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28-Feb-2005 PACKAGING INFORMATION Orderable Device SN5496J S
Top Searches for this datasheetSDLS946 28-Feb-2005 PACKAGING INFORMATION Orderable Device SN5496J SN7496N SN74LS96D SN74LS96DR SN74LS96J SN74LS96N SN74LS96N3 SNJ5496J SNJ5496W Status LIFEBUY OBSOLETE OBSOLETE OBSOLETE OBSOLETE OBSOLETE OBSOLETE LIFEBUY LIFEBUY Package Type CDIP PDIP SOIC SOIC CDIP PDIP PDIP CDIP Package Drawing Pins Package Plan None None None None None None None None None Lead/Ball Finish Call Call Call Call Call Call Call Call Call Peak Temp Level-NC-NC-NC Call Call Call Call Call Call Level-NC-NC-NC Level-NC-NC-NC marketing status values defined follows: ACTIVE: Product device recommended designs. LIFEBUY: announced that device will discontinued, lifetime-buy period effect. NRND: recommended designs. Device production support existing customers, does recommend using this part design. PREVIEW: Device been announced production. Samples available. OBSOLETE: discontinued production device. Plan currently available please check latest availability information additional product content details. None: available Lead (Pb-Free). Pb-Free (RoHS): TI's terms "Lead-Free" "Pb-Free" mean semiconductor products that compatible with current RoHS requirements substances, including requirement that lead exceed 0.1% weight homogeneous materials. Where designed soldered high temperatures, Pb-Free products suitable specified lead-free processes. Green (RoHS Sb/Br): defines "Green" mean "Pb-Free" addition, uses package materials that contain halogens, including bromine (Br) antimony (Sb) above 0.1% total product weight. MSL, Peak Temp. Moisture Sensitivity Level rating according JEDECindustry standard classifications, peak solder temperature. Important Information Disclaimer:The information provided this page represents TI's knowledge belief date that provided. bases knowledge belief information provided third parties, makes representation warranty accuracy such information. 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