PD168302 MONOLITHIC H-BRIDGE DRIVER DESCRIPTION µPD1683

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PD168302 MONOLITHIC H-BRIDGE DRIVER DESCRIPTION µPD1683

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INTEGRATED CIRCUIT
PD168302
MONOLITHIC H-BRIDGE DRIVER
DESCRIPTION
µPD168302 monolithic dual H-bridge driver which uses power FETs output stages. using process, this driver substantially improved voltage loss output stage power consumption compared with conventional driver using bipolar transistors. package, 24-pin plastic TSSOP adopted enable creation compact, slim application sets. provided with forward/reverse brake functions ideal driver motor stepping motor.
FEATURES
H-Bridge circuit employing power FETs Charge-pump circuit low-voltage operation output resistance: TYP. MAX. (Sum upper lower side) Output current: current A/ch Peak current A/ch Input logic frequency: logic power supply: Minimum operating supply voltage power supply motor drive Under voltage locked circuit: shutdown internal circuit TYP. 24-pin plastic TSSOP (5.72 (225), pitch)
ORDERING INFORMATION
Part Number Package 24-pin plastic TSSOP (5.72 (225))
PD168302MA-6A5
information this document subject change without notice. Before using this document, please confirm that this latest version.
products and/or types available every country. Please check with Electronics sales representative availability additional information.
Document S16402EJ1V0DS00 (1st edition) Date Published 2003 Printed Japan
2003
µPD168302
BLOCK DIAGRAM
UVLO Oscillator Circuit Charge-pump Circuit Circuit /STB Note2 Note2 Note2 Control Circuit Level Shift Circuit H-bridge Circuit Note3
Note3
OUT1A OUT1B
Note2 Note2
Control Circuit
Level Shift Circuit
H-bridge Circuit
OUT2A OUT2B
Note3
LGND
PGND1 Note1, PGND2 Note1,
Notes terminal which more than should connect only terminal terminals. Pull down resistance connected input terminal. recommended that terminal connected terminal which either higher. recommended that voltage PGND1 PGND2 lower value than GND.
Data Sheet S16402EJ1V0DS
µPD168302
CONNECTION
PGND1 OUT1A OUT1B PGND1 /STB
LGND PGND2 OUT2A OUT2B PGND2 N.C.
FUNCTIONS
PACKAGE: 24-pin plastic TSSOP (5.72 (225), pitch)
Name PGND1 OUT1A OUT1B PGND1 /STB N.C. PGND2 OUT2B OUT2A PGND2 LGND Function Capacitor connect charge-pump circuit Capacitor connect charge-pump circuit Gate voltage Power supply logic circuit Power Output Power supply power circuit Output Power Standby Input logic Input logic Input logic Input logic connect) Power Output Power supply power circuit Output Power Logic Power supply power circuit Capacitor connect charge-pump circuit Capacitor connect charge-pump circuit
Cautions terminal which more than should connect only terminal terminals. Please recommend connecting unused pins GND.
Data Sheet S16402EJ1V0DS
µPD168302
APPLICATION EXAMPLE
UVLO Oscillator Circuit Circuit /STB Charge-pump Circuit
OUT1A Control Circuit Level Shift Circuit H-bridge Circuit OUT1B OUT2A
Controller
Control Circuit
Level Shift Circuit
H-bridge Circuit
OUT2B
LGND
PGND1
PGND2
Remark This circuit diagram example connection, thing aiming mass production.
