA Wire Bond, 144-Pin MBGA Wire Bond Updated 144-Pin Plastic Thin Quad Flat Pack (TQFP) Data Sheet correct title ordering code reference Added revision history
Summary Changes
Changes additions described "Changes Made" section.
February 2007 v14.6
Revised data sheet (144-Pin Plastic Thin Quad Flat Pack (TQFP) Data Sheet), added revision history.
December 2006 v14.5
Table added Stratix Device Package Added Tables Stratix III, updated other data sheets. Cross-Reference Tables were added Stratix Thermal Resistance information 1517-Pin FineLine Ball-Grid Array (FBGA) Flip Chip data sheet added 1760-Pin FineLine Ball-Grid Array (FBGA) Flip Chip data sheet added "Wire Bond" "Flip Chip" added title each data sheet, appropriate "BGA" spelled "Ball-Grid Array" titles Some package outline drawings were reformatted Weights were updated many packages
Note Table
Formal revision history this document began with version 14.5.
Altera Corporation
DS-PKG-14.7
Altera Device Package Information Data Sheet
Introduction
This data sheet provides package information Altera® devices. includes these sections:
Device Package Cross Reference (below) Thermal Resistance (starting page Package Outlines (starting page
this data sheet, packages listed order ascending count.
Device Package Cross Reference
Tables through show devices available Ball-Grid Array (BGA), FineLine BGA® (FBGA), Ultra FineLine (UBGA), Micro FineLine (MBGA), Pin-Grid Array (PGA), Plastic J-Lead Chip Carrier (PLCC), Thin Quad Flat Pack (TQFP), Plastic Quad Flat Pack (PQFP), Ceramic Dual In-Line Package (CerDIP), Hybrid FineLine (HBGA):
ArriaGX FPGAs Stratix® series FPGAs Cyclone® series FPGAs MAX® series CPLDs HardCopy® series Structured ASICs APEXseries FPGAs ACEX® FPGAs MercuryFPGAs FLEX® series FPGAs ExcaliburFPGA Enhanced configuration devices
Table Arria Devices FineLine Ball Grid Array (FBGA) Flip Chip Packages (Part Device
EP1AGX20 Flip-chip FBGA Flip-chip FBGA EP1AGX35 Flip-chip FBGA Flip-chip FBGA EP1AGX50 Flip-chip FBGA Flip-chip FBGA Flip-chip FBGA
Package
Pins
1152
Altera Corporation
Altera Device Package Information Data Sheet
Table Arria Devices FineLine Ball Grid Array (FBGA) Flip Chip Packages (Part Device
EP1AGX60 Flip-chip FBGA Flip-chip FBGA Flip-chip FBGA EP1AGX90 Flip-chip FBGA
Package
Pins
1152 1152
Table Stratix Devices FineLine Ball-Grid Array (FBGA) Flip Chip Packages Device
EP3SL50
Package
FBGA, Flip Chip FBGA, Flip Chip FBGA, Flip Chip FBGA, Flip Chip FBGA, Flip Chip FBGA, Flip Chip FBGA, Flip Chip FBGA, Flip Chip FBGA, Flip Chip FBGA, Flip Chip FBGA, Flip Chip FBGA, Flip Chip FBGA, Flip Chip FBGA, Flip Chip FBGA, Flip Chip FBGA, Flip Chip FBGA, Flip Chip FBGA, Flip Chip FBGA, Flip Chip FBGA, Flip Chip
Pins
1152 1152 1152 1517 1517 1760 1152 1152 1152 1517
EP3SL70
EP3SL110
EP3SL150
EP3SL200
EP3SL340
EP3SE50
EP3SE80
EP3SE110
EP3SE260
Altera Corporation
Altera Device Package Information Data Sheet
Table Stratix Devices Device
EP2S15
Package
FBGA, Flip Chip FBGA, Flip Chip
Pins
1,020 1,020 1,508 1,020 1,508 1,020 1,508
EP2S30
FBGA, Flip Chip FBGA, Flip Chip
EP2S60
FBGA, Flip Chip FBGA, Flip Chip FBGA, Flip Chip
EP2S90
FBGA, Flip Chip FBGA, Flip Chip FBGA, Flip Chip FBGA, Flip Chip
EP2S130
FBGA, Flip Chip FBGA, Flip Chip FBGA, Flip Chip
EP2S180
FBGA, Flip Chip FBGA, Flip Chip
Table Stratix Devices Device
EP2SGX30 EP2SGX60
Package
FBGA, Flip Chip FBGA, Flip Chip FBGA, Flip Chip
Pins
1152 1152 1508 1508
EP2SGX90
FBGA, Flip Chip FBGA, Flip Chip
EP2SGX130
FBGA, Flip Chip
Table Stratix Devices (Part Device
EP1SGX10C EP1SGX10D
Package
FBGA, Flip Chip FBGA, Flip Chip
Pins
Altera Corporation
Altera Device Package Information Data Sheet
Table Stratix Devices (Part Device
EP1SGX25C EP1SGX25D
Package
FBGA, Flip Chip FBGA, Flip Chip FBGA, Flip Chip
Pins
1,020 1,020 1,020 1,020
EP1SGX25F EP1SGX40D EP1SGX40G
FBGA, Flip Chip FBGA, Flip Chip FBGA, Flip Chip
Table Stratix Devices (Part Device
EP1S10
Package
FBGA, Flip Chip BGA, Wirebond FBGA, Wirebond (Option FBGA, Flip Chip
Pins
1,020 1,020 1,020 1,508 1,020 1,508
EP1S20
FBGA, Flip Chip BGA, Wirebond FBGA, Wirebond (Option FBGA, Flip Chip
EP1S25
BGA, Wirebond FBGA, Wirebond (Option FBGA, Flip Chip FBGA, Flip Chip
EP1S30
FBGA, Flip Chip BGA, Flip Chip FBGA, Flip Chip
EP1S40
BGA, Flip Chip FBGA, Flip Chip FBGA, Flip Chip FBGA, Flip Chip
EP1S60
BGA, Flip Chip FBGA, Flip Chip FBGA, Flip Chip
Altera Corporation
Altera Device Package Information Data Sheet
Table Stratix Devices (Part Device
EP1S80
Package
BGA, Flip Chip FBGA, Flip Chip FBGA, Flip Chip
Pins
1,020 1,508
Table Cyclone Device Package Options (Part Device
EP3C5
Package
Plastic Enhanced Quad Flat Pack (EQFP) Wire Bond FineLine Ball-Grid Array (FBGA) Option Wire Bond Ultra FineLine Ball-Grid Array (UBGA) Wire Bond
Pins
EP3C10
Plastic Enhanced Quad Flat Pack (EQFP) Wire Bond FineLine Ball-Grid Array (FBGA) Option Wire Bond Ultra FineLine Ball-Grid Array (UBGA) Wire Bond
EP3C16
Plastic Enhanced Quad Flat Pack (EQFP) Wire Bond Plastic Quad Flat Pack (PQFP) Wire Bond FineLine Ball-Grid Array (FBGA) Option Wire Bond Ultra FineLine Ball-Grid Array (UBGA) Wire Bond FineLine Ball-Grid Array (FBGA) Option Wire Bond Ultra FineLine Ball-Grid Array (UBGA) Wire Bond
EP3C25
Plastic Enhanced Quad Flat Pack (EQFP) Wire Bond Plastic Quad Flat Pack (PQFP) Wire Bond FineLine Ball-Grid Array (FBGA) Option Wire Bond Ultra FineLine Ball-Grid Array (UBGA) Wire Bond FineLine Ball-Grid Array (FBGA) Wire Bond
EP3C40
Plastic Quad Flat Pack (PQFP) Wire Bond FineLine Ball-Grid Array (FBGA) Wire Bond FineLine Ball-Grid Array (FBGA) Option Wire Bond Ultra FineLine Ball-Grid Array (UBGA) Wire Bond FineLine Ball-Grid Array (FBGA) Option Wire Bond
EP3C55
FineLine Ball-Grid Array (FBGA) Option Wire Bond Ultra FineLine Ball-Grid Array (UBGA) Wire Bond FineLine Ball-Grid Array (FBGA) Option Wire Bond
Altera Corporation
Altera Device Package Information Data Sheet
Table Cyclone Device Package Options (Part Device
EP3C80
Package
FineLine Ball-Grid Array (FBGA) Option Wire Bond Ultra FineLine Ball-Grid Array (UBGA) Wire Bond FineLine Ball-Grid Array (FBGA) Option Wire Bond
Pins
EP3C120 FineLine Ball-Grid Array (FBGA) Option Wire Bond FineLine Ball-Grid Array (FBGA) Option Wire Bond Note Table
E144 package exposed bottom package. This exposed ground that must connected ground plane your PCB. This exposed used electrical connectivity thermal purposes. package type entries with "Option refer instances where multiple package options exist given package type count. Option number identifies specific type used corresponding device density.
Table Cyclone Devices Device
EP2C5
Package
TQFP, Wirebond PQFP, Wirebond FBGA, Wirebond (Option
Pins
EP2C8
TQFP, Wirebond PQFP, Wirebond FBGA, Wirebond (Option
EP2C20
PQFP, Wirebond FBGA, Wirebond (Option FBGA, Wirebond (Option
EP2C35
FBGA, Wirebond (Option UBGA, Wirebond FBGA, Wirebond (Option
EP2C50
FBGA, Wirebond (Option UBGA, Wirebond FBGA, Wirebond (Option
EP2C70
FBGA, Wirebond (Option FBGA, Wirebond
Altera Corporation
Altera Device Package Information Data Sheet
Table Cyclone Devices Device
EP1C3
Package
TQFP, Wirebond TQFP, Wirebond
Pins
EP1C4
FBGA, Wirebond FiBGA, Wirebond
EP1C6
TQFP, Wirebond PQFP, Wirebond FBGA, Wirebond (Option
EP1C12
PQFP, Wirebond FBGA, Wirebond (Option FBGA, Wirebond
EP1C20
FBGA, Wirebond FBGA, Wirebond
Table Series Devices (Part Device Devices
EPM240 TQFP, Wirebond FBGA, Wirebond (Option MBGA, Wirebond EPM570 TQFP, Wirebond TQFP, Wirebond MBGA, Wirebond FBGA, Wirebond (Option FBGA, Wirebond (Option MBGA, Wirebond EPM1270 TQFP, Wirebond FBGA, Wirebond (Option MBGA, Wirebond EPM2210 FBGA, Wirebond (Option FBGA, Wirebond
Package
Pins
9000 Devices
EPM9320 BGA, Wirebond
Altera Corporation
Altera Device Package Information Data Sheet
Table Series Devices (Part Device
EPM9320A EPM9560
Package
BGA, Wirebond BGA, Wirebond
Pins
7000B Devices
EPM7032B PLCC, Wirebond PQFP, Wirebond TQFP, Wirebond UBGA, Wirebond EPM7064B TQFP, Wirebond UBGA, Wirebond FBGA, Wirebond TQFP, Wirebond EPM7128B UBGA, Wirebond TQFP, Wirebond FBGA, Wirebond TQFP, Wirebond UBGA, Wirebond FBGA, Wirebond (Option EPM7256B TQFP, Wirebond TQFP, Wirebond UBGA, Wirebond PQFP, Wirebond FBGA, Wirebond (Option EPM7512B TQFP, Wirebond UBGA, Wirebond PQFP, Wirebond FBGA, Wirebond (Option BGA, Wirebond (Option
7000AE Devices
EPM7032AE PLCC, Wirebond TQFP, Wirebond
Altera Corporation
Altera Device Package Information Data Sheet
Table Series Devices (Part Device
EPM7064AE
Package
PLCC, Wirebond TQFP, Wirebond TQFP, Wirebond UBGA, Wirebond FBGA, Wirebond FBGA, Wirebond (Option
Pins
EPM7128AE
PLCC, Wirebond TQFP, Wirebond FBGA, Wirebond UBGA, Wirebond TQFP, Wirebond FBGA, Wirebond (Option
EPM7256AE
TQFP, Wirebond FBGA, Wirebond TQFP, Wirebond PQFP, Wirebond FBGA, Wirebond (Option
EPM7512AE
TQFP, Wirebond PQFP, Wirebond BGA, Wirebond (Option FBGA, Wirebond (Option
7000A Devices
EPM7032A PLCC, Wirebond TQFP, Wirebond EPM7128A PLCC, Wirebond TQFP, Wirebond FBGA, Wirebond TQFP, Wirebond FBGA, Wirebond (Option EPM7256A TQFP, Wirebond TQFP, Wirebond PQFP, Wirebond FBGA, Wirebond (Option
Altera Corporation
Altera Device Package Information Data Sheet
Table HardCopy Series Devices Device
HC20K400 HC20K600
Package
BGA, Wirebond (Option BGA, Wirebond (Option Flip Chip FBGA
Pins
1020 1,020 1,020
HC220
Flip Chip FPGA Flip Chip FBGA
HC230 HC1S25
Flip Chip FPGA FBGA, Wirebond (Option BGA, Wirebond
HC1S30 HC1S40 HC1S60 HC1S80
Flip Chip FBGA Flip Chip FBGA Flip Chip FBGA Flip Chip FBGA
Table APEX Series Devices (Part Device APEX Devices
EP2A15 Flip Chip FBGA Flip Chip EP2A25 Flip Chip FBGA Flip Chip Flip Chip FBGA EP2A40 Flip Chip FBGA Flip Chip Flip Chip FBGA EP2A70 Flip Chip Flip Chip FBGA 1,020 1,020 1,508
Package
Pins
APEX 20KE Devices
EP20K30E TQFP, Wirebond FBGA, Wirebond PQFP, Wirebond FBGA, Wirebond
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Altera Device Package Information Data Sheet
Table APEX Series Devices (Part Device
EP20K60E
Package
TQFP, Wirebond FBGA, Wirebond PQFP, Wirebond PQFP, Wirebond FBGA, Wirebond BGA, Wirebond
Pins
1,020
EP20K100E
TQFP, Wirebond FBGA, Wirebond PQFP, Wirebond PQFP, Wirebond FBGA, Wirebond BGA, Wirebond
EP20K160E
TQFP, Wirebond PQFP, Wirebond PQFP, Wirebond BGA, Wirebond FBGA, Wirebond (Option
EP20K200E
PQFP, Wirebond PQFP, Wirebond BGA, Wirebond FBGA, Wirebond (Option BGA, Wirebond (Option FBGA, Wirebond (Option
EP20K300E
PQFP, Wirebond BGA, Wirebond (Option FBGA, Wirebond (Option
EP20K400E
BGA, Wirebond (Option Flip Chip FBGA
EP20K600E
BGA, Wirebond (Option Flip Chip FBGA Flip Chip FBGA
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Altera Device Package Information Data Sheet
Table APEX Series Devices (Part Device
EP20K1000E
Package
Flip Chip Flip Chip FBGA Flip Chip FBGA
Pins
1,020 1,020
EP20K1500E
Flip Chip Flip Chip FBGA
APEX 20KC Devices
EP20K200C PQFP, Wirebond PQFP, Wirebond BGA, Wirebond FBGA, Wirebond (Option EP20K400C BGA, Wirebond (Option Flip Chip FBGA EP20K600C BGA, Wirebond (Option Flip Chip FBGA Flip Chip FBGA EP20K1000C Flip Chip Flip Chip FBGA Flip Chip FBGA 1,020 1,020
