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µBGA* Chip Scale Package Mechanical Shipping Media Specifications
Document Number: 290661-022
Information this document provided connection with Intel® products. license, express implied, estoppel otherwise, intellectual property rights granted this document. Except provided Intel's Terms Conditions Sale such products, Intel assumes liability whatsoever, Intel disclaims express implied warranty, relating sale and/or Intel products including liability warranties relating fitness particular purpose, merchantability, infringement patent, copyright other intellectual property right. Intel products intended medical, life saving, life sustaining applications. Intel make changes specifications product descriptions time, without notice. Designers must rely absence characteristics features instructions marked "reserved" "undefined." Intel reserves these future definition shall have responsibility whatsoever conflicts incompatibilities arising from future changes them. Contact your local Intel sales office your distributor obtain latest specifications before placing your product order. Copies documents which have ordering number referenced this document, other Intel literature obtained calling 1-800548-4725 visiting Intel's website http://www.intel.com.
Copyright Intel Corporation, 1999-2001 *Other names brands claimed property others.
Mechanical Specification
Contents
Chip Scale Package Construction
µBGA* Package Construction Very-Thin, Fine-Pitch, Ball Grid Array BGA) Package Construction µBGA* Package Daisy Chain Schematics G28FSDCCR µBGA* Package Drawing Dimensions Daisy Chain Devices G28FSDCCR Very-Thin, Fine-Pitch, Ball Grid Array BGA) Package Daisy Chain Schematics GE28FSDCR46 Very-Thin, Fine-Pitch, Ball Grid Array BGA) Package Drawing Dimensions Daisy Chain Devices GE28FSDCR46 µBGA* Daisy Chain Package Schematics GT28FSDCWC µBGA* Package Drawing Dimensions Daisy Chain Device GT28FSDCWC. µBGA* Package Drawing Dimensions µBGA* Package Dimensions FlashFileMemory Architecture Devices µBGA* Package Drawing Dimensions µBGA* Package Dimensions Boot Block Memory Components 28F800B3, 28F160B3, 28F008B3, 28F016B3 Devices Only.11 µBGA* Package Dimensions Boot Block Memory Components 28F016B3_A/ 28F160B3_A /28F320B3_A 28F160C3_A 28F320C3_A Devices Only Very-Thin, Fine-Pitch, Package BGA) Drawing Dimensions, 28F800B3_A.13 Very-Thin, Fine-Pitch, Package BGA) Drawing Dimensions, 28F320B3_C 28F320C3_C µBGA* Package Drawing Dimensions µBGA* Package Dimensions Fast Boot Block Memory Component Devices µBGA* Package Drawing Dimensions Intel® StrataFlashMemory µBGA* Package Dimensions 28F640J5 Intel® StrataFlashMemory µBGA* Package Drawing Dimensions Intel® Volt Wireless Flash Memory GT28F640W18, GT28F640W30 Very-Thin, Fine-Pitch, BGA) Package Drawing Dimensions Intel® Volt Wireless Flash Memory, GE28F320W18, GE28F320W30
Chip Scale Package Daisy Chain Evaluation Units.
