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SN74LVC2G17 DUAL SCHMITT TRIGGER BUFFER
Available Texas Instruments
NanoStar NanoFree Packages Supports Operation Inputs Accept Voltages Power Consumption, 10-µA ±24-mA Output Drive Typical VOLP (Output Ground Bounce) <0.8 25°C Typical VOHV (Output Undershoot) 25°C Ioff Supports Partial-Power-Down Mode Operation Latch-Up Performance Exceeds JESD Class Protection Exceeds JESD 2000-V Human-Body Model (A114-A) 1000-V Charged-Device Model (C101)
PACKAGE (TOP VIEW)
YEA, YEP, YZA, PACKAGE (BOTTOM VIEW)
description/ordering information
This dual Schmitt-trigger buffer designed 1.65-V 5.5-V operation. SN74LVC2G17 contains buffers performs Boolean function device functions independent buffers, because Schmitt action, have different input threshold levels positive-going (VT+) negative-going (VT-) signals. ORDERING INFORMATION
PACKAGE NanoStar WCSP (DSBGA) 0.17-mm Small Bump NanoFree WCSP (DSBGA) 0.17-mm Small Bump (Pb-free) NanoStar WCSP (DSBGA) 0.23-mm Large Bump -40°C 85°C NanoFree WCSP (DSBGA) 0.23-mm Large Bump (Pb-free) Reel 3000 (SOT-23) (SC-70) Reel Reel 3000 Reel Reel 3000 SN74LVC2G17YEPR SN74LVC2G17YZPR SN74LVC2G17DBVR SN74LVC2G17DBVT SN74LVC2G17DCKR SN74LVC2G17DCKT C17_ ORDERABLE PART NUMBER SN74LVC2G17YEAR SN74LVC2G17YZAR _C7_ TOP-SIDE MARKING
Package drawings, standard packing quantities, thermal data, symbolization, design guidelines available www.ti.com/sc/package. DBV/DCK: actual top-side marking additional character that designates assembly/test site. YEA/YZA, YEP/YZP: actual top-side marking three preceding characters denote year, month, sequence code, following character designate assembly/test site. identifier indicates solder-bump composition SnPb, Pb-free). Please aware that important notice concerning availability, standard warranty, critical applications Texas Instruments semiconductor products disclaimers thereto appears this data sheet. NanoStar NanoFree trademarks Texas Instruments.
PRODUCTION DATA information current publication date. Products conform specifications terms Texas Instruments standard warranty. Production processing does necessarily include testing parameters.
Copyright 2003, Texas Instruments Incorporated
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SN74LVC2G17 DUAL SCHMITT TRIGGER BUFFER
description/ordering information (continued)
NanoStar NanoFree package technology major breakthrough packaging concepts, using package. This device fully specified partial-power-down applications using Ioff. Ioff circuitry disables outputs, preventing damaging current backflow through device when powered down.
FUNCTION TABLE (each inverter) INPUT OUTPUT
logic diagram (positive logic)
absolute maximum ratings over operating free-air temperature range (unless otherwise noted)
Supply voltage range, -0.5 Input voltage range, (see Note -0.5 Voltage range applied output high-impedance power-off state, (see Note -0.5 Voltage range applied output high state, (see Notes -0.5 Input clamp current, Output clamp current, Continuous output current, Continuous current through ±100 Package thermal impedance, (see Note package 165°C/W package 259°C/W YEA/YZA package 143°C/W YEP/YZP package 123°C/W Storage temperature range, Tstg -65°C 150°C
Stresses beyond those listed under "absolute maximum ratings" cause permanent damage device. These stress ratings only, functional operation device these other conditions beyond those indicated under "recommended operating conditions" implied. Exposure absolute-maximum-rated conditions extended periods affect device reliability. NOTES: input negative-voltage output voltage ratings exceeded input output current ratings observed. value provided recommended operating conditions table. package thermal impedance calculated accordance with JESD 51-7.
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SN74LVC2G17 DUAL SCHMITT TRIGGER BUFFER
recommended operating conditions (see Note
Supply voltage Input voltage Output voltage 1.65 High-level output current 1.65 Low-level output current Operating 1.65 UNIT
Operating free-air temperature NOTE unused inputs device must held ensure proper device operation. Refer application report, Implications Slow Floating CMOS Inputs, literature number SCBA004.
