Heterojunction Bipolar Transistor (InGaP HBT) Broadband High Line
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Document Number: MMG3010NT1 Rev. 7/2007
Heterojunction Bipolar Transistor (InGaP HBT)
Broadband High Linearity Amplifier
MMG3010NT1 General Purpose Amplifier that internally input output matched. designed broad range Class small signal, high linearity, general purpose applications. suitable applications with frequencies from 6000 such Cellular, small signal Features Frequency: 6000 P1dB: Small Signal Gain: Third Order Output Intercept Point: Single Volt Supply Internally Matched Ohms Cost Surface Mount Package RoHS Compliant Tape Reel. Suffix 1000 Units inch Reel.
MMG3010NT1
6000 MHz, InGaP
CASE 1514 STYLE PLASTIC
Table Typical Performance
Characteristic Small Signal Gain (S21) Input Return Loss (S11) Output Return Loss (S22) Power Output @1dB Compression Third Order Output Intercept Point Symbol P1db 2140 16.5 3500 15.5 Unit
Table Maximum Ratings
Rating Supply Voltage Supply Current Input Power Storage Temperature Range Junction Temperature
Symbol Tstg
Value +150
Unit
Continuous voltage current applied device. reliable operation, junction temperature should exceed 150°C.
Vdc, 25°C, system
Table Thermal Characteristics (VCC Vdc, 25°C)
Characteristic Thermal Resistance, Junction Case Symbol Value Unit °C/W
Refer AN1955, Thermal Measurement Methodology Power Amplifiers. http://www.freescale.com/rf. Select Documentation/Application Notes AN1955.
Freescale Semiconductor, Inc., 2005-2007. rights reserved.
MMG3010NT1
Device Data Freescale Semiconductor
Table Electrical Characteristics (VCC Vdc, MHz, 25°C, system, Freescale Application Circuit)
Characteristic Small Signal Gain (S21) Input Return Loss (S11) Output Return Loss (S22) Power Output Compression Third Order Output Intercept Point Noise Figure Supply Current Supply Voltage Symbol P1dB Unit
reliable operation, junction temperature should exceed 150°C.
MMG3010NT1 Device Data Freescale Semiconductor
Table Functional Description
Number RFin Ground RFout/DC Supply Function
Figure Functional Diagram
Table Protection Characteristics
Test Methodology Human Body Model (per JESD A114) Machine Model (per EIA/JESD A115) Charge Device Model (per JESD C101) Class (Minimum) (Minimum) (Minimum)
Table Moisture Sensitivity Level
Test Methodology JESD A113, IPC/JEDEC Rating Package Peak Temperature Unit
MMG3010NT1 Device Data Freescale Semiconductor
TYPICAL CHARACTERISTICS
SMALL-SIGNAL GAIN (dB) 85°C 40°C
25°C S11, (dB)
FREQUENCY (GHz) FREQUENCY (GHz)
Figure Small Signal Gain (S21) versus Frequency
Figure Input/Output Return Loss versus Frequency
P1dB, COMPRESSION POINT (dBm) 1960 2600 2140
FREQUENCY (GHz)
SMALL-SIGNAL GAIN (dB)
3500
Pout, OUTPUT POWER (dBm)
Figure Small Signal Gain versus Output Power
IP3, THIRD ORDER OUTPUT INTERCEPT POINT (dBm) ICC, COLLECTOR CURRENT (mA) VCC, COLLECTOR VOLTAGE
