+0.15 3.25 ±0.1 max. Footprint/Dimensions -0.3 Package P-DSO
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Top Searches for this datasheet
P-DSO-20-10
+0.15 3.25 ±0.1 max.
Footprint/Dimensions
-0.3 Package P-DSO-20-10 1.27 13.48 1.83 0.68 1.27 +0.13 15.9 ±0.15
±0.15
+0.0 -0.027
15.74 ±0.1 (Heatsink) 0.25
14.2 ±0.3
Heatsink 0.95 ±0.15
0.25
Reflow soldering Index Marking
Dimensions
PC-Board
P-DSO-20-10
Application-Boards Measurement
P-DSO-20-10
0.375
P-DSO-20-10
Footprint only
0.375
FR4; 17.32
FR4; 12.247
FR4; Footprint only
Finite Element Method
Simulation (chip area zero airflow)
Tmax
Tmax
Footprint only; Tmax
Diagrams
Rthj-a Thermal Resistance Junction Ambient Rthj-a Heat Sink Area (zero airflow) Zthj-a Thermal Impedance Junction Ambient Zthj-a Single Pulse Time (zero airflow)
Rthj-c
Footprint 300mm
10-2 10-1
Published Infineon Technologies
http://www.infineon.com
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