APEX Devices
EP20K100 TQFP, Wirebond PQFP, Wirebond PQFP, Wirebond FBGA, Wirebond BGA, Wirebond EP20K160 PQFP, Wirebond TQFP, Wirebond EP20K200 PQFP, Wirebond PQFP, Wirebond BGA, Wirebond FBGA, Wirebond (Option EP20K300 FBGA, Wirebond (Option
Altera Corporation
Altera Device Package Information Data Sheet
Table APEX Series Devices (Part Device
EP20K400
Package
BGA, Wirebond (Option PGA, Wirebond Flip Chip FBGA
Pins
Table ACEX Devices Device
EP1K10
Package
TQFP, Wirebond TQFP, Wirebond PQFP, Wirebond FBGA, Wirebond (Option
Pins
EP1K30
TQFP, Wirebond PQFP, Wirebond FBGA, Wirebond (Option
EP1K50
TQFP, Wirebond PQFP, Wirebond FBGA, Wirebond (Option FBGA, Wirebond (Option
EP1K100
PQFP, Wirebond FBGA, Wirebond (Option FBGA, Wirebond (Option
Table Mercury Devices Device
EP1M120 EP1M350
Package
Flip Chip FBGA Flip Chip FBGA
Pins
Table FLEX Series Devices (Part Device FLEX 10KA Devices Package Pins
Altera Corporation
Altera Device Package Information Data Sheet
Table FLEX Series Devices (Part Device
EPF10K10A
Package
TQFP, Wirebond TQFP, Wirebond PQFP, Wirebond FBGA, Wirebond (Option
Pins
EPF10K30A
TQFP, Wirebond PQFP, Wirebond PQFP, Wirebond FBGA, Wirebond (Option BGA, Wirebond FBGA, Wirebond (Option
EPF10K100A
RQFP, Wirebond BGA, Wirebond FBGA, Wirebond (Option BGA, Wirebond
EPF10K250A
PGA, Wirebond BGA, Wirebond
FLEX 10KS Devices
EPF10K50S TQFP, Wirebond PQFP, Wirebond PQFP, Wirebond FBGA, Wirebond (Option BGA, Wirebond FBGA, Wirebond (Option EPF10K200S RQFP, Wirebond BGA, Wirebond FBGA, Wirebond (Option BGA, Wirebond FBGA, Wirebond (Option
FLEX 10KE Devices
EPF10K30E TQFP, Wirebond PQFP, Wirebond FBGA, Wirebond (Option FBGA, Wirebond (Option
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Altera Device Package Information Data Sheet
Table FLEX Series Devices (Part Device
EPF10K50E
Package
TQFP, Wirebond PQFP, Wirebond PQFP, Wirebond FBGA, Wirebond (Option BGA, Wirebond FBGA, Wirebond (Option
Pins
EPF10K100E
PQFP, Wirebond PQFP, Wirebond FBGA, Wirebond (Option BGA, Wirebond FBGA, Wirebond (Option
EPF10K130E
PQFP, Wirebond BGA, Wirebond FBGA, Wirebond (Option BGA, Wirebond FBGA, Wirebond (Option
EPF10K200E
PGA, Wirebond BGA, Wirebond FBGA, Wirebond (Option
EPF10K10
PLCC, Wirebond TQFP, Wirebond PQFP, Wirebond
EPF10K20
TQFP, Wirebond RQFP, Wirebond RQFP, Wirebond
EPF10K30
RQFP, Wirebond RQFP, Wirebond BGA, Wirebond
EPF10K40
RQFP, Wirebond RQFP, Wirebond
EPF10K50
RQFP, Wirebond BGA, Wirebond PGA, Wirebond
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Altera Device Package Information Data Sheet
Table FLEX Series Devices (Part Device
EPF10K50V
Package
RQFP, Wirebond PQFP, Wirebond BGA, Wirebond FBGA, Wirebond
Pins
EPF10K70
RQFP, Wirebond PGA, Wirebond
EPF10K100 EPF10K130V
PGA, Wirebond PGA, Wirebond BGA, Wirebond
EPF6010A
TQFP, Wirebond TQFP, Wirebond PQFP, Wirebond
EPF6016
TQFP, Wirebond PQFP, Wirebond PQFP, Wirebond BGA, Wirebond (Option
EPF6016A
TQFP, Wirebond FBGA, Wirebond TQFP, Wirebond PQFP, Wirebond FBGA, Wirebond (Option
EPF6024A
TQFP, Wirebond PQFP, Wirebond PQFP, Wirebond BGA, Wirebond (Option FBGA, Wirebond (Option
EPF8282A
PLCC, Wirebond TQFP, Wirebond
EPF8452A
TQFP, Wirebond PQFP, Wirebond
Altera Corporation
Altera Device Package Information Data Sheet
Table Excalibur Devices Device
EPXA1
Package
FBGA, Wirebond (Option Flip Chip FBGA
Pins
1,020 1,020
EPXA4
Flip Chip FBGA Flip Chip FBGA
EPXA10
Flip Chip FBGA
Table Enhanced Configuration Devices Device
EPC1
Package
PDIP, Wirebond PLCC, Wirebond
Pins
EPC2
PLCC, Wirebond TQFP, Wirebond
EPC4
PLCC, Wirebond TQFP, Wirebond PQFP, Wirebond FPGA, Wirebond
EPC8 EPC16
PQFP, Wirebond (Option UBGA, Wirebond PQFP, Wirebond (Option
EPC32 EPC1441
FPGA, Wirebond PDIP, Wirebond PLCC, Wirebond TQFP, Wirebond
Altera Corporation
Altera Device Package Information Data Sheet
Thermal Resistance
Tables through provide (junction-to-ambient thermal resistance) (junction-to-case thermal resistance) values following Altera device families:
Arria Stratix series FPGAs Cyclone series FPGAs series CPLDs HardCopy series Structured ASICs APEX series FPGAs ACEX FPGAs Mercury FPGAs FLEX series FPGAs Excalibur FPGA Classic devices
Altera transitioning industry-standard copper thermally enhanced thermally enhanced Flip Chip FBGA package offerings mentioned Process Change Notice PCN024 available Altera's website: This change affects APEX 20KE, APEX 20KC, APEX Mercury, Excalibur device families. Therefore, thermal resistance specifications provided devices affected this change. older packages identified using aluminum silicon carbide (AlSiC) lid, while newer packages identified using copper (Cu) lid. Thermally enhanced thermally enhanced Flip Chip FBGA packages offered newer Altera families, including Stratix Stratix were introduced using industry-standard lid. Therefore, these device specifications include only single thermal resistance specification.
Table Thermal Resistance Arria Devices (Part Count
EP1AGX35
Device
Package
C/W) Still
12.8 11.1 12.8 11.1
C/W) C/W) ft./min. ft./min.
10.3 10.3
C/W) ft./min.
C/W)
0.24 0.24
C/W)
3.14 3.14 3.14 3.14
EP1AGX20
FBGA FBGA FBGA FBGA
Altera Corporation
Altera Device Package Information Data Sheet
Table Thermal Resistance Arria Devices (Part Count
1152 EP1AGX60 1152 EP1AGX90 1152
Device
Package
C/W) Still
12.7 10.9 12.7 10.9
C/W) C/W) ft./min. ft./min.
10.2 10.2
C/W) ft./min.
C/W)
0.15 0.15 0.15 0.15 0.11
C/W)
2.86 2.84 2.86 2.84 2.33
EP1AGX50
FBGA FBGA FBGA FBGA FBGA FBGA FBGA
Table Thermal Resistance Stratix Devices (Part Device (°C/W) Package Count Still
1152 1152 1152 1517 1517 1760 1152 FBGA FBGA FBGA FBGA FBGA FBGA FBGA FBGA FBGA FBGA FBGA FBGA FBGA FBGA FBGA FBGA 12.6 11.1 12.6 11.1 10.8 10.8 12.6 11.1 10.8
(°C/W) (°C/W) (°C/W) (°C/W) (°C/W) ft./min. ft./min. ft./min.
10.0 10.0 10.0 0.27 0.27 0.27 0.27 0.16 0.16 0.16 0.16 0.12 0.12 0.27 0.27 0.16 0.16 2.72 2.34 2.72 2.34 1.99 1.81 1.99 1.81 1.68 1.67 1.48 1.21 2.72 2.34 1.99 1.81
EP3SL50
EP3SL70
EP3SL110
EP3SL150
EP3SL200
EP3SL340
EP3SE50
EP3SE80
Altera Corporation
Altera Device Package Information Data Sheet
Table Thermal Resistance Stratix Devices (Part Device (°C/W) Package Count Still
1152 1152 1517 FBGA FBGA FBGA FBGA 10.8
(°C/W) (°C/W) (°C/W) (°C/W) (°C/W) ft./min. ft./min. ft./min.
0.16 0.16 0.10 0.10 1.99 1.81 1.56 1.56
EP3SE110
EP3SE260
Table Thermal Resistance Stratix Devices Device
EP2S15
Count
Package
Flip Chip FBGA Flip Chip FBGA Flip Chip FBGA Flip Chip FBGA Flip Chip FBGA Flip Chip FBGA Flip Chip FBGA Flip Chip HBGA Flip Chip FBGA Flip Chip FBGA Flip Chip FBGA Flip Chip FBGA Flip Chip FBGA Flip Chip FBGA Flip Chip FBGA Flip Chip FBGA
C/W)
0.36 0.36 0.21 0.21 0.13 0.13 0.13 0.07 0.09 0.10 0.10 0.07 0.07 0.07 0.05 0.05
C/W) Still
13.1 12.2 12.6 11.7 12.3 11.4 10.4 12.0 10.80 10.2 10.1
C/W) ft./min.
11.1 10.2 10.6 10.3
C/W) ft./min.
C/W) ft./min.
EP2S30
EP2S60
1,020
EP2S90
1,020 1,508
EP2S130
1,020 1,508
EP2S180
1,020 1,508
Altera Corporation
Altera Device Package Information Data Sheet
Table Thermal Resistance Stratix Devices Device
EP2SGX30 EP2SGX60
Count
1152
Package
Flip Chip FBGA Flip Chip FBGA Flip Chip FBGA Flip Chip FBGA Flip Chip FBGA Flip Chip FBGA
C/W)
0.24 0.15 0.15 0.11 0.11
C/W) Still
11.1 10.9
C/W) ft./min.
C/W) ft./min.
C/W) ft./min.
EP2SGX90
1152 1508
EP2SGX130
1508
Table Thermal Resistance Stratix Devices Device
EP1SGX10C EP1SGX10D EP1SGX25C EP1SGX25D EP1SGX25D EP1SGX25F EP1SGX40D EP1SGX40G
Count
1020 1020
Package
Flip Chip FBGA Flip Chip FBGA Flip Chip FBGA Flip Chip FBGA
C/W)
0.39 0.23 0.23 0.16
C/W) Still
11.1 10.8
C/W) ft./min.
C/W) ft./min.
C/W) ft./min.
Table Thermal Resistance Stratix Devices (Part
Device
EP1S10
Count
Package
Flip Chip FBGA FBGA Flip Chip FBGA Flip Chip FBGA FBGA Flip Chip FBGA
C/W)
0.38 0.43 0.30 0.31
C/W) Still
11.9 16.8 17.2 10.9 11.8 15.5 10.7
C/W) ft./min.
13.7 12.4 12.8
C/W) ft./min.
11.9 12.2 10.7
C/W) ft./min.
10.5 10.8
EP1S20
Altera Corporation
Altera Device Package Information Data Sheet
Table Thermal Resistance Stratix Devices (Part
EP1S25 1020 EP1S30 1020 EP1S40 1020 1508 EP1S60 1020 1508 EP1S80 1020 1508 FBGA Flip Chip FBGA Flip Chip FBGA Flip Chip FBGA Flip Chip Flip Chip FBGA Flip Chip FBGA Flip Chip Flip Chip FBGA Flip Chip FBGA Flip Chip Flip Chip FBGA Flip Chip FBGA Flip Chip Flip Chip FBGA Flip Chip FBGA 0.25 0.25 0.17 0.18 0.17 0.18 0.13 0.13 0.13 14.8 15.3 10.5 10.0 10.4 10.4 11.7 10.0 10.4
Table Thermal Resistance Cyclone Devices (Part Device
EP3C5 EP3C5 EP3C5 EP3C10 EP3C10 EP3C10 EP3C16 EP3C16 EP3C16 EP3C16 EP3C16
Package
E144 F256 U256 E144 F256 U256 E144 Q240 F256 U256 U484
(C/W) Still
32.4 32.5 32.4 32.5 27.2 28.5 28.8 26.9
(C/W) (C/W) (C/W) ft./min. ft./min. ft./min.
17.5 28.9 29.1 17.5 28.9 29.1 17.5 24.7 25.1 25.4 23.5 15.4 27.2 15.4 27.2 15.4 22.1 23.2 23.5 21.6 25.5 25.6 25.5 25.6 17.8 21.7 20.1
(C/W)
11.7 12.2 11.7 12.2
Altera Corporation
Altera Device Package Information Data Sheet
Table Thermal Resistance Cyclone Devices (Part Device
EP3C16 EP3C25 EP3C25 EP3C25 EP3C25 EP3C25 EP3C40 EP3C40 EP3C40 EP3C40 EP3C40 EP3C55 EP3C55 EP3C55 EP3C80 EP3C80 EP3C80 EP3C120 EP3C120
Package
F484 E144 Q240 F256 U256 F324 Q240 F324 U484 F484 F780 U484 F484 F780 U484 F484 F780 F484 F780
(C/W) Still
22.9 27.5 27.9 26.6 25.8 23.2 22.8 19.8 18.7 21.6 18.9 17.8 20.4 16.9 17.1
(C/W) (C/W) (C/W) ft./min. ft./min. ft./min.
19.4 27.5 24.5 24.1 24.5 23.1 23.2 19.7 19.3 16.3 15.2 18.2 15.4 14.4 16.9 14.5 13.5 13.7 12.6 17.7 26.3 21.8 22.2 22.6 21.3 20.6 17.6 14.6 13.5 16.4 13.8 12.7 15.2 12.9 11.8 16.2 24.4 17.6 20.7 21.1 19.8 16.5 16.1 13.2 12.2 12.2 11.4 13.8 11.5 10.5 10.7
(C/W)
Table Thermal Resistance Cyclone Devices (Part Device
EP2C5
Count
Package
TQFP PQFP FBGA TQFP PQFP FBGA
C/W)
C/W) Still
30.4 30.2 29.8 30.2
C/W) ft./min.
29.3 29.2 26.1 28.3 28.8
C/W) ft./min.
27.9 27.3 23.6 26.9 26.9 20.5
C/W) ft./min.
25.5 22.3 21.7 24.9 21.7 18.5
EP2C8
Altera Corporation
Altera Device Package Information Data Sheet
Table Thermal Resistance Cyclone Devices (Part Device
EP2C20
Count
Package
PQFP FBGA FBGA FBGA UBGA FBGA FBGA UBGA FBGA FBGA FBGA
C/W)
C/W) Still
26.6 24.2 19.4 20.6 18.6 18.4 19.6 17.7 16.9 16.3
C/W) ft./min.
15.4 16.6 14.6 14.4 15.6 13.7 11.9
C/W) ft./min.
21.4 17.8 14.8 13.3 14.5 12.6 12.4 13.6 11.8 11.1 10.5
C/W) ft./min.
17.4 13.1 11.7 12.8 11.1 10.9 11.9 10.2
EP2C35
EP2C50
EP2C70
Table Thermal Resistance Cyclone Devices
Device
EP1C3
Count
Package
TQFP TQFP TQFP PQFP FBGA PQFP FBGA FBGA FBGA FBGA
C/W)
11.0 10.0
C/W) Still
37.5 31.1 29.4 27.2 28.7 26.0 24.3 23.0 21.0 20.7
C/W) ft./min.
35.4 29.4 28.0 24.7 24.5 23.4 20.2 19.8 17.7 17.5
C/W) ft./min.
33.4 27.9 26.7 22.1 22.3 20.8 18.1 17.7 15.6 15.5
C/W) ft./min.
29.8 25.5 24.7 17.8 20.5 17.1 16.4 16.1 14.1 13.9
EP1C6
EP1C12
EP1C20
Altera Corporation
Altera Device Package Information Data Sheet
Table Thermal Resistance Devices Device
EPM240
Count
Package
TQFP MBGA FBGA TQFP MBGA FBGA TQFP FBGA MBGA TQFP FBGA MBGA FBGA FBGA
C/W)
12.0 32.1 20.8 11.2 25.0 14.8 10.5 13.0 12.9 10.5 10.4 10.6
C/W) Still
39.5 53.8 51.2 38.7 46.5 42.8 32.1 37.4 39.5 31.4 33.5 36.1 30.2 29.8
C/W) ft./min.
