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Embedded Pentium® Processor with MMXTechnology Flexible Motherboard Design Guidelines
Order Number: 273206-002
Information this document provided connection with Intel products. license, express implied, estoppel otherwise, intellectual property rights granted this document. Except provided Intel's Terms Conditions Sale such products, Intel assumes liability whatsoever, Intel disclaims express implied warranty, relating sale and/or Intel products including liability warranties relating fitness particular purpose, merchantability, infringement patent, copyright other intellectual property right. Intel products intended medical, life saving, life sustaining applications. Intel make changes specifications product descriptions time, without notice. Designers must rely absence characteristics features instructions marked "reserved" "undefined." Intel reserves these future definition shall have responsibility whatsoever conflicts incompatibilities arising from future changes them. Pentium® processors with MMXtechnology contain design defects errors known errata which cause product deviate from published specifications. Current characterized errata available request. Contact your local Intel sales office your distributor obtain latest specifications before placing your product rder. Copies documents which have ordering number referenced this document, other Intel literature obtained calling 1-800548-4725 visiting Intel's website http://www.intel.com.
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Embedded Pentium® Processor with MMXTechnology Flexible Motherboard Design Guidelines
Contents
Introduction
Features List Flexible Motherboard. Benefits Flexible Motherboard.11 Overview Pentium® Processor with MMXTechnology Family External Features Differences.15 2.2.1 Fraction (BF) Selection 2.2.2 Pinout Considerations 2.2.3 Processor with CPUID Instruction Electrical Thermal Features Differences 2.3.1 Thermal Analysis.19 2.3.2 Split Power Supplies 2.3.3 Input Output 2.3.4 VIL3 (MAX) VIH3 (MIN) 2.3.5 Overshoot, Undershoot Ringback Overview Voltage Supply Split Power Planes Voltage Supply Split Power Planes Implementation Cost-savings Build Options 3.2.1 Layout Design Sample Implementation.23 3.2.2 Board Support Members Pentium® Processor with MMXTechnology Family 3.2.3 Board Low-Power Embedded Pentium® Processor with MMXTechnology Only 3.2.4 Board Embedded Pentium® Processor with MMXTechnology Only Switching Linear Voltage Regulators.27 3.3.1 General Principles Switching Linear Voltage Regulators 3.3.2 Design Considerations Voltage Supplies 3.3.2.1 Real Estate 3.3.2.2 Tolerance 3.3.2.3 Thermal Considerations 3.3.2.4 Decoupling Capacitors 3.3.2.5 Cost Component Split Power Plane Layout Decoupling 3.5.1 Bulk Decoupling 3.5.2 High Frequency Decoupling 3.5.3 Decoupling Recommendations 3.5.4 Placement Decoupling Capacitors Signal Routing Guidelines VCC2DET# Auto-Detect Circuit BIOS/Software Considerations.37 Dual Processor Design Considerations.37
Processor Design Considerations
Flexible Motherboard Implementation.22
Embedded Pentium® Processor with MMXTechnology Flexible Motherboard Design Guidelines
Socket Diagram Heat Transfer Fundamentals
Thermal Theory. Thermal Interface Material Basics. Device Suppliers Design Conversion. Vendor Contact List. Thermal Interface, Heatsink, Socket Suppliers
Vendors Device Suppliers
Related Resources
Figures
Embedded Pentium® Processor with MMXTechnology Family Flexible Motherboard Split Power Planes Flexible Motherboard Pentium® Processor with MMXTechnology Family. Interface Flexible Motherboard Assignments CPUID. Assignments CPUID. Basic Design Sample Implementation Board Embedded Pentium® Processor with MMXTechnology Only. Processor Power Island Layout (PPGA) Processor Power Split-Plane Example (HL-PBGA) Typical Capacitance Change Temperature Example Processor Decoupling Capacitor Placement. VCC2DET# Auto-Detect Circuit Socket Pinout-Top Side View Socket Pinout-Pin Side View Thermal Flow Ambient Environment Pressure Applied Solids Equal Thermal Resistance Single Solid
Embedded Pentium® Processor with MMXTechnology Flexible Motherboard Design Guidelines
Tables
Differences Pentium® Processors with MMXTechnology Family Frequency Selections Embedded Pentium® Processor with MMXTechnology Family Quick Reference Low-Power Embedded Pentium® Processor with MMXTechnology Assignment Definitions CPUID.18 Overshoot Specification Summary Undershoot Specification Summary Comparison Between Switching Linear Voltage Regulators Decoupling Recommendations Processor Core Voltage Islands.33 Socket Pins that Differ from Socket 5.40 Design Conversion Device Suppliers Voltage Regulators.47 Socket Vendors Decoupling Capacitor Vendors.48 Resistor Vendors.49 Clock Driver Suppliers SRAM/TagRAM.50 Thermal Interface, Heatsink, Socket Suppliers Related Resources.52
Embedded Pentium® Processor with MMXTechnology Flexible Motherboard Design Guidelines
Introduction
This application note provides guidelines designing flexible motherboard that supports Intel® Pentium® processor with MMXtechnology family. Figure illustrates flexible motherboard design that supports embedded Pentium processors with technology 200/233 low-power embedded Pentium processors with technology 166/266 manufactured with Intel's 0.25 micron fabrication process. 0.25 micron process enables processor achieve faster speeds lower voltages, reducing power consumption heat dissipation while improving performance. main difference between processors their core voltages. embedded Pentium processor with technology core voltage (VCORE) voltage (VI/O) lowpower embedded Pentium processor with technology VCORE VI/O
Figure Embedded Pentium® Processor with MMXTechnology Family Flexible Motherboard
Embedded Pentium® Processors with MMXTechnology
Low-Power Embedded Pentium® Processors with MMXTechnology
Note:
This application note presents design information specific PPGA package low-power embedded Pentium processor with technology. This processor also offered HighThermal, Low-Temperature Plastic Ball Grid Array (HL-PBGA) package. This document used reference designs using HL-PBGA device. more information lowpower embedded Pentium processor with technology HL-PBGA package, refer Low-Power Embedded Pentium® Processor with MMXTechnology datasheet (order number 273184). details HL-PBGA package, refer Intel Packaging Handbook (order number 240800).