Figure P1dB versus Frequency
Tone Spacing FREQUENCY (GHz)
Figure Collector Current versus Collector Voltage
Figure Third Order Output Intercept Point versus Frequency
MMG3010NT1 Device Data Freescale Semiconductor
TYPICAL CHARACTERISTICS
IP3, THIRD ORDER OUTPUT INTERCEPT POINT (dBm) IP3, THIRD ORDER OUTPUT INTERCEPT POINT (dBm) Tone Spacing
Tone Spacing 4.95 5.05 VCC, COLLECTOR VOLTAGE
TEMPERATURE (_C)
Figure Third Order Output Intercept Point versus Collector Voltage
Figure Third Order Output Intercept Point versus Case Temperature
IMD, THIRD ORDER INTERMODULATION DISTORTION (dBc)
MTTF (YEARS) Tone Spacing Pout, OUTPUT POWER (dBm) JUNCTION TEMPERATURE (°C) NOTE: MTTF calculated with Vdc,
Figure Third Order Intermodulation versus Output Power
Figure MTTF versus Junction Temperature
ACPR, ADJACENT CHANNEL POWER RATIO (dB)
Vdc, 2140 Single-Carrier W-CDMA, 3.84 Channel Bandwidth 0.01% Probability (CCDF)
NOISE FIGURE (dB)
FREQUENCY (GHz)
Pout, OUTPUT POWER (dBm)
Figure Noise Figure versus Frequency
Figure Single Carrier CDMA Adjacent Channel Power Ratio versus Output Power MMG3010NT1
Device Data Freescale Semiconductor
APPLICATION CIRCUIT:
VSUPPLY
INPUT
OUTPUT
0.347 0.058 Microstrip 0.575 0.058 Microstrip 0.172 0.058 Microstrip
0.403 0.058 Microstrip Getek Grade ML200C, 0.031,
Figure Test Circuit Schematic
S21, S11, (dB) FREQUENCY (MHz) MMG30XX
Figure S21, versus Frequency
Figure Test Circuit Component Layout
Table Test Circuit Component Designations Values
Part Description 0.01 Chip Capacitors 1000 Chip Capacitor Chip Inductor Chip Resistor Part Number C0603C103J5RAC C0603C102J5RAC BK2125HM471 ERJ3GEY0R00V Manufacturer Kemet Kemet Taiyo Yuden Panasonic
MMG3010NT1 Device Data Freescale Semiconductor
APPLICATION CIRCUIT: 3600
VSUPPLY
INPUT
OUTPUT
0.347 0.058 Microstrip 0.575 0.058 Microstrip 0.172 0.058 Microstrip
0.403 0.058 Microstrip Getek Grade ML200C, 0.031,
Figure Test Circuit Schematic
S21, S11, (dB) 1300 1800 2300 2800 3300 3800
MMG30XX
FREQUENCY (MHz)
Figure S21, versus Frequency
Figure Test Circuit Component Layout
Table Test Circuit Component Designations Values
Part Description Chip Capacitors 0.01 Chip Capacitor 1000 Chip Capacitor Chip Inductor Chip Resistor Part Number C0603C151J5RAC C0603C103J5RAC C0603C102J5RAC HK160856NJ ERJ3GEY0R00V Manufacturer Kemet Kemet Kemet Taiyo Yuden Panasonic
MMG3010NT1 Device Data Freescale Semiconductor
TYPICAL CHARACTERISTICS
Table Class Common Emitter Parameters Vdc, 255C
