Footprint/Dimensions +0.2 acc. 6784 15°max ±0.2 ±0.3 6.5±0.2 ±0.1
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Top Searches for this datasheet
SOT223-4-2
Footprint/Dimensions
+0.2 acc. 6784 15°max ±0.2 ±0.3 6.5±0.2 ±0.1 ±0.1
0.7±0.1
0.28±0.04
Reflow soldering 0.25
0.25
Dimensions
PC-Board
SOT223
Application-Boards Measurement
SOT223
SOT223
Footprint only
FR4; 24.49
FR4; 17.32
FR4; Footprint only
Finite Element Method
Simulation (chip area zero airflow)
Tmax
Tmax
Footprint only; Tmax
Diagrams
164.3 Thermal Resistance Junction Ambient Rthj-a Heat Sink Area (zero airflow) Footprint Thermal Impedance Junction Ambient Zthj-a Single Pulse Time (zero airflow)
Rthj-a
Rthj-pin4 16.5
Zthj-a
81.2
10-2 10-1
Published Infineon Technologies
http://www.infineon.com
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