Embedded Pentium® Processor with MMXTechnology Flexible Motherboard Design Guidelines
Features List Flexible Motherboard
Pentium processor with technology flexible motherboard should support following features:
Split Power Islands
accommodate split-plane processors, flexible motherboard should have four separate power islands: VCORE (VCC2), VI/O (VCC3), (3.3 power supply) power supply). low-power embedded Pentium processor with technology 166/266 uses same split-power plane, VCORE VI/O, embedded Pentium processor with technology, except that supply voltages different. VCORE VI/O embedded Pentium processor with technology respectively. VCORE VI/O low-power embedded Pentium processor with technology respectively. Both processors require power planes external motherboard components such DRAM (3.3 Figure illustrates four power planes Pentium processor with technology family. Figure Split Power Planes Flexible Motherboard Pentium Processor with MMXTechnology Family
V/2.8 V/3.3 VCORE
Power Supply
Power Supply
Socket Flexible Motherboard
V/2.8 Power Source VCORE Plane
VCORE plane supplies core voltage (VCC2) processor. low-power embedded Pentium processors with technology require (±142 core voltage. embedded Pentium processors with technology require (±100 mV). flexible motherboard implement this dual voltage power plane with single linear switching voltage regulator. "Switching Linear Voltage Regulators" page design considerations choosing voltage supply. VCC2 pins low-power embedded Pentium processor with technology V-tolerant. Therefore, flexible motherboard should have built-in precautions ensure that right voltage supplied when low-power embedded Pentium processor with technology installed socket. Refer "VCC2DET# Auto-Detect Circuit" page example safeguard circuit.
V/3.3 Power Source VI/O Plane
VI/O plane supplies voltage (VCC3) processor, clock, host controller, cache (SRAM). low-power embedded Pentium processor with technology requires (2.375 V-2.625 I/O. embedded Pentium processor with technology requires (3.135 V-3.6 clock, host controller, cache special dual-voltage components that either voltage.
Embedded Pentium® Processor with MMXTechnology Flexible Motherboard Design Guidelines
dual-voltage power plane flexible motherboard implemented with single linear switching voltage regulator. Figure illustrates interface flexible motherboard. VCC3 low-power embedded Pentium processor with technology tolerant. Therefore, flexible motherboard should have built-in precautions ensure that right voltage supplied when low-power embedded Pentium processor with technology installed socket. Refer "VCC2DET# Auto-Detect Circuit" page example safeguard circuit. Figure Interface Flexible Motherboard
Cache 2.5V/3.3V TagSRAM 3.3V
Processor
VCORE V/2.8V
VI/O 2.5V/3.3V
Chipset 2.5V/3.3V
DRAM 3.3V
Clock 2.5V/3.3V 2.5V/3.3V
000246
Power Source
flexible motherboard should provide power plane components such bus, system memory (DRAM), TagRAM (SRAM). voltage this plane from source power supply unit from voltage regulator.
Power Source
Components bus, such audio circuitry, keyboard/mouse controllers, flash memory, require plane.
Socket
flexible motherboard should implement Socket This processor socket accepts Socket compatible processors Pentium processor with technology family regardless differences their assignments power plane implementation. Socket 321-pin superset older 320-pin Socket sockets. Socket splits pins Socket into VCC2 pins VCC3 pins. These pins connected appropriately processor core voltage island processor voltage island.
Local Decoupling
Pentium processors with technology cause rapid fluctuation current during transitions between "idle" states "active" states. flexible motherboard should provide adequate decoupling capacitors near processor socket prevent violation voltage supply range specifications, documented "Decoupling" page
Embedded Pentium® Processor with MMXTechnology Flexible Motherboard Design Guidelines
Bus-to-Core Ratio
flexible motherboard should provide jumpers fraction strapping options that provide flexibility configuring ratio external frequency internal core frequency. bus-to-core ratios 1/4, 2/7, 1/3, 2/5. support selecting between embedded Pentium processors with technology low-power embedded Pentium processors with technology, jumpers should allow high logic setting three fraction pins (BF2, BF0). When enabled, these pins should pulled logic high (VI/O voltage level).
Thermal Mechanical Specifications
flexible motherboard should designed meet thermal mechanical specifications Socket Specification, Rev. 3.0.
BIOS Support
Each processor stepping assigned unique identification feature signature. CPUID instruction retrieves these signatures identification. flexible motherboard should provide system BIOS capable supporting steppings Pentium processors with technology. Using CPUID instruction, BIOS determine whether processor supports features such APIC. more details, refer "Processor with CPUID Instruction" page application note AP-485, Intel Processor Identification with CPUID Instruction (order number 241618).
Multiple Voltage Clock Drivers
flexible motherboard should include clock driver that drive clock inputs (CLK PICCLK) processor both ensure compatibility with Pentium processors with technology. embedded Pentium processors with technology require clock inputs low-power embedded Pentium processors with technology require clock inputs
Auto-Detect Configuration Circuit
Although possible design flexible motherboard jumpers resistors manually configure board each type processor, recommended that auto-detect configuration circuit used instead. circuit makes flexible motherboard more userfriendly. user does need reconfigure board manually remember jumper settings. auto-detect circuit serves safeguard low-power embedded Pentium processor with technology, which requires lower voltage levels than embedded Pentium processor with technology. This prevents incorrect voltage inputs processor, which could damage processor other components motherboard. Refer "VCC2DET# Auto-Detect Circuit" page more details.
Embedded Pentium® Processor with MMXTechnology Flexible Motherboard Design Guidelines
Benefits Flexible Motherboard
flexible motherboard design Pentium processor with technology family offers several benefits:
Provides price/performance options
flexible design, when populated different members Pentium processor with technology family, provide wide range price/performance options. Other assembly-time options motherboard components provide additional flexibility. example, external caches asynchronous SRAM cost effectiveness pipelined burst SRAM higher performance. Synchronous DRAM replace Extended Data (EDO) DRAM main memory maintain performance cost-effective platforms with optional external cache memory.
Reduces design validation effort multiple designs
flexible motherboard does have revised every proliferation processor, thus reducing design validation efforts. Instead, board designed accept various processors that populated build-time.
Reduces inventory manufacturing costs
Only motherboard design manufactured maintained inventory, reducing overall inventory management manufacturing costs. When product demand varies, board populated with processor that satisfies current market demand.
Reduces debug technical support costs
Only motherboard debugged. Field engineers other support personnel need only trained motherboard design, thus reducing technical support effort.
Embedded Pentium® Processor with MMXTechnology Flexible Motherboard Design Guidelines
Processor Design Considerations
This section describes considerations designing flexible motherboard family Pentium processors with technology. differences between embedded Pentium processor with technology low-power embedded Pentium processor with technology discussed.
Overview Pentium® Processor with MMXTechnology Family
Table highlights Pentium processor with technology family's electrical thermal specifications. Refer "Related Resources" page obtain specifications each processor.
