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CII51015-2.3 This chapter provides package information Altera® Cy


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Package Information Cyclone Devices
CII51015-2.3
This chapter provides package information Altera® Cyclone® devices, including:
Device package cross reference Thermal resistance values Package outlines
Table 15-1 shows Cyclone device package options.
Table 15-1. Cyclone Device Package Options Device
EP2C5
Package
Plastic Thin Quad Flat Pack (TQFP) Wirebond Plastic Quad Flat Pack (PQFP) Wirebond profile FineLine BGA® Wirebond
Pins
EP2C8
TQFP Wirebond PQFP Wirebond profile FineLine Wirebond
EP2C15
profile FineLine BGA, Option Wirebond FineLine BGA, Option Wirebond
EP2C20
PQFP Wirebond profile FineLine BGA, Option Wirebond FineLine BGA, Option Wirebond
EP2C35
FineLine BGA, Option Wirebond Ultra FineLine Wirebond FineLine BGA, Option Wirebond
EP2C50
FineLine BGA, Option Wirebond Ultra FineLine Wirebond FineLine BGA, Option Wirebond
EP2C70
FineLine BGA, Option Wirebond FineLine Wirebond
Altera Corporation February 2007
15-1
Thermal Resistance
Thermal Resistance
Thermal resistance values Cyclone devices provided board meeting JEDEC specifications typical board. values provided follows:
C/W) Still Air-Junction-to-ambient thermal resistance with airflow when heat sink being used. C/W) ft./minute-Junction-to-ambient thermal resistance with ft./minute airflow when heat sink being used. C/W) ft./minute-Junction-to-ambient thermal resistance with ft./minute airflow when heat sink being used. C/W) ft./minute-Junction-to-ambient thermal resistance with ft./minute airflow when heat sink being used. C/W)-Junction-to-case thermal resistance device. C/W)-Junction-to-board thermal resistance specific board being used.
Table 15-2 provides (junction-to-ambient thermal resistance) values (junction-to-case thermal resistance) values Cyclone devices board meeting JEDEC specifications thermal resistance calculation. JEDEC board specifications require signal power/ground planes available www.jedec.org.
Table 15-2. Thermal Resistance Cyclone Devices Board Meeting JEDEC Specifications (Part Device
EP2C5
Count
Package
TQFP PQFP FineLine TQFP PQFP FineLine FineLine FineLine PQFP FineLine FineLine FineLine Ultra FineLine FineLine
C/W) Still
30.4 30.2 29.8 30.2 24.2 26.6 24.2 19.4 20.6 18.6
C/W) C/W) C/W) ft./min. ft./min. ft./min.
29.3 29.2 26.1 28.3 28.8 15.4 16.6 14.6 27.9 27.3 23.6 26.9 26.9 20.5 17.8 14.8 21.4 17.8 14.8 13.3 14.5 12.6 25.5 22.3 21.7 24.9 21.7 18.5 13.1 17.4 13.1 11.7 12.8 11.1
C/W)
EP2C8
EP2C15
EP2C20
EP2C35
15-2 Cyclone Device Handbook, Volume
Altera Corporation February 2007
Package Information Cyclone Devices
Table 15-2. Thermal Resistance Cyclone Devices Board Meeting JEDEC Specifications (Part Device
EP2C50
Count
Package
FineLine Ultra FineLine FineLine FineLine FineLine
C/W) Still
18.4 19.6 17.7 16.9 16.3
C/W) C/W) C/W) ft./min. ft./min. ft./min.
14.4 15.6 13.7 11.9 12.4 13.6 11.8 11.1 10.5 10.9 11.9 10.2
C/W)
EP2C70
Table 15-3 provides board dimension information each package.
Table 15-3. Dimensions Notes (1), Thick
F896 F672 F672 F484 F484 U484 U484 F256 Notes Table 15-3:
Power layer thickness Signal layer thickness
Signal Layers
Power/Ground Layers
Package Dimension (mm)
Board Dimension (mm)
Altera Corporation February 2007
15-3 Cyclone Device Handbook, Volume
Package Outlines
Table 15-4 provides (junction-to-ambient thermal resistance) values, (junction-to-case thermal resistance) values, (junction-to-board thermal resistance) values Cyclone devices typical board.
