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Future DRAM Requirements Addressing Needs Industry
Name: Title: Company: Division/ Department: Russell Infineon Technologies
Historic View
DRAM MEMORY ROAD; soon forgotten BEDO VRAM Static Column PC66 PC100
Asynchronous SIMM
3.3V Synchronous DIMM
Evolving DRAM Architectures
Will this cause market fragmentation?
Seems like maze,
Control/Address/Data Memory EDRAM
EDRAM
PC100 PC133
DDRII
Protocol Memory SLDRAM C-RDRAM
Direct RDRAM®
Rambus RDRAM registered trademarks Rambus Inc.
Paradigm Shift Edge Century
1980 1980
Mainframes Minicomputers Eng. Workstations Telecom Microfiche Terminals
1990 1990
2000 2000
2010 2010
PC-centric
Networking
Internet-centric
DRAM High Density
Server Router Mobile DRAM Main Density Server Power Client
Main Memory Memory Feature
There will still only product mainstream, non-mainstream DRAM market will grow become significant portion overall market.
Development DRAM Application Market 1999 2004
1999 2004
Source: Infineon
share demand applications growing
Industry commitment next mainstream memory
industry chosen follow open evolutionary path Facts: Chipsets supporting vendors) manufacturers have their Roadmaps vendors) major Notebook Server manufacturers showing systems their roadmaps vendors) major motherboard manufacturers ready ship boards 2001(8 vendors)
Server Notebook
Advantage Products
Cost performance advantage over other memory technologies available Industry support from very high performance servers Evolutionary roadmap place executed time significantly increases systems performance typical applications (not just benchmarks) high bandwidth latency SDRAM utilizes existing SDRAM manufacturing experience Same processes; bank core architecture; TSOP package; Same tester/burn-in boards; etc. controller support both Maximizes infrastructure reuse semiconductor fabs motherboard problems minimized
Chipset Market Share 2001 Mbits served
applications: Server,
ServerWoks Intel
Source: Industry Press, Estimates: Infineon Data
More than chipset market going terms Bits
clear roadmap future
"Life Fast Lane."
even better
high-speed low-power low-latency low-cost
PC333 PC266 PC200 PC100 SDRAM PC133 SDRAM
PC166 SDRAM
PC66 SDRAM
Non-Mainstream Memory
High Bandwidth Latency Power Granularity Embedded
Non-Mainstream Memory
High Bandwidth
Main Driver: Advantage: Computing Increased System Performance
Standard require higher bandwidth same lower latency Approach: Proprietary: Industry:
Rambus JEDEC (DDR-1, DDR-2),
High Bandwidth
Market Drivers
Bandwidth Drivers Computing Segment:
Engineering Workstations Servers Players, Dolby AC-3 Microsoft Speech recognition Games (3D-Graphics, Virtual Reality)
High Bandwidth Challenges Design Manufacturing
Issue
improve parasitics improve parasitics special package special package requirements requirements increased transistor requir. increased transistor requir. sophisticated system sophisticated system design design design features: PLL, design features: PLL, DLLfor timing improvement DLLfor timing improvement tester precision equals tester precision equals timing margins speed timing margins speed data prefetch (2x,4x data prefetch (2x,4x increased heat increased heat
Impact
small parameter margins small parameter margins increased assembly increased assembly package (CSP) development package (CSP) development (revolution) (revolution) increased cost increased cost increased resources increased resources higher design complexity higher design complexity increased chip size, increased increased chip size, increased power power reduced yield reduced yield higher power consumption higher power consumption reliability retention time reliability retention time
High Bandwidth
Limiting Factors
factors increasing memory performance: technology design tester package assembly
real limiting factor COST., Cost will determine market success
Latency
Main Driver: Advantage: Server, Networking Router high speed random access faster access independent data statistics Cost replacement Fast Static
Approach:
FCRAM, FC-DDR, CAM-DRAM Others
Latency Target Application: Networking
(Next Generation Video Networks)
Networking applications searching packet transfers extremely important. (100 Mbit/s): Gbit/s): AOC-3: AOC-48: GbE: AOC-192:
PSTN
Mlookups/s Mlookups/s Mlookups/s Mlookups/s Mlookups/s Mlookups/s
These figures only include lookup times. They include update cycles. Depending architecture these cycles take about long occur with varying frequencies.
