Data Sheet PD-6.031C IR2117 SINGLE CHANNEL DRIVER Featu

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Data Sheet PD-6.031C IR2117 SINGLE CHANNEL DRIVER Featu

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Data Sheet PD-6.031C
IR2117
SINGLE CHANNEL DRIVER
Features
Floating channel designed bootstrap operation
Fully operational +600V Tolerant negative transient voltage dV/dt immune Gate drive supply range from Undervoltage lockout CMOS Schmitt-triggered inputs with pull-down Output phase with input
Product Summary
VOFFSET IO+/VOUT ton/off (typ.) 600V max.
Description
IR2117 high voltage, high speed power MOSFET IGBT driver. Proprietary HVIC latch immune CMOS technologies enable ruggedized monolithic construction. logic input compatible with standard CMOS outputs. output driver features high pulse current buffer stage designed minimum cross-conduction. floating channel used drive N-channel power MOSFET IGBT high side configuration which operates volts.
Packages
Typical Connection
600V
LOAD
Order
CONTROL INTEGRATED CIRCUIT DESIGNERS MANUAL
B-75
IR2117
Absolute Maximum Ratings
Absolute Maximum Ratings indicate sustained limits beyond which damage device occur. voltage parameters absolute voltages referenced COM. Thermal Resistance Power Dissipation ratings measured under board mounted still conditions. Additional information shown Figures through
Symbol
dVs/dt
Parameter Definition
High Side Floating Supply Voltage High Side Floating Supply Offset Voltage High Side Floating Output Voltage Logic Supply Voltage Logic Input Voltage Allowable Offset Supply Voltage Transient (Figure Package Power Dissipation +25°C Thermal Resistance, Junction Ambient Junction Temperature Storage Temperature Lead Temperature (Soldering, seconds) Lead DIP) Lead SOIC) Lead DIP) Lead SOIC)
Value Min.
-0.3 -0.3 -0.3
Max.
0.625
Units
V/ns °C/W
Recommended Operating Conditions
Input/Output logic timing diagram shown Figure proper operation device should used within recommended conditions. offset rating tested with supplies biased differential.
Symbol
Parameter Definition
High Side Floating Supply Absolute Voltage High Side Floating Supply Offset Voltage High Side Floating Output Voltage Logic Supply Voltage Logic Input Voltage Ambient Temperature
Value Min.
Note
Max.
Units
Note Logic operational +600V. Logic state held -VBS.
B-76
CONTROL INTEGRATED IRCUIT DESIGNERS MANUAL
Order
IR2117
Dynamic Electrical Characteristics
VBIAS (VCC, VBS) 15V, 1000 25°C unless otherwise specified. dynamic electrical characteristics measured using test circuit shown Figure
Symbol
Parameter Definition
Turn-On Propagation Delay Turn-Off Propagation Delay Turn-On Rise Time Turn-Off Fall Time
Value Min. Typ. Max. Units Test Conditions
600V
Static Electrical Characteristics
VBIAS (VCC, VBS) 25°C unless otherwise specified. VIN, parameters referenced COM. parameters referenced applicable respective output leads:
Symbol
Parameter Definition
Logic Input Voltage
Value Min. Typ. Max. Units Test Conditions
12.6 15V, 600V
Logic Input Voltage
IQCC IIN+ IINVBSUV+ VBSUVVCCUV+ VCCUVIO+
High Level Output Voltage, VBIAS Level Output Voltage, Offset Supply Leakage Current Quiescent Supply Current Quiescent Supply Current Logic Input Bias Current Logic Input Bias Current Supply Undervoltage Positive Going Threshold Supply Undervoltage Negative Going Threshold Supply Undervoltage Positive Going Threshold Supply Undervoltage Negative Going Threshold Output High Short Circuit Pulsed Current Output Short Circuit Pulsed Current
Order
CONTROL INTEGRATED CIRCUIT DESIGNERS MANUAL B-77
IR2117
Functional Block Diagram
DETECT
LEVEL SHIFT
PULSE FILTER
PULSE DETECT
Lead Definitions
Lead Symbol Description
Logic gate drive supply Logic input gate driver output (HO), phase with Logic ground High side floating supply High side gate drive output High side floating supply return
Lead Assignments
Lead
S0-8
IR2117 Part Number
B-78 CONTROL INTEGRATED IRCUIT DESIGNERS MANUAL
IR2117S
Order
IR2117
Device Information
Process Design Rule Transistor Count Size Outline HVDCMOS (mil)
Thickness Gate Oxide Connections First Layer
Second Layer Contact Hole Dimension Insulation Layer Passivation Method Method Bond Wire Bond Leadframe
Material Width Spacing Thickness Material Width Spacing Thickness Material Thickness Material Thickness
Package Remarks:
Method Material Material Area Lead Plating Types Materials
Poly Silicon (Si: 1.0% ±0.1%) (SiO2) (SiO2) Full Ablebond Thermo Sonic (1.0 mil) Lead PDIP SO-8 EME6300 MP150 MP190
Order
CONTROL INTEGRATED CIRCUIT DESIGNERS MANUAL B-79
IR2117
Figure Input/Output Timing Diagram Figure Floating Supply Voltage Transient Test Circuit
toff
Figure Switching Time Test Circuit
Figure Switching Time Waveform Definition
B-80
CONTROL INTEGRATED IRCUIT DESIGNERS MANUAL
Order
IR2117
320V 140V
320V
140V
Junction Temperature (°C) Junction Temperature (°C)
1E+2 1E+3 1E+4 Frequency (Hz) 1E+5 1E+6
1E+2 1E+3 1E+4 Frequency (Hz) 1E+5 1E+6
Figure IR2117 Frequency (IRFBC20) RGATE
Figure IR2117 Frequency (IRFBC30) RGATE
320V 140V
320V 140V
Junction Temperature (°C) Junction Temperature (°C) 1E+3 1E+4 Frequency (Hz) 1E+5 1E+6
1E+2
1E+2 1E+3 1E+4 Frequency (Hz) 1E+5 1E+6
Figure IR2117 Frequency (IRFBC40) RGATE
Figure IR2117 Frequency (IRFPE50) RGATE
Order
CONTROL INTEGRATED CIRCUIT DESIGNERS MANUAL B-81

Data Sheet PD-6.031C IR2117 SINGLE CHANNEL DRIVER Featu

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