Rev. November 2003 Product data Description N-channel enhanc
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BUK95/96/9E3R2-40B
Rev. November 2003 Product data
Description
N-channel enhancement mode field-effect power transistor plastic package using Philips High-Performance Automotive TrenchMOStechnology.
Features
Very on-state resistance rated Q101 compliant Logic level compatible.
Applications
Automotive systems Motors, lamps solenoids loads General purpose power switching.
Quick reference data
EDS(AL)S RDSon (typ) Ptot
Pinning information
Table Pinning SOT78, SOT404, SOT226 simplified outlines symbol Description gate drain source mounting base, connected drain
MBK106
Simplified outline
Symbol
MBB076
MBK116
MBK112
SOT78 (TO-220AB)
SOT404 (D2-PAK)
SOT226 (I2-PAK)
possible make connection SOT404 package.
Philips Semiconductors
BUK95/96/9E3R2-40B
Ordering information
Table Ordering information Package Name BUK953R2-40B BUK963R2-40B BUK9E3R2-40B TO-220AB D2-PAK I2-PAK Description Plastic single-ended package; heatsink mounted; mounting hole; 3-lead TO-220AB Version SOT78 Type number
Plastic single-ended surface mounted package (Philips version D2-PAK); SOT404 leads (one lead cropped) Plastic single-ended package (Philips version I2-PAK); low-profile lead TO-220AB SOT226
Limiting values
Table Limiting values accordance with Absolute Maximum Rating System (IEC 60134). Symbol Parameter VDGR drain-source voltage (DC) drain-gate voltage (DC) gate-source voltage (DC) drain current (DC) Figure Figure Ptot Tstg IDRM peak drain current total power dissipation storage temperature junction temperature reverse drain current (DC) reverse drain current pulsed; unclamped inductive load; starting
Conditions
+175 +175
Unit
pulsed; Figure Figure
Source-drain diode
Avalanche ruggedness EDS(AL)S non-repetitive drain-source avalanche energy
Current limited power dissipation chip rating. individual parts device must achieve maximum current rating.
9397 12049
Koninklijke Philips Electronics N.V. 2003. rights reserved.
Product data
Rev. November 2003
Philips Semiconductors
BUK95/96/9E3R2-40B
Pder
03na19
03nh38
Capped package
(°C)
(°C)
100%
Normalized total power dissipation function mounting base temperature.
Continuous drain current function mounting base temperature.
03nh36
Limit RDSon Capped package
10-1
single pulse.
Safe operating area; continuous peak drain currents function drain-source voltage.
9397 12049
Koninklijke Philips Electronics N.V. 2003. rights reserved.
Product data
Rev. November 2003
Philips Semiconductors
BUK95/96/9E3R2-40B
Thermal characteristics
Table Rth(j-mb) Rth(j-a) Thermal characteristics Conditions Unit thermal resistance from junction mounting Figure base thermal resistance from junction ambient SOT78 (TO-220AB) SOT404 (D2-PAK) SOT226 (I2-PAK) vertical still minimum footprint; mounted printed-circuit board vertical still Symbol Parameter
Transient thermal impedance
Zth(j-mb) (K/W)
03nh37
10-1 0.05 0.02 10-2
single shot 10-3 10-6
10-5 10-4 10-3 10-2 10-1
Transient thermal impedance from junction mounting base function pulse duration.
9397 12049
Koninklijke Philips Electronics N.V. 2003. rights reserved.
Product data
Rev. November 2003
Philips Semiconductors
BUK95/96/9E3R2-40B
Characteristics
Table Characteristics unless otherwise specified. Symbol V(BR)DSS Parameter drain-source breakdown voltage Conditions 0.25 VGS(th) gate-source threshold voltage VGS; Figure IDSS drain-source leakage current IGSS RDSon gate-source leakage current drain-source on-state resistance Figure Dynamic characteristics Qg(tot) Ciss Coss Crss td(on) td(off) total gate charge gate-to-source charge gate-to-drain (Miller) charge input capacitance output capacitance reverse transfer capacitance turn-on delay time rise time turn-off delay time fall time internal drain inductance from drain lead from package center from contact screw mounting base center SOT78 from upper edge drain mounting base center SOT404/SOT226 internal source inductance from source lead source bond MHz; Figure Figure 7877 1397 10502 1676 0.02 Unit Static characteristics
9397 12049
Koninklijke Philips Electronics N.V. 2003. rights reserved.
