CIII51015-1.1 This chapter provides package information Altera® C
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Package Information Cyclone Devices
CIII51015-1.1
This chapter provides package information Altera® Cyclone® devices, contains following sections:
"Thermal Resistance" page 15-2 "Package Outlines" page 15-2
Table 15-1 shows Cyclone device package options.
Table 15-1. Cyclone Device Package Options (Part Device
EP3C5
Package
Plastic Enhanced Quad Flat Pack (EQFP) Wire Bond FineLine Ball-Grid Array (FBGA) Option Wire Bond Ultra FineLine Ball-Grid Array (UBGA) Wire Bond
Pins
EP3C10
Plastic Enhanced Quad Flat Pack (EQFP) Wire Bond FineLine Ball-Grid Array (FBGA) Option Wire Bond Ultra FineLine Ball-Grid Array (UBGA) Wire Bond
EP3C16
Plastic Enhanced Quad Flat Pack (EQFP) Wire Bond Plastic Quad Flat Pack (PQFP) Wire Bond FineLine Ball-Grid Array (FBGA) Option Wire Bond Ultra FineLine Ball-Grid Array (UBGA) Wire Bond FineLine Ball-Grid Array (FBGA) Option Wire Bond Ultra FineLine Ball-Grid Array (UBGA) Wire Bond
EP3C25
Plastic Enhanced Quad Flat Pack (EQFP) Wire Bond Plastic Quad Flat Pack (PQFP) Wire Bond FineLine Ball-Grid Array (FBGA) Option Wire Bond Ultra FineLine Ball-Grid Array (UBGA) Wire Bond FineLine Ball-Grid Array (FBGA) Wire Bond
EP3C40
Plastic Quad Flat Pack (PQFP) Wire Bond FineLine Ball-Grid Array (FBGA) Wire Bond FineLine Ball-Grid Array (FBGA) Option Wire Bond Ultra FineLine Ball-Grid Array (UBGA) Wire Bond FineLine Ball-Grid Array (FBGA) Option Wire Bond
EP3C55
FineLine Ball-Grid Array (FBGA) Option Wire Bond Ultra FineLine Ball-Grid Array (UBGA) Wire Bond FineLine Ball-Grid Array (FBGA) Option Wire Bond
EP3C80
FineLine Ball-Grid Array (FBGA) Option Wire Bond Ultra FineLine Ball-Grid Array (UBGA) Wire Bond FineLine Ball-Grid Array (FBGA) Option Wire Bond
Altera Corporation Confidential Internal Only July 2007
15-1 Preliminary
Package Information Cyclone Devices
Table 15-1. Cyclone Device Package Options (Part Device
EP3C120
Package
FineLine Ball-Grid Array (FBGA) Option Wire Bond FineLine Ball-Grid Array (FBGA) Option Wire Bond
Pins
Notes Table 15-1:
E144 package exposed bottom package. This exposed ground that must connected ground plane your PCB. This exposed used electrical connectivity thermal purposes. package type entries with "Option refer instances where multiple package options exist given package type count. Option number identifies specific type used corresponding device density.
Thermal Resistance Package Outlines Referenced Documents Document Revision History
thermal resistance specifications Cyclone devices, refer Cyclone Series Device Thermal Resistance Data Sheet.
Cyclone device package outlines downloaded from Device Packaging Specifications page.
This chapter references following document:
Cyclone Series Device Thermal Resistance Data Sheet
Table 15-2 shows revision history this document.
Table 15-2. Document Revision History Date Document Version
July 2007 v1.1 March 2007 v1.0
Changes Made
Added chapter "Referenced Documents" section. Initial Release
Summary Changes
15-2 Cyclone Device Handbook, Volume
Altera Corporation Confidential Internal Only July 2007
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