4-Bit Binary Fill Adder With Fast Carry 'AC283 'ACT283 4-bit bina

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4-Bit Binary Fill Adder With Fast Carry 'AC283 'ACT283 4-bit bina

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CD54/74AC283, CD54/74ACT283
4-Bit Binary Fill Adder With Fast Carry
'AC283 'ACT283 4-bit binary adders with fast carry that utilize Advanced CMOS Logic technology. These devices 4-bit binary numbers generate carryout exceeds Because symmetry function, this device used with either active-HIGH operands (positive logic) with active-LOW operands (negative logic). When using positive logic, carry-in input must tied there carry-in.
August 1998 Revised 2000
Features
Buffered Inputs Exceeds Protection MIL-STD-883, Method 3015 SCR-Latchup-Resistant CMOS Process Circuit Design Speed Bipolar FASTTM/AS/S with Significantly Reduced Power Consumption Balanced Propagation Delays Types Feature 1.5V 5.5V Operation Balanced Noise Immunity Supply ±24mA Output Drive Current Fanout FASTICs Drives Transmission Lines
Ordering Information
PART NUMBER CD54AC283F3A CD74AC283E CD74AC283M CD54ACT283F3A CD74ACT283E CD74ACT283M NOTES: When ordering, entire part number. suffix obtain variant tape reel. Wafer this part number available which meets electrical specifications. Please contact your local sales office customer service ordering information. TEMP. RANGE (oC) 70oC, 70oC, 70oC, 70oC, SOIC PACKAGE CERDIP PDIP SOIC CERDIP PDIP
Pinout
CD54AC283, CD54ACT283 (CERDIP) CD74AC283, CD74ACT283 (PDIP, SOIC) VIEW
COUT
Functional Diagram
COUT
CAUTION: These devices sensitive electrostatic discharge. Users should follow proper Handling Procedures. FASTis Trademark Fairchild Semiconductor. Copyright 2000, Texas Instruments Incorporated
CD54/74AC283, CD54/74ACT283
Absolute Maximum Ratings
Supply Voltage, -0.5V Input Diode Current, -0.5V 0.5V .±20mA Output Diode Current, -0.5V 0.5V .±50mA Output Source Sink Current Output Pin, -0.5V 0.5V .±50mA Ground Current, IGND (Note .±100mA
Thermal Information
Thermal Impedance (Typical, Note (oC/W) PDIP Package 67oC/W SOIC Package 73oC/W Maximum Junction Temperature (Plastic Package) 150oC Maximum Storage Temperature Range .-65oC 150oC Maximum Lead Temperature (Soldering 10s) 300oC
Operating Conditions
Temperature Range, -55oC 125oC Supply Voltage Range, (Note Types. .1.5V 5.5V Types .4.5V 5.5V Input Output Voltage, Input Rise Fall Slew Rate, dt/dv Types, 1.5V 50ns (Max) Types, 3.6V 5.5V 20ns (Max) Types, 4.5V 5.5V. 10ns (Max)
CAUTION: Stresses above those listed "Absolute Maximum Ratings" cause permanent damage device. This stress only rating operation device these other conditions above those indicated operational sections this specification implied.
NOTES: outputs device, ±25mA each additional output. Unless otherwise specified, voltages referenced ground. package thermal impedance calculated accordance with JESD
Electrical Specifications
TEST CONDITIONS PARAMETER TYPES High Level Input Voltage Level Input Voltage High Level Output Voltage -0.05 -0.05 -0.05 (Note (Note 3.85 2.58 3.94 1.65 3.85 2.48 3.85 1.65 3.85 3.85 1.65 SYMBOL (mA) 25oC -40oC 85oC -55oC 125oC UNITS
CD54/74AC283, CD54/74ACT283
Electrical Specifications
(Continued) TEST CONDITIONS PARAMETER Level Output Voltage SYMBOL (mA) 0.05 0.05 0.05 (Note (Note Input Leakage Current Quiescent Supply Current TYPES High Level Input Voltage Level Input Voltage High Level Output Voltage -0.05 (Note (Note Level Output Voltage 0.05 (Note (Note Input Leakage Current Quiescent Supply Current Additional Supply Current Input Inputs High Unit Load NOTES: Test output time 1-second maximum duration. Measurement made forcing current measuring voltage minimize power dissipation. Test verifies minimum transmission-line-drive capability 85oC, 125oC. -2.1 3.94 0.36 ±0.1 3.85 0.44 1.65 3.85 1.65 25oC 0.36 0.36 ±0.1 -40oC 85oC 0.44 0.44 1.65 -55oC 125oC 1.65 UNITS
Input Load Table
INPUT UNIT LOAD 1.66
NOTE: Unit load limit specified Electrical Specifications Table, e.g., 2.4mA 25oC.
CD54/74AC283, CD54/74ACT283
Switching Specifications Input 3ns, 50pF (Worst Case)
-40oC 85oC PARAMETER TYPES Propagation Delay, COUT COUT tPLH, tPHL (Note (Note Propagation Delay, tPLH, tPHL Input Capacitance Power Dissipation Capacitance TYPES Propagation Delay, COUT COUT Propagation Delay, Input Capacitance Power Dissipation Capacitance NOTES: Limits tested 100%. 3.3V 3.6V, 5.5V, 4.5V. used determine dynamic power consumption function. VCC2 (CPD ACT: VCC2 (CPD where input frequency, output load capacitance, supply voltage. tPLH, tPHL (Note 17.6 (Note 22.4 23.2 16.5 24.6 17.6 25.5 18.2 SYMBOL -55oC 125oC UNITS
tPLH, tPHL (Note
16.5
18.2
OUTPUT INPUT LEVEL OUTPUT LOAD 50pF (NOTE)
INPUT
NOTE: Series Only: When 1.5V,
INVERTING OUTPUT
1.5V
Input Level Input Switching Voltage, Output Switching Voltage,
tPHL
tPLH
FIGURE PROPAGATION DELAY TIMES
FIGURE PROPAGATION DELAY TIMES
PACKAGE OPTION ADDENDUM
www.ti.com
28-Feb-2005
PACKAGING INFORMATION
Orderable Device CD54AC283F3A CD54ACT283F3A CD74AC283E CD74AC283M CD74AC283M96 CD74ACT283E CD74ACT283M CD74ACT283M96
Status ACTIVE ACTIVE ACTIVE ACTIVE ACTIVE ACTIVE ACTIVE ACTIVE
