September 1997 Revised December 2000 Quality Reliability Interfac

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September 1997 Revised December 2000 Quality Reliability Interfac

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Quality Reliability Interface Logic
September 1997 Revised December 2000
Quality Reliability Interface Logic
Quality Reliability
Fairchild Semiconductor's quality mission deliver superior multi-market semiconductor products customer value through innovation, service manufacturing excellence. From design concept through after-the-sale service, quality integral part everything Based upon ISO9000 QS9000 industry standards, quality system been fully integrated into business practices enabling Fairchild Semiconductor achieve quality levels that meet even most stringent requirements. proud this system welcome customers wish further discuss precesses detail. Product reliability, concept insuring that products perform intended desired duration field use, also received heavy emphasis within Fairchild Semiconductor. Reliability evaluations, utilizing innovative Wafer Level Reliability (WLR) test techniques, conducted normal part development cycle. Qualification testing, based largely JEDEC Industry Standards consistent with other product divisions within Fairchild Semiconductor, performed insure that products processes meet exceed customer requirements. Once production, product reliability monitor testing performed insure that reliability levels remain acceptable demonstrate continuous improvement line with internally goals. When used within specified conditions, products will provide many years trouble free operation. Fairchild Semiconductor continues role technology innovator, creating products that have industry standards. phase review processes, product process characterizations, manufacturing controls process monitors insure that products will continue this legacy. Your satisfaction with these products critically important Fairchild. maintain staff experienced individuals Sales Support, Technical Service, Applications Engineering Customer Quality Engineering. These groups place help with questions concerns have. Continuous improvement life Fairchild. data indicates that producing superior products that exceed customer expectations. customer's experience perception with products services, however, that ultimately determines have been sucessful. this reason, your feedback very important This information collected Customer Quality Engineering department shared with entire corporation. used reinforce desired practices drive changes when necessary. Customer feedback crucial component service quality program.
Qualification Requirements
Product qualification disciplined, team activity which focuses demonstrating, through acquisition analysis engineering data, that device design, manufacturing process, package design meets exceeds established standards performance. Fairchild utilizes both traditional reliability test methods test techniques access product reliability during qualification testing. properly designed qualification test sequence exposes, within matter weeks, weaknesses associated with design, materials workmanship that could lead premature product failure customer application. test methods fully documented reference appropriate industry standard method. summary table detailing traditional reliability test procedures (for plastic packages) utilized Fairchild Semiconductor appears below. Test Static Life HAST Autoclave Temperature Cycle Moisture Sensitivity Resistance Solder Heat Lead Integrity Mark Permanency Flammability Solderability Bond Pull Bond Shear Shear Physical Dimensions Industry Standard JESD22-A108 JESD22-A110 JESD22-A102 JESD22-A104 J-STD-020 JESD22-B106 JESD22-B105 JESD22-B107 UL94V-0 JESD22-B102 JESD22-C100 AEC-Q100-001 STD883-2019 JESD22-B100 EOS/ESD S5.1 Certificate 245C, Stress Conditions 150C, Biased 130C, 85%RH 121C, 100%RH
-65C +150C
150C 235C Peak Reflow Temp. 260C, sec.
High Temp Storage Life JESD22-A103
2000 Fairchild Semiconductor Corporation
MS011564
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Qualification Requirements
(Continued) addition these traditional reliability stresses, Fairchild active Wafer Level Reliability (WLR) program that serves assess process reliability providing quantifiable data observed sensitivities potential failure mechanisms (i.e. mobile ionics). This accomplished using very fast (typically less than minute duration) nontraditional test techniques applied customized test structures sensitive specific failure mechanisms. These nontraditional stress techniques meant provide supplementary data traditional stress techniques purposes characterizing improving process reliability during development stage. Fairchild developed tests following failure mechanisms: Intermetal Dielectric Integrity Metal Step Coverage Mobile Ionics Metal Stress Voids Gate Oxide Integrity Passivation Integrity Electron Degradation Metal Electromigration Bipolar Beta Degradation Process Induced Charging