Product data
Rev. November 2003
Philips Semiconductors
BUK95/96/9E3R2-40B
Table Characteristics.continued unless otherwise specified. Symbol Parameter source-drain (diode forward) voltage reverse recovery time recovered charge Conditions Figure dIS/dt -100 A/µs 0.85 Unit Source-drain diode
9397 12049
Koninklijke Philips Electronics N.V. 2003. rights reserved.
Product data
Rev. November 2003
Philips Semiconductors
BUK95/96/9E3R2-40B
03nh56
RDSon
03nh55
Label
Output characteristics: drain current function drain-source voltage; typical values.
Drain-source on-state resistance function gate-source voltage; typical values.
RDSon
03nh57
03aa27
Label
(°C)
DSon DSon Normalized drain-source on-state resistance factor function junction temperature.
Drain-source on-state resistance function drain current; typical values.
9397 12049
Koninklijke Philips Electronics N.V. 2003. rights reserved.
Product data
Rev. November 2003
Philips Semiconductors
BUK95/96/9E3R2-40B
VGS(th)
03ng52
10-1 10-2
03ng53
10-4
10-5
(°C)
10-6
Gate-source threshold voltage function junction temperature.
Sub-threshold drain current function gate-source voltage.
03nh53
12000 (pF) 8000 Ciss
03nh58
Coss
4000 Crss
10-1
Forward transconductance function drain current; typical values.
Input, output reverse transfer capacitances function drain-source voltage; typical values.
9397 12049
Koninklijke Philips Electronics N.V. 2003. rights reserved.
Product data
Rev. November 2003
Philips Semiconductors
BUK95/96/9E3R2-40B
03nh54
03nh52
(nC)
Transfer characteristics: drain current function gate-source voltage; typical values.
Gate-source voltage function gate charge; typical values.
03nh51
Source (diode forward) current function source-drain (diode forward) voltage; typical values.
9397 12049
Koninklijke Philips Electronics N.V. 2003. rights reserved.
Product data
Rev. November 2003
Philips Semiconductors
BUK95/96/9E3R2-40B
Package outline
Plastic single-ended package; heatsink mounted; mounting hole; 3-lead TO-220AB SOT78
mounting base
L1(1)
scale
DIMENSIONS original dimensions) UNIT 1.39 1.27 15.8 15.2 10.3 2.54 15.0 13.5 L1(1) 3.30 2.79 max.
Note Terminals this zone tinned. OUTLINE VERSION SOT78 REFERENCES JEDEC 3-lead TO-220AB EIAJ SC-46 EUROPEAN PROJECTION ISSUE DATE 00-09-07 01-02-16
SOT78 (TO-220AB).
9397 12049 Koninklijke Philips Electronics N.V. 2003. rights reserved.
Product data
Rev. November 2003
Philips Semiconductors
BUK95/96/9E3R2-40B
Plastic single-ended surface mounted package (Philips version D2-PAK); leads (one lead cropped)
SOT404
mounting base
scale
DIMENSIONS original dimensions) UNIT 4.50 4.10 1.40 1.27 0.85 0.60 0.64 0.46 max. 1.60 1.20 10.30 9.70 2.54 2.90 2.10 15.80 14.80 2.60 2.20
OUTLINE VERSION SOT404
REFERENCES JEDEC EIAJ
EUROPEAN PROJECTION
ISSUE DATE 99-06-25 01-02-12
SOT404 (D2-PAK).
9397 12049 Koninklijke Philips Electronics N.V. 2003. rights reserved.
Product data
Rev. November 2003
Philips Semiconductors
BUK95/96/9E3R2-40B
Plastic single-ended package (Philips version 2-PAK); low-profile lead TO-220AB
SOT226
mounting base
scale
DIMENSIONS original dimensions) UNIT Note Terminals this zone tinned. OUTLINE VERSION SOT226 REFERENCES JEDEC low-profile 3-lead TO-220AB JEITA EUROPEAN PROJECTION ISSUE DATE 99-09-13 03-10-14 1.40 1.27 9.65 8.65 10.3 2.54 15.0 13.5 3.30 2.79
SOT226 (I2-PAK).
