µPD16805 MONOLITHIC BRIDGE DRIVER CIRCUIT µPD16805 monolithi
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INTEGRATED CIRCUIT
µPD16805
MONOLITHIC BRIDGE DRIVER CIRCUIT
µPD16805 monolithic bridge driver which consists CMOS control circuit output
stage. compared with driver process using conventional bipolar transistor, reduction consumption current power consumption possible. With this product, clockwise inversion, brake function built best drive circuit motor film winding camera, motor auto focus/zooms. package adopted TSSOP, corresponds reduction mounting area mounting height. This product corresponds drive current (DC).
FEATURES
High drive current ID(pulse) MAX. (single pulse) ID(DC) (DC) Low-ON resistance (sum upper lower sides FET) TYP. Standby function that turns charge pump circuit Compact surface mount package 16-pin plastic (1.27 pitch) 24-pin plastic TSSOP (0.5 pitch)
ORDERING INFORMATION
Part Number Package 16-pin plastic (7.64 (300)) 24-pin plastic TSSOP (5.72 (225))
µPD16805GS µPD16805MA-6A5
information this document subject change without notice.
Document S11032EJ4V0DS00 (4th edition) Date Published July 2001 CP(K) Printed Japan
1997
µPD16805
ABSOLUTE MAXIMUM RATINGS 25°C, Glass epoxy substrate copper foil)
Parameter Supply voltage applied voltage Input voltage bridge drive current bridge drive current Power consumption Peak junction temperature Storage temperature Symbol ID(DC) ID(pulse) (single pulse) MA-6A5 TCH(MAX) Tstg Control section Motor section Conditions Rating -0.5 +6.5/+8.0Note -0.5 +6.5/+8.0 -0.5 +0.5 +150
Note
Unit A/ch
Note When charge pump used/when power-source supply from exterior.
RECOMMENDED OPERATING CONDITIONS 25°C, Glass epoxy substrate copper foil)
Parameter Symbol Charge pump capacitance applied voltageNote Operating temperature time external input Ambient temperature Conditions During normal operation input pins MIN. 0.01 6.0/7.5Note TYP. MAX. Unit
Supply voltage
Notes When voltage impressed terminal from exterior When charge pump used/when power-source supply from exterior.
ELECTRICAL SPECIFICATIONS (Unless otherwise specified, recommended operating condition,
Parameter Symbol IDD1 current IDD2 Conditions Recommended conditions Control pins high level Recommended conditions Control pins level Reommended conditions Control pins level Control pins level 0.01 upper lower sides MOSFET Recommended conditions Recommended conditions Recommended conditions 0.01 Recommended conditions
Data Sheet S11032EJ4V0DS
MIN.
TYP.
MAX.
Unit
current
bridge resistance
High-level input voltage Low-level input voltage Charge pump circuit turn-ON time bridge output circuit turn-ON time bridge output circuit turn-OFF time Control input pull-down resistor
tONG tONH tOFFH RIND
µPD16805
FUNCTION TABLE
Input Signal
Function Brake mode Forward mode Reverse mode Stop mode Stop mode Standby mode
Forward mode
Reverse mode
OUT1
OUT2
OUT1
OUT2
Brake mode
Stop mode
OUT1
OUT2
OUT1
OUT2
Data Sheet S11032EJ4V0DS
µPD16805
Terminal function
µPD16805GS Package: plastic
STBY OUT2 PGND OUT1 DGND
Terminal
Terminal name DGND OUT1 PGND OUT2 STBY
Terminal function capacitor connection terminal charge pumps capacitor connection terminal charge pumps capacitor connection terminal charge pumps Motor block supply voltage input terminal Control block supply voltage input terminal Input terminal Input terminal Input terminal Control block terminal Motor block supply voltage input terminal Output terminal Output block terminal Output terminal Standby terminal Gate input terminal capacitor connection terminal charge pumps
Data Sheet S11032EJ4V0DS
µPD16805
Terminal function
µPD16805MA-6A5 Package: plastic TSSOP
STBY OUT2 OUT2 PGND PGND OUT1 OUT1 DGND
Terminal
Terminal name DGND OUT1 OUT1 PGND PGND OUT2 OUT2 STBY
Terminal function capacitor connection terminal charge pumps capacitor connection terminal charge pumps capacitor connection terminal charge pumps Motor block supply voltage input terminal Motor block supply voltage input terminal used terminal used terminal used terminal Control block supply voltage input terminal Input terminal Input terminal Input terminal Control block terminal Motor block supply voltage input terminal Motor block supply voltage input terminal Output terminal Output terminal Output block terminal Output block terminal Output terminal Output terminal Standby terminal Gate input terminal capacitor connection terminal charge pumps
Notice Please connect terminals that have plural. (VM, OUT1, OUT2, PGND) used terminals connected ground.