0.15 0.25 0.35 0.45 0.55 0.65 0.75 0.85 0.95 1.05 1.15 1.25 1.35 1.45 1.55 1.65 1.75 1.85 1.95 2.05 2.15 2.25 2.35 |S11| 0.18961 0.18946 0.18931 0.18916 0.18900 0.18887 0.18873 0.18856 0.18844 0.18829 0.18813 0.18799 0.18783 0.18769 0.18753 0.18738 0.18723 0.18703 0.18689 0.18674 0.18657 0.18643 0.18629 0.18613 0.18599 0.18582 0.18568 0.18567 0.18569 0.18591 0.18645 0.18767 0.18855 0.19030 0.19186 0.19364 0.19581 0.19775 0.20022 0.20274 0.20483 0.20673 0.21006 0.21183 0.21443 0.21661 174.356 172.591 170.087 168.286 166.103 163.926 161.691 159.363 157.207 154.948 152.775 150.556 148.43 146.278 144.103 142.071 140.126 138.174 136.334 134.574 132.862 131.57 130.147 128.841 127.621 126.515 125.418 124.471 123.602 122.392 120.668 119.047 117.338 115.719 114.043 112.379 110.938 109.449 108.079 106.526 105.054 103.673 102.263 100.83 99.385 98.005 |S21| 6.08599 6.06991 6.05558 6.04027 6.03125 6.01832 6.00664 5.99750 5.98612 5.97231 5.95537 5.94078 5.92660 5.90891 5.88998 5.86905 5.84578 5.82588 5.80670 5.77963 5.75495 5.72982 5.70191 5.67762 5.65132 5.62394 5.59479 5.56625 5.54822 5.52432 5.49674 5.46526 5.43646 5.40925 5.38177 5.35341 5.32341 5.29221 5.25998 5.22900 5.20224 5.16895 5.13639 5.10466 5.07001 5.03818 176.121 173.709 171.476 169.492 167.447 165.299 163.288 161.184 159.055 157.036 154.979 152.921 150.895 148.835 146.803 144.751 142.751 140.772 138.776 136.782 134.777 132.79 130.817 128.866 126.933 124.986 123.074 121.175 119.257 117.274 115.354 113.429 111.53 109.673 107.795 105.878 104.011 102.117 100.28 98.422 96.556 94.728 92.885 91.074 89.25 87.453 |S12| 0.10045 0.10051 0.10055 0.10060 0.10065 0.10069 0.10073 0.10078 0.10085 0.10090 0.10098 0.10111 0.10103 0.10115 0.10113 0.10130 0.10126 0.10142 0.10134 0.10156 0.10146 0.10159 0.10169 0.10184 0.10183 0.10196 0.10201 0.10211 0.10220 0.10258 0.10272 0.10283 0.10301 0.10315 0.10333 0.10340 0.10356 0.10384 0.10401 0.10405 0.10413 0.10441 0.10441 0.10468 0.10472 0.10489 1.147 1.684 2.764 3.23 3.883 4.61 5.218 5.914 6.577 7.176 7.816 8.444 9.124 9.76 10.388 11.106 11.715 12.347 13.049 13.635 14.317 14.945 15.594 16.271 16.958 17.615 18.236 18.888 19.552 20.344 20.962 21.702 22.327 23.09 23.804 24.547 25.192 25.884 26.62 27.296 28.065 28.819 29.517 30.238 30.97 31.768 |S22| 0.01890 0.01961 0.02022 0.02108 0.02178 0.02240 0.02324 0.02417 0.02490 0.02589 0.02683 0.02784 0.02895 0.03030 0.03176 0.03328 0.03472 0.03683 0.03847 0.04077 0.04304 0.04551 0.04827 0.05112 0.05460 0.05759 0.06146 0.06306 0.06362 0.06362 0.06377 0.06570 0.06858 0.07094 0.07392 0.07711 0.08039 0.08395 0.08764 0.09155 0.09523 0.09969 0.10388 0.10812 0.11217 0.11632 117.716 119.073 121.834 123.647 125.155 127.572 129.668 131.224 133.739 135.854 137.345 139.784 141.384 143.84 145.852 147.52 148.773 150.721 153.215 155.358 159.06 162.691 166.671 170.497 174.453 178.275 178.051 174.258 170.85 163.521 160.673 158.125 155.716 153.133 151.055 148.881 147.016 145.259 143.574 141.882 140.434 138.992 137.594 136.199 134.891 133.499
MMG3010NT1 Device Data Freescale Semiconductor
TYPICAL CHARACTERISTICS
Table Class Common Emitter Parameters Vdc, 255C (continued)