Table 15-4. Thermal Resistance Cyclone Devices Typical Board Device
EP2C5 EP2C8
Count
Package
FineLine FineLine FineLine FineLine FineLine FineLine FineLine Ultra FineLine FineLine FineLine FineLine Ultra FineLine Ultra FineLine FineLine FineLine FineLine FineLine
C/W) C/W) C/W) C/W) ft./min. ft./min. ft./min. C/W) Still
30.2 27.9 24.7 20.5 24.7 20.5 18.8 17.4 17.7 18.1 19.4 16.5 15.7 15.9 14.6 25.8 23.2 20.1 16.2 20.1 16.2 14.5 15.5 13.3 13.5 13.8 14.6 12.4 11.7 11.9 10.7 22.9 20.5 17.5 13.9 17.5 13.9 12.3 13.2 11.3 11.4 11.7 12.3 12.7 10.5 20.6 18.4 15.3 12.2 15.3 12.2 10.6 11.3 10.1 10.6 10.9
C/W)
14.8 12.3
EP2C15 EP2C20 EP2C35 EP2C50 EP2C70
Package Outlines
package outlines following pages listed order ascending count.
144-Pin Plastic Thin Quad Flat Pack (TQFP) Wirebond
dimensions tolerances conform ASME Y14.5M 1994. Controlling dimension millimeters. indicated dot, special feature, proximity package surface.
15-4 Cyclone Device Handbook, Volume
Altera Corporation February 2007
Package Information Cyclone Devices
Tables 15-5 15-6 show package information package outline figure references, respectively, 144-pin TQFP package.
Table 15-5. 144-Pin TQFP Package Information Description
Ordering code reference Package acronym Lead frame material Lead finish (plating) JEDEC Outline Reference Maximum lead coplanarity Weight Moisture sensitivity level TQFP Copper Regular: 85Sn:15Pb (Typ.) Pb-free: Matte MS-026 Variation: 0.003 inches (0.08mm) Printed moisture barrier
Specification
Table 15-6. 144-Pin TQFP Package Outline Dimensions Millimeter Symbol Min.
0.20 0.17 0.09 0.45 0.05 1.35
Nom.
1.40 22.00 20.00 22.00 20.00 0.60 1.00 0.22 0.50 3.5°
Max.
1.60 0.15 1.45
0.75
0.27 0.20
Altera Corporation February 2007
15-5 Cyclone Device Handbook, Volume
Package Outlines
Figure 15-1 shows 144-pin TQFP package outline. Figure 15-1. 144-Pin TQFP Package Outline
Detail
DETAIL Gage Plane 0.25mm
15-6 Cyclone Device Handbook, Volume
Altera Corporation February 2007
Package Information Cyclone Devices
208-Pin Plastic Quad Flat Pack (PQFP) Wirebond
dimensions tolerances conform ASME Y14.5M 1994. Controlling dimension millimeters. indicated proximity package surface.
Tables 15-7 15-8 show package information package outline figure references, respectively, 208-pin PQFP package.
Table 15-7. 208-Pin PQFP Package Information Description
Ordering code reference Package acronym Lead material Lead finish (plating) JEDEC Outline Reference Maximum lead coplanarity Weight Moisture sensitivity level PQFP Copper Regular: 85Sn:15Pb (Typ.) Pb-free: Matte MS-029 Variation: FA-1 0.003 inches (0.08 Printed moisture barrier
Specification
Table 15-8. 208-Pin PQFP Package Outline Dimensions (Part Millimeter Symbol Min.
0.20 0.17 0.09 0.50 0.25 3.20
Nom.
3.40 30.60 28.00 30.60 28.00 0.60 1.30
Max.
4.10 0.50 3.60
0.75
0.27 0.20
Altera Corporation February 2007
15-7 Cyclone Device Handbook, Volume
Package Outlines
Table 15-8. 208-Pin PQFP Package Outline Dimensions (Part Millimeter Symbol Min.
Nom.
0.50 3.5°
Max.
Figure 15-2 shows 208-pin PQFP package outline. Figure 15-2. 208-pin PQFP Package Outline
Detail
Detail
Gage Plane
0.25mm
15-8 Cyclone Device Handbook, Volume
Altera Corporation February 2007
Package Information Cyclone Devices
240-Pin Plastic Quad Flat Pack (PQFP)
dimensions tolerances conform ASME Y14.5M 1994. Controlling dimension millimeters. indicated dot, special feature, proximity package surface.