GGSN
Internet
Latency Challenges
Issue
Modified array architecture Modified array architecture
smaller blocks smaller blocks shorter shorter
Impact
Increased size Increased size
Non-multiplexed addresses Non-multiplexed addresses
Higher count Higher count increased number pads increased number pads higher power consumption higher power consumption
Special design special application needs: Special design special application needs: increased market fragmentation increased market fragmentation away from "one type serves all" commodity business away from "one type serves all" commodity business
Power
Main Driver: Advantage: Mobile Appliances (Smart Phone, Palm, HPC) longer battery life reduced weight (due smaller battery) minimal power dissipation
Approach:
Low-Power DRAM
Power Mobile Appliances: Market
Handheld (Clamshell) Organizer (Palm) Smart Mobile Phone
Million Units 1999 2000 2001 2002 2003 2004 2005
Terminals Organizers Dictionaries E-Book WebPhone WebPad PALM Clamshell Mini Notebook
Power Mobile Appliances: Requirements
Features:
internet connectivity (WAP, Bluetooth) e-Mail organizer functionality travel information ease (colored graphics) small form factor voice recognition long battery life
Memory Requirement:
random access memory non-volatile memory integration (embedded memory) power power down feature long/no refresh voltage wide (x32) chip-scale/ paper thin package
Power Mobile Appliances: Conclusion
Market Memory Content Information Appliances: Internet information appliances gaining tremendous importance increased:
mobility utilization internet data bandwidth (UMTS, Bluetooth, xDSL)
fast growing, fragmented market utilizing platforms (Transmeta, Symbian/EPOC, Linux, power form factor highest importance memory solutions: MByte MByte 2003
FeRAM: ideal memory solution (random access non-volatile) eDRAM: system integration (SOC) DRAM: power SPEC, wide (x32),
Power Challenges Design Manufacturing
Issue
Improve transistor Improve transistor leakage leakage
superior process superior process technology technology
Impact
Higher cost Higher cost
improved circuit design improved circuit design reduce power reduce power consumption consumption periphery circuits periphery circuits narrowed process narrowed process window window
larger dies size larger dies size
reduced yield reduced yield
Special design special application needs: Special design special application needs: increased market fragmentation increased market fragmentation away from "one type serves all" commodity business away from "one type serves all" commodity business
Power Challenges Design Manufacturing
Issue
Improve transistor Improve transistor leakage leakage
superior process superior process technology technology
Impact
Higher cost Higher cost
improved circuit design improved circuit design reduce power reduce power consumption consumption periphery circuits periphery circuits narrowed process narrowed process window window
larger dies size larger dies size
reduced yield reduced yield
Special design special application needs: Special design special application needs: increased market fragmentation increased market fragmentation away from "one type serves all" commodity business away from "one type serves all" commodity business
Granularity
Main Driver: Advantage: Appliances Consumer Products higher bandwidth chip chip solution
Approach:
x32, Rambus
Power Challenges Design Manufacturing
Issue
More pads More pads wider on-chip buses wider on-chip buses more data activated more data activated access requires access requires design trade-offs design trade-offs parallel test parallel test
Impact
Larger package Larger package increased chip size increased chip size higher power higher power consumption consumption increased testing cost increased testing cost
Special design special application needs: Special design special application needs: increased market fragmentation increased market fragmentation away from "one type serves all" commodity business away from "one type serves all" commodity business
Embedded Solutions
Main Driver: Advantage: High Performance /Low power system chip solution reduced parts smaller form factor higher performance allow customized densities power clocking methodologies puddle memory configurations
Embedded DRAM Benefits
Improvements random cycle times have improved Improvements random cycle times have improved overall system bandwidth overall system bandwidth Reductions size increased memory capacity Reductions size increased memory capacity Flexibility multi bank arrangements improved Flexibility multi bank arrangements improved memory efficiencies memory efficiencies Developments processes have resulted improved Developments processes have resulted improved logic DRAM performance logic DRAM performance Improvements manufacturing have increased yields Improvements manufacturing have increased yields
Multiple test methodologies single device have Multiple test methodologies single device have increased coverage reduced test time. BIST, Logic increased coverage reduced test time. BIST, Logic BIST, JTAG, SCAN, IDDQ) BIST, JTAG, SCAN, IDDQ)
Embedded DRAM Challenges Design Manufacturing
Issue
volume volume larger size (larger larger size (larger system) system) cannot fill fabs (low cannot fill fabs (low production efficiency) production efficiency) testability testability flexible design flow flexible design flow
Impact
High cost High cost reduced yield reduced yield reduced yield reduced yield higher cost higher cost high engineering resources high engineering resources custom burn-in boards custom burn-in boards yield, cannot maintain yield, cannot maintain effeciency effeciency
reliability (process control) reliability (process control) process lifetime process lifetime
Embedded DRAM Summary
true system chip designs several different memories true system chip designs several different memories required performance, data integrity maximum efficiencies. required performance, data integrity maximum efficiencies. portable internet appliances technology ideal form factor, portable internet appliances technology ideal form factor, power reduction capabilities. power reduction capabilities. Improvements DRAM processes have enabled high yield Improvements DRAM processes have enabled high yield DRAM Memory Logic performance single device. DRAM Memory Logic performance single device. learning curve E-DRAM becoming mature industry learning curve E-DRAM becoming mature industry with multiple technology solutions. with multiple technology solutions. Capabilities development several memory architectures will Capabilities development several memory architectures will enable markets evolve mature markets continue enable markets evolve mature markets continue improve. improve. Development Application Specific Memories will increase Development Application Specific Memories will increase advancements embedded memories. advancements embedded memories.
Summary Outlook
Leaving commodity DRAM sphere influence means loosing Leaving commodity DRAM sphere influence means loosing economy scale cost relationship economy scale cost relationship Required devices Application Sets have similar Required devices Application Sets have similar organizations differ package, power, interface organizations differ package, power, interface performance requirements performance requirements Awareness memory manufacturers flexibility will become Awareness memory manufacturers flexibility will become increasingly important customer base regards increasingly important customer base regards ability supply this wider complement devices ability supply this wider complement devices Main memory will still retain major share memory Main memory will still retain major share memory devices., Servers will account over half bits consumed devices., Servers will account over half bits consumed expected grow 110% next years expected grow 110% next years Growth mobile requirements along with communications Growth mobile requirements along with communications creating genre requirements., growth will creating genre requirements., growth will fairly dramatic communication bandwidths improve fairly dramatic communication bandwidths improve
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