FlashFileMemory Components
Boot Block Flash Memory Components
Fast Boot Block Memory Components
Intel® StrataFlashMemory
Intel® Volt Wireless Flash Memory
Mechanical Specification
Chip Scale Package Media Information
Carrier Tape Diagram Dimensions. Carrier Tape Reel Diagram Dimensions Injection Molded Thin JEDEC Tray Parameters Shipping Media Ordering Information 8.4.1 Ordering Information
Additional Information
Mechanical Specification
Revision History
Date Revision 10/29/97 11/20/97 12/04/97 05/12/98 Version First external release Deleted Intel's word-wide FlashFilememory components Added package media information Added 28F800B3, 28F160B3, 28F008B3, 28F016B3, 28F016B3_A/ 28F160B3_A /28F032B3_A /28F320B3_A, 28F016C3_A /28F160C3_A 28F032C3_A /28F320C3_A device information Changed name document from Micro Ball Grid Array Package Mechanical Specifications Media Information µBGA* Package Mechanical Shipping Media Specifications Converted tape daisy chain silicon daisy chain Discontinued 40-ball tape daisy chain Changed 56-Ball array µBGA package 28F640/320J5 product pinouts reflect removal balls Added Fast Boot Block Advanced+ Boot Block information; deleted ball count references. Updated specifications Table 4.3, µBGA* Package Dimensions Boot Block Memory Components. Corrected pinout layout 28F320B3_A/28F320C3_A, Section 4.10. Added µBGA* Package Silicon Daisy Chain Schematics G28FSDCCR µBGA* Package Drawing Dimensions Silicon Daisy Chain Devices G28FSDCCR Removed references 28F0xxC3 28F032B3 (x8) Added 28F160C18 information (Section 4.11) Provided additional media socket ordering information (Section 7.4.1) Added Volt Dual-Plane Flash Memory Section (Section 7.0) Removed 28F160C18 information Removed references 28F008B3_A 28F008C3_A Corrected designation products Removed 28FSDC56 SDC's Removed electrical pinouts Added Very-Thin, Fine-Pitch, Ball Grid Array BGA) Package Construction figure (Section 1.2) Removed µBGA* Package Silicon Daisy Chain Schematics G28FSDC48 Removed µBGA* Package Drawing Dimensions Silicon Daisy Chain Devices G28FSDC48 Added Package Silicon Daisy Chain Schematics (Section 2.3) Added Package Drawing Dimensions Silicon Daisy Chain Devices GE28FSDCR46 (Section 2.4) Added Package Drawing Dimensions, 28F800B3 (Section 4.4, Section 4.5) Revised Chip Scale Package Thin Tray Dimensions table include information (Section 8.3) Revised Ordering Information include information (Section 8.4.1) Description
05/26/98
06/18/98 07/29/98 08/18/98 11/11/98 02/16/99 03/08/99 03/17/99 06/07/99
3.10 3.11 3.12 3.13 3.14 3.15 3.1.6
10/06/99
3.1.7
03/01/00 05/03/00
3.1.8 -019
06/30/00
-020
Mechanical Specification
Date Revision
Version
Description Removed references Intel® Volt Dual-Plane Flash Memory Revised Section 2.4, Very-Thin, Fine-Pitch, Ball Grid Array BGA) Package Drawing Dimensions Daisy Chain Devices GE28FSDCR46 Added Section 2.5, µBGA* Daisy Chain Package Schematics GT28FSDCWC Added Section 2.6, µBGA* Package Drawing Dimensions Daisy Chain Devices GT28FSDCWC Added Section 2.7, Very-Thin, Fine-Pitch, Package BGA) Daisy Chain Package Schematic GE28FSDC56 Added Section 2.8, Very-Thin, Fine-Pitch, Package BGA) Daisy Chain Drawing Dimensions GE28FSDC56 Added Section 7.1, µBGA* Package Drawing Dimensions Intel® Volt Wireless Flash Memory GT28F640W18 Added Section 7.2, Very-Thin, Fine-Pitch, BGA) Package Drawing Dimensions Intel® Volt Wireless Flash Memory GE28F320W18, GE28F320W30 Revised Section 8.4.1, Ordering Information Minor text edits Removed Section 2.7, Very-Thin, Fine-Pitch, Package BGA) Daisy Chain Package Schematic GE28FSDC56 Removed Section 2.8, Very-Thin, Fine-Pitch, Package BGA) Daisy Chain Drawing Dimensions GE28FSDC56
03/30/01
-021
04/20/01
-022
Mechanical Specification
Chip Scale Package Construction
µBGA* Package Construction
following figure illustrates typical cross section construction µBGA* package.