Embedded Pentium® Processor with MMXTechnology Flexible Motherboard Design Guidelines
Table
Differences Pentium® Processors with MMXTechnology Family
Embedded Pentium® Processor with MMXTechnology Core Frequency (MHz) Frequency (MHz) Frequency Ratio2 Clock Level Core Supply (VCC2) Supply (VCC3) ICC2 ICC3 Max. Power5 Timings VCC2 Pins VCC3 Pins External Plane Type Internal Plane Type Package Type Low-Power Embedded Pentium Processor with Technology PPGA Package1 166, Low-Power Embedded Pentium Processor with Technology HL-PBGA Package1 166,
200,
1/3, (±100 (3.135 V-3.60 6.50 (233 MHz) 5.70 (200 MHz) (233 MHz) (200 MHz) 17.0 (233 MHz) 15.7 (200 MHz) Split Split 296-pin PPGA
2/5, ±142 (2.375 2.625 (266 MHz) (166 MHz) (266 MHz) (166 MHz) (266 MHz) (166 MHz) -0.3 (Min) (Max) VCC3 (Min) VCC3 (Max) VCC3 (IOH VCC3 (IOH Abus Dbus min/max valid delays have changed Split Split 296-pin PPGA
2/5, ±150 (266 MHz) ±135 (166 MHz) (2.375 2.625 (266 MHz) 2.35 (166 MHz) (266 MHz) (166 MHz) (266 MHz) (166 MHz) -0.3 (Min) (Max) VCC3 (Min) VCC3 (Max) VCC3 (IOH VCC3 (IOH Abus Dbus min/max valid delays have changed Split Split 352-ball HL-PBGA
NOTES: data low-power embedded Pentium processor with technology best estimates time this document's publication. Refer Low-Power Embedded Pentium® Processor with MMXTechnology datasheet (order number 273184) latest specifications. Note that overshoot, undershoot ringback different between embedded Pentium processor with technology low-power embedded Pentium processor with technology. Refer "Overshoot, Undershoot Ringback" page number shown represents worst case maximum current/power. ICC2 refers VCC2 (core) supply current. ICC3 refers VCC3 (I/O) supply current. Refer Low-Power Embedded Pentium® Processor with MMXTechnology datasheet (order number 273184) complete timing specifications.
Embedded Pentium® Processor with MMXTechnology Flexible Motherboard Design Guidelines
embedded Pentium processor with technology Socket split core processor with core voltage voltage operates core speeds with external bus. introduced several architectural enhancements classic Pentium processor family: increase from Kbytes Kbytes internal data code cache size, better branch prediction, support technology. low-power embedded Pentium processor with technology lower power version Pentium processor with technology, capable running speeds with VCORE VI/O functionally identical Pentium processor with technology with following differences: voltage supplies, power consumption, dual processing (DP) support, support selectable buffer sizes. low-power embedded Pentium processor with technology offered Socket package, compatible with embedded Pentium processor with technology. "Socket Diagram" page pinouts. Intel430TX PCIset chipset directly supports low-power embedded Pentium processor with technology embedded Pentium processor with technology. Level shifters used interface Intel430HX PCIset chipset low-power embedded Pentium processor with technology. more information, Interfacing Low-Power Embedded Pentium Processor with Technology 82439HX System Controller (order number 273188).
Embedded Pentium® Processor with MMXTechnology Flexible Motherboard Design Guidelines
External Features Differences
This section discusses some differences between external features embedded Pentium processor with technology those low-power embedded Pentium processor with technology.
2.2.1
Fraction (BF) Selection
configuration pins provided select allowable bus-to-core ratios: 1/4, 2/7, 1/3, 2/5. Processors multiply input achieve higher internal core frequencies. internal clock multiplier requires constant frequency input within ±250 therefore input cannot changed dynamically. external frequency power-up RESET through pin. Pentium processors with technology sample BF2-BF0 pins falling edge RESET determine which bus-to-core ratio use.
Warning:
float pins RESET processors running 166, 200, MHz. When pins left floating, these processors will configured bus-to-core frequency ratio, which unsupported these processors. Table summarizes operation pins Pentium processor with technology. added support ratio low-power embedded Pentium processor with technology running MHz.
Table
Frequency Selections Embedded Pentium® Processor with MMXTechnology Family
Embedded Pentium® Processor with Technology (200/233 MHz) Bus-to-Core Ratio Reserved Reserved Reserved Reserved Pentium® Low-Power Embedded Pentium Processor with Technology (166/266 MHz) Bus-to-Core Ratio Reserved Reserved Reserved Reserved Bus/Core Frequency (MHz) 66/166 66/200 66/133 66/233 66/266
processor with MMXtechnology This default bus-to-core ratio embedded low-power embedded Pentium processor with technology. pins left floating, processor will configured bus-to-core frequency ratio, which unsupported these processors.
Embedded Pentium® Processor with MMXTechnology Flexible Motherboard Design Guidelines
2.2.2
Pinout Considerations
functional signals low-power embedded Pentium processor with technology compatible with Pentium processor with technology. However, some assignments have changed changes feature set. Table provides quick reference changes. major changes described below more detail.
VCC2, VCC3
embedded Pentium processor with technology, VCC3 internal logic isolated from VCC2 core logic. This allows core lower voltage (2.8 order obtain faster core frequencies reduce overall power consumption. low-power embedded Pentium processor with technology designed same way, except that VCC2 VCC3 voltage core logic supplied through VCC2 pins voltage logic supplied through VCC3 pins. Therefore, motherboard design splits processor power plane into separate core voltage islands: that supply (VCC2) another that supply (VCC3).
VCC2DET#
This signal defined Pentium processor with technology indicate system which processor installed processor socket. low-power embedded Pentium processor with technology, VCC2DET# left floating (infinite impedance). embedded Pentium processor with technology, internally connected ground. circuit designed detect VCC2DET# signal should have weak pull-up resistor. This will cause signal pulled high with low-power embedded Pentium processor with technology driven with embedded Pentium processor with technology. sample circuit, refer "VCC2DET# Auto-Detect Circuit" page additional note that VCC2DET# also defined floating Pentium processors 100/133/166 MHz. There should minimal issues from this overlap, because low-power embedded Pentium processor with technology Pentium processors 100/133/166 normally supported single motherboard design.
BF2-BF0
fraction selection pins determine bus-to-core frequency ratio. pins sampled processor RESET, sampled processor again until another cold-boot assertion RESET. signal pins indication speed, only ratio processor core with respect bus. Table summarizes operation pins Pentium processors with technology.
CLK, PICCLK
low-power embedded Pentium processor with technology supports input output levels only. clock (CLK) APIC clock (PICCLK) tolerant. clock inputs processor flexible motherboard driven dual voltage V/3.3 clock driver: low-power embedded Pentium processor with technology embedded Pentium processor with technology. Table lists differences between embedded Pentium processor with technology low-power embedded Pentium processor with technology. Square brackets around signal name indicate that signal defined only RESET.
Embedded Pentium® Processor with MMXTechnology Flexible Motherboard Design Guidelines
Table
Quick Reference Low-Power Embedded Pentium® Processor with MMXTechnology
Name Function low-power embedded Pentium processor with technology uses BF0, pins determine bus-to-core frequency ratio.1 These pins sampled RESET, cannot changed until another non-warm assertion RESET. Additionally, pins must change values while RESET active. When BF0, left floating, low-power embedded Pentium processor with technology defaults bus-to-core ratio. complete configuration table pins listed below. Fraction functionality further explained "Overview Voltage Supply Split Power Planes" page VCC2DET# CPUTYP, D/P#, FRCMC#, PBGNT#, PBREQ#, PHIT#, PHITM#, BRDYC#, ADSC# Output Fraction Reserved 1/22 Reserved Reserved
[BF0], [BF1], [BF2]
Input
low-power embedded Pentium processor with technology leaves this floating. embedded Pentium processor with technology drives low.
