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CD54 / 74HC138, CD54 / 74HCT138, CD54 / 74HC238, CD54 / 74HCT238

October 1997 - Revised August 2004

CD54 / 74HC138, CD54 / 74HCT138, CD54 / 74HC238, CD54 / 74HCT238
Data sheet acquired from Harris Semiconductor SCHS147I
October 1997 - Revised August 2004
High-Speed CMOS Logic 3- to 8-Line Decoder / Demultiplexer Inverting and Noninverting
Ordering Information
PART NUMBER CD54HC138F3A CD54HC238F3A CD54HCT138F3A CD54HCT238F3A CD74HC138E CD74HC138M CD74HC138MT CD74HC138M96 CD74HC238E CD74HC238M CD74HC238MT CD74HC238M96 CD74HC238NSR CD74HC238PW CD74HC238PWR CD74HC238PWT CD74HCT138E CD74HCT138M CD74HCT138MT CD74HCT138M96 CD74HCT238E CD74HCT238M CD74HCT238M96 TEMP. RANGE (oC) -55 to 125 -55 to 125 -55 to 125 -55 to 125 -55 to 125 -55 to 125 -55 to 125 -55 to 125 -55 to 125 -55 to 125 -55 to 125 -55 to 125 -55 to 125 -55 to 125 -55 to 125 -55 to 125 -55 to 125 -55 to 125 -55 to 125 -55 to 125 -55 to 125 -55 to 125 -55 to 125 PACKAGE 16 Ld CERDIP 16 Ld CERDIP 16 Ld CERDIP 16 Ld CERDIP 16 Ld PDIP 16 Ld SOIC 16 Ld SOIC 16 Ld SOIC 16 Ld PDIP 16 Ld SOIC 16 Ld SOIC 16 Ld SOIC 16 Ld SOP 16 Ld TSSOP 16 Ld TSSOP 16 Ld TSSOP 16 Ld PDIP 16 Ld SOIC 16 Ld SOIC 16 Ld SOIC 16 Ld PDIP 16 Ld SOIC 16 Ld SOIC
Features
· Select One Of Eight Data Outputs Active Low for 138, Active High for 238
/ Title (CD74 HC138 , CD74 HCT13 8, CD74 HC238 , CD74 HCT23 8) / Subject (High Speed
Description
NOTE: When ordering, use the entire part number. The suffixes 96 and R denote tape and reel. The suffix T denotes a small-quantity reel of 250.
CAUTION: These devices are sensitive to electrostatic discharge. Users should follow proper IC Handling Procedures. Copyright
CD54 / 74HC138, CD54 / 74HCT138, CD54 / 74HC238, CD54 / 74HCT238 Pinout
CD54HC138, CD54HCT138, CD54HC238, CD54HCT238 (CERDIP) CD74HC138, CD74HCT138, CD74HCT238 (PDIP, SOIC) CD74HC238 (PDIP, SOIC, SOP, TSSOP) TOP VIEW
A0 1 A1 2 A2 3 E1 4 E2 5 E3 6 (Y7) Y7 7 GND 8 16 VCC 15 Y0 (Y0) 14 Y1 (Y1) 13 Y2 (Y2) 12 Y3 (Y3) 11 Y4 (Y4) 10 Y5 (Y5) 9 Y6 (Y6) E1 5 E2 E3 6 9 Y6 7 Y7 Y7 Y6 10 Y5 Y5
Functional Diagram
CD54 / 74HC138, CD54 / 74HCT138, CD54 / 74HC238, CD54 / 74HCT238
Absolute Maximum Ratings
Thermal Information
Operating Conditions
CAUTION: Stresses above those listed in "Absolute Maximum Ratings" may cause permanent damage to the device. This is a stress only rating, and operation of the device at these or any other conditions above those indicated in the operational sections of this specification is not implied.
NOTE: 1. The package thermal impedance is calculated in accordance with JESD 51-7.
DC Electrical Specifications
CD54 / 74HC138, CD54 / 74HCT138, CD54 / 74HC238, CD54 / 74HCT238
DC Electrical Specifications
VCC (V)
5.5 5.5 4.5 to 5.5
HCT Input Loading Table
INPUT A0-A2 E1, E2 E3 UNIT LOADS 1.5 1.25 1
NOTE: Unit Load is ICC limit specified in DC Electrical Table, e.g., 360µA max at 25oC.