Silicon 1.0mm Elastomer Elastomer Construction provides excellent Reliability
.75mm Pitch
Very-Thin, Fine-Pitch, Ball Grid Array BGA) Package Construction
Wire
Encapsulation (Mold)
Silicon 1.0mm Attach Material Eutectic Solder Balls
0.75mm Pitch
Thin Organic Substrate
Mechanical Specification
Chip Scale Package Daisy Chain Evaluation Units
µBGA* Package Daisy Chain Schematics G28FSDCCR
Bottom View-Ball Side
Package Connections: Ball Number Ball Number Ball Number Ball Number
Mechanical Specification
µBGA* Package Drawing Dimensions Daisy Chain Devices G28FSDCCR
Ball Indicator
Ball Corner
View Bumps Down
Complete Mark Shown
Bottom View Bump side
Seating Plane
Side View
Millimeters Package Height Ball Height Package Body Thickness Ball (Lead) Width Package Body Width Package Body Length Pitch Ball (Lead) Count Seating Plane Coplanarity Corner Ball Distance Along Corner Ball Distance Along 0.918 1.507 1.018 1.607 0.850 0.150 0.600 0.300 7.186 6.864 0.700 0.350 7.286 6.964 0.750 0.100 1.118 1.707 0.0361 0.0593 0.800 0.400 7.386 7.064 1.000 Notes 0.0335 0.0059 0.0236 0.0118 0.2829 0.2702
Inches 0.0394
0.0276 0.0138 0.2868 0.2742 0.0295
0.0315 0.0157 0.2908 0.2781
0.0039 0.0400 0.0633 0.0440 0.0672
Mechanical Specification
Very-Thin, Fine-Pitch, Ball Grid Array BGA) Package Daisy Chain Schematics GE28FSDCR46
View-Balls Down
Daisy Package Connections:
Ball Number
Ball Number
Ball Number
Ball Number
Mechanical Specification
Very-Thin, Fine-Pitch, Ball Grid Array BGA) Package Drawing Dimensions Daisy Chain Devices GE28FSDCR46
Ball Indicator
Ball Corner
View Bumps Down
Complete Mark Shown
Bottom View Bump side
Seating Plane
Side View
Millimeters Symbol Package Height Ball Height Package Body Thickness Ball (Lead) Width Package Body Width (8Mb) Package Body Length (8Mb) Pitch Ball (Lead) Count Seating Plane Coplanarity Corner Ball Distance Along Corner Ball Distance Along 1.230 1.275 1.330 1.375 0.850 0.150 0.610 0.275 7.810 6.400 0.660 0.350 7.910 6.500 0.750 0.100 1.430 1.475 0.0484 0.0502 0.710 0.425 8.010 6.600 1.000 Notes 0.0335 0.0059 0.0236 0.0108 0.3075 0.2520
Inches 0.0394
0.0276 0.0138 0.3114 0.2559 0.0295
0.0315 0.0167 0.3154 0.2598
0.0039 0.0524 0.0541 0.0563 0.0581
Mechanical Specification
µBGA* Daisy Chain Package Schematics GT28FSDCWC
View Ball Side Down
Package Connections:
Ball Number
Ball Number
Ball Number
Mechanical Specification
µBGA* Package Drawing Dimensions Daisy Chain Device GT28FSDCWC
Indicator
Corner
View Silicom backside
Complete Mark Shown
Bottom View Bump side
Side View
Seating Plane
Millimeters Symbol Package Height Ball Height Package Body Thickness Ball (Lead) Width Package Body Width Package Body Length Pitch Ball (Lead) Count Seating Plane Coplanarity Corner Ball Distance Along Corner Ball Distance Along 1.125 2.150 1.225 2.250 0.850 0.150 0.612 0.300 7.600 8.900 0.712 0.350 7.700 9.000 0.750 0.100 1.325 2.350 0.0443 0.0846 0.812 0.400 7.800 9.100 1.000 Notes 0.0335 0.0059 0.0241 0.0118 0.2992 0.3503
Inches 0.0394
0.0280 0.0122 0.3031 0.3543 0.0295
0.0320 0.0157 0.3071 0.3583
0.0039 0.0482 0.0886 0.0522 0.0925
Mechanical Specification
FlashFileMemory Components
µBGA* Package Drawing Dimensions
Ball
Ball Corner
Indicator
View Silicon backside
Complete Mark Shown
Bottom View Bump side
Seating Plane
Side View
40-Ball µBGA* Package Specifications 28F008S3/28F016S3
