THREE PHASE MOTOR DRIVER SUPPLY VOLTAGE FROM PEAK CURRENT TYP. VA
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L6234
THREE PHASE MOTOR DRIVER
SUPPLY VOLTAGE FROM PEAK CURRENT TYP. VALUE 25°C CROSS CONDUCTION PROTECTION COMPATIBLE DRIVER OPERATING FREQUENCY 50KHz THERMAL SHUTDOWN INTRINSIC FAST FREE WHEELING DIODES INPUT ENABLE FUNCTION EVERY HALF BRIDGE EXTERNAL REFERENCE AVAILABLE DESCRIPTION L6234 triple half bridge drive brushless motor. realized Multipower technology which combines isolated DMOS power transistors with CMOS Bipolar circuits same chip. using mixed technology been possible optimize logic circuitry power stage achieve best possible performance. output DMOS transistors sustain very high current fact that DMOS structure affected second breakdown efPIN CONNECTION (Top view)
POWER (16+2+2)
PowerSO20
ORDERING NUMBERS: L6234 (POWER 16+2+2) L6234PD (PowerSO20)
fect, maximum current practically limited dissipation capability package. logic inputs TTL, CMOS compatible. Each channel controlled separate logic input. L6234 available POWER package (16+2+2) PowerSO20.
OUT1 OUT3
D98IN848
OUT2 SENSE1 SENSE2 VBOOT VREF
SENSE1 OUT2 OUT1
D94IN129A
SENSE2 BOOT OUT3
POWER (16+2+2)
PowerSO20
March 1998
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L6234
BLOCK DIAGRAM
0.22µF 10nF CHARGE PUMP VREF VBOOT VREF= OUT1 100µF 1N4148
OUT2
THERMAL PROTECTION
SENSE1
OUT3
SENSE2
D95IN309A
RSENSE
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L6234
THERMAL DATA
Symbol j-pin j-amb1 j-amb2 j-case Parameter Thermal Resistance, Junction Thermal Resistance, Junction Ambient (see Thermal Characteristics) Thermal Resistance, Junction Ambient (see Thermal Characteristics) Thermal Resistance Junction-case DIP16+2+2 PowerSO20 Unit °C/W °C/W °C/W °C/W
THERMAL CHARACTERISTICS j-pins DIP16+2+2. thermal resistance referred thermal path from dissipating region surface silicon chip, points along four central pins package, distance away from stand-offs. j-amb1 dissipating surface, thick least with surface similar bigger than shown, created making printed circuit. Such heatsinking surface considered bottom side horizontal (worst case). j-amb2 power dissipating pins (the four central
ones), well others, have minimum thermal connection with external world (very thin strips only) that dissipation takes place through still through itself. same situation point above, without heatsinking surface created purpose board. Additional data PowerDip PowerSO20 package found Application Note AN467: Thermal Characteristics PowerDip 20,24 Packages Soldered 1,2,3 Copper Application Note AN668: High Power Surface Mount Package: PowerSO20 Power Packaging from Insertion Surface Mounting.
Figure Printed Heatsink
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L6234
ABSOLUTE MAXIMUM RATINGS
Symbol VIN,VEN Ipeak VSENSE VREF Ptot Ptot Tstg, Parameter Power Supply Voltage Input Enable Voltage Pulsed Output Current (note Sensing Voltage Voltage) Bootstrap Peak Voltage Differential Output Voltage (between pins) Commutation Frequency Reference Voltage Total Power Dissipation Total Power Dissipation L6234PD Tamb 70°C L6234 Tamb 70°C Value Unit
Storage Junction Temperature Range
Note Pulse width limited only junction temperature transient thermal impedance Mounted board with minimized copper area
RECOMMENDED OPERATING CONDITIONS
Symbol Iout VSENSE Supply Voltage Peak Peak Differential Voltage (between pins) Output Current Power SO20 (Tamb 25°C) Output Current Power (Tamb 25°C) with infinite heatsink Sensing Voltage (pulsed 300nsec) Sensing Voltage (DC) Junction Temperature Range Parameter Value Unit
FUNCTIONS
Powerdip 15,16 4/10 PowerSO20 1,10 11,20 Name SENSE2 SENSE1 Vref VBOOT Output channels 1/2/3. Function
Logic input channels 1/2/3. logic HIGH level (when corresponding HIGH) switches upper DMOS Power Transistor, while logic switches corresponding side DMOS Power. Enable channels 1/2/3. logic level this switches both power DMOS related channel. Power Supply Voltage. resistance Rsense connected this provides feedback motor current control bridge resistance Rsense connected this provides feedback motor current control bridges Internal Voltage Reference. capacitor connected from this increases stability Power DMOS drive circuit. Bootstrap Oscillator. Oscillator output external charge pump. Overvoltage input drive upper DMOS Common Ground Terminal. Powerdip packages these pins used dissipate heat forward PCB.