37.5 47.7 45.2 36.6 40.4 36.8 30.3 33.1 33.6 29.7 29.3 30.2 26.1 25.7
C/W) ft./min.
35.5 45.7 43.2 34.6 38.4 34.9 28.7 30.5 31.6 28.2 26.8 28.3 23.6 23.3
C/W) ft./min.
31.6 44.0 41.5 30.8 36.8 33.3 26.1 28.4 30.1 25.8 24.7 26.8 21.7 21.3
EPM570
EPM1270
EPM2210
Table Thermal Resistance 9000 Devices (Part Device
EPM9320
Count
Package
PLCC RQFP PLCC RQFP PLCC RQFP RQFP RQFP RQFP
C/W)
C/W) Still
29.0 17.0 14.0 14.0 29.0 17.0 12.0 29.0 17.0 14.0 17.0 12.0
C/W) ft./min.
27.0 16.0 10.0 12.0 27.0 16.0 11.0 27.0 16.0 12.0 16.0 11.0
C/W) ft./min.
25.0 15.0 11.0 26.0 15.0 10.0 25.0 15.0 11.0 15.0 10.0
C/W) ft./min.
23.0 13.0 10.0 23.0 13.0 23.0 13.0 10.0 12.0
EPM9320A
EPM9400
EPM9480
Altera Corporation
Altera Device Package Information Data Sheet
Table Thermal Resistance 9000 Devices (Part Device
EPM9560
Count
Package
RQFP RQFP RQFP RQFP RQFP
C/W)
C/W) Still
17.0 12.0 14.0 12.0 12.0 17.0 11.0 12.0
C/W) ft./min.
16.0 11.0 10.0 11.0 11.0 16.0 10.0 11.0
C/W) ft./min.
15.0 10.0 10.0 10.0 15.0 10.0
C/W) ft./min.
12.0 12.0
EPM9560A
Table Thermal Resistance 7000 Devices (Part Device
EPM7032
Count
Package
PLCC PQFP TQFP
C/W)
10.0 15.0 14.0 10.0 14.0 23.0 10.0 14.0 14.0 14.0 14.0 11.0
C/W) Still
33.0 48.0 46.0 33.0 46.0 69.0 33.0 46.0 31.0 45.0 31.0 46.0 31.0 46.0 28.0 39.0
C/W) ft./min.
31.0 46.0 44.0 31.0 44.0 67.0 31.0 44.0 30.0 44.0 30.0 45.0 30.0 44.0 26.0 37.0
C/W) ft./min.
30.0 45.0 43.0 30.0 43.0 66.0 30.0 43.0 28.0 42.0 28.0 43.0 28.0 43.0 25.0 35.0
C/W) ft./min.
27.0 42.0 40.0 27.0 40.0 62.0 27.0 40.0 25.0 39.0 25.0 40.0 25.0 40.0 23.0 32.0
EPM7032B
PLCC TQFP
EPM7032S
UBGA PLCC TQFP
EPM7032V
PLCC TQFP
EPM7032AE
PLCC TQFP
EPM7064S
PLCC TQFP
PLCC TQFP
Altera Corporation
Altera Device Package Information Data Sheet
Table Thermal Resistance 7000 Devices (Part Device
EPM7064
Count
Package
PLCC TQFP
C/W)
13.0 14.0 23.0 12.0 21.0 11.0 18.0 12.0 22.0 11.0 19.0 16.0 13.0 10.0 10.0 12.0 10.0
C/W) Still
31.0 44.0 29.0 28.0 33.0 31.0 46.0 56.0 39.0 49.0 29.0 28.0 32.0 28.0 37.0 44.0 31.0 38.0 53.0 38.0 46.0 32.0 44.0 40.0 29.0 32.0 32.0 30.0 38.0 35.0 33.0
C/W) ft./min.
30.0 43.0 28.0 26.0 32.0 30.0 45.0 53.0 37.0 47.0 27.0 26.0 31.0 26.0 35.0 42.0 29.0 36.0 50.0 36.0 44.0 30.0 42.0 38.0 28.0 31.0 31.0 28.0 36.0 34.0 32.0
C/W) ft./min.
28.0 41.0 26.0 25.0 31.0 28.0 43.0 51.0 35.0 44.0 26.0 24.0 30.0 25.0 33.0 39.0 28.0 34.0 48.0 34.0 41.0 29.0 39.0 36.0 26.0 30.0 30.0 26.0 34.0 33.0 31.0
C/W) ft./min.
25.0 38.0 23.0 22.0 30.0 25.0 40.0 47.0 31.0 40.0 23.0 22.0 29.0 22.0 30.0 35.0 25.0 31.0 44.0 31.0 37.0 26.0 35.0 33.0 23.0 29.0 28.0 23.0 30.0 32.0 30.0
EPM7064AE EPM7064B
PLCC PLCC PQFP PLCC TQFP
UBGA TQFP FBGA
EPM7096
PLCC PLCC PQFP PLCC TQFP FBGA
EPM7128A
EPM7128B
TQFP FBGA UBGA TQFP FBGA
EPM7128E EPM7128S
TQFP UBGA FBGA PLCC PQFP PQFP PLCC TQFP PQFP
PQFP
Altera Corporation
Altera Device Package Information Data Sheet
Table Thermal Resistance 7000 Devices (Part Device
EPM7128AE
Count
Package
PLCC TQFP FBGA
C/W)
11.0 12.0 14.0 11.0 14.0 12.0 10.0 10.0 12.0 12.0 12.0 13.0
C/W) Still
30.0 38.0 43.0 33.0 42.0 39.0 29.0 32.0 33.0 35.0 37.0 33.0 32.0 20.0 32.0 36.0 32.0 30.0 34.0 37.0 33.0 40.0 31.0 34.0 20.0 31.0 17.0 30.0 18.0
C/W) ft./min.
28.0 36.0 40.0 30.0 40.0 37.0 28.0 31.0 32.0 28.0 35.0 32.0 31.0 13.0 31.0 34.0 27.0 28.0 32.0 35.0 29.0 38.0 29.0 32.0 13.0 30.0 16.0 29.0 17.0
C/W) ft./min.
26.0 34.0 38.0 28.0 38.0 35.0 26.0 30.0 31.0 26.0 33.0 31.0 30.0 10.0 30.0 32.0 25.0 26.0 29.0 33.0 27.0 36.0 27.0 30.0 10.0 29.0 15.0 26.0 16.0
C/W) ft./min.
23.0 30.0 37.0 26.0 36.0 31.0 23.0 29.0 30.0 23.0 30.0 30.0 29.0 26.0 30.0 24.0 21.0 28.0 30.0 25.0 34.0 22.0 28.0 25.0 13.0 21.0 15.0
EPM7160E EPM7160S EPM7192S EPM7192E
TQFP UBGA FBGA PLCC PQFP PQFP PLCC TQFP PQFP PQFP PQFP
EPM7256A
TQFP TQFP PQFP FBGA TQFP TQFP UBGA PQFP FBGA PQFP RQFP PQFP RQFP
EPM7256B
EPM7256E
EPM7256S
Altera Corporation
Altera Device Package Information Data Sheet
Table Thermal Resistance 7000 Devices (Part Device
EPM7256AE
Count
Package
FBGA TQFP TQFP PQFP FBGA TQFP PQFP FBGA
C/W)
13.0 12.0 10.0 11.0 10.0 12.0 11.0
C/W) Still
42.0 37.0 33.0 31.0 34.0 32.0 30.0 14.0 32.0 32.0 35.0 30.0 14.0 32.0
C/W) ft./min.
39.0 35.0 29.0 29.0 32.0 27.0 28.0 12.0 30.0 27.0 33.0 28.0 12.0 30.0
C/W) ft./min.
37.0 33.0 27.0 27.0 30.0 25.0 25.0 11.0 28.0 25.0 31.0 25.0 11.0 28.0
C/W) ft./min.
36.0 30.0 25.0 22.0 28.0 23.0 21.0 10.0 22.0 24.0 30.0 21.0 10.0 27.0
EPM7512AE
EPM7512B
TQFP UBGA PQFP FBGA
Table Thermal Resistance 3000A Devices
Device
EPM3032A
Count
Package
TQFP PLCC
C/W)
14.0 14.0 12.0 12.0 11.0 11.0
C/W) Still
46.0 31.0 46.0 31.0 39.0 38.0 33.0 33.0 31.0 30.0 32.0
C/W) ft./min.
45.0 30.0 45.0 30.0 37.0 36.0 30.0 29.0 29.0 28.0 30.0
C/W) ft./min.
43.0 28.0 43.0 28.0 35.0 34.0 28.0 27.0 27.0 25.0 28.0
C/W) ft./min.
40.0 25.0 40.0 25.0 31.0 30.0 26.0 25.0 22.0 21.0 22.0
EPM3064A
TQFP PLCC
EPM3128A EPM3256A EPM3512A
TQFP TQFP TQFP TQFP PQFP PQFP FBGA
Altera Corporation
Altera Device Package Information Data Sheet
Table Thermal Resistance HardCopy Series Devices
Device
HC210
Count
Package
Flip Chip FBGA FBGA Flip Chip FBGA Flip Chip FBGA Flip Chip FBGA Flip Chip FBGA Flip Chip FBGA Flip Chip FBGA FBGA
C/W)
0.96 0.43 0.43 0.291 0.291
C/W) Still
13.4 24.2 12.1 11.7 10.8 10.6 13.0 19.7 19.3 10.9 10.9 12.22 12.22
C/W) ft./min.
11.2 20.3 10.2 15.8 15.6 8.54 8.54
C/W) ft./min.
18.3 13.9 13.8 7.02 7.02
C/W) ft./min.
16.6 12.4 12.3 5.82 5.82
HC220
HC230 HC240
1020 1020 1508
HC20K400 HC20K600 HC1S25
HC1S30 HC1S40 HC1S60 HC1S80
1020 1020
Flip Chip FBGA Flip Chip FBGA Flip Chip FBGA Flip Chip FBGA
Table Thermal Resistance APEX Devices (Part
Device
EP2A15
Count
Package
Flip Chip FBGA lid) Flip Chip FBGA (AlSiC lid)
C/W)
0.22 0.34 0.23 0.35 0.17 0.26 0.17 0.27 0.17 0.27
C/W) C/W) C/W) C/W) Still ft./min. ft./min. ft./min.
10.8 11.6 10.0 10.7 11.5 10.0 10.4
Flip Chip lid) Flip Chip (AlSiC lid)
EP2A25
FBGA lid) Flip Chip FBGA (AlSiC lid)
Flip Chip lid) Flip Chip (AlSiC lid)
1020
Flip Chip FBGA lid) Flip Chip FBGA (AlSiC lid)
Altera Corporation
Altera Device Package Information Data Sheet
Table Thermal Resistance APEX Devices (Part
Device
EP2A40
Count
Package
Flip Chip FBGA lid) Flip Chip FBGA (AlSiC lid)
C/W)
0.24 0.15 0.19 0.15 0.19 0.10 0.14 0.10 0.14
C/W) C/W) C/W) C/W) Still ft./min. ft./min. ft./min.
10.0 10.0 10.0
Flip Chip lid) Flip Chip (AlSiC lid)
1,020
Flip Chip FBGA lid) Flip Chip FBGA (AlSiC lid)
EP2A70
Flip Chip lid) Flip Chip (AlSiC lid)
1,508
Flip Chip FBGA lid) Flip Chip FBGA (AlSiC lid)
Table Thermal Resistance APEX APEX 20KE Devices (Part
Device
EP20K30E
Count
Package
TQFP PQFP FBGA FBGA TQFP FBGA PQFP PQFP FBGA TQFP PQFP PQFP FBGA
C/W)
14.0 11.0
C/W) Still
29.0 30.0 36.0 31.0 28.0 33.0 30.0 26.0 29.0 12.0 26.0 29.0 25.0 28.0 12.0
C/W) ft./min.
28.0 29.0 34.0 29.0 26.0 32.0 28.0 24.0 28.0 11.0 25.0 27.0 23.0 26.0 11.0
C/W) C/W) ft./min. ft./min.
26.0 27.0 32.0 28.0 25.0 30.0 26.0 21.0 26.0 10.0 24.0 25.0 20.0 25.0 10.0 25.0 22.0 29.0 25.0 24.0 27.0 21.0 17.0 24.0 23.0 20.0 17.0 23.0
EP20K60E
EP20K100
Altera Corporation
Altera Device Package Information Data Sheet
Table Thermal Resistance APEX APEX 20KE Devices (Part
Device
EP20K100E
Count
Package
TQFP FBGA PQFP PQFP FBGA TQFP PQFP PQFP FBGA PQFP PQFP FBGA PQFP PQFP FBGA FBGA PQFP PQFP FBGA PQFP FBGA FBGA FBGA
C/W)
0.36
C/W) Still
26.0 32.0 29.0 25.0 28.0 12.0 25.0 28.0 24.0 12.0 24.0 25.0 21.0 12.0 22.0 25.0 22.0 12.0 23.0 12.0 21.0 25.0 22.0 12.0 23.0 19.0 12.0 20.0 11.6
C/W) ft./min.
25.0 30.0 27.0 23.0 26.0 11.0 24.0 26.0 21.0 11.0 23.0 23.0 19.0 11.0 21.0 23.0 19.0 11.0 22.0 11.0 20.0 23.0 19.0 11.0 22.0 18.0 11.0 19.0
C/W) C/W) ft./min. ft./min.
24.0 29.0 25.0 20.0 25.0 10.0 23.0 23.0 19.0 10.0 22.0 20.0 17.0 10.0 20.0 20.0 18.0 10.0 21.0 10.0 19.0 20.0 18.0 10.0 21.0 16.0 10.0 18.0 23.0 26.0 20.0 17.0 23.0 22.0 19.0 16.0 21.0 17.0 15.0 19.0 17.0 16.0 20.0 18.0 17.0 16.0 20.0 15.0 17.0
EP20K160E
EP20K200
EP20K200E
EP20K200C
EP20K300E
EP20K400
Altera Corporation
Altera Device Package Information Data Sheet
Table Thermal Resistance APEX APEX 20KE Devices (Part
Device
EP20K400E EP20K400C
Count
Package
FBGA lid) FBGA (AlSiC lid)
C/W)
0.25 0.38 0.18 0.28 0.19 0.29 0.12 0.12 0.12 0.19 0.10 0.15 0.10 0.15
C/W) Still
10.9 11.7 10.8 11.6 10.4 10.6 11.4 10.2 10.1
C/W) ft./min.
C/W) C/W) ft./min. ft./min.
EP20K600E EP20K600C
FBGA FBGA lid) FBGA (AlSiC lid)
1,020
FBGA FBGA lid) FBGA (AlSiC lid)
1,020 EP20K1000E EP20K1000C
FBGA lid) (AlSiC lid)
FBGA FBGA lid) FBGA (AlSiC lid)
1,020
FBGA FBGA lid) FBGA (AlSiC lid)
1,020 EP20K1500E
FBGA lid) (AlSiC lid)
1,020
FBGA FBGA FBGA lid) FBGA (AlSiC lid)
1,020 Note Table
FBGA
"fin" extra heat sink that customers device. Several vendors make heat sinks, they have different sizes. Altera performed thermal calculations Table using following specifications: width: 0.25 height: pitch: base thickness:
Altera Corporation
Altera Device Package Information Data Sheet
Table Thermal Resistance ACEX Devices
Device
EP1K10
Count
Package
TQFP TQFP PQFP FBGA TQFP PQFP FBGA TQFP PQFP FBGA FBGA PQFP FBGA FBGA
C/W)
11.0 12.0
C/W) Still
37.0 31.0 30.0 37.0 28.0 30.0 31.0 26.0 29.0 30.0 25.0 28.0 28.0 24.0
C/W) ft./min.