Mechanical Specification
µBGA* Package Dimensions FlashFileMemory Architecture Devices
Millimeters 0.850 0.150 0.600 0.300 7.330 7.528 5.590 9.128 0.700 0.350 7.430 7.628 5.690 9.228 0.750 0.100 0.99 1.089 1.245 3.014 1.090 1.189 1.345 3.114 1.19 1.29 1.45 3.21 0.0390 0.0429 0.0490 0.1187 0.0429 0.0468 0.0530 0.1226 0.800 0.400 7.530 7.728 5.790 9.328 1.000 Notes 0.0335 0.0059 0.0236 0.0118 0.2886 0.2964 0.2201 0.3594 0.0276 0.0138 0.2925 0.3003 0.2240 0.3633 0.0295 0.0039 0.0469 0.0507 0.0569 0.1265 0.0315 0.0157 0.2965 0.3043 0.2280 0.3672 Inches 0.0394
Package Height Ball Height Package Body Thickness Ball (Lead) Width Package Body Width Package Body Width Package Body Length Package Body Length Pitch Ball (Lead) Count Seating Plane Coplanarity Corner Ball Distance Along Corner Ball Distance Along Corner Ball Distance Along Corner Ball Distance Along
Remarks: Specific ball population patterns vary depending product. Please refer specific product datasheet.
Mechanical Specification
Boot Block Flash Memory Components
µBGA* Package Drawing Dimensions
Ball
Ball Corner
Indicator
View Silicon backside
Complete Mark Shown
Bottom View Bump side
Seating Plane
Side View
µBGA* Package Specifications 28F160C3_A/28F320C3_A
Remarks: Specific ball population patterns vary depending product. Please refer specific product datasheet.
Mechanical Specification
µBGA* Package Dimensions Boot Block Memory Components 28F800B3, 28F160B3, 28F008B3, 28F016B3 Devices Only
Millimeters 0.850 0.150 0.600 0.300 7.810 7.480 6.400 9.710 0.700 0.350 7.910 7.580 6.500 9.810 0.750 0.100 1.23 1.065 1.275 2.93 1.330 1.165 1.375 3.030 1.43 1.27 1.48 3.13 0.0484 0.0419 0.0502 0.1154 0.0524 0.0459 0.0541 0.1193 0.800 0.400 8.010 7.680 6.600 9.910 1.000 Notes 0.0335 0.0059 0.0236 0.0118 0.3075 0.2945 0.2520 0.3823 0.0276 0.0138 0.3114 0.2984 0.2559 0.3862 0.0295 0.0039 0.0563 0.0498 0.0581 0.1232 0.0315 0.0157 0.3154 0.3024 0.2598 0.3902 Inches 0.0394
Package Height Ball Height Package Body Thickness Ball (Lead) Width Package Body Width Package Body Width Package Body Length Package Body Length Pitch Ball (Lead) Count Seating Plane Coplanarity Corner Ball Distance Along Corner Ball Distance Along Corner Ball Distance Along Corner Ball Distance Along
NOTE: Some ball locations populated some products. specific product datasheet complete details.
Mechanical Specification
µBGA* Package Dimensions Boot Block Memory Components 28F016B3_A/28F160B3_A /28F320B3_A 28F160C3_A /28F320C3_A Devices Only
Millimeters 0.850 0.150 0.600 0.300 7.186 7.186 6.864 10.75 0.700 0.350 7.286 7.286 6.964 10.85 0.750 0.100 0.918 0.918 1.507 3.45 1.018 1.018 1.607 3.55 1.118 1.118 1.707 3.65 0.0361 0.0361 0.0593 0.1358 0.0400 0.0400 0.0633 0.1398 0.800 0.400 7.386 7.386 7.064 10.95 1.000 Notes 0.0335 0.0059 0.0236 0.0118 0.2829 0.2829 0.2702 0.4232 0.0276 0.0138 0.2868 0.2868 0.2742 0.4272 0.0295 0.0039 0.0440 0.0440 0.0672 0.1437 0.0315 0.0157 0.2908 0.2908 0.2781 0.4311 Inches 0.0394
Package Height Ball Height Package Body Thickness Ball (Lead) Width Package Body Width Package Body Width Package Body Length Package Body Length Pitch Ball (Lead) Count Seating Plane Coplanarity Corner Ball Distance Along Corner Ball Distance Along Corner Ball Distance Along Corner Ball Distance Along
Some ball locations populated some products. specific datasheet complete details.