These pins have been removed from low-power embedded Pentium processor with technology.
NOTES: Refer Low-Power Embedded Pentium® Processor with MMXTechnology datasheet (order number 273184) complete pinout specifications. Default bus-to-core ratio BF2-BF0 pins left floating. This fraction supported low-power embedded Pentium processor with technology.
2.2.3
Processor with CPUID Instruction
CPUID instruction allows BIOS software determine type features microprocessor which executing. When executing CPUID, low-power embedded Pentium processor with technology behaves like embedded Pentium processor with technology:
value `0', then 12-byte ASCII string "Genuine Intel" (little endian)
returned EBX, EDX, ECX. Also, returned EAX.
value `1', then processor version returned processor
capabilities returned EDX. values low-power embedded Pentium processor with technology given Figure Figure Table
value neither `1', low-power embedded Pentium processor with
technology writes registers.
Embedded Pentium® Processor with MMXTechnology Flexible Motherboard Design Guidelines
Figure Assignments CPUID
(Reserved)
Type Family
Model Stepping
000250
Figure Assignments CPUID
Rsvd
000251
Reserved
Reserved
following values defined CPUID instruction executed with `1'. processor version assignments given Figure Table Assignment Definitions CPUID
10-11 16-22 24-31 Value Comments FPU: Floating-Point Unit on-chip VME: Virtual-8086 Mode Enhancements Debugging Extensions PSE: Page Size Extension TSC: Time Stamp Counter MSR: Pentium® Processor PAE: Physical Address Extension MCE: Machine Check Exception CX8: CMPXCHG8B Instruction APIC: APIC on-chip Reserved-Do write these bits rely their values MTRR: Memory Type Range Registers PGE: Page Global Enable MCA: Machine Check Architecture CMOV: Conditional Move Instruction supported Reserved-Do write these bits rely their values Intel® Architecture MMXTechnology supported Reserved-Do write these bits rely their values
Indicates that APIC present hardware-enabled (software disabling does affect this bit).
Embedded Pentium® Processor with MMXTechnology Flexible Motherboard Design Guidelines
family field same Pentium processors (family 5H). model field different: embedded Pentium processor with technology model number low-power embedded Pentium processor with technology model number stepping field same format Pentium processor. low-power embedded Pentium processor with technology, stepping field returns A-step B-step. type field defined `00'. assignments shown Figure Table After masking reserve bits, products based low-power embedded Pentium processor with technology will value 0x008003BF (when APIC enabled boot) 0x008001BF (when APIC disabled using APICEN boot pin) upon completion CPUID instruction.
Electrical Thermal Features Differences
This section discusses some electrical thermal features low-power embedded Pentium processor with technology highlights their differences from embedded Pentium processor with technology.
2.3.1
Thermal Analysis
low-power embedded Pentium processor with technology consumes MHz. embedded Pentium processor with technology consumes 17.0 MHz. chassis, heatsink, embedded Pentium processor with technology must capable dissipating watts power (power dissipation MHz) order TCASE processor remain within specified temperature range Therefore, maximum factor thermal considerations lies with embedded Pentium processor with technology MHz. thermal solution designed handle heat dissipation Pentium processor with technology MHz, thermal requirements satisfied low-power embedded Pentium processor with technology.
2.3.2
Split Power Supplies
low-power embedded Pentium processor with technology uses same split power planes, VCORE VI/O, embedded Pentium processor with technology, except supply voltages have changed. VCORE VI/O embedded Pentium processor with technology respectively, whereas VCORE VI/O low-power embedded Pentium processor with technology respectively. Therefore, VCORE pins must connected voltage supply that supply VI/O pins must connected supply VI/O plane supply should supply approximately This plane only powers VI/O pins low-power embedded Pentium processor with technology also host clock generator, chipset, cache, BF2-0 bus-to-core fraction pull-ups.
Embedded Pentium® Processor with MMXTechnology Flexible Motherboard Design Guidelines
2.3.3
Input Output
inputs outputs low-power embedded Pentium processor with technology compatible with JEDEC non-terminated digital interface standard. Both inputs outputs also compatible, although inputs cannot tolerate voltage swings above VIN3 max. low-power embedded Pentium processor with technology outputs, Pentium processor with technology system support components should JEDEC compatible inputs. This because low-power embedded Pentium processor with technology drives signals according JEDEC specification. low-power embedded Pentium processor with technology inputs, voltage must exceed VIN3 specification. System support components consist devices open-collector devices. open-collector configuration, external resistor biased with VCC3.
2.3.4
VIL3 (MAX) VIH3 (MIN)
VIL3 (MAX) low-power embedded Pentium processor with technology This decrease from embedded Pentium processor with technology's specification VIH3 (MIN) low-power embedded Pentium processor with technology VCC3 This change from specification embedded Pentium processor with technology.
2.3.5
Overshoot, Undershoot Ringback
Signal quality specifications low-power embedded Pentium processor with technology different from embedded Pentium processor with technology. These specifications must ensure that components read data properly that incoming signals affect reliability component. Refer Table Table summary overshoot, undershoot, ringback specifications low-power embedded Pentium processor with technology. more detailed signal quality specifications, refer Low-Power Embedded Pentium® Processor with MMXTechnology datasheet (order number 273184).