POST OFFICE 655303
DALLAS, TEXAS 75265
SN74LVC2G17 DUAL SCHMITT TRIGGER BUFFER
electrical characteristics over recommended operating free-air temperature range (unless otherwise noted)
PARAMETER TEST CONDITIONS 1.65 Positive-going input threshold voltage 1.65 Negative-going input threshold voltage 1.65 Hysteresis (VT+ VT-) -100 Ioff input GND, input Other inputs 1.65 1.65 1.65 1.65 1.65 VCC-0.1 0.45 0.55 0.55 UNIT
typical values 25°C.
switching characteristics over recommended operating free-air temperature range (unless otherwise noted) (see Figure
PARAMETER FROM (INPUT) (OUTPUT) 0.15 UNIT
POST OFFICE 655303
DALLAS, TEXAS 75265
SN74LVC2G17 DUAL SCHMITT TRIGGER BUFFER
operating characteristics, 25°C
PARAMETER Power dissipation capacitance TEST CONDITIONS UNIT
POST OFFICE 655303
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SN74LVC2G17 DUAL SCHMITT TRIGGER BUFFER
PARAMETER MEASUREMENT INFORMATION
VLOAD Open TEST tPLH/tPHL tPLZ/tPZL tPHZ/tPZH Open VLOAD
From Output Under Test (see Note
LOAD CIRCUIT INPUTS 0.15 tr/tf VCC/2 VCC/2 VCC/2 VLOAD 0.15 0.15 Timing Input Input VOLTAGE WAVEFORMS PULSE DURATION Input tPLH Output tPHL tPHL tPLH Output VOLTAGE WAVEFORMS PROPAGATION DELAY TIMES INVERTING NONINVERTING OUTPUTS Output Waveform (see Note Output Control tPZL tPZH VOLTAGE WAVEFORMS SETUP HOLD TIMES tPLZ VLOAD/2 tPHZ Data Input
Output Waveform VLOAD (see Note
VOLTAGE WAVEFORMS ENABLE DISABLE TIMES LOW- HIGH-LEVEL ENABLING
NOTES: includes probe capacitance. Waveform output with internal conditions such that output except when disabled output control. Waveform output with internal conditions such that output high except when disabled output control. input pulses supplied generators having following characteristics: MHz, outputs measured time with transition measurement. tPLZ tPHZ same tdis. tPZL tPZH same ten. tPLH tPHL same tpd. parameters waveforms applicable devices.
Figure Load Circuit Voltage Waveforms
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PACKAGE OPTION ADDENDUM
www.ti.com
25-Feb-2005
PACKAGING INFORMATION
Orderable Device SN74LVC2G17DBVR SN74LVC2G17DBVT SN74LVC2G17DCKR SN74LVC2G17DCKT SN74LVC2G17YEAR SN74LVC2G17YEPR SN74LVC2G17YZAR SN74LVC2G17YZPR
Status ACTIVE ACTIVE ACTIVE ACTIVE ACTIVE ACTIVE ACTIVE ACTIVE
Package Type SOT-23 SOT-23 SC70 SC70 WCSP WCSP WCSP WCSP
Package Drawing
Pins Package Plan 3000 Green (RoHS Sb/Br) Pb-Free (RoHS)
Lead/Ball Finish NIPDAU NIPDAU NIPDAU NIPDAU SNPB SNPB Call SNAGCU
Peak Temp Level-1-260C-UNLIM Level-1-260C-UNLIM Level-1-260C-UNLIM Level-1-260C-UNLIM Level-1-260C-UNLIM Level-1-260C-UNLIM Call Level-1-260C-UNLIM
3000 Green (RoHS Sb/Br) 3000 3000 3000 3000 Pb-Free (RoHS) None None None Pb-Free (RoHS)
marketing status values defined follows: ACTIVE: Product device recommended designs. LIFEBUY: announced that device will discontinued, lifetime-buy period effect. NRND: recommended designs. Device production support existing customers, does recommend using this part design. PREVIEW: Device been announced production. Samples available. OBSOLETE: discontinued production device.
Plan currently available please check latest availability information additional product content details. None: available Lead (Pb-Free). Pb-Free (RoHS): TI's terms "Lead-Free" "Pb-Free" mean semiconductor products that compatible with current RoHS requirements substances, including requirement that lead exceed 0.1% weight homogeneous materials. Where designed soldered high temperatures, Pb-Free products suitable specified lead-free processes. Green (RoHS Sb/Br): defines "Green" mean "Pb-Free" addition, uses package materials that contain halogens, including bromine (Br) antimony (Sb) above 0.1% total product weight.
MSL, Peak Temp. Moisture Sensitivity Level rating according JEDECindustry standard classifications, peak solder temperature. Important Information Disclaimer:The information provided this page represents TI's knowledge belief date that provided. bases knowledge belief information provided third parties, makes representation warranty accuracy such information. Efforts underway better integrate information from third parties. taken continues take reasonable steps provide representative accurate information have conducted destructive testing chemical analysis incoming materials chemicals. suppliers consider certain information proprietary, thus numbers other limited information available release. event shall TI's liability arising such information exceed total purchase price part(s) issue this document sold Customer annual basis.
Addendum-Page
MECHANICAL DATA
MPDS114 FEBRUARY 2002
(R-PDSO-G6)
PLASTIC SMALL-OUTLINE PACKAGE
0,65
0,30 0,15
0,10
1,40 1,10
2,40 1,80
0,13
2,15 1,85
Gage Plane
0,15 0°-8° 0,46 0,26
Seating Plane 1,10 0,80 0,10 0,00 0,10
4093553-3/D 01/02 NOTES: linear dimensions millimeters. This drawing subject change without notice. Body dimensions include mold flash protrusion. Falls within JEDEC MO-203
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