35.0 29.0 29.0 35.0 27.0 28.0 29.0 25.0 28.0 28.0 24.0 26.0 26.0 23.0
C/W) ft./min.
33.0 28.0 27.0 33.0 26.0 26.0 28.0 24.0 25.0 27.0 23.0 23.0 25.0 22.0
C/W) ft./min.
29.0 25.0 22.0 30.0 24.0 21.0 25.0 23.0 20.0 24.0 22.0 18.0 23.0 21.0
EP1K30
EP1K50
EP1K100
Table Thermal Resistance Mercury Devices
Device
EP1M120
Count
Package
FBGA lid) FBGA (AlSiC lid) FBGA lid) FBGA (AlSiC lid)
C/W)
0.58 0.87 0.22 0.34
C/W) Still
12.2 13.0 10.5 11.0
C/W) ft./min.
10.1 11.1
C/W) ft./min.
C/W) ft./min.
EP1M350
Table Thermal Resistance FLEX Devices (Part
Device
EPF10K10
Count
Package
PLCC TQFP PQFP
C/W)
C/W) Still
28.0 26.0 29.0
C/W) ft./min.
26.0 25.0 27.0
C/W) ft./min.
24.0 24.0 25.0
C/W) ft./min.
22.0 23.0 20.0
Altera Corporation
Altera Device Package Information Data Sheet
Table Thermal Resistance FLEX Devices (Part
Device
EPF10K10A
Count
Package
TQFP TQFP PQFP FBGA TQFP RQFP RQFP RQFP RQFP TQFP PQFP PQFP FBGA FBGA TQFP PQFP FBGA FBGA RQFP RQFP RQFP
C/W)
10.0
C/W) Still
35.0 29.0 30.0 33.0 24.0 17.0 14.0 17.0 13.0 12.0 25.0 29.0 25.0 28.0 12.0 24.0 28.0 30.0 31.0 26.0 17.0 13.0 12.0 12.0 12.0 10.0 25.0 13.0 12.0 23.0
C/W) ft./min.
33.0 28.0 29.0 30.0 23.0 16.0 12.0 16.0 12.0 11.0 24.0 27.0 22.0 26.0 11.0 22.0 27.0 28.0 29.0 25.0 16.0 12.0 11.0 11.0 10.0 22.0 12.0 11.0 22.0
C/W) ft./min.
31.0 26.0 27.0 28.0 22.0 15.0 11.0 15.0 11.0 10.0 23.0 24.0 20.0 24.0 10.0 21.0 26.0 26.0 28.0 24.0 15.0 11.0 10.0 10.0 20.0 11.0 10.0 21.0
C/W) ft./min.
28.0 25.0 21.0 26.0 21.0 13.0 10.0 12.0 10.0 22.0 19.0 17.0 23.0 20.0 24.0 21.0 25.0 22.0 12.0 10.0 17.0 10.0 20.0
EPF10K20
EPF10K30
EPF10K30A
EPF10K30E
EPF10K40
EPF10K50
EPF10K50V
PQFP RQFP FBGA
Altera Corporation
Altera Device Package Information Data Sheet
Table Thermal Resistance FLEX Devices (Part
Device
EPF10K50E
Count
Package
TQFP PQFP PQFP FBGA FBGA TQFP PQFP PQFP FBGA FBGA RQFP
C/W)
C/W) Still
26.0 29.0 25.0 29.0 25.0 26.0 29.0 26.0 30.0 12.0 25.0 12.0 13.0 12.0 22.0 10.0 28.0 23.0 28.0 12.0 24.0 10.0 21.0 12.0 23.0 10.0 21.0
C/W) ft./min.
25.0 27.0 22.0 27.0 24.0 25.0 28.0 23.0 28.0 11.0 24.0 11.0 11.0 11.0 21.0 26.0 21.0 26.0 11.0 23.0 19.0 11.0 22.0 20.0
C/W) ft./min.
24.0 24.0 20.0 26.0 23.0 24.0 25.0 20.0 27.0 10.0 23.0 10.0 10.0 10.0 20.0 23.0 19.0 25.0 10.0 22.0 17.0 10.0 21.0 19.0
C/W) ft./min.
23.0 19.0 17.0 24.0 21.0 23.0 20.0 17.0 24.0 22.0 18.0 18.0 16.0 23.0 21.0 15.0 20.0 18.0
EPF10K50S
EPF10K70
EPF10K100
EPF10K100A
RQFP FBGA PQFP PQFP FBGA FBGA PQFP FBGA FBGA
EPF10K100E
EPF10K130V
EPF10K130E
Altera Corporation
Altera Device Package Information Data Sheet
Table Thermal Resistance FLEX Devices (Part
Device
EPF10K200E
Count
Package
FBGA RQFP FBGA FBGA
C/W)
C/W) Still
10.0 20.0 13.0 12.0 22.0 10.0 21.0 10.0
C/W) ft./min.
19.0 11.0 11.0 21.0 20.0
C/W) ft./min.
18.0 10.0 10.0 20.0 19.0
C/W) ft./min.
17.0 19.0 18.0
EPF10K200S
EPF10K250A
Notes Table
With attached pin-fin heat sink. With attached motor-driven heat sink.
Table Thermal Resistance FLEX 8000 Devices (Part Device
EPF8282A
Count
Package
PLCC TQFP PLCC TQFP PQFP PLCC PQFP PQFP RQFP
C/W)
10.0 11.0 10.0 11.0 10.0
C/W) C/W) C/W) C/W) Still ft./min. ft./min. ft./min.
30.0 36.0 30.0 35.0 32.0 20.0 29.0 32.0 16.0 30.0 17.0 28.0 34.0 28.0 33.0 31.0 13.0 28.0 31.0 11.0 38.0 16.0 26.0 32.0 26.0 31.0 30.0 10.0 26.0 30.0 26.0 15.0 23.0 29.0 23.0 28.0 28.0 23.0 27.0 20.0 14.0
EPF8452A
EPF8636A
Altera Corporation
Altera Device Package Information Data Sheet
Table Thermal Resistance FLEX 8000 Devices (Part
EPF8820A EPF81188A EPF81500A TQFP PQFP PQFP RQFP PQFP PQFP RQFP PQFP RQFP RQFP 26.0 32.0 16.0 29.0 17.0 28.0 28.0 14.0 24.0 14.0 22.0 13.0 14.0 11.0 25.0 31.0 11.0 27.0 16.0 19.0 26.0 10.0 21.0 12.0 20.0 12.0 10.0 10.0 24.0 30.0 25.0 15.0 14.0 24.0 19.0 11.0 19.0 11.0 23.0 27.0 20.0 14.0 11.0 19.0 16.0 10.0 16.0 10.0
Table Thermal Resistance FLEX 6000 Devices
Device
EPF6010A
Count
Package
TQFP TQFP TQFP PQFP PQFP TQFP FBGA
C/W)
11.0 10.0 10.0 11.0 14.0 10.0 10.0 10.0
C/W) Still
35.0 28.0 28.0 30.0 26.0 28.0 35.0 36.0 29.0 30.0 32.0 27.0 29.0 26.0 28.0 30.0
C/W) ft./min.
33.0 26.0 26.0 28.0 24.0 22.0 33.0 34.0 28.0 29.0 30.0 26.0 28.0 23.0 22.0 29.0
C/W) C/W) ft./min. ft./min.
31.0 25.0 25.0 26.0 21.0 20.0 31.0 32.0 26.0 26.0 29.0 25.0 26.0 21.0 20.0 27.0 28.0 24.0 24.0 21.0 17.0 19.0 28.0 29.0 24.0 21.0 26.0 24.0 20.0 17.0 19.0 25.0
EPF6016
EPF6016A
EPF6024A
TQFP PQFP FBGA TQFP PQFP PQFP FBGA
Altera Corporation
Altera Device Package Information Data Sheet
Table Thermal Resistance Excalibur Embedded Processor Solutions
Device
EPXA1
Count
Package
FBGA Flip Chip FBGA lid) Flip Chip FBGA (AlSiC lid) Flip Chip FBGA lid) Flip Chip FBGA (AlSiC lid) Flip Chip FBGA lid) Flip Chip FBGA (AlSiC lid) Flip Chip FBGA lid) Flip Chip FBGA (AlSiC lid)
C/W)
0.52 0.78 0.21 0.31 0.21 0.32 0.11 0.17
C/W) C/W) C/W) C/W) Still ft./min. ft./min. ft./min.
20.0 11.3 12.2 10.8 11.6 10.4 10.0 18.3 10.2 15.8 13.9
EPXA4
1,020 1,020
EPXA10
1,020 1,020
Altera Corporation
Altera Device Package Information Data Sheet
Table Thermal Resistance Classic Devices Device
EP600I
Count
Package
PDIP CerDIP
C/W)
22.0 18.0 16.0 10.0 18.0 17.0 13.0 18.0 22.0 16.0 23.0 10.0 12.0 23.0 10.0 17.0 29.0 13.0 12.0 13.0
C/W)
67.0 60.0 64.0 60.0 55.0 77.0 74.0 60.0 67.0 64.0 49.0 58.0 40.0 49.0 58.0 44.0 51.0 55.0 44.0 47.0 44.0 38.0
EP610
PLCC CerDIP PDIP SOIC
EP610I
PLCC CerDIP PDIP
EP900I EP910
PLCC PDIP PLCC CerDIP PDIP
EP910I
PLCC CerDIP PDIP
EP1800I EP1810
PLCC PLCC JLCC PLCC
Package Outlines
package outlines following pages listed order ascending count. Altera package outlines meet requirements JEDEC Publication
Altera Corporation
Altera Device Package Information Data Sheet
Altera Corporation
Altera Device Package Information
8-Pin Plastic Dual In-Line Package (PDIP) Wire Bond
dimensions tolerances conform ASME Y14.5M 1994. Controlling dimension inches. indicated dot, special feature, proximity package surface. Package Outline Dimension Table Specification Symbol
Ordering Code Reference Package Acronym Leadframe Material Lead Finish (Plating) JEDEC Outline Reference Weight Moisture Sensitivity Level PDIP Copper Regular: 85Sn:15Pb (Typ.) Pb-free: Matte MS-001 Variation: Printed moisture barrier 0.360 0.300 0.240 0.125 0.016 0.008
Package Information Description
Inches Min.
0.015
Nom.
0.130 0.310 0.250 0.018 0.010 0.100
Max.
0.170 0.380 0.325 0.260 0.135 0.020 0.014
Maximum Lead Coplanarity
Altera Corporation
Altera Device Package Information
Package Outline
Altera Corporation
Altera Device Package Information
8-Pin Small Outline Integrated Circuit Package (SOIC) Wire Bond
dimensions tolerances conform ASME Y14.5M 1994. Controlling dimension millimeters. indicated dot, special feature, proximity package surface.
Package Information Description
Ordering Code Reference Package Acronym Leadframe Material Lead Finish (Plating) JEDEC Outline Reference Weight Moisture Sensitivity Level SOIC Copper Regular: 85Sn:15Pb (Typ) Pb-free: NiPdAu (Preplated) MS-012 Var. Printed moisture barrier
Package Outline Dimension Table Specification Symbol Minimum
Millimeters Nom.
4.90 6.00 3.90 0.40 0.31 0.17 1.04 1.27 0.51 0.25 1.27
Maximum
1.75 0.25 1.65
1.35 0.10 1.25
Maximum Lead Coplanarity
Altera Corporation
Altera Device Package Information
Package Outline
Detail
Detail
0.25mm Gage Plane
Altera Corporation
Altera Device Package Information
16-Pin Small Outline Integrated Circuit Package (SOIC) Wire Bond
dimensions tolerances conform ASME Y14.5M 1994. Controlling dimension millimeters. indicated dot, special feature, proximity package surface.
Package Information Description
Ordering Code Reference Package Acronym Leadframe Material Lead Finish (Plating) JEDEC Outline Reference Weight Moisture Sensitivity Level SOIC Copper Pb-free: NiPdAu (Preplated) MS-013 Var. Printed moisture barrier
Package Outline Dimension Table Specification Symbol Minimum
Millimeters Nom.
10.30 10.30 7.50 0.40 0.31 0.20 1.40 1.27 0.51 0.33 1.27
Maximum
2.65 0.30 2.55
2.35 0.10 2.05
Maximum Lead Coplanarity
Altera Corporation
Altera Device Package Information
Package Outline
Detail
Detail
0.25mm Gage Plane
Altera Corporation
Altera Device Package Information
20-Pin Plastic J-Lead Chip Carrier (PLCC) Wire Bond
dimensions tolerances conform ASME Y14.5M 1994. Controlling dimension inches. generally indicated indentation plastic body, proximity, package surface. Package Outline Dimension Table Specification Symbol
Ordering Code Reference Package Acronym Leadframe Material Lead Finish (Plating) JEDEC Outline Reference Weight Moisture Sensitivity Level PLCC Copper Regular: 85Sn:15Pb (Typ.) Pb-free: Matte MS-018 Variation: Printed moisture barrier 0.385 0.350 0.290 0.385 0.350 0.290 0.013
Package Information Description
Inches Min.
0.165 0.020
Nom.
0.172 0.150 0.390 0.353 0.310 0.390 0.353 0.310 0.010 0.050
Max.
0.180 0.395 0.356 0.330 0.395 0.356 0.330 0.021
Maximum Lead Coplanarity 0.004 inches (0.10mm)
Altera Corporation
Altera Device Package Information
Package Outline
Altera Corporation
Altera Device Package Information
24-Pin Ceramic Dual In-Line Package (CerDIP) Wire Bond
dimensions tolerances conform ASME Y14.5M 1994. Controlling dimension inches. indicated dot, special feature, proximity package surface.
Package Information Description
Ordering Code Reference Package Acronym Leadframe Material Lead Finish JEDEC Outline Reference CerDIP Alloy Regular: 63Sn:37Pb (Typ.) MS-030 Variation:
Package Outline Dimension Table Specification Symbol Min.
0.015 1.240 0.290 0.280 0.125 0.015
Inches Nom.
0.028 1.260 0.305 0.295 0.018 0.100
Max.
0.200 0.041 1.280 0.320 0.310 0.021
Maximum Lead Coplanarity Weight Moisture Sensitivity Level Printed moisture barrier
Altera Corporation
Altera Device Package Information
Package Outline
Altera Corporation
Altera Device Package Information
24-Pin Plastic Dual In-Line Package (PDIP) Wire Bond
dimensions tolerances conform ASME Y14.5M 1994. Controlling dimension inches. indicated dot, special feature, proximity package surface. Package Outline Dimension Table Specification Symbol
Ordering Code Reference Package Acronym Leadframe Material Lead Finish (Plating) PDIP Copper Regular: 85Sn:15Pb (Typ.) Pb-free: Matte 1.245 0.300 0.245 0.125 0.014 0.008
Package Information Description
Inches Min.
0.015
Nom.
0.130 1.250 0.310 0.018 0.010 0.100
Max.
0.170 1.255 0.325 0.270 0.135 0.022 0.014
JEDEC Outline Reference MS-001 Variation: Maximum Lead Coplanarity Weight Moisture Sensitivity Level Printed moisture barrier
Altera Corporation
Altera Device Package Information
Package Outline
Altera Corporation
Altera Device Package Information
24-Pin Small Outline Integrated Circuit Package (SOIC) Wire Bond
dimensions tolerances conform ASME Y14.5M 1994. Controlling dimension millimeters. indicated dot, special feature, proximity package surface.
Package Information Description
Ordering Code Reference Package Acronym Leadframe Material Lead Finish (Plating) JEDEC Outline Reference Weight Moisture Sensitivity Level SOIC Copper Regular 85Sn:15Pb (Typ) MS-013 Printed moisture barrier Variation:
Package Outline Dimension Table Specification Symbol Minimum
Millimeters Nom.
