Footprint/Dimensions +0.1 -0.05 (0.3) ±0.2 (2.2) 10°max ±0.1
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Top Searches for this datasheet
SCT595-5-1
Footprint/Dimensions
+0.1 -0.05 (0.3)
±0.2 (2.2) 10°max ±0.1 +0.2 acc. 6784 +0.1 -0.05 0.95 Dimensions 10°max
0.95 Reflow soldering 0.25
+0.1 -0.05 0.20
0.15 +0.1 -0.06
PC-Board
SCT595
0.375
Application-Boards Measurement
SCT595
SCT595
Footprint only
0.375
FR4; 17.32
FR4; 12.247
FR4; Footprint only
Finite Element Method
Simulation (chip area zero airflow)
Tmax
Tmax
Footprint only; Tmax
Diagrams
178.7 Thermal Resistance Junction Ambient Rthj-a Heat Sink Area (zero airflow) Zthj-a Thermal Impedance Junction Ambient Zthj-a Single Pulse Time (zero airflow)
Rthj-a
Rthj-pin5 25.9
Footprint
98.5
10-2
10-1
Published Infineon Technologies
http://www.infineon.com
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