28-Feb-2005 PACKAGING INFORMATION Orderable Device CD54AC574

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28-Feb-2005 PACKAGING INFORMATION Orderable Device CD54AC574

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This data sheet applicable CD54/74AC574 CD54/74ACT574. CD54/74AC564 CD54/74ACT564 were acquired from Harris Semiconductor.
28-Feb-2005
PACKAGING INFORMATION
Orderable Device CD54AC574F3A CD54ACT574F3A CD74AC574E CD74AC574M CD74AC574M96 CD74ACT574E CD74ACT574M CD74ACT574M96
Status ACTIVE ACTIVE ACTIVE ACTIVE ACTIVE ACTIVE ACTIVE ACTIVE
Package Type CDIP CDIP PDIP SOIC SOIC PDIP SOIC SOIC
Package Drawing
Pins Package Plan 2000 2000 None None Pb-Free (RoHS) Pb-Free (RoHS) Pb-Free (RoHS) Pb-Free (RoHS) Pb-Free (RoHS) Pb-Free (RoHS)
Lead/Ball Finish Call Call NIPDAU NIPDAU NIPDAU NIPDAU NIPDAU NIPDAU
Peak Temp Level-NC-NC-NC Level-NC-NC-NC Level-NC-NC-NC Level-2-250C-1 YEAR/ Level-1-235C-UNLIM Level-2-250C-1 YEAR/ Level-1-235C-UNLIM Level-NC-NC-NC Level-2-250C-1 YEAR/ Level-1-235C-UNLIM Level-2-250C-1 YEAR/ Level-1-235C-UNLIM
marketing status values defined follows: ACTIVE: Product device recommended designs. LIFEBUY: announced that device will discontinued, lifetime-buy period effect. NRND: recommended designs. Device production support existing customers, does recommend using this part design. PREVIEW: Device been announced production. Samples available. OBSOLETE: discontinued production device.
Plan currently available please check latest availability information additional product content details. None: available Lead (Pb-Free). Pb-Free (RoHS): TI's terms "Lead-Free" "Pb-Free" mean semiconductor products that compatible with current RoHS requirements substances, including requirement that lead exceed 0.1% weight homogeneous materials. Where designed soldered high temperatures, Pb-Free products suitable specified lead-free processes. Green (RoHS Sb/Br): defines "Green" mean "Pb-Free" addition, uses package materials that contain halogens, including bromine (Br) antimony (Sb) above 0.1% total product weight.
MSL, Peak Temp. Moisture Sensitivity Level rating according JEDECindustry standard classifications, peak solder temperature. Important Information Disclaimer:The information provided this page represents TI's knowledge belief date that provided. bases knowledge belief information provided third parties, makes representation warranty accuracy such information. Efforts underway better integrate information from third parties. taken continues take reasonable steps provide representative accurate information have conducted destructive testing chemical analysis incoming materials chemicals. suppliers consider certain information proprietary, thus numbers other limited information available release. event shall TI's liability arising such information exceed total purchase price part(s) issue this document sold Customer annual basis.
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28-Feb-2005 PACKAGING INFORMATION Orderable Device CD54AC574

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