9397 12049 Koninklijke Philips Electronics N.V. 2003. rights reserved.
Product data
Rev. November 2003
Philips Semiconductors
BUK95/96/9E3R2-40B
Soldering
handbook, full pagewidth
10.85 10.60 10.50 1.50 7.50 7.40 1.70
2.25 2.15
8.15
8.35
8.275 1.50
4.60
0.30 4.85
5.40 8.075
7.95
3.00
0.20
solder lands solder resist occupied area solder paste 5.08
1.20 1.30 1.55
MSD057
Dimensions
Reflow soldering footprint SOT404.
9397 12049
Koninklijke Philips Electronics N.V. 2003. rights reserved.
Product data
Rev. November 2003
Philips Semiconductors
BUK95/96/9E3R2-40B
Revision history
Table Date 20031114 Revision history CPCN Description Product data (9397 12049) Modifications:
20030116
Addition BUK9E3R2-40B type data sheet.
Product data (9397 10844) Modifications:
20021014 20020409
Maximum drain current (DC) changed from Section Limiting values.
Product data (9397 10275) Product data (9397 09491)
9397 12049
Koninklijke Philips Electronics N.V. 2003. rights reserved.
Product data
Rev. November 2003
Philips Semiconductors
BUK95/96/9E3R2-40B
Data sheet status
Level Data sheet status[1] Objective data Preliminary data Product status[2][3] Development Qualification Definition This data sheet contains data from objective specification product development. Philips Semiconductors reserves right change specification manner without notice. This data sheet contains data from preliminary specification. Supplementary data will published later date. Philips Semiconductors reserves right change specification without notice, order improve design supply best possible product. This data sheet contains data from product specification. Philips Semiconductors reserves right make changes time order improve design, manufacturing supply. Relevant changes will communicated Customer Product/Process Change Notification (CPCN).
Product data
Production
Please consult most recently issued data sheet before initiating completing design. product status device(s) described this data sheet have changed since this data sheet published. latest information available Internet data sheets describing multiple type numbers, highest-level product status determines data sheet status.
Definitions
Short-form specification data short-form specification extracted from full data sheet with same type number title. detailed information relevant data sheet data handbook. Limiting values definition Limiting values given accordance with Absolute Maximum Rating System (IEC 60134). Stress above more limiting values cause permanent damage device. These stress ratings only operation device these other conditions above those given Characteristics sections specification implied. Exposure limiting values extended periods affect device reliability. Application information Applications that described herein these products illustrative purposes only. Philips Semiconductors make representation warranty that such applications will suitable specified without further testing modification.
customers using selling these products such applications their risk agree fully indemnify Philips Semiconductors damages resulting from such application. Right make changes Philips Semiconductors reserves right make changes products including circuits, standard cells, and/or software described contained herein order improve design and/or performance. When product full production (status `Production'), relevant changes will communicated Customer Product/Process Change Notification (CPCN). Philips Semiconductors assumes responsibility liability these products, conveys licence title under patent, copyright, mask work right these products, makes representations warranties that these products free from patent, copyright, mask work right infringement, unless otherwise specified.
Trademarks
TrenchMOS trademark Koninklijke Philips Electronics N.V.
Disclaimers
Life support These products designed life support appliances, devices, systems where malfunction these products reasonably expected result personal injury. Philips Semiconductors
Contact information
additional information, please visit sales office addresses, send e-mail
9397 12049
Fax: 24825
Koninklijke Philips Electronics N.V. 2003. rights reserved.
Product data
Rev. November 2003
Philips Semiconductors
BUK95/96/9E3R2-40B
Contents
Product profile Description Features Applications Quick reference data. Pinning information Ordering information Limiting values. Thermal characteristics. Transient thermal impedance Characteristics Package outline Soldering Revision history Data sheet status Definitions Disclaimers Trademarks.
Koninklijke Philips Electronics N.V. 2003. Printed Netherlands
rights reserved. Reproduction whole part prohibited without prior written consent copyright owner. information presented this document does form part quotation contract, believed accurate reliable changed without notice. liability will accepted publisher consequence use. Publication thereof does convey imply license under patent- other industrial intellectual property rights. Date release: November 2003 Document order number: 9397 12049
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