TEST CONDITIONS 25oC VCC (V) MIN TYP MAX -40oC TO 85oC MIN MAX -55oC TO 125oC MIN MAX UNITS
PARAMETER HC TYPES Propagation Delay Address to Output
SYMBOL
CD54 / 74HC138, CD54 / 74HCT138, CD54 / 74HC238, CD54 / 74HCT238
PARAMETER Enable to Output HC / HCT138
SYMBOL
TEST CONDITIONS
Test Circuits and Waveforms
INVERTING OUTPUT
FIGURE 7. HC AND HCU TRANSITION TIMES AND PROPAGATION DELAY TIMES, COMBINATION LOGIC
FIGURE 8. HCT TRANSITION TIMES AND PROPAGATION DELAY TIMES, COMBINATION LOGIC
PACKAGE OPTION ADDENDUM
www.ti.com
8-Mar-2005
PACKAGING INFORMATION
Orderable Device 5962-8688401EA CD54HC138F CD54HC138F3A CD54HC238F3A CD54HCT138F CD54HCT138F3A CD54HCT238F3A CD74HC138E CD74HC138M CD74HC138M96 CD74HC138MT CD74HC238E CD74HC238M CD74HC238M96 CD74HC238MT CD74HC238NSR CD74HC238PW CD74HC238PWR CD74HC238PWT CD74HCT138E CD74HCT138M CD74HCT138M96 CD74HCT138MT CD74HCT238E CD74HCT238M CD74HCT238M96 CD74HCT238PW CD74HCT238PWR Status (1) ACTIVE ACTIVE ACTIVE ACTIVE ACTIVE ACTIVE ACTIVE ACTIVE ACTIVE ACTIVE ACTIVE ACTIVE ACTIVE ACTIVE ACTIVE ACTIVE ACTIVE ACTIVE ACTIVE ACTIVE ACTIVE ACTIVE ACTIVE ACTIVE ACTIVE ACTIVE ACTIVE ACTIVE Package Type CDIP CDIP CDIP CDIP CDIP CDIP CDIP PDIP SOIC SOIC SOIC PDIP SOIC SOIC SOIC SO TSSOP TSSOP TSSOP PDIP SOIC SOIC SOIC PDIP SOIC SOIC TSSOP TSSOP Package Drawing J J J J J J J N D D D N D D D NS PW PW PW N D D D N D D PW PW Pins Package Eco Plan (2) Qty 16 16 16 16 16 16 16 16 16 16 16 16 16 16 16 16 16 16 16 16 16 16 16 16 16 16 16 16 1 1 1 1 1 1 1 25 40 None None None None None None None Pb-Free (RoHS) Green (RoHS & no Sb / Br) Lead / Ball Finish Call TI Call TI Call TI Call TI Call TI Call TI Call TI CU NIPDAU CU NIPDAU CU NIPDAU CU NIPDAU CU NIPDAU CU NIPDAU CU NIPDAU CU NIPDAU CU NIPDAU CU NIPDAU CU NIPDAU CU NIPDAU CU NIPDAU CU NIPDAU CU NIPDAU CU NIPDAU CU NIPDAU CU NIPDAU CU NIPDAU CU NIPDAU CU NIPDAU MSL Peak Temp (3) Level-NC-NC-NC Level-NC-NC-NC Level-NC-NC-NC Level-NC-NC-NC Level-NC-NC-NC Level-NC-NC-NC Level-NC-NC-NC Level-NC-NC-NC Level-1-260C-UNLIM Level-1-260C-UNLIM Level-2-260C-1 YEAR / Level-1-235C-UNLIM Level-NC-NC-NC Level-2-260C-1 YEAR / Level-1-235C-UNLIM Level-2-260C-1 YEAR / Level-1-235C-UNLIM Level-2-260C-1 YEAR / Level-1-235C-UNLIM Level-2-260C-1 YEAR / Level-1-235C-UNLIM Level-1-250C-UNLIM Level-1-250C-UNLIM Level-1-250C-UNLIM Level-NC-NC-NC Level-2-260C-1 YEAR / Level-1-235C-UNLIM Level-2-260C-1 YEAR / Level-1-235C-UNLIM Level-2-260C-1 YEAR / Level-1-235C-UNLIM Level-NC-NC-NC Level-2-260C-1 YEAR / Level-1-235C-UNLIM Level-2-260C-1 YEAR / Level-1-235C-UNLIM Level-1-250C-UNLIM Level-1-250C-UNLIM
2500 Green (RoHS & no Sb / Br) 250 25 40 2500 250 2000 90 2000 250 25 40 2500 250 25 40 2500 90 2000 Pb-Free (RoHS) Pb-Free (RoHS) Pb-Free (RoHS) Pb-Free (RoHS) Pb-Free (RoHS) Pb-Free (RoHS) Pb-Free (RoHS) Pb-Free (RoHS) Pb-Free (RoHS) Pb-Free (RoHS) Pb-Free (RoHS) Pb-Free (RoHS) Pb-Free (RoHS) Pb-Free (RoHS) Pb-Free (RoHS) Pb-Free (RoHS) Pb-Free (RoHS) Pb-Free
Addendum-Page 1
PACKAGE OPTION ADDENDUM
www.ti.com
8-Mar-2005
Orderable Device
Status (1)
Package Type
Package Drawing
Pins Package Eco Plan (2) Qty (RoHS)
Lead / Ball Finish
MSL Peak Temp (3)
The marketing status values are defined as follows: ACTIVE: Product device recommended for new designs. LIFEBUY: TI has announced that the device will be discontinued, and a lifetime-buy period is in effect. NRND: Not recommended for new designs. Device is in production to support existing customers, but TI does not recommend using this part in a new design. PREVIEW: Device has been announced but is not in production. Samples may or may not be available. OBSOLETE: TI has discontinued the production of the device.
Addendum-Page 2
MECHANICAL DATA
MTSS001C - JANUARY 1995 - REVISED FEBRUARY 1999
PW (R-PDSO-G)
14 PINS SHOWN
PLASTIC SMALL-OUTLINE PACKAGE
0, 15 NOM 4, 50 4, 30 6, 60 6, 20 Gage Plane 0, 25 1 A 7 0°- 8° 0, 75 0, 50
Seating Plane 1, 20 MAX 0, 15 0, 05 0, 10
PINS DIM A MAX
4040064 / F 01 / 97 NOTES: A. B. C. D. All linear dimensions are in millimeters. This drawing is subject to change without notice. Body dimensions do not include mold flash or protrusion not to exceed 0, 15. Falls within JEDEC MO-153
POST OFFICE BOX 655303
· DALLAS, TEXAS 75265