Data Sheet S16402EJ1V0DS
µPD168302
FUNCTION TABLE
Input /STB OUT1A Hi-Z
Output Current direction OUT1B Hi-Z Stop OUT1AOUT1B
(Forward) OUT1BOUT1A
(Reverse) Brake
(Regeneration mode) output stop mode
Hi-Z
Hi-Z (Standby)
Input /STB OUT2A Hi-Z
Output Current direction OUT2B Hi-Z Stop OUT1AOUT1B
(Forward) OUT1BOUT1A
(Reverse) Brake
(Regeneration mode) output stop mode
Hi-Z
Hi-Z (Standby)
Remark High-level, Low-level, Hi-Z: High impedance
Data Sheet S16402EJ1V0DS
µPD168302
H-BRIDGE OPERATION FIGURE
Forward
Reverse
LOAD
LOAD
Stop
Brake
LOAD
LOAD
Data Sheet S16402EJ1V0DS
µPD168302
ELECTRICAL SPECIFICATIONS
ABSOLUTE MAXIMUM RATINGS 25°C. When mounted glass epoxy board (100 copper foil))
Parameter Power Supply Symbol Voltage Input Voltage Output Voltage Output Current Peak Output Current Power consumption Peak junction temperature Storage temperature VOUT ID(DC) ID(pulse) Tch(MAX.) Tstg Motor Duty Logic Motor Condition Rating -0.5 +6.0 -0.5 +4.0 -0.5 +8.0 -0.5 +150 Unit A/ch A/ch
Caution Product quality suffer absolute maximum rating exceeded even momentarily parameter. That absolute maximum ratings rated values which product verge suffering physical damage, therefore product must used under conditions that ensure that absolute maximum ratings exceeded. RECOMMENDED OPERATING CONDITIONS 25°C. When mounted glass epoxy board (100 copper foil))
Parameter Power Supply Voltage Note Input Voltage Output Current Peak Output Current Logic input frequency Capacitor charge-pump Operating temperature ID(DC) ID(pulse) 0.008 0.01 Duty Symbol Logic Motor Condition MIN. -0.3 -0.7 TYP. MAX. +0.3 +0.7 0.012 Unit A/ch A/ch
Note When using charge-pump circuit, voltage occurs internally VG-pin (TYP.)).
Data Sheet S16402EJ1V0DS
µPD168302
ELECTRICAL CHARACTERISTICS (Unless otherwise specified, 25°C,
Parameter current standby current operating High-level Input current Low-level Input current Input pull-down resistance High-level Input voltage Low-level Input voltage resistance H-Bridge Output Leak current Symbol IDD(STB) IDD(ACT) RIND IM(off) upper lower control-pin Recommenred range MAX.) low-voltage detected voltage turn-ON time charge-pump Output turn-ON time Output turn-OFF time VDDS tONC toff 0.01 refer Figure -1.0 /STB Condition MIN. TYP. MAX. Unit
Figure Charge-pump circuit operating wave
tONC (reference)
Figure Switching Wave
toff
Data Sheet S16402EJ1V0DS
µPD168302
PACKAGE DRAWING
24-PIN PLASTIC TSSOP (5.72 (225))
detail lead
NOTE Each lead centerline located within 0.10 true position (T.P.) maximum material condition.
ITEM
MILLIMETERS 6.65±0.10 6.5±0.1 0.575 (T.P.) 0.22±0.05 0.1±0.05 MAX. 1.0±0.05 6.4±0.1 4.4±0.1 1.0±0.1 0.17±0.025 0.10 0.08 3°+5° 0.25 0.6±0.15 P24MA-50-6A5
Data Sheet S16402EJ1V0DS
µPD168302
RECOMMENDED SOLDERING CONDITIONS
µPD168302 should soldered mounted under following recommended conditions. soldering methods conditions other than those recommended below, contact Electronics sales representative. technical information, following website. Semiconductor Device Mount Manual
µPD168302MA-6A5: 24-pin plastic TSSOP (5.72 (225))
Soldering Method Soldering Conditions Recommended Condition symbol Infrared reflow Package peak temperature: 260°C, Time: seconds MAX. 220°C higher), Count: Three times less, Exposure limit: None, Flux: Rosin flux with chlorine (0.2 below) recommended IR60-00-3
Caution different soldering methods together (except partial heating).