Mechanical Specification
Very-Thin, Fine-Pitch, Package BGA) Drawing Dimensions, 28F800B3_A
Ball Iindicator
Ball Corner
View Bumps Down
Complete Mark Shown
Bottom View Bump side
Seating Plane
Side View
Millimeters Package Height Ball Height Package Body Thickness Ball (Lead) Width Package Body Width Package Body Length Pitch Ball (Lead) Count Seating Plane Coplanarity Corner Ball Distance Along Corner Ball Distance Along 1.230 1.275 1.330 1.375 0.850 0.150 0.610 0.275 7.810 6.400 0.660 0.350 7.910 6.500 0.750 0.100 1.430 1.475 0.0484 0.0502 0.710 0.425 8.010 6.600 1.000 Notes 0.0335 0.0059 0.0240 0.0108 0.3075 0.2520
Inches 0.0394
0.0260 0.0138 0.3114 0.2559 0.0295
0.0279 0.0167 0.3154 0.2598
0.0039 0.0524 0.0541 0.0563 0.0581
Mechanical Specification
Very-Thin, Fine-Pitch, Package BGA) Drawing Dimensions, 28F320B3_C 28F320C3_C
Ball indicator
Ball Corner
View Bumps Down
Complete Mark Shown
Bottom View Bump side
Seating Plane
Side View
Millimeters Package Height Ball Height Package Body Thickness Ball (Lead) Width Package Body Width Package Body Length Pitch Ball (Lead) Count Seating Plane Coplanarity Corner Ball Distance Along Corner Ball Distance Along 0.918 1.507 1.018 1.607 0.850 0.150 0.610 0.275 7.186 6.864 0.660 0.350 7.286 6.964 0.750 0.100 1.118 1.707 0.0361 0.0593 0.710 0.425 7.386 7.064 1.000 Notes 0.0335 0.0059 0.0240 0.0108 0.2829 0.2702
Inches 0.0394
0.0260 0.0138 0.2869 0.2742 0.0295
0.0279 0.0167 0.2908 0.2781
0.0039 0.0401 0.0633 0.0440 0.0672
Mechanical Specification
Fast Boot Block Memory Components
µBGA* Package Drawing Dimensions
Ball Indicator
Ball Corner
View Silicon backside
Complete Mark Shown
Bottom View Bump side
Seating Plane
Side View
Remarks: Specific ball population patterns vary depending product. Please refer specific product datasheet.
Mechanical Specification
µBGA* Package Dimensions Fast Boot Block Memory Component Devices
Millimeters 0.850 0.150 0.600 0.300 10.14 0.700 0.350 10.24 0.750 0.100 1.258 0.525 0.612 3.145 1.358 0.625 0.712 3.245 1.458 0.725 0.812 3.345 0.0495 0.021 0.0241 0.1238 0.0535 0.0246 0.0280 0.1277 0.800 0.400 10.34 1.000 Notes 0.0335 0.0059 0.0236 0.0118 0.311 0.399 0.0276 0.0138 0.315 0.4031 0.0295 0.0039 0.0574 0.0285 0.0320 0.1317 0.0315 0.0157 0.3189 0.4071 Inches 0.0394
Package Height Ball Height Package Body Thickness Ball (Lead) Width Package Body Width Package Body Length Pitch Ball (Lead) Count Seating Plane Coplanarity Corner First Ball Distance Along Corner First Ball Distance Along Corner First Ball Distance Along Corner First Ball Distance Along
Mechanical Specification
Intel® StrataFlashMemory
µBGA* Package Drawing Dimensions Intel® StrataFlashMemory
Indicator
Corner
View Silicon Backside
Complete Mark Shown
Bottom View Bump Side
Seating Plane
Side View
µBGA* Package Specifications Intel® StrataFlashMemory
Remarks: Specific ball population patterns vary depending product. Please refer specific product datasheet.