specification helps improve tester-to-tester repeatability independent part type, designating waveform guidelines, similar fashion those MIL-STD883/3015.7. waveform guidelines ensure that stray capacitance tester will limited less. EOS/ESD Association recommended EOS/ESDS5.1 used conjunction with MIL-STD-883/3015.7 provide better testing environment well most representative waveform. Using this methodology will provide greater repeatability without compromising intent testing. More information stray capacitance EOS/ESD S5.1 found 1993 EOS/ESD Symposium Proceedings' article "Analysis testers specifications using order lumped element model", 129- 137.
Overstress Sensitivities Minimum Geometry Products
demand high performance process technology capable faster speeds, minimal noise lower operating voltages drives microelectronics industry towards decreasing layout geometries. Advanced process technology minimizes gate widths, gate oxide thickness junction depths improve gate switching speeds. contrast, decreased geometries reduce ability devices built advanced processes resist electrical overstresses. geometries decrease, emphasis shifts towards reduction environmentally induced electrical overstresses ensure system component reliability. Market trends continue drive need smaller geometries with reduced power supply voltages. Current 5.0V technologies migrating towards 3.0V lower voltage technologies these lower voltage technologies have shown greater sensitivity electrical overstresses. Sensitivities electrical overstresses have been observed large geometries. Device damage from electrical overstresses vary categories include, limited Electrical-OverStress (EOS) excessive current voltage exposure Electro-Static-Discharge (ESD) exposure Human Body Model, Charged Device Model Machine Model. Sources electrically induced overstresses difficult determine; however, investigation failures from small geometry devices show that environmental hazards such unregulated unconditioned power supplies field exceed "Absolute Maximum Ratings" causing unrecoverable device damage. effort resolve device sensitivities electrical overstresses, designers engineers reference device databooks. Databook specifications include "Absolute Maximum Ratings" adherence this specification essential ensuring component system level reliability.
Note Amerasekera, Chatterjee, Investigation BiCMOS Protection Circuit Elements Applications Submicron Technologies", EOS/ESD Symposium, p5B.6.1.
Electrostatic Discharge Sensitivity (ESD)
Fairchild's interface logic products manufactured using either Bipolar, CMOS, BiCMOS technology. protect these circuits from harmful effects Human Body Model (HBM) events, protection circuitry and/or traditional diodes used. design, this circuitry improves immunity both Electrical Overstress (EOS). Protection provided from pin-to-ground (GND) pin-to-VCC. Additional protection provided proprietary solutions that provide resistance path between during various combinations. device design layout ensures dependable turn-on characteristics well robustness. Normal handling precautions should observed case semiconductor.
Repeatability Results
Research shown that stray capacitance testers cause device degradation early failure. this discussion, stray capacitance defined capacitance that distributed from device socket through board connections lines network: 1500 ±1%, charging capacitor: ±10%. This degradation seen mainly N-channel protection caused charge delivered stray capacitance, charge that accounted MIL-STD-883/3015.7. Lowering stray capacitance tester advocated EOS/ESD Association under their EOS/ESD-S5.1. This
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Quality Reliability Interface Logic
Latchup Testing
MIL-STD standard measurement procedure characterization CMOS integrated circuit latchup susceptibility/immunity, measured under static conditions. method allows over current/over voltage stressing inputs, outputs supply detect latchup. short, MIL-STD follows sequence Apply power Setup conditions place device desired state Apply trigger source desired duration Measure supply current Remove trigger stimulus, test limit Inspect electrical damage interface logic products, logic states checked susceptibility latchup accordance with MIL-STD method 3023. high trigger stresses, devices used latchup testing should discarded used design, production, other tests. Latchup testing potentially destructive limit life device.
Fairchild does assume responsibility circuitry described, circuit patent licenses implied Fairchild reserves right time without notice change said circuitry specifications. LIFE SUPPORT POLICY FAIRCHILD'S PRODUCTS AUTHORIZED CRITICAL COMPONENTS LIFE SUPPORT DEVICES SYSTEMS WITHOUT EXPRESS WRITTEN APPROVAL PRESIDENT FAIRCHILD SEMICONDUCTOR CORPORATION. used herein: Life support devices systems devices systems which, intended surgical implant into body, support sustain life, whose failure perform when properly used accordance with instructions provided labeling, reasonably expected result significant injury user. critical component component life support device system whose failure perform reasonably expected cause failure life support device system, affect safety effectiveness. www.fairchildsemi.com
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September 1997 Revised December 2000 Quality Reliability Interfac

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