Table
Overshoot Specification Summary
Specification Name Threshold Level (CLK PICCLK) Threshold Level (all other inputs) Maximum Overshoot Level (CLK PICCLK) Maximum Overshoot Level (all other inputs) Maximum Threshold Duration Maximum Ringback VCC3, nominal +0.3 VCC3, nominal +0.5 VCC3, nominal +0.6 VCC3, nominal +1.0 clock period above threshold voltage VCC3, nominal -0.7 Value Units
Embedded Pentium® Processor with MMXTechnology Flexible Motherboard Design Guidelines
Table
Undershoot Specification Summary
Specification Name Threshold Level Threshold Level (all other inputs) Minimum Undershoot Level (CLK PICCLK) Minimum Undershoot Level (all other inputs) Maximum Threshold Duration Maximum Ringback -0.3 -0.5 -0.6 -1.0 clock period below threshold voltage Value Units
Embedded Pentium® Processor with MMXTechnology Flexible Motherboard Design Guidelines
Flexible Motherboard Implementation
This chapter describes implementation split plane flexible motherboard Pentium processors with technology using Socket
Overview Voltage Supply Split Power Planes
order support Pentium processors with technology with different voltage requirements, flexible motherboard should include provisions supply voltages three different power planes. Refer Figure page conceptual diagram which power planes need which voltages. specific method implementing voltage supplies partitioning power planes depends actual design. Several options feasible designing flexible motherboard Pentium processors with technology. This section provides details design that provides flexibility cost-savings options manufacturer. designs, VCORE must always electrically isolated from other power planes because Pentium processors with technology split-plane processors, unlike single-plane embedded Pentium processors. With VI/O power supply planes, however, possible connect together when embedded Pentium processor with technology used because both This method, which discussed further "Voltage Supply Split Power Planes Implementation Cost-savings Build Options" page provide cost-saving options manufacturer. most cost-effective implement dual voltages VCORE VI/O V/3.3 voltage regulators, respectively. Either linear switching voltage regulator used. Both options have advantages disadvantages. linear voltage regulator component cheaper than switching regulator. However, linear voltage regulator generates more heat (dissipative nature), which increase cost thermal solution board. Also, linear regulators reliable. Refer "Switching Linear Voltage Regulators" page more detailed comparison switching linear voltage regulators. auto-configure circuit based VCC2DET# signal implemented flexible motherboard eliminate need jumper/resistor configuration serve safeguard low-power embedded Pentium processor with technology. Refer "Pinout Considerations" page more detailed description VCC2DET# signal used safeguard low-power embedded Pentium processor with technology from higher voltage levels intended embedded Pentium processor with technology. addition supplying correct voltage, voltage supplies must supply enough current components particular power plane. embedded Pentium processor with technology draws most current (6.5 core. Therefore, VCC2 supply voltage source must supply VI/O plane, V/3.3 dual-voltage regulator must supply approximately processor's I/O, cache, chipset. Because low-power embedded Pentium processor with technology requires less power (4.0 VCORE VI/O) than embedded Pentium processor with technology, design that meets requirements embedded Pentium processor with technology adequate both processor types.
value derived from 0.75 required VCC3 pins embedded Pentium® processor with MMXtechnology MHz, estimated 1.25 cache (512 Kbyte), chipset, host clock generator, pull-ups BF[2:0] pins.
Embedded Pentium® Processor with MMXTechnology Flexible Motherboard Design Guidelines
Voltage Supply Split Power Planes Implementation Cost-savings Build Options
This section discusses sample flexible motherboard design Pentium processor with technology family. design allows manufacturer build motherboards that support members Pentium processor with technology family only particular member. This flexibility result significant cost savings increase manufacturer's ability adjust market conditions without changing motherboard design. three boards based design, differing only components that assembled board build-time. conceptual design sample implementation discussed first, followed sections that detail three boards point flexibility cost-savings features each. Refer "Switching Linear Voltage Regulators" page component options voltage supplies.
3.2.1
Layout Design Sample Implementation
Figure shows basic layout sample implementation. following list highlights main features:
VCORE VI/O powered V/2.8 V/3.3 voltage regulator, respectively. cache chipset reside partially VI/O power plane powered
V/3.3 voltage regulator. dual-voltage regulators.
auto-detect circuit driven VCC2DET# signal selects correct voltage power supply plane powered system power supply unit.
DRAM, TagRAM, other components reside this power plane.
design laid accept shorting resistors that connect VI/O power
supply power planes. This layout supports cost-savings build options. "Board Embedded Pentium® Processor with MMXTechnology Only" page
Embedded Pentium® Processor with MMXTechnology Flexible Motherboard Design Guidelines
Figure Basic Design Sample Implementation
VCORE VI/O 3.3VPOWER SUPPLY 5VPOWER SUPPLY
Cache VCC2 Pins VCC3 Pins Chipset
TagRAM
DRAM
Socket
3.3V 1.9V/2.8V 2.5V/3.3V Slots ShortingResistor Power Supply Unit
Voltage Regulators (Voltage selected VCC2DET# auto-detect circuit.)
000245
embedded Pentium processor with technology draws most current (6.5 ICC2 ICC3) Pentium processor with technology family therefore sets maximum current that dual-voltage regulators must supply. (For ICC3, power from cache chipset must also factored determine size voltage regulator. Estimated current draw required cache chipset A-1.25 auto-configurable regulator circuit triggered VCC2DET# signal (see "Pinout Considerations" page makes possible support processor Pentium processor with technology family without need jumper/resistor configuration. also serves safeguard low-power embedded Pentium processor with technology, which V-tolerant VCORE VI/O pins, respectively. When embedded Pentium processor with technology plugged into Socket VCC2DET# signal low, causing auto-detect circuit toggle V/2.8 voltage regulator (VCORE), V/3.3 voltage regulator (VI/O). When low-power embedded Pentium processor with technology plugged into Socket floating VCC2DET# signal pulled high weak pull-up resistor autoconfigure circuit. This causes V/2.8 voltage regulator toggle (VCORE), V/3.3 voltage regulator toggle (VI/O).
Embedded Pentium® Processor with MMXTechnology Flexible Motherboard Design Guidelines
3.2.2
Board Support Members Pentium® Processor with MMXTechnology Family
Configuring sample design support members Pentium processor with technology family straightforward. This board follows basic layout design from "Layout Design Sample Implementation" page with following requirement: slots designed shorting resistors connect VI/O power supply plane must remain empty. other words, resistors assembled onto board. This maintains three separate power planes times, which necessary support low-power embedded Pentium processor with technology. With exception this requirement, flexible motherboard design follows design outlined "Layout Design Sample Implementation" page
V/2.8 V/3.3 voltage regulators power VCORE VI/O power planes,
respectively.
power supply powered from system power supply unit. auto-detect circuit driven VCC2DET# selects correct voltage level.
This most flexible options discussed this document. This option offers advantages:
This design gives consumer upgrade path from embedded Pentium processor with
technology low-power embedded Pentium processor with technology, without changing motherboards.
From manufacturer's perspective, this design offers flexibility adjust changing
market conditions with motherboard. decision which processor install system made assembly time.
3.2.3
Board Low-Power Embedded Pentium® Processor with MMXTechnology Only
Building board support only low-power embedded Pentium processor with technology also straightforward. fact, from motherboard design perspective, identical all-members board discussed "Board Support Members Pentium® Processor with MMXTechnology Family" above.
voltage regulators power VCORE VI/O power planes, respectively. power supply powered from system power supply unit. auto-detect circuit driven VCC2DET# selects correct voltage level. Shorting resistor slots left empty maintain three separate power planes.
primary reason considering board this type cost savings. most compelling cost savings scaling back thermal solution (e.g., heatsinks, fans) system. This possible because low-power embedded Pentium processor with technology consumes less power than processor. Additional cost savings possible using voltage regulator that does need supply much current, because ICC2 lowpower processor (4.0 less than processor (6.5
Embedded Pentium® Processor with MMXTechnology Flexible Motherboard Design Guidelines
voltage regulator could replaced with discrete regulators, because this board supports only processor. This provides some cost-savings, additional cost changing Bill Materials (BOM) modifying assembly line support this outweigh cost-savings.
