Example land pattern design !Rectangular chip resistors (MCR) Ens
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Example land pattern design
Example land pattern design
!Rectangular chip resistors (MCR) Ensure that areas other than solder land printed circuit surface covered with solder resist.
(Units
MCR01
MCR03 MCR10 MCR18 MCR25 MCR50 MCR100
Land
Cross jumper line
Dimensions Type
10.5
0.3~0.4
(ref. value) 0.52~0.92 1.1~1.3 1.4~1.8 2.1~3.0 2.1~3.0 2.56~4.8
MCR03
MCR10 MCR18 MCR25 MCR50 MCR100
!Network chip resistor (MNR)
MNR02 MNR04
Land
MNR35
Land
0.50
0.50
0.50
1.50
0.50
1.50
2.10
0.80
0.90
0.50
0.50
0.80
3.70
0.40 Land 0.65 0.55
0.30 0.50
0.40
circuit
1.40 1.30
0.55
MNR12 MNR14 MNR32 MNR34
Land
Category MNR12
1.27
MNR32
MNR15
Land
MNR18
Land
0.72 0.64 0.32 0.48
This land pattern only standard pattern. will gurantee characteristics parts.
Example land pattern design
!Trimmer chip resistor (MVR)
MVR22 MVR34 MVR32
Land
Resistor type
0.65
MVR22 (Type MVR32 (Type
!Recommended soldering conditions Reflow method Reflow soldering with lead solder paste. Condition soldering Preheat 150°C Maximum temperature 240±5°C Time Maximum twice.
Max.6s.
less than 1min. less than
Solder temperature (°C)
Max. 2.5min.
(min.)
3~4min.
Reflow soldering with lead free solder paste. Condition soldering Preheat 150°C Maximum temperature 260±5°C Time Maximum twice.
Max.6s.
less than 1min. less than
Solder temperature (°C)
Max. 2.5min.
(min.)
3~4min.
Correction soldering cycle allowed. "Soldering iron temperature: 270±10°C #Operation time $Soldering iron less
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