Package Type CDIP CDIP PDIP SOIC SOIC PDIP SOIC SOIC
Package Drawing
Pins Package Plan 2500 2500 None None Pb-Free (RoHS) Pb-Free (RoHS) Pb-Free (RoHS) Pb-Free (RoHS) Pb-Free (RoHS) Pb-Free (RoHS)
Lead/Ball Finish Call Call NIPDAU NIPDAU NIPDAU NIPDAU NIPDAU NIPDAU
Peak Temp Level-NC-NC-NC Level-NC-NC-NC Level-NC-NC-NC Level-2-250C-1 YEAR Level-2-250C-1 YEAR Level-NC-NC-NC Level-2-250C-1 YEAR Level-2-250C-1 YEAR
marketing status values defined follows: ACTIVE: Product device recommended designs. LIFEBUY: announced that device will discontinued, lifetime-buy period effect. NRND: recommended designs. Device production support existing customers, does recommend using this part design. PREVIEW: Device been announced production. Samples available. OBSOLETE: discontinued production device.
Plan currently available please check latest availability information additional product content details. None: available Lead (Pb-Free). Pb-Free (RoHS): TI's terms "Lead-Free" "Pb-Free" mean semiconductor products that compatible with current RoHS requirements substances, including requirement that lead exceed 0.1% weight homogeneous materials. Where designed soldered high temperatures, Pb-Free products suitable specified lead-free processes. Green (RoHS Sb/Br): defines "Green" mean "Pb-Free" addition, uses package materials that contain halogens, including bromine (Br) antimony (Sb) above 0.1% total product weight.
MSL, Peak Temp. Moisture Sensitivity Level rating according JEDECindustry standard classifications, peak solder temperature. Important Information Disclaimer:The information provided this page represents TI's knowledge belief date that provided. bases knowledge belief information provided third parties, makes representation warranty accuracy such information. Efforts underway better integrate information from third parties. taken continues take reasonable steps provide representative accurate information have conducted destructive testing chemical analysis incoming materials chemicals. suppliers consider certain information proprietary, thus numbers other limited information available release. event shall TI's liability arising such information exceed total purchase price part(s) issue this document sold Customer annual basis.
Addendum-Page
IMPORTANT NOTICE Texas Instruments Incorporated subsidiaries (TI) reserve right make corrections, modifications, enhancements, improvements, other changes products services time discontinue product service without notice. Customers should obtain latest relevant information before placing orders should verify that such information current complete. products sold subject TI's terms conditions sale supplied time order acknowledgment. warrants performance hardware products specifications applicable time sale accordance with TI's standard warranty. Testing other quality control techniques used extent deems necessary support this warranty. Except where mandated government requirements, testing parameters each product necessarily performed. assumes liability applications assistance customer product design. Customers responsible their products applications using components. minimize risks associated with customer products applications, customers should provide adequate design operating safeguards. does warrant represent that license, either express implied, granted under patent right, copyright, mask work right, other intellectual property right relating combination, machine, process which products services used. Information published regarding third-party products services does constitute license from such products services warranty endorsement thereof. such information require license from third party under patents other intellectual property third party, license from under patents other intellectual property Reproduction information data books data sheets permissible only reproduction without alteration accompanied associated warranties, conditions, limitations, notices. Reproduction this information with alteration unfair deceptive business practice. responsible liable such altered documentation. Resale products services with statements different from beyond parameters stated that product service voids express implied warranties associated product service unfair deceptive business practice. responsible liable such statements. Following URLs where obtain information other Texas Instruments products application solutions: Products Amplifiers Data Converters Interface Logic Power Mgmt Microcontrollers amplifier.ti.com dataconverter.ti.com dsp.ti.com interface.ti.com logic.ti.com power.ti.com microcontroller.ti.com Applications Audio Automotive Broadband Digital Control Military Optical Networking Security Telephony Video Imaging Wireless Mailing Address: Texas Instruments Post Office 655303 Dallas, Texas 75265 Copyright 2005, Texas Instruments Incorporated www.ti.com/audio www.ti.com/automotive www.ti.com/broadband www.ti.com/digitalcontrol www.ti.com/military www.ti.com/opticalnetwork www.ti.com/security www.ti.com/telephony www.ti.com/video www.ti.com/wireless

4-Bit Binary Fill Adder With Fast Carry 'AC283 'ACT283 4-bit bina

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