3.2.4
Board Embedded Pentium® Processor with MMXTechnology Only
This board based same design other options presented above. main reason considering this board cost savings. This design takes advantage fact that with embedded Pentium processor with technology, both VI/O power supply planes This opens possibility connecting VI/O power supply planes together, removing need voltage regulators. shown Figure this design uses only voltage regulator. Other features include:
voltage regulator power VCORE power plane Shorting resistor slots that stuffed with resistors order connect VI/O
power supply power plane
VI/O power supply power planes, which powered from
system power supply unit1 Figure Board Embedded Pentium® Processor with MMXTechnology Only
VCORE VI/O 3.3VPOWER SUPPLY 5VPOWER SUPPLY
Cache VCC2 Pins VCC3 Pins Chipset
TagRAM
DRAM
Socket
3.3V 1.9V/ Voltage Regulator ShortingResistor Power Supply Unit
000252
Powering VCC3 pins embedded Pentium® processor with MMXtechnology with supply from power supply unit possible because power supply's supply specification meets processor's requirements. processor requires VI/O between 3.135 power supply guarantees supply (3.168 V-3.432
Embedded Pentium® Processor with MMXTechnology Flexible Motherboard Design Guidelines
Stuffing shorting resistors removing second voltage regulator normally used VI/O plane most significant differences between this board design other designs. voltage from power supply unit will able handle voltage draw from processor's I/O, cache, chipset, from other components (e.g., DRAM). main cost savings with this design comes needing second voltage regulator. This saves significant amount Bill Materials (BOM). This done build-time with motherboard design. voltage regulator could replaced with discrete regulator because this board supports only processor. This provides some cost-savings, additional cost changing Bill Materials (BOM) modifying assembly line support this outweigh cost-savings.
Switching Linear Voltage Regulators
Both switching linear voltage regulators used voltage supplies flexible motherboard. Both regulators have advantages disadvantages. This section highlights general working principles types regulators factors that will affect your decision.
3.3.1
General Principles Switching Linear Voltage Regulators
dissipative regulation voltage current linear voltage regulator), power lost form heat. dissipative element, power transistor, given task "soaking excess power, which result heat dissipation problems. does matter sophisticated control electronics such power supply; dissipative element functions rheostat, which relatively simple method regulating power. switching power supply, switching device substituted dissipative device. Control regulation power achieved varying duty cycle repetition rate switch rather than resistance. ideal switch does absorb dissipate power-it either completely completely off, with intermediate resistive state dissipate power. result, overall efficiency switching regulator much higher than conventional dissipative-type power supplies. comparison provided Table
Embedded Pentium® Processor with MMXTechnology Flexible Motherboard Design Guidelines
Table
Comparison Between Switching Linear Voltage Regulators
Feature Efficiency Overall Regulation Switching Regulator expected. common specification. Tighter regulation usually difficult achieve peak-to-peak average. Smaller ripple voltage usually difficult achieve. 20°C 40°C easily achieved. Cost decreases with higher switch rates. There general tendency costs decrease semiconductors evolve. Cost crossover keeps decreasing. More parts, recent designs capitalize ICS. Enhanced reliability obtained from cooler operation. Linear Regulator expected. common. Much tighter regulation available greater cost. peak-to-peak average lower values obtained greater cost. 100° average, depending upon heat dissipation techniques. Small linear regulators have cost advantage. However, considering factors overall system, other cost factors become very significant larger ratings. Higher operating temperature often degrades reliability.
Ripple
Temperature Rise
Cost
Reliability
Power Density Isolation from Line Transients
cubic inch cubic inch depending switchers. Higher switching rates power level, input voltage range, heat dissipation hardware. yield cubic inch. Very good, often greater than troublesome. Requires attention shielding, suppression filtering. Generally inferior switching types. Noisy line often affects load. Less likely adverse factor.
3.3.2
Design Considerations Voltage Supplies
This section discusses design considerations that should taken into account when choosing between switching linear voltage regulators.
3.3.2.1
Real Estate
Because linear regulators relatively simple devices compared switching regulators, they take much less real estate. However, this gain often offset larger heatsink required linear regulator. Also, some designs, components cannot placed under around immediate vicinity heatsink. Therefore, although linear regulator itself small, amount real estate required implement considerably greater.
3.3.2.2
Tolerance
Switching regulators inherently have more ripple than linear regulators because they switch during operation. This more (large) capacitors required switching regulator solution (see "Decoupling Capacitors" page 29). However, difference ripple between type regulators tens millivolts range. Unless timing requirements processor other component marginal, extra ripple introduced switching regulator should major design consideration.
Embedded Pentium® Processor with MMXTechnology Flexible Motherboard Design Guidelines
3.3.2.3
Thermal Considerations
With dissipative nature linear regulators, more heat will generated, requiring better thermal solution system (for example, better thermal flow-through system bigger heatsink).
3.3.2.4
Decoupling Capacitors
Switching regulators need larger, more expensive decoupling capacitors opposed linear regulators, which only need smaller tantalum capacitors.
3.3.2.5
Cost Component
Because switching regulators more complex components, they generally cost more than simpler linear regulators.
Split Power Plane Layout
Implementing power island existing power layer instead assigning separate power layer core more economical solution. separate voltage island isolated from other section power plane using gap. size determined analyzing noise effects board manufacturing capabilities (typically mils). Figure shows typical layout separate voltage islands processor area. shows core pins (VCC2) clustered side processor allow easy layout core voltage island. remaining pins periphery (VCC3) located other side part voltage island (refer "Socket Diagram" page 38). island should also include other dual-voltage V/3.3 components that interface with processor. typical configuration would include V/3.3 cache SRAM, V/3.3 chipset I/O, processor same VI/O voltage island. This ensures that signals that provide interface processor other dual-voltage V/3.3 components operate same voltage levels. This also avoids split plane crossovers these signals. Removing split plane crossovers improves signal quality reduces EMI/RFI effects. Carefully routing power source voltage islands should done avoid significant voltage drop processor increase thermal dissipation voltage islands. recommended that wide traces used prevent excessive voltage drop across power plane. Vias through-holes cutting through power plane critical widths should avoided.
Embedded Pentium® Processor with MMXTechnology Flexible Motherboard Design Guidelines
Figure Processor Power Island Layout (PPGA)
Core Island Island
Core Island
Island
Includes Cache, Chipset etc.