Tables 15-9 15-10 show package information package outline figure references, respectively, 240-pin PQFP package.
Table 15-9. 240-Pin PQFP Package Information Description
Ordering Code Reference Package Acronym Leadframe Material Lead Finish (Plating) JEDEC Outline Reference Maximum Lead Coplanarity Weight Moisture Sensitivity Level PQFP Copper Regular: 85Sn:15Pb (Typ.) Pb-free: Matte MS-029 Variation: 0.003 inches (0.08mm) Printed moisture barrier
Specification
Table 15-10. 240-Pin PQFP Package Outline Dimensions (Part Millimeter Symbol Min.
0.20 0.17 0.09 0.45 0.25 3.20
Nom.
3.40 34.60 32.00 34.60 32.00 0.60 1.30
Max.
4.10 0.50 3.60
0.75
0.27 0.20
Altera Corporation February 2007
15-9 Cyclone Device Handbook, Volume
Package Outlines
Table 15-10. 240-Pin PQFP Package Outline Dimensions (Part Millimeter Symbol Min.
Nom.
0.50 3.5°
Max.
Figure 15-3 shows 240-pin PQFP package outline. Figure 15-3. 240-pin PQFP Package Outline
Detail
DETAIL
Gage Plane 0.25mm
15-10 Cyclone Device Handbook, Volume
Altera Corporation February 2007
Package Information Cyclone Devices
256-Pin FineLine Ball-Grid Array, Option Wirebond
dimensions tolerances conform ASME Y14.5M 1994. Controlling dimension millimeters. indicated dot, special feature, proximity package surface. This applicable F256 package Cyclone product only. Tables 15-11 15-12 show package information package outline figure references, respectively, 256-pin FineLine package.
Table 15-11. 256-Pin FineLine Package Information Description
Ordering code reference Package acronym Substrate material Solder ball composition JEDEC Outline Reference Maximum lead coplanarity Weight Moisture sensitivity level FineLine Regular: 63Sn:37Pb (Typ.) Pb-free: Sn:3Ag:0.5Cu (Typ.) MO-192 Variation: AAF-1
Specification
0.008 inches (0.20 Printed moisture barrier
Table 15-12. 256-Pin FineLine Package Outline Dimensions Millimeter Symbol Min.
0.40 0.25
Nom.
1.05 17.00 17.00 0.50 1.00
Max.
1.55
0.80
0.55
Altera Corporation February 2007
15-11 Cyclone Device Handbook, Volume
Package Outlines
Figure 15-4 shows 256-pin FineLine package outline. Figure 15-4. 256-Pin FineLine Package Outline
VIEW
BOTTOM VIEW
Corner
15-12 Cyclone Device Handbook, Volume
Altera Corporation February 2007
Package Information Cyclone Devices
484-Pin FineLine BGA, Option Wirebond
dimensions tolerances conform ASME Y14.5M 1994. Controlling dimension millimeters. indicated dot, special feature, proximity package surface. Tables 15-13 15-14 show package information package outline figure references, respectively, 484-pin FineLine package.
Table 15-13. 484-Pin FineLine Package Information Description
Ordering code reference Package acronym Substrate material Solder ball composition JEDEC Outline Reference Maximum lead coplanarity Weight Moisture sensitivity level FineLine Regular: 63Sn:37Pb (Typ.) Pb-free: Sn:3Ag:0.5Cu (Typ.) MS-034 Variation: AAJ-1
Specification
0.008 inches (0.20 Printed moisture barrier
Table 15-14. 484-Pin FineLine Package Outline Dimensions Millimeter Symbol Min.
0.50 0.30
Nom.
23.00 23.00 0.60 1.00
Max.
2.60 2.20 1.80
0.70
Altera Corporation February 2007
15-13 Cyclone Device Handbook, Volume
Package Outlines
Figure 15-5 shows 484-pin FineLine package outline. Figure 15-5. 484-Pin FineLine Package Outline
VIEW BOTTOM VIEW
Corner
15-14 Cyclone Device Handbook, Volume
Altera Corporation February 2007
Package Information Cyclone Devices
484-Pin Ultra FineLine Wirebond
dimensions tolerances conform ASME Y14.5M 1994. Controlling dimension millimeters. indicated dot, special feature, proximity package surface. Tables 15-15 15-16 show package information package outline figure references, respectively, 484-pin Ultra FineLine package.