15.40 10.30 7.50 0.40 0.31 0.20 1.40 1.27 0.51 0.33 1.27
Maximum
2.65 0.30 2.55
2.35 0.10 2.05
Maximum Lead Coplanarity
Altera Corporation
Altera Device Package Information
Package Outline
Detail
Detail
0.25mm Gage Plane
Altera Corporation
Altera Device Package Information
28-Pin Plastic J-Lead Chip Carrier (PLCC) Wire Bond
dimensions tolerances conform ASME Y14.5M 1994. Controlling dimension inches. generally indicated indentation plastic body, proximity, package surface. Package Outline Dimension Table Specification Symbol
Ordering Code Reference Package Acronym Leadframe Material Lead Finish (Plating) JEDEC Outline Reference Weight Moisture Sensitivity Level PLCC Copper Regular: 85Sn:15Pb (Typ.) Pb-free: Matte MS-018 Printed moisture barrier Variation: 0.485 0.450 0.382 0.485 0.450 0.382 0.013
Package Information Description
Inches Min.
0.165 0.020
Nom.
0.172 0.150 0.490 0.453 0.410 0.490 0.453 0.410 0.010 0.050
Max.
0.180 0.495 0.456 0.438 0.495 0.456 0.438 0.021
Maximum Lead Coplanarity 0.004 inches (0.10
Altera Corporation
Altera Device Package Information
Package Outline
Altera Corporation
Altera Device Package Information
32-Pin Plastic Thin Quad Flat Pack (TQFP) Wire Bond
dimensions tolerances conform ASME Y14.5M 1994. Controlling dimension millimeters. indicated dot, special feature, proximity package surface. Package Outline Dimension Table Specification Symbol
Ordering Code Reference Package Acronym Leadframe Material Lead Finish (Plating) TQFP Copper Regular: 85Sn:15Pb (Typ.) Pb-free: Matte 0.20 0.30 0.09 0.45
Package Information Description
Millimeters Min.
0.05 0.95
Nom.
1.00 9.00 7.00 9.00 7.00 0.60 1.00 0.37 0.80 3.5°
Max.
1.20 0.15 1.05
JEDEC Outline Reference MS-026 Variation: Maximum Lead Coplanarity 0.004 inches (0.1mm) Weight Moisture Sensitivity Level Printed moisture barrier
0.75 0.45 0.20
Altera Corporation
Altera Device Package Information
Package Outline
Pin32
Detail
Detail
Gage Plane
0.25mm
Altera Corporation
Altera Device Package Information
40-Pin Ceramic Dual In-Line Package (CerDIP) Wire Bond
dimensions tolerances conform ASME Y14.5M 1994. Controlling dimension inches. indicated dot, special feature, proximity package surface. Package Outline Dimension Table Specification Symbol
Ordering Code Reference Package Acronym Leadframe Material Lead Finish JEDEC Outline Reference Weight Moisture Sensitivity Level CerDIP Alloy Regular: 63Sn:37Pb (Typ.) MS-032 Variation: 12.8 Printed moisture barrier
Package Information Description
Inches Min.
0.015 2.030 0.600 0.510 0.125 0.016 0.008
Nom.
0.025 2.050 0.610 0.550 0.018 0.010 0.100
Max.
0.225 0.035 2.070 0.620 0.590 0.020 0.012
Maximum Lead Coplanarity
Altera Corporation
Altera Device Package Information
Package Outline
Altera Corporation
Altera Device Package Information
40-Pin Plastic Dual In-Line Package (PDIP) Wire Bond
dimensions tolerances conform ASME Y14.5M 1994. Controlling dimension inches. indicated dot, special feature, proximity package surface.
Package Information Description
Ordering Code Reference Package Acronym Leadframe Material Lead Finish (Plating) JEDEC Outline Reference Weight Moisture Sensitivity Level PDIP Copper Regular: 85Sn:15Pb (Typ.) MS-011 Variation: Printed moisture barrier
Package Outline Dimension Table Specification Symbol Min.
2.030 0.600 0.520 0.125 0.015 0.008 0.015
Inches Nom.
0.150 2.050 0.540 0.018 0.100 2.070 0.625 0.560 0.135 0.022 0.012
Max.
0.190
Maximum Lead Coplanarity
Altera Corporation
Altera Device Package Information
Package Outline
Altera Corporation
Altera Device Package Information
44-Pin Plastic J-Lead Chip Carrier (PLCC) Wire Bond
dimensions tolerances conform ASME Y14.5M 1994. Controlling dimension inches. generally indicated indentation plastic body, proximity, package surface. Package Outline Dimension Table Specification Symbol
Ordering Code Reference Package Acronym Leadframe Material Lead Finish (Plating) JEDEC Outline Reference Weight Moisture Sensitivity Level PLCC Copper Regular: 85Sn:15Pb (Typ.) Pb-free: Matte MS-018 Printed moisture barrier Variation: 0.685 0.650 0.582 0.685 0.650 0.582 0.013
Package Information Description
Inches Min.
0.165 0.020
Nom.
0.172 0.150 0.690 0.653 0.610 0.690 0.653 0.610 0.010 0.050
Max.
0.180 0.695 0.656 0.638 0.695 0.656 0.638 0.021
Maximum Lead Coplanarity 0.004 inches (0.10
Altera Corporation
Altera Device Package Information
Package Outline
Altera Corporation
Altera Device Package Information
44-Pin Plastic Quad Flat Pack (PQFP) Wire Bond
dimensions tolerances conform ASME Y14.5M 1994. Controlling dimension millimeters. indicated dot, special feature, proximity package surface. Package Outline Dimension Table Specification Symbol
Ordering Code Reference Package Acronym Leadframe Material Lead Finish (Plating) JEDEC Outline Reference Weight Moisture Sensitivity Level PQFP Copper Regular: 85Sn:15Pb (Typ.) Pb-free: Matte MS-022 Variation: Printed moisture barrier 0.20 0.29 0.11 0.73
Package Information Description
Millimeters Min.
1.80
Nom.
2.00 13.20 10.00 13.20 10.00 0.88 1.60 0.80
Max.
2.45 0.25 2.20
Maximum Lead Coplanarity 0.004 inches (0.10
1.03 0.45 0.23
Altera Corporation
Altera Device Package Information
Package Outline
Detail
Detail
Gage Plane
0.25mm
Altera Corporation
Altera Device Package Information
44-Pin Plastic Thin Quad Flat Pack (TQFP) Wire Bond
dimensions tolerances conform ASME Y14.5M 1994. Controlling dimension millimeters. indicated dot, special feature, proximity package surface. Package Outline Dimension Table Specification Symbol
Ordering Code Reference Package Acronym Leadframe Material Lead Finish (Plating) JEDEC Outline Reference Weight Moisture Sensitivity Level TQFP Copper Regular: 85Sn:15Pb (Typ.) Pb-free: Matte MS-026 Variation: Printed moisture barrier 0.20 0.30 0.09 0.45
Package Information Description
Millimeters Min.
0.05 0.95
Nom.
12.00 10.00 12.00 10.00 0.60 1.00 0.37 0.80 3.5°
Max.
1.20 0.15
Maximum Lead Coplanarity 0.004 inches (0.1mm)
0.75 0.45 0.20
Altera Corporation
Altera Device Package Information
Package Outline
Detail
Detail
Gage Plane
0.25mm
Altera Corporation
Altera Device Package Information
49-Pin Ultra FineLine Ball-Grid Array (UBGA) Wire Bond
dimensions tolerances conform ASME Y14.5M 1994. Controlling dimension millimeters. indicated dot, special feature, proximity package surface.
Package Information Description
Ordering Code Reference Package Acronym Substrate Material Solder Ball Composition JEDEC Outline Reference Weight Moisture Sensitivity Level UBGA Regular: 63Sn:37Pb (Typ.) Pb-free: Sn:3Ag:0.5Cu (Typ.) MO-216 Variation: BAB-2 Printed moisture barrier
Package Outline Dimension Table Specification Symbol Min.
0.40 0.20
Millimeters Nom.
0.70 7.00 7.00 0.50 0.80 0.60
Max.
1.55 1.35
Maximum Lead Coplanarity 0.005 inches (0.12mm)
Altera Corporation
Altera Device Package Information
Package Outline
VIEW BOTTOM VIEW
Corner
Altera Corporation
Altera Device Package Information
68-Pin Ceramic Pin-Grid Array (PGA) Wire Bond
dimensions tolerances conform ASME Y14.5M 1994. Controlling dimension inches. indicated dot, special feature, proximity package surface. Package Outline Dimension Table Specification Symbol
Ordering Code Reference Package Acronym Leadframe Material Lead Finish JEDEC Outline Reference Weight Moisture Sensitivity Level Alloy Gold Over Nickel Plate MO-066 Variation: 10.4 Printed moisture barrier 0.016 0.114 1.100 1.100
Package Information Description
Inches Min.
0.154
Nom.
0.177 0.050 0.127 1.120 1.120 0.130 0.018 0.100
Max.
0.200 0.140 1.140 1.140 0.020
Maximum Lead Coplanarity
Altera Corporation
Altera Device Package Information
Package Outline
VIEW
Corner
BOTTOM VIEW
Altera Corporation
Altera Device Package Information
68-Pin Plastic J-Lead Chip Carrier (PLCC) Wire Bond
dimensions tolerances conform ASME Y14.5M 1994. Controlling dimension inches. generally indicated indentation plastic body, proximity, package surface. Package Outline Dimension Table Specification Symbol
Ordering Code Reference Package Acronym Lead Material Lead Finish (Plating) JEDEC Outline Reference Weight Moisture Sensitivity Level PLCC Copper Regular: 85Sn:15Pb (Typ.) Pb-free: Matte MS-018 Printed moisture barrier Variation: 0.985 0.950 0.882 0.985 0.950 0.882 0.013
Package Information Description
Inches Min.
0.165 0.020
Nom.
0.172 0.150 0.990 0.954 0.910 0.990 0.954 0.910 0.008 0.050
Max.
0.180 0.995 0.958 0.938 0.995 0.958 0.938 0.021
Maximum Lead Coplanarity 0.004 inches (0.10
Altera Corporation
Altera Device Package Information
Package Outline
Altera Corporation
Altera Device Package Information
68-Pin Micro FineLine Ball-Grid Array (MBGA) Wire Bond
dimensions tolerances conform ASME Y14.5M 1994. Controlling dimension inches. indicated dot, special feature, proximity package surface. Package Outline Dimension Table Specification Symbol
Ordering Code Reference Package Acronym Substrate Material Solder Ball Composition JEDEC Outline Reference Weight Moisture Sensitivity Level MBGA Pb-free: Sn:3Ag:0.5Cu (Typ.) MO-195 Variation: Printed moisture barrier 0.25
Package Information Description
Inches Min.
0.15
Nom.
0.60 5.00 5.00 0.30 0.50
Max.
1.20 1.00
Maximum Lead Coplanarity 0.003 inch (0.08
0.35
Altera Corporation
Altera Device Package Information
Package Outline
VIEW
BOTTOM VIEW
Corner
Altera Corporation
Altera Device Package Information
84-Pin Plastic J-Lead Chip Carrier (PLCC) Wire Bond
dimensions tolerances conform ASME Y14.5M 1994. Controlling dimension inches. generally indicated indentation plastic body, proximity, package surface. Package Outline Dimension Table Specification Symbol
Ordering Code Reference Package Acronym Leadframe Material Lead Finish (Plating) JEDEC Outline Reference Weight Moisture Sensitivity Level PLCC Copper Regular: 85Sn:15Pb (Typ.) Pb-free: Matte MS-018 Variation: Printed moisture barrier 1.185 1.150 1.082 1.185 1.150 1.082 0.013
Package Information Description
Inches Min.
0.165 0.020
Nom.
0.172 0.150 1.190 1.154 1.110 1.190 1.154 1.110 0.008 0.050
Max.
0.180 1.195 1.158 1.138 1.195 1.158 1.138 0.021
Maximum Lead Coplanarity 0.004 inches (0.10mm)
Altera Corporation
Altera Device Package Information
Package Outline
Altera Corporation
Altera Device Package Information
88-Pin Ultra FineLine Ball-Grid Array (UBGA) Wire Bond
dimensions tolerances conform ASME Y14.5M 1994. Controlling dimension millimeters. indicated dot, special feature, proximity package surface. Package Outline Dimension Table Specification Symbol
Ordering Code Reference Package Acronym Substrate Material Solder Ball Composition JEDEC Outline Weight Moisture Sensitivity Level UBGA Regular: 63Sn:37Pb (Typ.) Pb-free: Sn:3Ag:0.5Cu (Typ.) MO-219 Printed moisture barrier 0.40
Package Information Description
Millimeters Min.
0.25 0.80
Nom.
11.00 8.00 0.45 0.80
Max.
1.40
Maximum Lead Coplanarity 0.005 inches (0.12
0.50
Altera Corporation
Altera Device Package Information
Package Outline
VIEW BOTTOM VIEW
Corner
Altera Corporation
Altera Device Package Information
100-Pin FineLine Ball-Grid Array (FBGA) Option Wire Bond
dimensions tolerances conform ASME Y14.5M 1994. Controlling dimension millimeters. indicated dot, special feature, proximity package surface.
Note: This applicable F100 packages products except which assembled Option package outlines.
Package Information Description
Ordering Code Reference Package Acronym Substrate Material Solder ball composition JEDEC Outline Reference Weight Moisture Sensitivity Level FBGA Regular: 63Sn:37Pb (Typ.) Pb-free: Sn:3Ag:0.5Cu (Typ.) MO-192 Variation: AAC-1 Printed moisture barrier
Package Outline Dimension Table Specification Symbol Min.
0.50 0.30 0.25
Millimeters Nom.
11.00 11.00 0.60 1.00 0.70
Max.
1.70 1.10 0.80
Maximum Lead Coplanarity 0.008 inches (0.20mm)
Altera Corporation
Altera Device Package Information
Package Outline
VIEW
BOTTOM VIEW
Corner
Altera Corporation
Altera Device Package Information
100-Pin FineLine Ball-Grid Array (FBGA) Option Wire Bond
dimensions tolerances conform ASME Y14.5M 1994. Controlling dimension millimeters. indicated dot, special feature, proximity package surface.
Note: This applicable F100 packages device only.
Package Information Description
Ordering Code Reference Package Acronym Substrate Material Solder ball composition JEDEC Outline Reference Weight Moisture Sensitivity Level FBGA Regular: 63Sn:37Pb (Typ.) Pb-free: Sn:3Ag:0.5Cu (Typ.) MO-192 Variation: DAC-1 Printed moisture barrier
Package Outline Dimension Table Specification Symbol Min.
0.45 0.25
Millimeters Nom.
1.05 11.00 11.00 0.50 1.00 0.55 0.80
Max.
1.55
Maximum Lead Coplanarity 0.008 inches (0.20mm)
Altera Corporation
Altera Device Package Information
Package Outline
VIEW
BOTTOM VIEW
Corner
Altera Corporation
Altera Device Package Information
100-Pin Micro FineLine Ball-Grid Array (MBGA) Wire Bond
dimensions tolerances conform ASME Y14.5M 1994. Controlling dimension millimeters. indicated dot, special feature, proximity package surface. Package Outline Dimension Table Specification Symbol
Ordering Code Reference Package Acronym Substrate Material Solder Ball Composition JEDEC Outline Reference Weight Moisture Sensitivity Level MBGA Pb-free: Sn:3Ag:0.5Cu (Typ.) MO-195 Printed moisture barrier Variation: 0.25
Package Information Description
Millimeters Min.
0.15
Nom.
0.60 6.00 6.00 0.30 0.50
Max.
1.20 1.00
Maximum Lead Coplanarity 0.003 inch (0.08mm)
0.35
Altera Corporation
Altera Device Package Information
Package Outline
VIEW
BOTTOM VIEW
Corner
Altera Corporation
Altera Device Package Information
100-Pin Plastic Quad Flat Pack (PQFP) Option Wire Bond
dimensions tolerances conform ASME Y14.5M 1994. Controlling dimension millimeters. indicated dot, special feature, proximity package surface.