Data Sheet S16402EJ1V0DS
µPD168302
NOTES CMOS DEVICES
PRECAUTION AGAINST SEMICONDUCTORS Note: Strong electric field, when exposed device, cause destruction gate oxide ultimately degrade device operation. Steps must taken stop generation static electricity much possible, quickly dissipate once, when occurred. Environmental control must adequate. When dry, humidifier should used. recommended avoid using insulators that easily build static electricity. Semiconductor devices must stored transported anti-static container, static shielding conductive material. test measurement tools including work bench floor should grounded. operator should grounded using wrist strap. Semiconductor devices must touched with bare hands. Similar precautions need taken boards with semiconductor devices HANDLING UNUSED INPUT PINS CMOS Note: connection CMOS device inputs cause malfunction. connection provided input pins, possible that internal input level generated noise, etc., hence causing malfunction. CMOS devices behave differently than Bipolar NMOS devices. Input levels CMOS devices must fixed high using pull-up pull-down circuitry. Each unused should connected with resistor, considered have possibility being output pin. handling related unused pins must judged device device related specifications governing devices. STATUS BEFORE INITIALIZATION DEVICES Note: Power-on does necessarily define initial status device. Production process does define initial operation status device. Immediately after power source turned devices with reset function have been initialized. Hence, power-on does guarantee out-pin levels, settings contents registers. Device initialized until reset signal received. Reset operation must executed immediately after power-on devices having reset function.
Data Sheet S16402EJ1V0DS
µPD168302
Reference Documents Semiconductor Device Reliability/Quality Control System (C10983E) Quality Grades Semiconductor Devices (C11531E)
information this document current May, 2003. information subject change without notice. actual design-in, refer latest publications Electronics data sheets data books, etc., most up-to-date specifications Electronics products. products and/or types available every country. Please check with Electronics sales representative availability additional information. part this document copied reproduced form means without prior written consent Electronics. Electronics assumes responsibility errors that appear this document. Electronics does assume liability infringement patents, copyrights other intellectual property rights third parties arising from Electronics products listed this document other liability arising from such products. license, express, implied otherwise, granted under patents, copyrights other intellectual property rights Electronics others. Descriptions circuits, software other related information this document provided illustrative purposes semiconductor product operation application examples. incorporation these circuits, software information design customer's equipment shall done under full responsibility customer. Electronics assumes responsibility losses incurred customers third parties arising from these circuits, software information. While Electronics endeavors enhance quality, reliability safety Electronics products, customers agree acknowledge that possibility defects thereof cannot eliminated entirely. minimize risks damage property injury (including death) persons arising from defects Electronics products, customers must incorporate sufficient safety measures their design, such redundancy, fire-containment anti-failure features. Electronics products classified into following three quality grades: "Standard", "Special" "Specific". "Specific" quality grade applies only Electronics products developed based customerdesignated "quality assurance program" specific application. recommended applications Electronics product depend quality grade, indicated below. Customers must check quality grade each Electronics product before using particular application. "Standard": Computers, office equipment, communications equipment, test measurement equipment, audio visual equipment, home electronic appliances, machine tools, personal electronic equipment industrial robots. "Special": Transportation equipment (automobiles, trains, ships, etc.), traffic control systems, anti-disaster systems, anti-crime systems, safety equipment medical equipment (not specifically designed life support). "Specific": Aircraft, aerospace equipment, submersible repeaters, nuclear reactor control systems, life support systems medical equipment life support, etc. quality grade Electronics products "Standard" unless otherwise expressly specified Electronics data sheets data books, etc. customers wish Electronics products applications intended Electronics, they must contact Electronics sales representative advance determine Electronics' willingness support given application. (Note) "NEC Electronics" used this statement means Electronics Corporation also includes majority-owned subsidiaries. "NEC Electronics products" means product developed manufactured Electronics defined above).
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PD168302 MONOLITHIC H-BRIDGE DRIVER DESCRIPTION µPD1683

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