MPC755 RISC Microprocessor Hardware Specifications Addendum XPC755xxxn

The Datasheet Archive - 100 Million Datasheets from 7500 Manufacturers.

MPC755 RISC Microprocessor Hardware Specifications Addendum XPC755xxxn

Datasheet Thumbnail

Top Searches for this datasheet

Document Number: MPC755ECS03AD Rev. 0.1, 02/2006
MPC755 RISC Microprocessor Hardware Specifications Addendum XPC755xxxnnnLE Series
This document describes part-number-specific changes recommended operating conditions revised electrical specifications, applicable, from those described general MPC755 RISC Microprocessor Hardware Specifications (MPC755EC). MPC755 MPC745 reduced instruction computing (RISC) microprocessors that implement PowerPCinstruction architecture. devices described this specification longer production this document provided reference only. recommended upgrades replacement devices, contact your Freescale sales office. Specifications provided this document supersede those MPC755 RISC Microprocessor Hardware Specifications, Rev. later, part numbers listed Table only. Specifications addressed herein unchanged. Note that headings table numbers this document consecutively numbered. They intended correspond heading table affected general hardware specification. Freescale Part Numbers Affected:
XPC755BRX400LE XPC755BPX400LE XPC755CRX450LE
This document contains information product. Specifications information herein subject change without notice.
Freescale Semiconductor, Inc., 2003, 2006. rights reserved.
Part numbers addressed this document listed Table more detailed ordering information, Section "Ordering Information."
Table Part Numbers Addressed This Data Sheet
Operating Conditions Freescale Part Number Frequency (MHz) (°C) Significant Differences from Hardware Specification
±100
XPC755BRX400LE XPC755BPX400LE XPC755CRX450LE
Modified power specifications. These devices longer production.
Note: prefix Freescale PowerPC part number designates "Pilot Production Prototype" defined Freescale 3-13. These from limited production volume prototypes manufactured, tested, Q.A. inspected qualified technology simulate normal production. These parts have only preliminary reliability characterization data. Before pilot production prototypes shipped, written authorization from customer must file applicable sales office acknowledging qualification status fact that product changes still occur while shipping pilot production prototypes.
Electrical Characteristics
Table Recommended Operating Conditions
Recommended Value Characteristic Symbol MHz, 2.10 2.10 2.10 Unit Notes
Core supply voltage supply voltage supply voltage
AVDD L2AVDD
1.90 1.90 1.90
Notes: These recommended tested operating conditions. Proper device operation outside these conditions guaranteed. nominal.
MPC755 RISC Microprocessor Hardware Specifications Addendum XPC755xxxnnnLE Series, Rev.
Table Power Consumption MPC755
Processor (CPU) Frequency Unit Full-Power Mode Typical Maximum Doze Mode Maximum Mode Maximum Sleep Mode Maximum Sleep Mode (PLL Disabled) Maximum Notes
Notes: These values apply valid processor ratios. values include supply power (OVDD L2OVDD) PLL/DLL supply power (AVDD L2AVDD). OVDD L2OVDD power system dependent, typically <10% power. Worst case power consumption AVDD L2AVDD Maximum power measured nominal (see Table while running entirely cache-resident, contrived sequence instructions which keep execution units maximally busy. Typical power average value measured nominal recommended (see Table 65°C system while running typical code sequence. 100% tested. Characterized periodically sampled.
4.2.1
Clock Specifications
Table Clock Timing Specifications
recommended operating conditions (see Table
Maximum Processor Core Frequency Characteristic Symbol Processor frequency frequency fcore fVCO Unit Notes
Note: Caution: SYSCLK frequency PLL_CFG[0:3] settings must chosen such that resulting SYSCLK (bus) frequency, (core) frequency, (VCO) frequency exceed their respective maximum minimum operating frequencies. Refer PLL_CFG[0:3] signal description Section 1.8.1, "PLL Configuration," valid PLL_CFG[0:3] settings.
MPC755 RISC Microprocessor Hardware Specifications Addendum XPC755xxxnnnLE Series, Rev. Freescale Semiconductor
Ordering Information
10.1
Ordering Information
Part Numbers Addressed This Specification
Table Part Numbering Nomenclature
Table provides ordering information MPC755 parts described this specification.
Product Code
Part Identifier
Process Descriptor HiP4DP
Package CBGA PBGA
Processor Frequency
Application Modifier ±100 105°C
Revision Level 2.8; 0008 3203
HiP4DP
CBGA