Note: This applicable Q100 packages products noted Option
Package Information Description
Ordering Code Reference Package Acronym Leadframe Material Lead Finish (Plating) JEDEC Outline Reference Weight Moisture Sensitivity Level PQFP Copper Regular: 85Sn:15Pb (Typ.) Pb-free: Matte MS-022 Variation: GC-1 Printed moisture barrier
Package Outline Dimension Table Specification Symbol Min.
0.20 0.22 0.11 0.73 0.25 2.50
Millimeters Nom.
2.70 17.20 14.00 23.20 20.00 0.88 1.60 0.65 0.40 0.23 1.03
Max.
3.40 0.50 2.90
Maximum Lead Coplanarity 0.004 inches (0.10mm)
Altera Corporation
Altera Device Package Information
Package Outline
Detail
Detail
Gage Plane
0.25mm
Altera Corporation
Altera Device Package Information
100-Pin Plastic Quad Flat Pack (PQFP) Option Wire Bond
dimensions tolerances conform ASME Y14.5M 1994. Controlling dimension millimeters. indicated dot, special feature, proximity package surface.
Note: This only applicable Q100 packages EPC8 EPC16 manufactured Japan. Refer PCN0506 details.
Package Information Description
Ordering Code Reference Package Acronym Leadframe Material Lead Finish (Plating) JEDEC Outline Reference PQFP Copper Regular: 85Sn:15Pb (Typ.)
Package Outline Dimension Table Specification Symbol Min.
0.20 0.10 17.90 13.80 23.90 19.80 1.75
Millimeters Nom.
1.95 0.10 1.85 18.30 14.00 24.30 20.00 1.20 2.15 0.30 0.15 0.65 0.40 0.20 18.70 14.20 24.70 20.20
Max.
2.15 0.20
Maximum Lead Coplanarity 0.006 inches (0.15mm) Weight Moisture Sensitivity Level Printed moisture barrier
Altera Corporation
Altera Device Package Information
Package Outline
Detail
Detail
Gage Plane 0.25mm
Altera Corporation
Altera Device Package Information
100-Pin Plastic Thin Quad Flat Pack (TQFP) Wire Bond
dimensions tolerances conform ASME Y14.5M 1994. Controlling dimension millimeters. indicated dot, special feature, proximity package surface. Package Outline Dimension Table Specification Symbol
Ordering Code Reference Package Acronym Leadframe Material Lead Finish (Plating) JEDEC Outline Reference Weight Moisture Sensitivity Level TQFP Copper Regular: 85Sn:15Pb (Typ.) Pb-free: Matte MS-026 Variation: Printed moisture barrier 0.20 0.17 0.09 0.45
Package Information Description
Millimeters Min.
0.05 0.95
Nom.
1.00 16.00 14.00 16.00 14.00 0.60 1.00 0.22 0.50 3.5°
Max.
1.20 0.15 1.05
Maximum Lead Coplanarity 0.003 inches (0.08mm)
0.75 0.27 0.20
Altera Corporation
Altera Device Package Information
Package Outline
Detail
Detail
Gage Plane
0.25mm
Altera Corporation
Altera Device Package Information
144-Pin Plastic Enhanced Quad Flat Pack (EQFP) Wire Bond
dimensions tolerances conform ASME Y14.5M 1994. Controlling dimension millimeters. indicated dot, special feature, proximity package surface. Package Outline Figure Reference Specification Symbol
Ordering Code Reference Package Acronym Leadframe Material Lead Finish (Plating) JEDEC Outline Reference EQFP Copper Regular: 85Sn:15Pb (Typ.) Pb-free: Matte MS-026 Variation: Maximum Lead Coplanarity 0.003 inches (0.08mm) Weight Moisture Sensitivity Level Printed moisture barrier 0.20 0.17 0.09 4.00 0.45 4.00
Package Information Description
Millimeters Min.
0.05 1.35
Nom.
1.40 22.00 20.00
Max.
1.60 0.15 1.45
0.75 0.27 0.20
22.00 20.00 0.60 1.00 0.22 0.50 3.5°
Altera Corporation
Altera Device Package Information
Package Outline
VIEW
BOTTOM VIEW
Detail
Detail
Gage Plane
0.25mm
Altera Corporation
Altera Device Package Information
144-Pin FineLine Ball-Grid Array (FBGA) Wire Bond
dimensions tolerances conform ASME Y14.5M 1994. Controlling dimension millimeters. indicated dot, special feature, proximity package surface. Package Outline Dimension Table Specification Symbol
Ordering Code Reference Package Acronym Substrate Material Solder Ball Composition JEDEC Outline Reference Weight Moisture Sensitivity Level FBGA Regular: 63Sn:37Pb (Typ.) Pb-free: Sn:3Ag:0.5Cu (Typ.) MO-192 Variation: AAD-1 Printed moisture barrier 0.50
Package Information Description
Millimeters Min.
0.30 0.25
Nom.
13.00 13.00 0.60 1.00
Max.
1.70 1.10 0.80
Maximum Lead Coplanarity 0.008 inches (0.20mm)
0.70
Altera Corporation
Altera Device Package Information
Package Outline
VIEW
BOTTOM VIEW
Corner
Altera Corporation
Altera Device Package Information
144-Pin Micro FineLine Ball-Grid Array (MBGA) Wire Bond
dimensions tolerances conform ASME Y14.5M 1994. Controlling dimension millimeters. indicated dot, special feature, proximity package surface. Package Outline Dimension Table Specification Symbol
Ordering Code Reference Package Acronym Substrate Material Solder Ball Composition JEDEC Outline Reference Weight Moisture Sensitivity Level MBGA Pb-free: Sn:3Ag:0.5Cu (Typ.) MO-195 Variation: Printed moisture barrier 0.25
Package Information Description
Millimeters Min.
0.15
Nom.
0.60 7.00 7.00 0.30 1.00
Max.
1.20 1.00
Maximum Lead Coplanarity 0.003 inch (0.08mm)
0.35
Altera Corporation
Altera Device Package Information
Package Outline
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Altera Corporation
Altera Device Package Information
144-Pin Plastic Thin Quad Flat Pack (TQFP) Wire Bond
dimensions tolerances conform ASME Y14.5M 1994. Controlling dimension millimeters. indicated dot, special feature, proximity package surface. Package Outline Figure Reference Specification Symbol
Ordering Code Reference Package Acronym Leadframe Material Lead Finish (Plating) JEDEC Outline Reference Weight Moisture Sensitivity Level TQFP Copper Regular: 85Sn:15Pb (Typ.) Pb-free: Matte MS-026 Variation: Printed moisture barrier 0.20 0.17 0.09 0.45
Package Information Description
Millimeters Min.
0.05 1.35
Nom.
1.40 22.00 20.00 22.00 20.00 0.60 1.00 0.22 0.50 3.5°
Max.
1.60 0.15 1.45
Maximum Lead Coplanarity 0.003 inches (0.08mm)
0.75 0.27 0.20
Altera Corporation
Altera Device Package Information
Package Outline
Detail
Detail
Gage Plane
0.25mm
Altera Corporation
Altera Device Package Information
160-Pin Ceramic Pin-Grid Array (PGA) Wire Bond
dimensions tolerances conform ASME Y14.5M 1994. Controlling dimension inches. indicated dot, special feature, proximity package surface. Package Outline Dimension Table Specification Symbol
Ordering Code Reference Package Acronym Leadframe Material Lead Finish JEDEC Outline Reference Weight Moisture Sensitivity Level Alloy Gold Over Nickel Plate MO-067 Variation: 19.9 Printed moisture barrier 0.016 0.120 1.540 1.540
Package Information Description
Inches Min.
0.160
Nom.
0.190 0.050 0.140 1.560 1.560 0.130 0.018 0.100
Max.
0.220 0.160 1.580 1.580 0.020
Maximum Lead Coplanarity
Altera Corporation
Altera Device Package Information
Package Outline
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Altera Corporation
Altera Device Package Information
160-Pin Plastic Quad Flat Pack (PQFP) Wire Bond
dimensions tolerances conform ASME Y14.5M 1994. Controlling dimension millimeters. indicated dot, special feature, proximity package surface. Package Outline Dimension Table Specification Symbol
Ordering Code Reference Package Acronym Leadframe Material Lead Finish (Plating) JEDEC Outline Reference Weight Moisture Sensitivity Level PQFP Copper Regular: 85Sn:15Pb (Typ.) Pb-free: Matte MS-022 Variation: DD-1 Printed moisture barrier 0.20 0.22 0.09 0.50
Package Information Description
Millimeters Min.
0.25 3.20
Nom.
3.40 31.20 28.00 31.20 28.00 1.60 0.65
Max.
4.10 0.50 3.60
Maximum Lead Coplanarity 0.004 inches (0.10mm)
1.03 0.40 0.23
Altera Corporation
Altera Device Package Information
Package Outline
Detail
Detail
Gage Plane
0.25mm
Altera Corporation
Altera Device Package Information
169-Pin Ultra FineLine Ball-Grid Array (UBGA) Wire Bond
dimensions tolerances conform ASME Y14.5M 1994. Controlling dimension millimeters. indicated dot, special feature, proximity package surface. Package Outline Dimension Table Specification Symbol
Ordering Code Reference Package Acronym Substrate Material Solder Ball Composition JEDEC Outline Reference Weight Moisture Sensitivity Level UBGA Regular: 63Sn:37Pb (Typ.) Pb-free: Sn:3Ag:0.5Cu (Typ.) MO-216 Variation: BAF-1 Printed moisture barrier 0.40
Package Information Description
Millimeters Min.
0.20 0.65
Nom.
0.70 11.00 11.00 0.50 0.80
Max.
1.70
Maximum Lead Coplanarity 0.005 inches (0.12mm)
0.60
Altera Corporation
Altera Device Package Information
Package Outline
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Altera Corporation
Altera Device Package Information
192-Pin Ceramic Pin-Grid Array (PGA) Wire Bond
dimensions tolerances conform ASME Y14.5M 1994. Controlling dimension inches. indicated dot, special feature, proximity package surface. Package Outline Dimension Table Specification Symbol
Ordering Code Reference Package Acronym Leadframe Material Lead Finish JEDEC Outline Reference Weight Moisture Sensitivity Level Alloy Gold Over Nickel Plate MO-067 Variation: 21.0 Printed moisture barrier 0.016 0.127 1.740 1.740
Package Information Description
Inches Min.
0.167
Nom.
0.192 0.050 0.142 1.760 1.760 0.130 0.018 0.100
Max.
0.217 0.157 1.780 1.780 0.020
Maximum Lead Coplanarity
Altera Corporation
Altera Device Package Information
Package Outline
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Altera Corporation
Altera Device Package Information
208-Pin Plastic Quad Flat Pack (PQFP) Wire Bond
dimensions tolerances conform ASME Y14.5M 1994. Controlling dimension millimeters. indicated proximity package surface.
Package Information Description
Ordering Code Reference Package Acronym Lead Material Lead Finish (Plating) JEDEC Outline Reference Weight Moisture Sensitivity Level PQFP Copper Regular: 85Sn:15Pb (Typ.) Pb-free: Matte MS-029 Variation: FA-1 Printed moisture barrier
Package Outline Dimension Table Specification Symbol Min.
0.20 0.17 0.09 0.50 0.25 3.20
Millimeters Nom.
3.40 30.60 28.00 30.60 28.00 0.60 1.30 0.50 3.5° 0.27 0.20 0.75
Max.
4.10 0.50 3.60
Maximum Lead Coplanarity 0.003 inches (0.08
Altera Corporation
Altera Device Package Information
Package Outline
Detail
Detail
Gage Plane
0.25mm
Altera Corporation
Altera Device Package Information
208-Pin Power Quad Flat Pack (RQFP) Wire Bond
dimensions tolerances conform ASME Y14.5M 1994. Controlling dimension millimeters. indicated dot, special feature, proximity package surface. Package Outline Dimension Table Specification Symbol
Ordering Code Reference Package Acronym Leadframe Material Lead Finish (Plating) JEDEC Outline Reference Weight Moisture Sensitivity Level RQFP Copper Regular: 85Sn:15Pb (Typ.) Pb-free: Matte MS-029 Variation: FA-1 Printed moisture barrier 0.20 0.17 0.09 0.45
Package Information Description
Millimeters Min.
0.25 3.20
Nom.
3.40 30.60 28.00 30.60 28.00 0.60 1.30 0.50 3.5°
Max.
4.10 0.50 3.60
Maximum Lead Coplanarity 0.003 inches (0.08mm)
0.75 0.27 0.20
Altera Corporation
Altera Device Package Information
Package Outline
Detail
Detail
Gage Plane
0.25mm
Altera Corporation
Altera Device Package Information
232-Pin Ceramic Pin-Grid Array (PGA) Wire Bond
dimensions tolerances conform ASME Y14.5M 1994. Controlling dimension inches. indicated dot, special feature, proximity package surface. Package Outline Dimension Table Specification Symbol
Ordering Code Reference Package Acronym Leadframe Material Lead Finish JEDEC Outline Reference Weight Moisture Sensitivity Level Alloy Gold Over Nickel Plate MO-067 Variation: 25.5 Printed moisture barrier 0.016 0.134 1.740 1.740
Package Information Description
Inches Min.
0.174
Nom.
0.192 0.050 0.142 1.760 1.760 0.130 0.018 0.100
Max.
0.210 0.150 1.780 1.780 0.020
Maximum Lead Coplanarity
Altera Corporation
Altera Device Package Information
Package Outline
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Altera Corporation
Altera Device Package Information
240-Pin Plastic Quad Flat Pack (PQFP) Wire Bond
dimensions tolerances conform ASME Y14.5M 1994. Controlling dimension millimeters. indicated dot, special feature, proximity package surface. Package Outline Dimension Table Specification Symbol
Ordering Code Reference Package Acronym Leadframe Material Lead Finish (Plating) JEDEC Outline Reference Weight Moisture Sensitivity Level PQFP Copper Regular: 85Sn:15Pb (Typ.) Pb-free: Matte MS-029 Variation: Printed moisture barrier 0.20 0.17 0.09 0.45
Package Information Description
Millimeters Min.
0.25 3.20
Nom.
3.40 34.60 32.00 34.60 32.00 0.60 1.30 0.50 3.5°
Max.
4.10 0.50 3.60
Maximum Lead Coplanarity 0.003 inches (0.08mm)
0.75 0.27 0.20
Altera Corporation
Altera Device Package Information
Package Outline
Detail
Detail
Gage Plane
0.25mm
Altera Corporation
Altera Device Package Information
240-Pin Power Quad Flat Pack (RQFP) Wire Bond
dimensions tolerances conform ASME Y14.5M 1994. Controlling dimension millimeters. indicated dot, special feature, proximity package surface. Package Outline Dimension Table Specification Symbol
Ordering Code Reference Package Acronym Leadframe Material Lead Finish (Plating) JEDEC Outline Reference Weight Moisture Sensitivity Level RQFP Copper Regular: 85Sn:15Pb (Typ.) Pb-free: Matte MS-029 Variation: Printed moisture barrier 0.20 0.17 0.09 0.45
Package Information Description
Millimeters Min.
0.25 3.20
Nom.
3.40 34.60 32.00 34.60 32.00 0.60 1.30 0.50 3.5°
Max.
4.10 0.50 3.60
Maximum Lead Coplanarity 0.003 inches (0.08mm)
0.75 0.27 0.20
Altera Corporation
Altera Device Package Information
Package Outline
Detail
Detail
Gage Plane
0.25mm
Altera Corporation
Altera Device Package Information
256-Pin Ball-Grid Array (BGA) Option Wire Bond
dimensions tolerances conform ASME Y14.5M 1994. Controlling dimension millimeters. indicated dot, special feature, proximity package surface. Package Outline Dimension Table Specification Symbol
Ordering Code Reference Package Acronym Substrate Material Solder Ball Composition JEDEC Outline Reference Weight Moisture Sensitivity Level tape Regular: 63Sn:37Pb (Typ.) Pb-free: Sn:3Ag:0.5Cu (Typ.) MO-192 Variation: BAL-2 Printed moisture barrier 0.60
Package Information Description
Millimeters Min.
0.35 0.25
Nom.