Socket
Embedded Pentium® Processor with MMXTechnology Flexible Motherboard Design Guidelines
Figure provides example customer could separate VCC2 (Core) VCC3 (I/O) power planes split-plane system HL-PBGA package. Figure shows core VCC2 pins clustered towards inside processor allow easy layout core voltage island. remaining VCC3 pins periphery located towards outside part signals routed motherboard. Figure Processor Power Split-Plane Example (HL-PBGA)
LOCK#
HOLD
BOFF# KEN# AHOLD M/IO# PM1/BP1 IERR# WB/WT# EWBE# PM0/BP0 VCC2 BRDY# VCC2 CACHE# FERR#
APCHK# PRDY
SMIACT#
VCC3
VCC3 VCC3 VCC3 VCC3 VCC3 VCC3 VCC3 VCC2
HLDA
BREQ PCHK# VCC2 VCC3 VCC2 VCC3 VCC3
VCC2 VCC3
VCC2 VCC3 VCC2
VCC2 VCC3 VCC3
VCC2 VCC2
VCC3 VCC2 VCC3 VCC2
VCC3 VCC2
D/C#
EADS#
W/R#
ADS#
FLUSH# HIT# HITM# VCC3 BE0# BE2# BUSCHK# BE1# A20M# VCC3 VCC3 VCC3 VCC2 VCC3 VCC2 VCC3 VCC3
BE3# BE5#
BE4# BE7#
BE6#
View
VCC3 VCC3 VCC3 VCC3 VCC3
SCYC RESET VCC2
VCC3 VCC3
VCC2 VCC2 VCC2
VCC2 (Core) Power Plane
VCC3 VCC2
VCC2
VCC3 VCC2 VCC3
VCC3 VCC2
VCC3 VCC3
VCC3
VCC2
VCC2
VCC2 VCC2
VCC3 VCC2 VCC2 VCC2
VCC2 VCC2
VCC3 VCC2
PICD[0]
SMI# NMI/LINT1
INIT
BF[0] BF[2]
VCC2 VCC2
PICCLK
IGNNE# PEN# BF[1] STPCLK# INTR/LINT0
TRST#
PICD[1]
A7246-01
VCC3 (I/O) Power Plane
Embedded Pentium® Processor with MMXTechnology Flexible Motherboard Design Guidelines
Decoupling
Proper decoupling island power plane voltage ground plane essential small size processor core voltage island, isolation from motherboard power plane, support varied voltage requirements. Appropriate decoupling capacitors implemented voltage island near processor ensure that processor voltage stays within specified limits during normal transient conditions. There types decoupling that need considered: bulk decoupling high-frequency decoupling.
3.5.1
Bulk Decoupling
processors supported flexible motherboard, power consumption transition rapidly from level much higher level vice versa). This happen during normal program execution during specific events such entering exiting Stop-Grant state. Another example when executing HALT instruction that causes processor enter AutoHALT Power Down state transition from HALT back Normal state. (The AutoHALT Power Down feature always enabled, even when other power management features implemented.) Because voltage supply (regulator) cannot instantaneously respond sudden load change, bulk storage capacitors with (effective series resistance) used maintain regulated supply voltage during interval from when current load changes when regulated power supply output reacts change. order reduce ESR, necessary place several bulk storage capacitors parallel.
3.5.2
High Frequency Decoupling
minimize noise, high frequency decoupling required provide short, low-impedance path high frequency components such high current spikes. Transient power surges result when processor drives large address data buses high frequencies, particularly when driving large capacitive loads. high frequency decoupling, inductance capacitors interconnects recommended best high speed electrical performance. Inductance reduced shortening circuit board traces between processor decoupling capacitors much possible. Surface mount capacitors preferable, because capacitors with long leads inductance circuit. capacitors should grade, with inductance reduce spikes.
3.5.3
Decoupling Recommendations
Table shows processor decoupling recommendations flexible motherboard both processor core voltage islands. This based simulation testing voltage transients from processor effects motherboard decoupling. Spice modeling (modeling worst case current transients including processor package inductance, capacitance, routing, decoupling, voltage regulator output inductance) should used estimate amount decoupling capacitance required processor voltage island. highly recommended that solution simulated variety variables components, temperature, lifetime degradation before committing change from decoupling capacitor recommendation.
Embedded Pentium® Processor with MMXTechnology Flexible Motherboard Design Guidelines
bulk decoupling, tantalum capacitors recommended over electrolytic capacitors. general, electrolytic capacitors degrade much faster rate, accurate, stable over temperature tantalum capacitors. high speed decoupling processor core voltage island, inductance 1-µF capacitors dielectric recommended. These capacitors decouple processor core high frequency noise control voltage during very fast transients (less than ns). Figure shows that ceramic capacitors X7S) dielectric exhibit relatively stable capacitor characteristics over temperature compared capacitors Z5U- Y5V-type dielectric. example, typical operating temperature 45°C, dielectric lose initial rated capacitance. Additional capacitors between power planes (stitching capacitors) needed improve signal return path. need these stitching capacitors layout design dependent. flexible motherboard Pentium processor with technology family, recommended place capacitor near every three high speed signals (data address signals) that cross VCORE-VI/O power islands (within distance inch). placement these stitching capacitors also depends specific design layout motherboard. information measurement techniques ensuring that motherboard designs within noise transients specification, refer AP-580: Voltage Guidelines Pentium® Processors with MMXTechnology Processors application note (order number 243186). Table Decoupling Recommendations Processor Core Voltage Islands
Quantity Processor core voltage island Processor voltage island Between VCC2 VCC3 power planes every three high-speed signals Value mOhms
0.45
Type Tantalum dielectric, ceramic Type Type
mOhms
0.084
NOTES: capacitor should less than mOhms. capacitor (including inductance capacitor) should less than capacitor should less than mOhms. capacitor (including inductance capacitor) should less than This does include decoupling components other than processor voltage island.
Embedded Pentium® Processor with MMXTechnology Flexible Motherboard Design Guidelines
Figure Typical Capacitance Change Temperature
Change Temperature (°C)
Temperature (°C) Temp Coefficient (Spec.) X7R: ±15% Z5U: +22% -56% Y5V: +22% -82%
3.5.4
Placement Decoupling Capacitors
Figure shows example recommended processor decoupling capacitors (Figure should placed inside respective voltage islands flexible motherboard. bulk capacitors should placed near processor inside voltage island ensure that supply voltage stays within specified limits during changes supply current during operation. 1-µF capacitors should evenly distributed inside processor core voltage island inside around processor footprint. Figure shows twelve 0.1-µF capacitors evenly placed around processor, close processor VCC3 pins inside processor voltage island. this example, capacitors placed side board. components assembled both sides board, these capacitors distributed between bottom sides. When done this way, vias connecting capacitor pads power ground layers shared between capacitors bottom sides. However, sharing vias (common vias) limits total current flow, hindering fast transient response. Separate vias preferable because they lower effective ESR. shared vias when there more space board. traces connecting vias capacitor pads should kept short possible. When difficult reduce length circuit board trace, trace should made wider reduce trace inductance. Placement stitching capacitors between VCORE-VI/O power islands shown Figure This because their placement depends exact layout design motherboard (for example, whether board four layers, socket oriented relation other board components).