Data Sheet S11032EJ4V0DS
µPD16805
BLOCK DIAGRAM
Charge-pump circuit
STBY
OUT2
OUT2
PGND
H-bridge circuit Level shift circuit Control circuit
PGND
OUT1
OUT1
DGND
connection diagram µPD16805MA-6A5 shows block diagram.
µPD16805GS does
change, except that there plural terminals. plural terminal should connect terminals.
Data Sheet S11032EJ4V0DS
µPD16805
example standard connection
using charge pump circuit
0.01 0.01
STBY OUT2 OUT2
Charge-pump circuit
0.01
PGND PGND OUT1 OUT1 DGND
Level shift circuit Control circuit
H-bridge circuit
unusing charge pump circuit
STBY OUT2 OUT2 PGND PGND OUT1 OUT1 DGND
Charge-pump circuit
Level shift circuit Control circuit
H-bridge circuit
connection diagram µPD16805MA-6A5 shown inside figure. This circuit diagrams example connection, intended actual design-ins. Moreover, recommendeds inserting about several capacitor between VM-GND surge voltage protection output stage.
Data Sheet S11032EJ4V0DS
µPD16805
TYPICAL CHARACTERISTICS 25°C)
PT-TA characteristics
H-bridge resistance Total power dissipation
RON-TA characteristics
PD16805MA-6A5
PD16805GS
Ambient temperature (°C)
Ambient temperature (°C)
VG-IG characteristics
Gate current H-bridge resistance
VG-RON characteristics
Gate supply voltage
Gate supply voltage
Data Sheet S11032EJ4V0DS
µPD16805
PACKAGE DIMENSION (µPD16805GS)
16-PIN PLASTIC (7.62 (300))
detail lead
NOTE Each lead centerline located within 0.12 true position (T.P.) maximum material condition.
ITEM
MILLIMETERS 10.2±0.2 0.78 MAX. 1.27 (T.P.) 0.42 +0.08 -0.07 0.1±0.1 1.65±0.15 1.55 7.7±0.3 5.6±0.2 1.1±0.2 0.22 +0.08 -0.07 0.6±0.2 0.12 0.10 P16GM-50-300B-6
Data Sheet S11032EJ4V0DS
µPD16805
PACKAGE DIMENSION (µPD16805MA-6A5)
24-PIN PLASTIC TSSOP (5.72 (225))
detail lead
NOTE Each lead centerline located within 0.10 true position (T.P.) maximum material condition.
ITEM
MILLIMETERS 6.65±0.10 6.5±0.1 0.575 (T.P.) 0.22±0.05 0.1±0.05 MAX. 1.0±0.05 6.4±0.1 4.4±0.1 1.0±0.1 0.17±0.025 0.10 0.08 3°+5° 0.25 0.6±0.15 P24MA-50-6A5
Data Sheet S11032EJ4V0DS
µPD16805
RECOMMENDED SOLDERING CONDITIONS
recommended solder this under conditions described below. soldering methods conditions other than those listed below, consult NEC. details recommended soldering conditions, refer information document "Semiconductor Device Mounting Technology Manual".
µPD16805GS
Soldering Method Soldering Conditions Peak package temperature: 235°C, Time: seconds MAX. (210°C MIN.), Number times: MAX. Peak package temperature: 215°C, Time: seconds MAX. (200°C MIN.), Number times: MAX. Recommended Conditions Symbol IR35-00-2
Infrared reflow
VP15-00-2
number storage days 25°C, after pack been opened
µPD16805MA-6A5
Soldering Method Soldering Conditions Package peak temperature: 235°C; Duration: sec. max. (210°C above): Number times: Max. Time limit: NoneNote Flux: Rosin type flux with reduced chlorine content (chlorine less) recommended. Package peak temperature: 215°C; Duration: sec. max. (200°C above): Number times:3; Time limit: NoneNote Flux: Rosin type flux with reduced chlorine content (chlorine less) recommended. Package peak temperature: 260°C less, Duration: sec. Max.,. Preparatory heating temperature: 120°C less; Number times: Flux: Rosin type flux with reduced chlorine content (chlorine less) recommended. Recommended Conditions Symbol
Infrared reflow
IR35-00-3
VP15-00-3
Wave soldering
WS60-00-1
Note number storage days 25°C, after pack been opened Caution more than soldering method should avoided.