27.00 27.00 0.75 1.27
Max.
1.70 1.10
Maximum Lead Coplanarity 0.008 inches (0.20
0.90
Altera Corporation
Altera Device Package Information
Package Outline
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Altera Corporation
Altera Device Package Information
256-Pin Plastic Ball-Grid Array (BGA) Option Wire Bond
dimensions tolerances conform ASME Y14.5M 1994. Controlling dimension millimeters. indicated dot, special feature, proximity package surface. Package Outline Dimension Table Specification Symbol
Ordering Code Reference Package Acronym Substrate Material Solder Ball Composition JEDEC Outline Reference Weight Moisture Sensitivity Level Regular: 63Sn:37Pb (Typ.) Pb-free: Sn:3Ag:0.5Cu (Typ.) MS-034 Printed moisture barrier Variation: BAL-2 0.60
Package Information Description
Millimeters Min.
0.35
Nom.
27.00 27.00 0.75 1.27
Max.
2.60 2.20 1.80
Maximum Lead Coplanarity 0.008 inches (0.20
0.90
Altera Corporation
Altera Device Package Information
Package Outline
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Corner
Altera Corporation
Altera Device Package Information
256-Pin FineLine Ball-Grid Array (FBGA) Option Wire Bond
dimensions tolerances conform ASME Y14.5M 1994. Controlling dimension millimeters. indicated dot, special feature, proximity package surface.
Note: This applicable F256 packages products except Cyclone which assembled Option package outlines.
Package Information Description
Ordering Code Reference Package Acronym Substrate Material Solder Ball Composition JEDEC Outline Reference Weight Moisture Sensitivity Level FBGA Regular: 63Sn:37Pb (Typ.) Pb-free: Sn:3Ag:0.5Cu (Typ.) MS-034 Printed moisture barrier Variation: AAF-1
Package Outline Dimension Table Specification Min.
0.50 0.30
Millimeters Nom.
0.70 17.00 17.00 0.60 1.00 0.70
Max.
2.20 1.80
Maximum Lead Coplanarity 0.008 inches (0.20
Altera Corporation
Altera Device Package Information
Package Outline
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Altera Corporation
Altera Device Package Information
256-Pin FineLine Ball-Grid Array (FBGA) Option Wire Bond
dimensions tolerances conform ASME Y14.5M 1994. Controlling dimension millimeters. indicated dot, special feature, proximity package surface.
Note: This applicable F256 packages Cyclone product only.
Package Information Description
Ordering Code Reference Package Acronym Substrate Material Solder Ball Composition JEDEC Outline Reference Weight Moisture Sensitivity Level FBGA Regular: 63Sn:37Pb (Typ.) Pb-free: Sn:3Ag:0.5Cu (Typ.) MO-192 Printed moisture barrier Variation: DAF-1
Package Outline Dimension Table Specification Min.
0.45 0.25
Millimeters Nom.
1.05 17.00 17.00 0.50 1.00 0.55 0.80
Max.
1.55
Maximum Lead Coplanarity 0.008 inches (0.20
Altera Corporation
Altera Device Package Information
Package Outline
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Altera Corporation
Altera Device Package Information
256-Pin Micro FineLine Ball-Grid Array (MBGA) Wire Bond
dimensions tolerances conform ASME Y14.5M 1994. Controlling dimension millimeters. indicated dot, special feature, proximity package surface.
Package Information Description
Ordering Code Reference Package Acronym Substrate Material Solder Ball Composition JEDEC Outline Reference Weight Moisture Sensitivity Level MBGA Pb-free: Sn:3Ag:0.5Cu (Typ.) MO-195 Printed moisture barrier Variation:
Package Outline Dimension Table Specification Min.
0.25 0.15
Millimeters Nom.
0.60 11.00 11.00 0.30 0.50 0.35
Max.
1.20 1.00
Maximum Lead Coplanarity 0.003 inch (0.08mm)
Altera Corporation
Altera Device Package Information
Package Outline
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BOTTOM VIEW
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Altera Corporation
Altera Device Package Information
256-Pin Ultra FineLine Ball-Grid Array (UBGA) Wire Bond
dimensions tolerances conform ASME Y14.5M 1994. Controlling dimension millimeters. indicated dot, special feature, proximity package surface.
Package Information Description
Ordering Code Reference Package Acronym Substrate Material Solder Ball Composition JEDEC Outline Reference Weight Moisture Sensitivity Level UBGA Regular: 63Sn:37Pb (Typ.) Pb-free: Sn:3Ag:0.5Cu (Typ.) MO-216 Variation: BAJ-2 (0.12mm) Printed moisture barrier
Package Outline Dimension Table Specification Min.
0.40 0.20 0.65
Millimeters Nom.
0.80 14.00 14.00 0.50 0.80 0.60
Max.
2.20
Maximum Lead Coplanarity 0.005 inches
Altera Corporation
Altera Device Package Information
Package Outline
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Altera Corporation
Altera Device Package Information
280-Pin Ceramic Pin-Grid Array (PGA) Wire Bond
dimensions tolerances conform ASME Y14.5M 1994. Controlling dimension inches. indicated dot, special feature, proximity package surface. Package Outline Dimension Table Specification Symbol
Ordering Code Reference Package Acronym Leadframe Material Lead Finish JEDEC Outline Reference Weight Moisture Sensitivity Level Alloy Gold Over Nickel Plate MO-067 Variation: 29.5 Printed moisture barrier 0.016 0.125 1.940 1.940
Package Information Description
Inches Min.
0.165
Nom.
0.185 0.050 0.135 1.960 1.960 0.130 0.018 0.100
Max.
0.205 0.145 1.980 1.980 0.020
Maximum Lead Coplanarity
Altera Corporation
Altera Device Package Information
Package Outline
VIEW
Corner
BOTTOM VIEW
Altera Corporation
Altera Device Package Information
304-Pin Power Quad Flat Pack (RQFP) Wire Bond
dimensions tolerances conform ASME Y14.5M 1994. Controlling dimension millimeters. indicated dot, special feature, proximity package surface. Package Outline Dimension Table Specification Symbol
Ordering Code Reference Package Acronym Leadframe Material Lead Finish (Plating) JEDEC Outline Reference Weight Moisture Sensitivity Level RQFP Copper Regular: 85Sn:15Pb (Typ.) Pb-free: Matte MS-029 Variation: 14.3 Printed moisture barrier 0.20 0.17 0.09 0.45
Package Information Description
Millimeters Min.
0.25 3.55
Nom.
3.80 42.60 40.00 42.60 40.00 0.60 1.30 0.50 3.5°
Max.
4.50 0.50 4.05
Maximum Lead Coplanarity 0.003 inches (0.08mm)
0.75 0.27 0.20
Altera Corporation
Altera Device Package Information
Package Outline
Detail
Detail
Gage Plane
0.25mm
Altera Corporation
Altera Device Package Information
324-Pin FineLine Ball-Grid Array (FBGA) Wire Bond
dimensions tolerances conform ASME Y14.5M 1994. Controlling dimension millimeters. indicated dot, special feature, proximity package surface. Package Outline Dimension Table Specification Symbol
Ordering Code Reference Package Acronym Substrate Material Solder Ball Composition JEDEC Outline Reference Weight Moisture Sensitivity Level FBGA Regular: 63Sn:37Pb (Typ.) Pb-free: Sn:3Ag:0.5Cu (Typ.) MS-034 Variation: AAG-1 Printed moisture barrier 0.50
Package Information Description
Millimeters Min.
0.30
Nom.
0.70 19.00 19.00 0.60 1.00
Max.
2.20 1.80
Maximum Lead Coplanarity 0.008 inches (0.20mm)
0.70
Altera Corporation
Altera Device Package Information
Package Outline
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Altera Corporation
Altera Device Package Information
356-Pin Ball-Grid Array (BGA) Wire Bond
dimensions tolerances conform ASME Y14.5M 1994. Controlling dimension millimeters. indicated dot, special feature, proximity package surface. Package Outline Dimension Table Specification Symbol
Ordering Code Reference Package Acronym Substrate Material Solder Ball Composition JEDEC Outline Reference Weight Moisture Sensitivity Level tape Regular: 63Sn:37Pb (Typ.) Pb-free: Sn:3Ag:0.5Cu (Typ.) MO-192 Variation: BAR-2 Printed moisture barrier 0.60
Package Information Description
Millimeters Min.
0.35 0.25
Nom.
35.00 35.00 0.75 1.27
Max.
1.70 1.10
Maximum Lead Coplanarity 0.008 inches (0.20mm)
0.90
Altera Corporation
Altera Device Package Information
Package Outline
VIEW
BOTTOM VIEW
Corner
Altera Corporation
Altera Device Package Information
400-Pin FineLine Ball-Grid Array (FBGA) Wire Bond
dimensions tolerances conform ASME Y14.5M 1994. Controlling dimension millimeters. indicated dot, special feature, proximity package surface. Package Outline Dimension Table Specification Symbol
Ordering Code Reference Package Acronym Substrate Material Solder Ball Composition JEDEC Outline Reference Weight Moisture Sensitivity Level FBGA Regular: 63Sn:37Pb (Typ.) Pb-free: Sn:3Ag:0.5Cu (Typ.) MS-034 Variation: AAH-1 Printed moisture barrier 0.50
Package Information Description
Millimeters Min.
0.30
Nom.
0.80 21.00 21.00 0.60 1.00
Max.
2.20 1.80
Maximum Lead Coplanarity 0.008 inches (0.20mm)
0.70
Altera Corporation
Altera Device Package Information
Package Outline
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BOTTOM VIEW
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Altera Corporation
Altera Device Package Information
403-Pin Ceramic Pin-Grid Array (PGA) Wire Bond
dimensions tolerances conform ASME Y14.5M 1994. Controlling dimension inches. indicated dot, special feature, proximity package surface. Package Outline Dimension Table Specification Symbol
Ordering Code Reference Package Acronym Leadframe Material Lead Finish JEDEC Outline Reference Weight Moisture Sensitivity Level Alloy Gold Over Nickel Plate MO-128 Variation: 47.7 Printed moisture barrier 0.016 0.117 1.940 1.940
Package Information Description
Inches Min.
0.157
Nom.
0.180 0.050 0.130 1.960 1.960 0.130 0.018 0.100
Max.
0.203 0.143 1.980 1.980 0.020
Maximum Lead Coplanarity
Altera Corporation
Altera Device Package Information
Package Outline
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BOTTOM VIEW
Corner
Altera Corporation
Altera Device Package Information
484-Pin FineLine Ball-Grid Array (FBGA) Option Flip Chip
dimensions tolerances conform ASME Y14.5M 1994. Controlling dimension millimeters. indicated dot, special feature, proximity package surface. Package Outline Dimension Table Specification Symbol
Ordering Code Reference Package Acronym Substrate Material Solder Ball Composition JEDEC Outline Reference Weight Moisture Sensitivity Level FBGA Regular: 63Sn:37Pb (Typ.) Pb-free: Sn:3Ag:0.5Cu (Typ.) MS-034 Variation: AAJ-1 Printed moisture barrier 0.50
Package Information Description
Millimeters Min.
0.30 0.25
Nom.
23.00 23.00 0.60 1.00
Max.
3.50 3.00 2.50
Maximum Lead Coplanarity 0.008 inches (0.20
0.70
Altera Corporation
Altera Device Package Information
Package Outline
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BOTTOM VIEW
Corner
Altera Corporation
Altera Device Package Information
484-Pin FineLine Ball-Grid Array (FBGA) Option Wire Bond
dimensions tolerances conform ASME Y14.5M 1994. Controlling dimension millimeters. indicated dot, special feature, proximity package surface.
Package Information Description
Ordering Code Reference Package Acronym Substrate Material Solder Ball Composition JEDEC Outline Reference Weight Moisture Sensitivity Level FBGA Regular: 63Sn:37Pb (Typ.) Pb-free: Sn:3Ag:0.5Cu (Typ.) MS-034 Printed moisture barrier Variation: AAJ-1
Package Outline Dimension Table Specification Symbol Min.
0.50 0.30
Millimeters Nom.
23.00 23.00 0.60 1.00 0.70
Max.
2.60 2.20 1.80
Maximum Lead Coplanarity 0.008 inches (0.20
Altera Corporation
Altera Device Package Information
Package Outline
VIEW BOTTOM VIEW
Corner
Altera Corporation
Altera Device Package Information
484-Pin FineLine Ball-Grid Array (FBGA) Option Wire Bond
dimensions tolerances conform ASME Y14.5M 1994. Controlling dimension millimeters. indicated dot, special feature, proximity package surface.
Package Information Description
Ordering Code Reference Package Acronym Substrate Material Solder Ball Composition JEDEC Outline Reference Weight Moisture Sensitivity Level FBGA Regular: 63Sn:37Pb (Typ.) Pb-free: Sn:3Ag:0.5Cu (Typ.) MS-034 Printed moisture barrier Variation: AAJ-1
Package Outline Dimension Table Specification Symbol Min.
0.50 0.30
Millimeters Nom.
23.00 23.00 0.60 1.00 0.70
Max.
2.60 2.20 1.80
Maximum Lead Coplanarity 0.008 inches (0.20
Altera Corporation
Altera Device Package Information
Package Outline
VIEW BOTTOM VIEW
Corner
Altera Corporation
Altera Device Package Information
484-Pin Hybrid FineLine Ball-Grid Array (HBGA) Flip Chip
dimensions tolerances conform ASME Y14.5M 1994. Controlling dimension millimeters. indicated dot, special feature, proximity package surface. Package Outline Dimension Table Specification Symbol
Ordering Code Reference Package Acronym Substrate Material Solder Ball Composition JEDEC Outline Reference Weight Moisture Sensitivity Level HBGA Regular: 63Sn:37Pb (Typ.) Pb-free: Sn:3Ag:0.5Cu (Typ.) MS-034 Variation: AAL-1 10.0 Printed moisture barrier 0.50
Package Information Description
Millimeters Min.
0.30 0.25
Nom.
27.00 27.00 0.60 1.00
Max.
3.50 3.00 2.50
Maximum Lead Coplanarity 0.008 inches (0.20mm)
0.70
Altera Corporation
Altera Device Package Information
Package Outline
VIEW
BOTTOM VIEW
Corner
Altera Corporation
Altera Device Package Information
484-Pin Ultra FineLine Ball-Grid Array (UBGA) Wire Bond
dimensions tolerances conform ASME Y14.5M 1994. Controlling dimension millimeters. indicated dot, special feature, proximity package surface. Package Outline Dimension Table Specification Symbol
Ordering Code Reference Package Acronym Substrate Material Solder Ball Composition JEDEC Outline Reference Weight Moisture Sensitivity Level UBGA Regular: 63Sn:37Pb (Typ.) Pb-free: Sn:3Ag:0.5Cu (Typ.) MO-216 Variation: BAP-2 Printed moisture barrier 0.40
Package Information Description
Millimeters Min.
0.20 0.65
Nom.
0.95 19.00 19.00 0.50 0.80
Max.
2.20
Maximum Lead Coplanarity 0.005 inches (0.12mm)
0.60
Altera Corporation
Altera Device Package Information
Package Outline
VIEW
BOTTOM VIEW
Corner
Altera Corporation
Altera Device Package Information
503-Pin Ceramic Pin-Grid Array (PGA) Wire Bond
dimensions tolerances conform ASME Y14.5M 1994. Controlling dimension inches. indicated dot, special feature, proximity package surface. Package Outline Dimension Table Specification
Alloy Gold Over Nickel Plate MO-128 59.0 Printed moisture barrier Variation: 0.016 2.245 2.245
Package Information Description
Ordering Code Reference Package Acronym Leadframe Material Lead Finish JEDEC Outline Reference Weight Moisture Sensitivity Level
Inches Min.
Nom.
0.050 2.260 2.260 0.130 0.018 0.100
Max.
