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Compatible with Existing 32-Bit Code Base 940-Pin Package Specific Fea
Top Searches for this datasheetOpteronTMProcessor Product Data Sheet Compatible with Existing 32-Bit Code Base 940-Pin Package Specific Features Including support SSE, SSE2, SSE3*, MMXTM, 3DNow!technology legacy instructions Refer Functional Data Sheet, 940-Pin Package, order# 31412, functional, *SSE3 supported later electrical, mechanical details 940-pin Runs existing operating systems drivers processors. Local APIC chip AMD64 Technology AMD64 technology instruction extensions 64-bit integer registers, 48-bit virtual addresses, 40-bit physical addresses Eight additional 64-bit integer registers total) Eight additional 128-bit SSE/SSE2/SSE3 registers total) Multi-Core Architecture Single-core dual-core options Discrete cache structures each core 64-Kbyte 2-Way Associative ECC-Protected Data Cache 64-bit operations cycle, 3-cycle latency 64-Kbyte 2-Way Associative Parity-Protected Instruction Cache With advanced branch prediction 1024-Kbyte (1-Mbyte) 16-Way Associative ECC-Protected Cache Exclusive cache architecture-storage addition caches Mbyte cache Machine Check Architecture Includes hardware scrubbing major ECC-protected arrays Power Management Multiple low-power states System Management Mode (SMM) ACPI compliant, including support processor performance states Electrical Interfaces HyperTransporttechnology: LVDS-Like differential, unidirectional SDRAM: SSTL_2 JEDEC specification Clock, reset, test signals also SDRAM-like electrical specifications Packaging 940-pin lidded ceramic organic micro 1.27-mm pitch array ceramic organic substrate Ceramic organic attach Integrated Memory Controller Low-latency, high-bandwidth 144-bit SDRAM 100, 133, 166, (200 supported later) Supports eight registered DIMMs checking with double-bit detect single-bit correct HyperTransportTechnology Devices Three links, 16-bits each direction, each supports 2000 MT/s GB/s each direction (2000MT/s supported later) Each link uniprocessor (UP) models supports connections devices. Each link dual-processor (DP) models supports connections devices, three available links connect another processor. Each link multiprocessor (MP) models supports connections devices other processors. Publication Issue Date: 23932 March 2007 Revision: 3.23 Advanced Micro Devices OpteronProcessor Product Data Sheet 23932 Rev. 3.23 March 2007 939-Pin Package Specific Features Refer Functional Data Sheet, 939-Pin Package, order# 31411, functional, electrical, mechanical details 939-pin package processors. Electrical Interfaces HyperTransporttechnology: LVDS-Like differential, unidirectional SDRAM: SSTL_2 JEDEC specification Clock, reset, test signals also SDRAM-like electrical specifications Packaging 939-pin lidded micro 1.27-mm pitch array organic substrate Organic attach Integrated Memory Controller Low-latency, high-bandwidth 144-bit SDRAM 100, 133, 166, Supports four unbuffered DIMMs checking with double-bit detect single-bit correct HyperTransportTechnology Devices 16-bit link supporting speeds (2000 MT/s) Gigabytes/s each direction Socket Processor Specific Features Refer Socket Processor Functional Data Sheet, order# 31117, functional mechanical details socket processors. Refer Family Processor Electrical Data Sheet, order# 31119, electrical details socket processors. Electrical Interfaces HyperTransportTechnology: LVDS-like differential, unidirectional DDR2 SDRAM: SSTL_1.8 JEDEC specification Clock, reset, test signals also DDR2 SDRAM-like electrical specifications Packaging Lidded micro grid array 1.27-mm pitch Compliant with RoHS Directive 2002/95/EC) with lead used only small amounts specifically exempted applications Integrated Memory Controller Low-latency, high-bandwidth 144-bit DDR2 SDRAM controller operating Supports four unbuffered DIMMs checking with double-bit detect singlebit correct HyperTransportTechnology Devices 16-bit link supporting speeds (2000 MT/s) Gigabytes/s each direction 23932 Rev. 3.23 March 2007 OpteronProcessor Product Data Sheet Socket (1207) Processor Specific Features Refer Socket (1207) Processor Functional Data Sheet, order# 31118 functional mechanical details socket (1207) processors. Refer Family Processor Electrical Data Sheet, order# 31119 electrical details socket (1207) processors. Electrical Interfaces HyperTransporttechnology: LVDS-Like differential, unidirectional DDR2 SDRAM: SSTL_2 JEDEC specification Clock, reset, test signals also DDR2 SDRAM-like electrical specifications Packaging Lidded Land Grid Array package grid array Compliant with RoHS Directive 2002/95/EC) with lead used only small amounts specifically exempted applications Integrated Memory Controller Low-latency, high-bandwidth 144-bit DDR2 SDRAM Supports eight registered DIMMs checking with double-bit detect singlebit correct On-line spare feature provides single-rank DRAM redundancy HyperTransportTechnology Devices Three links, 16-bits each direction, each supports 2000 MT/s GB/s each direction (2000MT/s supported later) Each link uniprocessor (UP) models supports connections devices. Each link dual-processor (DP) models supports connections devices, three available links connect another processor. Each link multiprocessor (MP) models supports connections devices other processors. OpteronProcessor Product Data Sheet 23932 Rev. 3.23 March 2007 Revision History Date March 2007 Revision 3.23 Description Public release. Corrected typo. Updated reference Socket (1207) Processor Functional Data Sheet. Public release. Added RoHS compliance statement Socket Socket (1207) specific features sections. Public release. Formatting changes. Updated with features. August 2006 3.19 July 2006 June 2005 3.17 3.13 2005 2007 Advanced Micro Devices, Inc. rights reserved. contents this document provided connection with Advanced Micro Devices, Inc. ("AMD") products. makes representations warranties with respect accuracy completeness contents this publication reserves right make changes specifications product descriptions time without notice. information contained herein preliminary advance nature subject change without notice. license, whether express, implied, arising estoppel otherwise, intellectual property rights granted this publication. Except forth AMD's Standard Terms Conditions Sale, assumes liability whatsoever, disclaims express implied warranty, relating products including, limited implied warranty merchantability, fitness particular purpose, infringement intellectual property right. AMD's products designed, intended, authorized warranted components systems intended surgical implant into body, other applications intended support sustain life, other application which failure AMD's product could create situation where personal injury, death, severe property environmental damage occur. reserves right discontinue make changes products time without notice. Trademarks AMD, Arrow logo, Opteron, combinations thereof, 3DNow! trademarks Advanced Micro Devices, Inc. HyperTransport licensed trademark HyperTransport Technology Consortium. trademark Intel Corporation. Other product names used this publication identification purposes only trademarks their respective companies. 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