Notes: prefix Freescale part number designates "Pilot Production Prototype" defined Freescale 3-13. These from limited production volume prototypes manufactured, tested, Q.A. inspected qualified technology simulate normal production. These parts have only preliminary reliability characterization data. Before pilot production prototypes shipped, written authorization from customer must file applicable sales office acknowledging qualification status fact that product changes still occur while shipping pilot production prototypes.
MPC755 RISC Microprocessor Hardware Specifications Addendum XPC755xxxnnnLE Series, Rev.
Ordering Information
10.3
Part Marking
Parts marked example shown Figure
MPC755B RX400LE MMMMMM ATWLYYWWA
Notes: MMMMMM 6-digit mask number. ATWLYYWWA traceability code. CCCCC country assembly. This space left blank parts assembled United States.
Figure Part Marking Device
MPC755 RISC Microprocessor Hardware Specifications Addendum XPC755xxxnnnLE Series, Rev. Freescale Semiconductor
Document Revision History
Table provides revision history this hardware specifications addendum.
Table Document Revision History
Rev. Date 02/15/2006 Editor/ Writer BM/NB Substantive Change(s) Changed document order number (was MPC755XLEPNS, Rev. Updated Freescale template. Updated section numbers match hardware specifications document. Initial release.
MPC755 RISC Microprocessor Hardware Specifications Addendum XPC755xxxnnnLE Series, Rev.
Ordering Information
THIS PAGE INTENTIONALLY LEFT BLANK
MPC755 RISC Microprocessor Hardware Specifications Addendum XPC755xxxnnnLE Series, Rev. Freescale Semiconductor
Reach
Home Page: www.freescale.com email: support@freescale.com USA/Europe Locations Listed: Freescale Semiconductor Technical Information Center, CH370 1300 Alma School Road Chandler, Arizona 85224 (800) 521-6274 480-768-2130 support@freescale.com Europe, Middle East, Africa: Freescale Halbleiter Deutschland GmbH Technical Information Center Schatzbogen 81829 Muenchen, Germany 1296 (English) 52200080 (English) 92103 (German) (French) support@freescale.com Japan: Freescale Semiconductor Japan Ltd. Headquarters ARCO Tower 1-8-1, Shimo-Meguro, Meguro-ku Tokyo 153-0064, Japan 0120 191014 5437 9125 support.japan@freescale.com Asia/Pacific: Freescale Semiconductor Hong Kong Ltd. Technical Information Center King Street Industrial Estate, N.T., Hong Kong +800 2666 8080 support.asia@freescale.com Literature Requests Only: Freescale Semiconductor Literature Distribution Center P.O. 5405 Denver, Colorado 80217 (800) 441-2447 303-675-2140 Fax: 303-675-2150 LDCForFreescaleSemiconductor @hibbertgroup.com
Information this document provided solely enable system software implementers Freescale Semiconductor products. There express implied copyright licenses granted hereunder design fabricate integrated circuits integrated circuits based information this document. Freescale Semiconductor reserves right make changes without further notice products herein. Freescale Semiconductor makes warranty, representation guarantee regarding suitability products particular purpose, does Freescale Semiconductor assume liability arising application product circuit, specifically disclaims liability, including without limitation consequential incidental damages. "Typical" parameters which provided Freescale Semiconductor data sheets and/or specifications vary different applications actual performance vary over time. operating parameters, including "Typicals" must validated each customer application customer's technical experts. Freescale Semiconductor does convey license under patent rights rights others. Freescale Semiconductor products designed, intended, authorized components systems intended surgical implant into body, other applications intended support sustain life, other application which failure Freescale Semiconductor product could create situation where personal injury death occur. Should Buyer purchase Freescale Semiconductor products such unintended unauthorized application, Buyer shall indemnify hold Freescale Semiconductor officers, employees, subsidiaries, affiliates, distributors harmless against claims, costs, damages, expenses, reasonable attorney fees arising directly indirectly, claim personal injury death associated with such unintended unauthorized use, even such claim alleges that Freescale Semiconductor negligent regarding design manufacture part. Freescaleand Freescale logo trademarks Freescale Semiconductor, Inc. described product contains PowerPC processor core. PowerPC name trademark Corp. used under license. other product service names property their respective owners.
Freescale Semiconductor, Inc., 2003, 2006.
Document Number: MPC755ECS03AD Rev. 02/2006

MPC755 RISC Microprocessor Hardware Specifications Addendum XPC755xxxn

Top Searches for this datasheet

Other recent searches