0.205 0.145 2.275 2.275 0.020
Maximum Lead Coplanarity
Altera Corporation
Altera Device Package Information
Package Outline
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BOTTOM VIEW
Corner
Altera Corporation
Altera Device Package Information
599-Pin Ceramic Pin-Grid Array (PGA) Wire Bond
dimensions tolerances conform ASME Y14.5M 1994. Controlling dimension inches. indicated dot, special feature, proximity package surface. Package Outline Dimension Table Specification Symbol
Ordering Code Reference Package Acronym Leadframe Material Lead Finish JEDEC Outline Reference Weight Moisture Sensitivity Level Alloy Gold Over Nickel Plate MO-128 Variation: 69.0 Printed moisture barrier 0.016 2.445 2.445
Package Information Description
Inches Min.
Nom.
0.050 2.460 2.460 0.130 0.018 0.100
Max.
0.205 0.145 2.475 2.475 0.020
Maximum Lead Coplanarity
Altera Corporation
Altera Device Package Information
Package Outline
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Altera Corporation
Altera Device Package Information
600-Pin Ball-Grid Array (BGA) Wire Bond
dimensions tolerances conform ASME Y14.5M 1994. Controlling dimension millimeters. indicated dot, special feature, proximity package surface. Package Outline Dimension Table Specification Symbol
Ordering Code Reference Package Acronym Substrate Material Solder Ball Composition JEDEC Outline Reference Weight Moisture Sensitivity Level tape Regular: 63Sn:37Pb (Typ.) Pb-free: Sn:3Ag:0.5Cu (Typ.) MO-192 Variation: BAW-1 12.0 Printed moisture barrier 0.60
Package Information Description
Millimeters Min.
0.35 0.25
Nom.
45.00 45.00 0.75 1.27
Max.
2.00 1.10
Maximum Lead Coplanarity 0.008 inches (0.20mm)
0.90
Altera Corporation
Altera Device Package Information
Package Outline
VIEW
BOTTOM VIEW
Corner
Altera Corporation
Altera Device Package Information
652-Pin Ball-Grid Array (BGA) Option Flip Chip
dimensions tolerances conform ASME Y14.5M 1994. Controlling dimension millimeters. indicated dot, special feature, proximity package surface.
Package Information Description
Ordering Code Reference Package Acronym Substrate Material Solder Ball Composition JEDEC Outline Reference Weight Moisture Sensitivity Level Regular: 63Sn:37Pb (Typ.) Pb-free: Sn:3Ag:0.5Cu (Typ.) MS-034 23.8 Printed moisture barrier Variation: BAW-1
Package Outline Dimension Table Specification Symbol Min.
0.60 0.30 0.25
Millimeters Nom.
45.00 45.00 0.75 1.27 0.90
Max.
3.50 3.00 2.50
Maximum Lead Coplanarity 0.008 inches (0.20
Altera Corporation
Altera Device Package Information
Package Outline
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Altera Corporation
Altera Device Package Information
652-Pin Plastic Ball-Grid Array (BGA) Option Wire Bond
dimensions tolerances conform ASME Y14.5M 1994. Controlling dimension millimeters. indicated dot, special feature, proximity package surface.
Package Information Description
Ordering Code Reference Package Acronym Substrate Material Solder Ball Composition JEDEC Outline Reference Weight Moisture Sensitivity Level Regular: 63Sn:37Pb (Typ.) Pb-free: Sn:3Ag:0.5Cu (Typ.) MS-034 Printed moisture barrier Variation: BAW-1
Package Outline Dimension Table Specification Symbol Min.
0.60 0.35
Millimeters Nom.
45.00 45.00 0.75 1.27 0.90
Max.
3.20 2.80 2.40
Maximum Lead Coplanarity 0.008 inches (0.20
Altera Corporation
Altera Device Package Information
Package Outline
VIEW
BOTTOM VIEW
Corner
Altera Corporation
Altera Device Package Information
652-Pin Plastic Ball-Grid Array (BGA) Option Wire Bond
dimensions tolerances conform ASME Y14.5M 1994. Controlling dimension millimeters. indicated dot, special feature, proximity package surface.
Package Information Description
Ordering Code Reference Package Acronym Substrate Material Solder Ball Composition JEDEC Outline Reference Weight Moisture Sensitivity Level tape Regular: 63Sn:37Pb (Typ.) Pb-free: Sn:3Ag:0.5Cu (Typ.) MO-192 Variation: BAW-1 12.1 Printed moisture barrier
Package Outline Dimension Table Specification Symbol Min.
0.60 0.35 0.25
Millimeters Nom.
45.00 45.00 0.75 1.27 0.90
Max.
2.00 1.10
Maximum Lead Coplanarity 0.008 inches (0.20
Altera Corporation
Altera Device Package Information
Package Outline
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Altera Corporation
Altera Device Package Information
655-Pin Ceramic Pin-Grid Array (PGA) Wire Bond
dimensions tolerances conform ASME Y14.5M 1994. Controlling dimension inches. indicated dot, special feature, proximity package surface. Package Outline Dimension Table Specification Symbol
Ordering Code Reference Package Acronym Leadframe Material Lead Finish JEDEC Outline Reference Weight Moisture Sensitivity Level Alloy Gold Over Nickel Plate MO-128 Variation: 74.9 Printed moisture barrier 0.016 2.445 2.445
Package Information Description
Inches Min.
Nom.
0.050 2.460 2.460 0.130 0.018 0.100
Max.
0.205 0.145 2.475 2.475 0.020
Maximum Lead Coplanarity
Altera Corporation
Altera Device Package Information
Package Outline
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Altera Corporation
Altera Device Package Information
672-Pin Plastic Ball-Grid Array (BGA) Wire Bond
dimensions tolerances conform ASME Y14.5M 1994. Controlling dimension millimeters. indicated dot, special feature, proximity package surface.
Package Information Description
Ordering Code Reference Package Acronym Substrate Material Solder Ball Composition JEDEC Outline Reference Weight Moisture Sensitivity Level Regular: 63Sn:37Pb (Typ.) Pb-free: Sn:3Ag:0.5Cu (Typ.) MS-034 Printed moisture barrier Variation: BAR-2
Package Outline Dimension Table Specification Symbol Min.
0.60 0.35
Millimeters Nom.
35.00 35.00 0.75 1.27 0.90
Max.
2.60 2.20 1.80
Maximum Lead Coplanarity 0.008 inches (0.20
Altera Corporation
Altera Device Package Information
Package Outline
VIEW BOTTOM VIEW
Corner
Altera Corporation
Altera Device Package Information
672-Pin FineLine Ball-Grid Array (FBGA) Option Flip Chip
dimensions tolerances conform ASME Y14.5M 1994. Controlling dimension millimeters. indicated dot, special feature, proximity package surface. Package Outline Dimension Table Specification Symbol
Ordering Code Reference Package Acronym Substrate Material Solder Ball Composition JEDEC Outline Reference Weight Moisture Sensitivity Level FBGA Regular: 63Sn:37Pb (Typ.) Pb-free: Sn:3Ag:0.5Cu (Typ.) MS-034 10.2 Printed moisture barrier Variation: AAL-1 0.50
Package Information Description
Millimeters Min.
0.30 0.25
Nom.
27.00 27.00 0.60 1.00
Max.
3.50 3.00 2.50
Maximum Lead Coplanarity 0.008 inches (0.20
0.70
Altera Corporation
Altera Device Package Information
Package Outline
VIEW
BOTTOM VIEW
Corner
Altera Corporation
Altera Device Package Information
672-Pin FineLine Ball-Grid Array (FBGA) Option Wire Bond
dimensions tolerances conform ASME Y14.5M 1994. Controlling dimension millimeters. indicated dot, special feature, proximity package surface.
Package Information Description
Ordering Code Reference Package Acronym Substrate Material Solder Ball Composition JEDEC Outline Reference Weight Moisture Sensitivity Level FBGA Regular: 63Sn:37Pb (Typ.) Pb-free: Sn:3Ag:0.5Cu (Typ.) MS-034 Printed moisture barrier Variation: AAL-1
Package Outline Dimension Table Specification Symbol Min.
0.50 0.30
Millimeters Nom.
27.00 27.00 0.60 1.00 0.70
Max.
2.60 2.20 1.80
Maximum Lead Coplanarity 0.008 inches (0.20
Altera Corporation
Altera Device Package Information
Package Outline
VIEW BOTTOM VIEW Corner
Altera Corporation
Altera Device Package Information
672-Pin FineLine Ball-Grid Array (FBGA) Option Wire Bond
dimensions tolerances conform ASME Y14.5M 1994. Controlling dimension millimeters. indicated dot, special feature, proximity package surface.
Package Information Description
Ordering Code Reference Package Acronym Substrate Material Solder Ball Composition JEDEC Outline Reference Weight Moisture Sensitivity Level FBGA Regular: 63Sn:37Pb (Typ.) Pb-free: Sn:3Ag:0.5Cu (Typ.) MS-034 Printed moisture barrier Variation: AAL-1
Package Outline Dimension Table Specification Symbol Min.
0.50 0.30
Millimeters Nom.
27.00 27.00 0.60 1.00 0.70
Max.
2.60 2.20 1.80
Maximum Lead Coplanarity 0.008 inches (0.20
Altera Corporation
Altera Device Package Information
Package Outline
VIEW BOTTOM VIEW
Corner
Altera Corporation
Altera Device Package Information
724-Pin Ball-Grid Array (BGA) Flip Chip
dimensions tolerances conform ASME Y14.5M 1994. Controlling dimension millimeters. indicated dot, special feature, proximity package surface.
Package Information Description
Ordering Code Reference Package Acronym Substrate Material Solder Ball Composition JEDEC Outline Reference Weight Moisture Sensitivity Level Regular: 63Sn:37Pb (Typ.) Pb-free: Sn:3Ag:0.5Cu (Typ.) MS-034 13.6 Printed moisture barrier Variation: BAR-1
Package Outline Dimension Table Specification Symbol Min.
0.60 0.30 0.25
Millimeters Nom.
35.00 35.00 0.75 1.27 0.90
Max.
3.50 3.00 2.50
Maximum Lead Coplanarity 0.008 inches (0.20
Altera Corporation
Altera Device Package Information
Package Outline
VIEW
BOTTOM VIEW
Corner
Altera Corporation
Altera Device Package Information
780-Pin FineLine Ball-Grid Array (FBGA) Option Flip Chip
dimensions tolerances conform ASME Y14.5M 1994. Controlling dimension millimeters. indicated dot, special feature, proximity package surface.
Package Information Description
Ordering Code Reference Package Acronym Substrate Material Solder Ball Composition JEDEC Outline Reference Weight Moisture Sensitivity Level FBGA Regular: 63Sn:37Pb (Typ.) Pb-free: Sn:3Ag:0.5Cu (Typ.) MS-034 11.9 Printed moisture barrier Variation: AAM-1
Package Outline Dimension Table Specification Symbol Min.
0.50 0.30 0.25
Millimeters Nom.
29.00 29.00 0.60 1.00 0.70
Max.
3.50 3.00 2.50
Maximum Lead Coplanarity 0.008 inches (0.20
Altera Corporation
Altera Device Package Information
Package Outline
VIEW
BOTTOM VIEW
Corner
Altera Corporation
Altera Device Package Information
780-Pin FineLine Ball-Grid Array (FBGA) Option Wire Bond
dimensions tolerances conform ASME Y14.5M 1994. Controlling dimension millimeters. indicated dot, special feature, proximity package surface.
Package Information Description
Ordering Code Reference Package Acronym Substrate Material Solder Ball Composition JEDEC Outline Reference Weight Moisture Sensitivity Level FBGA Regular: 63Sn:37Pb (Typ.) Pb-free: Sn:3Ag:0.5Cu (Typ.) MS-034 Printed moisture barrier Variation: AAM-1
Package Outline Dimension Table Specification Symbol Min.
0.50 0.30
Millimeters Nom.
29.00 29.00 0.60 1.00 0.70
Max.
2.60 2.20 1.80
Maximum Lead Coplanarity 0.008 inches (0.20
Altera Corporation
Altera Device Package Information
Package Outline
VIEW
BOTTOM VIEW
Corner
Altera Corporation
Altera Device Package Information
896-Pin FineLine Ball-Grid Array (FBGA) Wire Bond
dimensions tolerances conform ASME Y14.5M 1994. Controlling dimension millimeters. indicated dot, special feature, proximity package surface.
Package Information Description
Ordering Code Reference Package Acronym Substrate Material Solder Ball Composition JEDEC Outline Reference Weight Moisture Sensitivity Level FBGA Regular: 63Sn:37Pb (Typ.) Pb-free: Sn:3Ag:0.5Cu (Typ.) MS-034 Printed moisture barrier Variation: AAN-1
Package Outline Dimension Table Specification Symbol Min.
0.50 0.30
Millimeters Nom.
31.00 31.00 0.60 1.00 0.70
Max.
2.60 2.20 1.80
Maximum Lead Coplanarity 0.008 inches (0.20
Altera Corporation
Altera Device Package Information
Package Outline
VIEW BOTTOM VIEW
Corner
Altera Corporation
Altera Device Package Information
956-Pin Ball-Grid Array (BGA) Flip Chip
dimensions tolerances conform ASME Y14.5M 1994. Controlling dimension millimeters. indicated dot, special feature, proximity package surface.
Package Information Description
Ordering Code Reference Package Acronym Substrate Material Solder Ball Composition JEDEC Outline Reference Maximum Lead Coplanarity Weight Moisture Sensitivity Level Regular: 63Sn:37Pb (Typ.) Pb-free: Sn:3Ag:0.5Cu (Typ.) MS-034 19.6 Printed moisture barrier Variation: BAU-1
Package Outline Dimension Table Specification Symbol Min.
0.60 0.30 0.25
Millimeters Nom.
40.00 40.00 0.75 1.27 0.90
Max.
3.50 3.00 2.50
0.008 inches (0.20
Altera Corporation
Altera Device Package Information
Package Outline
VIEW
BOTTOM VIEW
Corner
Altera Corporation
Altera Device Package Information
1020-Pin FineLine Ball-Grid Array (FBGA) Flip Chip
dimensions tolerances conform ASME Y14.5M 1994. Controlling dimension millimeters. indicated dot, special feature, proximity package surface.
Package Information Description
Ordering Code Reference Package Acronym Substrate Material Solder Ball Composition JEDEC Outline Reference Weight Moisture Sensitivity Level FBGA Regular: 63Sn:37Pb (Typ.) Pb-free: Sn:3Ag:0.5Cu (Typ.) MS-034 14.1 Printed moisture barrier Variation: AAP-1
Package Outline Dimension Table Specification Symbol Min.
0.50 0.30 0.25
Millimeters Nom.
33.00 33.00 0.60 1.00 0.70
Max.
3.50 3.00 2.50
Maximum Lead Coplanarity 0.008 inches (0.20
Altera Corporation
Altera Device Package Information
Package Outline
VIEW
BOTTOM VIEW
Corner
Altera Corporation
Altera Device Package Information
1152-Pin FineLine Ball-Grid Array (FBGA) Flip Chip
dimensions tolerances conform ASME Y14.5M 1994. Controlling dimension millimeters. indicated dot, special feature, proximity package surface.
Package Information Description
Ordering Code Reference Package Acronym Substrate Material Solder Ball Composition JEDEC Outline Reference Weight Moisture Sensitivity Level FBGA Regular: 63Sn:37Pb (Typ.) Pb-free: Sn:3Ag:0.5Cu (Typ.) MS-034 15.8 Printed moisture barrier Variation: AAR-1
Package Outline Dimension Table Specification Symbol Min.
0.50 0.30 0.25
Millimeters Nom.
35.00 35.00 0.60 1.00 0.70
Max.
3.50 3.00 2.50
Maximum Lead Coplanarity 0.008 inches (0.20
Altera Corporation
Altera Device Package Information
Package Outline
VIEW
BOTTOM VIEW
Corner
Altera Corporation
Altera Device Package Information
1508-Pin FineLine Ball-Grid Array (FBGA) Flip Chip
dimensions tolerances conform ASME Y14.5M 1994. Controlling dimension millimeters. indicated dot, special feature, proximity package
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