Data Sheet S11032EJ4V0DS
µPD16805
[MEMO]
Data Sheet S11032EJ4V0DS
µPD16805
[MEMO]
Data Sheet S11032EJ4V0DS
µPD16805
[MEMO]
Data Sheet S11032EJ4V0DS
µPD16805
NOTES CMOS DEVICES
PRECAUTION AGAINST SEMICONDUCTORS Note: Strong electric field, when exposed device, cause destruction gate oxide ultimately degrade device operation. Steps must taken stop generation static electricity much possible, quickly dissipate once, when occurred. Environmental control must adequate. When dry, humidifier should used. recommended avoid using insulators that easily build static electricity. Semiconductor devices must stored transported anti-static container, static shielding conductive material. test measurement tools including work bench floor should grounded. operator should grounded using wrist strap. Semiconductor devices must touched with bare hands. Similar precautions need taken boards with semiconductor devices HANDLING UNUSED INPUT PINS CMOS Note: connection CMOS device inputs cause malfunction. connection provided input pins, possible that internal input level generated noise, etc., hence causing malfunction. CMOS devices behave differently than Bipolar NMOS devices. Input levels CMOS devices must fixed high using pull-up pull-down circuitry. Each unused should connected with resistor, considered have possibility being output pin. handling related unused pins must judged device device related specifications governing devices. STATUS BEFORE INITIALIZATION DEVICES Note: Power-on does necessarily define initial status device. Production process does define initial operation status device. Immediately after power source turned devices with reset function have been initialized. Hence, power-on does guarantee out-pin levels, settings contents registers. Device initialized until reset signal received. Reset operation must executed immediately after power-on devices having reset function.
Data Sheet S11032EJ4V0DS
µPD16805
information this document current June, 2001. information subject change without notice. actual design-in, refer latest publications NEC's data sheets data books, etc., most up-to-date specifications semiconductor products. products and/or types available every country. Please check with sales representative availability additional information. part this document copied reproduced form means without prior written consent NEC. assumes responsibility errors that appear this document. does assume liability infringement patents, copyrights other intellectual property rights third parties arising from semiconductor products listed this document other liability arising from such products. license, express, implied otherwise, granted under patents, copyrights other intellectual property rights others. Descriptions circuits, software other related information this document provided illustrative purposes semiconductor product operation application examples. incorporation these circuits, software information design customer's equipment shall done under full responsibility customer. assumes responsibility losses incurred customers third parties arising from these circuits, software information. While endeavours enhance quality, reliability safety semiconductor products, customers agree acknowledge that possibility defects thereof cannot eliminated entirely. minimize risks damage property injury (including death) persons arising from defects semiconductor products, customers must incorporate sufficient safety measures their design, such redundancy, fire-containment, anti-failure features. semiconductor products classified into following three quality grades: "Standard", "Special" "Specific". "Specific" quality grade applies only semiconductor products developed based customer-designated "quality assurance program" specific application. recommended applications semiconductor product depend quality grade, indicated below. Customers must check quality grade each semiconductor product before using particular application. "Standard": Computers, office equipment, communications equipment, test measurement equipment, audio visual equipment, home electronic appliances, machine tools, personal electronic equipment industrial robots "Special": Transportation equipment (automobiles, trains, ships, etc.), traffic control systems, anti-disaster systems, anti-crime systems, safety equipment medical equipment (not specifically designed life support) "Specific": Aircraft, aerospace equipment, submersible repeaters, nuclear reactor control systems, life support systems medical equipment life support, etc. quality grade semiconductor products "Standard" unless otherwise expressly specified NEC's data sheets data books, etc. customers wish semiconductor products applications intended NEC, they must contact sales representative advance determine NEC's willingness support given application. (Note) "NEC" used this statement means Corporation also includes majority-owned subsidiaries. "NEC semiconductor products" means semiconductor product developed manufactured defined above).
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