Footprint/Dimensions +0.15 -0.10 ±0.1 +0.05 -0.10 +0.08
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Top Searches for this datasheet
P-TO252-3-1
Footprint/Dimensions
+0.15 -0.10
±0.1
+0.05 -0.10 +0.08 -0.04
±0.1 ±0.15 (4.17)
±0.5 6.22 -0.2
10.6
0.51
5.76 Reflow soldering
0.15 side
0.75 ±0.1 2.28 0.25
0.0.15 +0.08 -0.04 1±0.1
4.57
Dimensions
PC-Board
P-TO252-3-1
Application-Boards Measurement
P-TO252-3-1
Footprint only
P-TO252-3-1
FR4; 24.49
FR4; 17.32
FR4; Footprint only
Finite Element Method
Simulation (chip area zero airflow)
Tmax
Tmax
Footprint only; Tmax
Diagrams
143.9 Thermal Resistance Junction Ambient Rthj-a Heat Sink Area (zero airflow) Footprint Thermal Impedance Junction Ambient Zthj-a Single Pulse Time (zero airflow)
Rthj-a
Rthj-c
Zthj-a
54.7
10-2 10-1
Published Infineon Technologies
http://www.infineon.com
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