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Footprint/Dimensions 1.75 max. 0.35 -0.2 0.19 +0.06 1.2


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P-DSO-14-4
Footprint/Dimensions
1.75 max. 0.35 -0.2
0.19 +0.06
1.27 0.35 +0.15 ±0.2 +0.8
max.
Package P-DSO-14-4 1.27 5.69 1.31 0.65
-0.1 1.45 -0.2
Reflow soldering
8.75 -0.21) Index Marking Dimensions
PC-Board
P-DSO-14-4
0.375
Application-Boards Measurement
P-DSO-14-4
0.375
P-DSO-14-4 -16-1
Footprint only
0.67
FR4; 17.32
FR4; 12.247
FR4; Footprint only
Finite Element Method
Simulation (chip area zero airflow)
298.1 Tmax 377.7
Tmax 389.8
Footprint only; Tmax 410.1
Diagrams
10-2 10-1 Thermal Resistance Junction Ambient Rthj-a Heat Sink Area (zero airflow) Zthj-a Thermal Impedance Junction Ambient Zthj-a Single Pulse Time (zero airflow)
Rthj-a
Rthj-pin4 31.7
Footprint
Published Infineon Technologies
http://www.infineon.com

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