2.45 2.55 2.65 2.75 2.85 2.95 3.05 3.15 3.25 3.35 3.45 3.55 |S11| 0.21882 0.22193 0.22303 0.22524 0.22731 0.22921 0.23072 0.23259 0.23443 0.23625 0.23786 0.23979 0.24125 0.24422 0.24610 0.24792 0.25072 0.25383 0.25590 0.25874 0.26159 0.26531 0.26829 0.27180 0.27525 96.635 95.395 93.907 92.5 91.106 89.599 88.26 86.873 85.515 84.122 82.84 81.448 80.072 78.711 77.547 76.337 75.174 73.947 72.848 71.738 70.666 69.68 68.707 67.687 66.773 |S21| 5.00516 4.97224 4.93831 4.90747 4.87540 4.84438 4.81170 4.77720 4.74514 4.71210 4.68334 4.64992 4.61988 4.58846 4.55812 4.52495 4.49699 4.46681 4.43561 4.40430 4.37458 4.34458 4.31385 4.28470 4.25389 85.611 83.821 82.052 80.256 78.504 76.72 74.931 73.147 71.382 69.615 67.904 66.078 64.334 62.607 60.863 59.115 57.356 55.612 53.877 52.133 50.384 48.649 46.916 45.167 43.44 |S12| 0.10502 0.10521 0.10527 0.10541 0.10567 0.10587 0.10582 0.10600 0.10623 0.10637 0.10648 0.10664 0.10700 0.10702 0.10736 0.10733 0.10748 0.10765 0.10784 0.10813 0.10814 0.10821 0.10846 0.10856 0.10871 32.469 33.265 34.008 34.706 35.467 36.255 37.021 37.804 38.579 39.349 40.152 41.004 41.819 42.586 43.392 44.248 45.078 45.892 46.753 47.687 48.565 49.382 50.314 51.229 52.108 |S22| 0.12050 0.12557 0.12957 0.13384 0.13842 0.14269 0.14690 0.15188 0.15645 0.16075 0.16529 0.16969 0.17439 0.17909 0.18404 0.18914 0.19427 0.19983 0.20478 0.21036 0.21586 0.22115 0.22678 0.23264 0.23850 132.176 130.946 129.503 128.151 126.605 125.06 123.585 122.036 120.364 118.48 116.779 114.827 112.861 111.23 109.114 107.101 105.076 102.924 100.877 98.897 96.818 94.763 92.769 90.836 88.858
MMG3010NT1 Device Data Freescale Semiconductor
7.62 0.305 diameter
3.48 5.33 1.27 1.27 0.86 0.64 3.86 0.58
2.49
2.54
Recommended Solder Stencil
NOTES: THERMAL GROUNDING CONSIDERATIONS SHOULD USED LAYOUT DESIGN. DEPENDING DESIGN RULES, MANY VIAS POSSIBLE SHOULD PLACED LANDING PATTERN. VIAS CANNOT PLACED LANDING PATTERN, THEN MANY VIAS POSSIBLE SHOULD PLACED CLOSE LANDING PATTERN POSSIBLE OPTIMAL THERMAL PERFORMANCE. RECOMMENDED PATTERN SHOWN 0.381 0.762 PITCH.
Figure Recommended Mounting Configuration
MMG3010NT1 Device Data Freescale Semiconductor
PACKAGE DIMENSIONS
MMG3010NT1 Device Data Freescale Semiconductor
MMG3010NT1 Device Data Freescale Semiconductor
MMG3010NT1 Device Data Freescale Semiconductor
PRODUCT DOCUMENTATION
Refer following documents your design process. Application Notes AN1955: Thermal Measurement Methodology Power Amplifiers AN3100: General Purpose Amplifier Biasing
REVISION HISTORY
following table summarizes revisions this document.
Revision Date Mar. 2007 July 2007 Description Corrected updated Part Numbers Tables Component Designations Values, RoHS compliant part numbers, Replaced Case Outline 1514 with 1514 Issue Case updated missing dimension
MMG3010NT1 Device Data Freescale Semiconductor
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MMG3010NT1
Document Number: Device Data MMG3010NT1 Rev. 7/2007 Freescale Semiconductor
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