Mechanical Specification
µBGA* Package Dimensions 28F640J5 Intel® StrataFlashMemory
Millimeters 0.850 0.150 0.600 0.300 7.570 16.270 0.700 0.350 7.670 16.370 0.750 0.100 1.114 5.835 1.214 5.935 1.314 6.035 0.0439 0.2297 0.0478 0.2337 0.800 0.400 7.770 16.470 1.000 Notes 0.0335 0.0059 0.0236 0.0118 0.2980 0.6406 0.0276 0.0138 0.3020 0.6445 0.0295 0.0039 0.0517 0.2376 0.0315 0.0157 0.3059 0.6484 Inches 0.0394
Package Height Ball Height Package Body Thickness Ball (Lead) Width Package Body Width Package Body Length Pitch Ball (Lead) Count Seating Plane Coplanarity Corner First Ball Distance Along Corner First Ball Distance Along
Mechanical Specification
Intel® Volt Wireless Flash Memory
µBGA* Package Drawing Dimensions Intel® Volt Wireless Flash Memory GT28F640W18, GT28F640W30
Indicator
Corner
View Silicon backside
Complete Mark Shown
Bottom View Bump side
Side View
Seating Plane
Millimeters Symbol Notes
Inches
Package Height Ball Height Package Body Thickness Ball (Lead) Width Package Body Width Package Body Length Pitch Ball (Lead) Count Seating Plane Coplanarity Corner Ball Distance Along Corner Ball Distance Along
0.850 0.150 0.600 0.300 7.600 8.900 0.700 0.350 7.700 9.000 0.750
1.000
0.0335 0.0059
0.0394
0.800 0.400 7.800 9.100
0.0236 0.0118 0.2992 0.3503
0.0276 0.0122 0.3031 0.3543 0.0295
0.0315 0.0157 0.3071 0.3583
0.100 1.125 2.150 1.225 2.250 1.325 2.350 0.0443 0.0846 0.0482 0.0886
0.0039 0.0522 0.0925
NOTE: lower density devices, upper address balls treated ball locations populated.
Mechanical Specification
Very-Thin, Fine-Pitch, BGA) Package Drawing Dimensions Intel® Volt Wireless Flash Memory, GE28F320W18, GE28F320W30
Indicator
Corner
View Silicon backside
Complete Mark Shown
Bottom View Bump side
Side View
Seating Plane
Millimeters Package Height Ball Height Package Body Thickness Ball (Lead) Width Package Body Width Package Body Length Pitch Ball (Lead) Count Seating Plane Coplanarity Corner First Ball Distance Along Corner First Ball Distance Along 1.125 2.150 1.225 2.250 0.850 0.150 0.615 0.325 7.600 8.900 0.665 0.375 7.700 9.000 0.750 0.100 1.325 2.350 0.0443 0.846 0.715 0.425 7.800 9.100 1.000 Notes 0.0335 0.0059 0.0242 0.0128 0.2992 0.3503
Inches 0.0394
0.0262 0.0148 0.3031 0.3543 0.0295
0.0281 0.0167 0.3071 0.3583
0.0039 0.0482 0.0886 0.0522 0.0925
NOTE: lower density devices, upper address balls treated ball locations populated.