Table 15-15. 484-Pin Ultra FineLine Package Information Description
Ordering Code Reference Package Acronym Substrate Material Solder Ball Composition JEDEC Outline Reference Maximum Lead Coplanarity Weight Moisture Sensitivity Level UBGA Regular: 63Sn:37Pb (Typ.) Pb-free: Sn:3Ag:0.5Cu (Typ.) MO-216 Variation: BAP-2 0.005 inches (0.12mm) Printed moisture barrier
Specification
Table 15-16. 484-Pin Ultra FineLine Package Outline Dimensions Millimeter Symbol Min.
0.40 0.20 0.65
Nom.
0.80 19.00 19.00 0.50 0.80
Max.
2.20
0.60
Altera Corporation February 2007
15-15 Cyclone Device Handbook, Volume
Package Outlines
Figure 15-6 shows 484-pin Ultra FineLine package outline. Figure 15-6. 484-Pin Ultra FineLine Package Outline
VIEW
BOTTOM VIEW
Corner
15-16 Cyclone Device Handbook, Volume
Altera Corporation February 2007
Package Information Cyclone Devices
672-Pin FineLine Package, Option Wirebond
dimensions tolerances conform ASME Y14.5M 1994. Controlling dimension millimeters. indicated dot, special feature, proximity package surface.
Tables 15-17 15-18 show package information package outline figure references, respectively, 672-pin FineLine package.
Table 15-17. 672-Pin FineLine Package Information Description
Ordering code reference Package acronym Substrate material Solder ball composition JEDEC Outline Reference Maximum lead coplanarity Weight Moisture sensitivity level FineLine Regular: 63Sn:37Pb (Typ.) Pb-free: Sn:3Ag:0.5Cu (Typ.) MS-034 Variation: AAL-1
Specification
0.008 inches (0.20 Printed moisture barrier
Table 15-18. 672-Pin FineLine Package Outline Dimensions Dimensions (mm) Symbol Min.
0.50 0.30
Nom.
27.00 27.00 0.60 1.00
Max.
2.60 2.20 1.80
0.70
Altera Corporation February 2007
15-17 Cyclone Device Handbook, Volume
Package Outlines
Figure 15-7 shows 672-pin FineLine package outline. Figure 15-7. 672-Pin FineLine Package Outline
VIEW BOTTOM VIEW
Corner
15-18 Cyclone Device Handbook, Volume
Altera Corporation February 2007
Package Information Cyclone Devices
896-Pin FineLine Package Wirebond
dimensions tolerances conform ASME Y14.5M 1994. Controlling dimension millimeters. A1's location indicated proximity package surface.
Tables 15-19 15-20 show package information package outline figure references, respectively, 896-pin FineLine BGA.
Table 15-19. 896-Pin FineLine Package Information Description
Ordering code reference Package acronym Substrate material Solder ball composition JEDEC outline reference Maximum lead coplanarity Weight Moisture sensitivity level FineLine Regular: 63Sn: 37Pb (typical) Pb-free: 3.0Ag: 0.5Cu (typical) MS-034 variation AAN-1 0.008 inches (0.20 11.5 Printed moisture barrier
Specification
Table 15-20. 896-Pin FineLine Package Outline Dimensions Dimensions (mm) Symbol Min.
0.50 0.30
Nom.
31.00 31.00 0.60 1.00
Max.
2.60 2.20 1.80
0.70
Altera Corporation February 2007
15-19 Cyclone Device Handbook, Volume
Package Outlines
Figure 15-8 shows 896-pin FineLine package outline. Figure 15-8. 896-Pin FineLine Package Outline
VIEW BOTTOM VIEW
Corner
15-20 Cyclone Device Handbook, Volume
Altera Corporation February 2007
Package Information Cyclone Devices
Document Revision History
Table 15-21 shows revision history this document.
Table 15-21. Document Revision History Date Document Version
February 2007 v2.3
Changes Made
Added document revision history.
Summary Changes
November 2005 Updated information throughout. v2.1 July 2005 v2.0 Updated packaging information.
November 2004 Added document Cyclone Device Handbook. v1.0
Altera Corporation February 2007
15-21 Cyclone Device Handbook, Volume
Document Revision History
15-22 Cyclone Device Handbook, Volume
Altera Corporation February 2007

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