L6234
ELECTRICAL CHARACTERISTICS 25°C unless otherwise specified)
Symbol Vref Parameter Supply Voltage Reference Voltage Quiescent Supply Current Thermal Shutdown Dead Time Protection Test Condition Min. Typ. Max. Unit
OUTPUT DMOS TRANSISTOR
Symbol IDSS (ON) Parameter Leakage Current Resistance Test Condition Min. Typ. Max. Unit
SOURCE DRAIN DIODE
Symbol Parameter Forward Voltage Reverse Recovery Time Forward Recovery Time Test Condition Min. Typ. Max. Unit
LOGIC LEVELS
Symbol VINL, VENL VINH, VENH IINL, IENL IINH, IENH Parameter Input Voltage Input HIGH Voltage Input Current Input HIGH Current VIN,VEN VIN,VEN Test Condition Min. -0.3 Typ. Max. Unit
CIRCUIT DESCRIPTION L6234 triple half bridge designed drive brushless motors. Each half bridge power DMOS transistors with RdsON 0.3. half bridges controlled independentlyby means inputs IN1, IN2, inputs EN1, EN2,
EN3. external connection common side DMOS sources provided connect sensing resistor constant current chopping application. driving stage logic stage designed work from 52V.
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L6234
Figure Quiescent Current Supply Voltage.
130°C 25°C -40°C 25°C
Figure Normalized Quiescent Current switching frequency.
Iq/(Iq@500Hz) 1.75
130°C
-40°C
100°C
1.25
0.75 [kHz]
Figure Typical (ON) Supply Voltage.
Figure Source Drain Forward voltage Junction Temperature.
30°C
Iout=4A
Figure Typical Diode Forward characteristics
25°C
Figure Reference Voltage Supply Voltage.
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L6234
Figure Reference Voltage Junction Temperature.
Figure PowerSO-20 Transient Thermal Resistance
Figure PowerSO-20 Thermal Resistance (Mounted Aluminium substrate)
Figure PowerSO-20 Thermal Resistance (Mounted monolayersubstrate)
Figure PowerSO-20: with external heatsink
Figure Thermal Impedance PowerSO-20 standard SO20
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L6234
PowerSO-20 PACKAGE MECHANICAL DATA
DIM. MIN. 0.23 15.8 13.9 1.27 11.43 10.9 15.5 11.1 15.9 (max.) (max) 0.394 0.429 0.228 0.000 0.610 0.031 TYP. MAX. 0.53 0.32 14.5 MIN. 0.004 0.000 0.016 0.009 0.622 0.370 0.547 0.050 0.450 0.437 0.114 0.244 0.004 0.626 0.043 0.043 inch TYP. MAX. 0.142 0.012 0.130 0.004 0.021 0.013 0.630 0.386 0.570
include mold flash protrusions. Mold flash protrusions shall exceed 0.15 (0.006"). Critical dimensions: "E", "a3"
DETAILB
DETAIL
lead
DETAIL
DETAIL
Gage Plan 0.35
slug
TING PLANE (COPLANARITY)
PSO20MEC
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L6234
POWERDIP PACKAGE MECHANICAL DATA
DIM. MIN. 3.30 1.27 8.80 2.54 22.86 7.10 5.10 0.130 0.050 0.38 0.51 0.85 0.50 0.50 24.80 0.346 0.100 0.900 0.280 0.201 0.015 1.40 TYP. MAX. MIN. 0.020 0.033 0.020 0.020 0.976 0.055 inch TYP. MAX.
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L6234
Informationfurnished isbelievedto beaccurateand patentsorotherrights licenseis MSON Microelectronics. pecification mentioned arenotauthorizedforuse ascriticalcomponents inlif 1998 SGS-THOMSON Microelectronics Printed Italy Rights Reserved SGS-THOMSON Microelectronics GROUP COMPANIES Australia Brazil Canada China France Germany Italy Japan Korea Malaysia Malta Morocco Netherlands Singapore Spain Sweden Switzerland Taiwan Thailand United Kingdom U.S.A.
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