Mechanical Specification
Chip Scale Package Media Information
Carrier Tape Diagram Dimensions
NOTE: Note: indicator µBGA* packages located nearest circular sprocket holes carrier tape. Note that some carrier tapes have sets sprocket holes, along side, which "circular" sprocket holes, another along bottom side, which "oval" sprocket holes. indicator located nearest circular sprocket holes along side carrier tape. Single/ DoubleSprocket Single
Pkg. Type 28F008S3 other µBGA packages
Tape Size
1.65-1.85
3.9-4.1
11.9-12.1
0.27-0.29
11.9-12.3
1.65-1.85
Single
3.9-4.1
11.9-12.1
0.32-0.34
23.9-24.3
NOTE: Dimensions millimeters
Mechanical Specification
Carrier Tape Reel Diagram Dimensions
Millimeters Maximum Minimum Maximum
20.2 16.0
20.2 30.4
20.2 38.4
NOTE: Dimensions millimeters
Mechanical Specification
Injection Molded Thin JEDEC Tray Parameters
Mechanical Specification
Chip Scale Package Thin Tray Dimensions Package Type 28F008S3 28F016S3 28F800B3 (µBGA BGA) 28F008B3 (µBGA BGA) 28F160B3 28F016B3 28F160B3_A 28F016B3_A 28F160C3_A 28F320B3 BGA) 28F320C3 BGA) 28F320B3 28F320C3 28F160F3 28F640J5 28F320D18 28F320W18 BGA) 28F320W30 BGA) 28F640W18 (µBGA*) 17.246 12.052 12.390 13.386 16.129 12.128 11.532 12.522 13.462 19.380 15.367 17.043 9.220 12.420 13.919 13.640 Columns Rows Pockets
18.9
12.4
10.9
15.7 18.9 13.386 12.95 15.70
19.380 12.15 11.70
12.4 12.4 25.121 15.30 10.80
10.9 13.640 10.00 9.50
NOTE: Dimensions millimeters
Two-Piece Sample Tape-in-Tube
Mechanical Specification
8.4.1
Shipping Media Ordering Information
Ordering Information
Shipping media off-board programming sockets purchased directly from manufacturers. These materials have been characterized Intel ensure optimal quality reliability same materials used internally testing shipping media. following tables list various materials, manufacturer's part numbers, U.S. contact information. outside U.S., please consult manufacturer's nearest sales office. Note:
hardware vendor remains solely responsible design, sale functionality product, including liability arising from product infringement product warranty.
Carrier Tape Vendor: Contact 1-800-666-8273 Product 28F008S3 28F800B3 BGA) 28F160B3 28F640J5 28F160B3_A 28F016B3_A 28F160C3_A 28F320B3 BGA) 28F320C3 BGA) 28F320C3_A 28F160F3 28F320D18 Vendor: Advantek Contact 1-612-938-6800 Product 28F320W18 BGA) 28F320W30 BGA) 28F640W18 (µBGA*) Part Number INCS05-A Part Number US035751 US040001 US038431 US039141
US044581
US046761 US045081 3M051581
Mechanical Specification
Cover Tape Vendor: Contact 1-800-666-8273 Product 28F008S3 other µBGA* packages Vendor: Advantek Contact 1-612-938-6800 Product Advantek Part Number PS0213 Part Number #2666 Cond. #2666 Cond.
Reels Pc.) Vendor: Advantek Contact 1-612-938-6800 Product 28F008S3 other µBGA* packages Part Number RD33704SW RD33708SW RD33708SW RD33716SW
Mechanical Specification
JEDEC Thin Trays Distributor: Alliance Electronics Contact 1-303-433-1648 Product 28F008S3 28F800B3 BGA) 28F160B3 28F640J5 Vendor: Daiwon Contact (408) 562-6172 (USA) 82-347-794-2001 (Korea) Product 28F160B3_A 28F016B3_A 28F160C3_A 28F320B3 BGA) 28F320C3 BGA) 28F320C3_A 28F160F3 28F320D18 28F320W18 BGA) 28F320W30 BGA) 28F640W18 (µBGA*) Part Number Part Number 21002-370 21002-373 21002-371 21002-372
12E-0607-C13
12E-0710-C13 12E-0810-C13 12E-0713-C13 12E-7790-C13
Mechanical Specification
Additional Information
Order Number 298161 298000 Intel® Intel® Document/Tool Flash Memory Chip Scale Package User's Guide Flash Memory Tools Guide
NOTE: Please call Intel Literature Center (800) 548-4725 request Intel documentation. International customers should contact their local Intel distribution sales office. Visit Intel's World Wide tools software page technical documentation tools.

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