Embedded Pentium® Processor with MMXTechnology Flexible Motherboard Design Guidelines
Figure Example Processor Decoupling Capacitor Placement
Tantalum (1206) (603)
Signal Routing Guidelines
Because power plane flexible motherboard split into separate voltage islands, signal routing should implemented that minimizes crossovers between voltage islands high-speed signals. Signal routing between voltage islands system power plane should limited only those signals that must cross between island power plane. This avoids possible signal degradation from impedance discontinuity effects. Significant levels could generated electromagnetic radiation from high-speed traces (such clocks, strobes, data lines address lines) when their return path interrupted. multi-layer board, this return path power ground plane adjacent signal layer directly under signal trace. When this trace routed over break return path, return current must find longer path maintain current continuity. increased area generated signal trace length this extended return path lead increased radiation levels from this signal trace. following guidelines should followed when routing high-speed signals flexible motherboard:
Clocks Strobes: These signals should routed over breaks reference plane
return path. vias connect between signal planes should minimized, signal planes should within mils reference plane. Clock signals should routed layer that adjacent ground layer.
Data Address Lines: These signals routed signal layer. However,
desirable minimize number traces crossing over splits return path plane. Among this group, signals that must cross should routed signal layer near ground plane minimize radiated emissions (using via, trace taken down layer that referenced ground plane). four-layer board, signal layer with least potential signal crossovers should placed adjacent power plane. Capacitive
Embedded Pentium® Processor with MMXTechnology Flexible Motherboard Design Guidelines
decoupling across split planes also used near signal crossovers (for those that cannot avoided) help reduce magnitude radiation. Within inch signal crossover violation, 0.1-µF ceramic capacitor should placed across power plane gap, using capacitor every three trace violations (provided they within one-inch limit).
VCC2DET# Auto-Detect Circuit
Although jumpers resistors could used, auto-detect circuit driven VCC2DET# signal recommended configuring flexible motherboard main reasons:
auto-detect circuit makes flexible motherboard more user-friendly. eliminates
need user manually configure board each processor remember jumper settings. With auto-detect circuit, motherboard will automatically configure itself when processor inserted into socket powered
auto-detect circuit also serves safeguard against incorrect voltages low-power
embedded Pentium processor with technology. Because low-power processor tolerant, accidentally applying those voltages could damage auto-detect circuit prevents this automatically setting voltage regulators eliminating possibility human error. Figure example implementing auto-detect circuit. Figure VCC2DET# Auto-Detect Circuit
Linear Adjustable Regulator VCC2DET# VCC2
000247
auto-detect circuit configure number settings. V/2.8 V/3.3 voltage regulators could configured depending VCC2DET# signal. auto-detect circuit turn turn cooling depending which processor running. This circuit configure setting motherboard that dependent processor. VCC2DET# defined floating Pentium processors 100/133/166 MHz, there should minimal issues from this overlap; low-power embedded Pentium processor with technology Pentium processors 100/133/166 normally supported single motherboard design.
Embedded Pentium® Processor with MMXTechnology Flexible Motherboard Design Guidelines
BIOS/Software Considerations
Since flexible motherboard accommodate variety processors, BIOS should designed support processors that used. BIOS code should CPUID instruction identify processor's CPUID signature (see "Processor with CPUID Instruction" page 17). fastest low-power embedded Pentium processor with technology operates (compared fastest embedded Pentium processor with technology, which operates MHz). Therefore, BIOS code should contain software timing loops should independent prefetch algorithm.
Dual Processor Design Considerations
low-power embedded Pentium processor with technology does support dual processor (DP) mode. flexible motherboard should support dual processors.
Embedded Pentium® Processor with MMXTechnology Flexible Motherboard Design Guidelines
Socket Diagram
Figure Socket Pinout-Top Side View
VCC3 VCC3 VCC3 VCC3 INTR VCC3 VCC3 VCC3 VCC3 VCC3 VCC2 VCC2 VCC2 VCC2 VCC2
VCC2 FLUSH# W/R#
EADS#
SCYC
BE6#
BE4#
BE2#
BE0# BUSCHK# HITM# A20M# HIT#
VCC2DET BREQ
RESET
BE7#
BE5#
BE3#
BE1#
D/C# HLDA
ADS#
LOCK#
SMIACT# VCC2 PCHK# APCHK# PRDY VCC2 VCC2
R/S#
SMI# INIT
HOLD BUSCHK#
WB/WT# VCC2
VCC3 IGNNE# VCC3 VCC3
PEN#
BOFF# BOFF#
BRDYC# VCC2
VCC2
BRDY# KEN#
EWBE#
STPCLK# VCC3 VCC3 VCC3 VCC3 VCC3 VCC3 TRST# VCC3
AHOLD#
Side View
INV#
CACHE# VCC2 VCC2
VCC3
MI/O#
PM1BP1
FERR# PM0BP0# VCC2 IERR# VCC2 VCC2 VCC2 VCC2
PICD1
VCC3 VCC3
PICD0
PICCLK DP19
VCC3
VCC3
VCC3
VCC3
VCC3
VCC3
VCC2
VCC2
VCC2
VCC2
VCC2
VCC2
000260
Embedded Pentium® Processor with MMXTechnology Flexible Motherboard Design Guidelines
Figure Socket Pinout-Pin Side View
BREQ
VCC2 VCC2 VCC2 VCC2 VCC2 VCC3 VCC3 VCC3 VCC3 VCC3 INTR VCC3 VCC3 VCC3 VCC3
FLUSH# VCC2 W/R#
EADS#
VCC2DET
HITM# BUSCHK# BE0# HIT# A20M#
BE2#
BE4#
BE6#
SCYC
D/C# HLDA
BE1#
BE3#
BE5#
BE7#
RESET
ADS#
LOCK#
VCC2 SMIACT# VCC2 VCC2 PCHK# APCHK# PRDY
R/S#
BUSCHK# HOLD VCC2 WB/WT#
SMI# INIT
IGNNE#
BOFF#
PEN#
VCC3 VCC3
VCC2 BRDYC#
VCC2
BRDY# KEN#
EWBE#
AHOLD# INV#
STPCLK#
VCC2 CACHE# VCC2
Side View
VCC3
VCC3 VCC3
MI/O#
VCC3 TRST#
PM1BP1
VCC2 PM0BP0# FERR# VCC2 VCC2 VCC2 VCC2 IERR#
VCC3
VCC3 VCC3
VCC3 PICD0
PICD1
VCC3 VCC3 VCC3
PICCLK
DP19
VCC2
VCC2
VCC2
VCC2
VCC2
VCC2
VCC3
VCC3
VCC3
VCC3
VCC3
VCC3
000261
Embedded Pentium® Processor with MMXTechnology Flexible Motherboard Design Guidelines
Socket same definition Socket with exception pins listed below. Table Socket Pins that Differ from Socket
Symbol CLK, PICCLK Type
Name Function Unlike some Pentium processors, Clock Programmable Interrupt Controller Clock inputs Socket tolerant. These inputs driven appropriate clock driver. VCC2 Detect defined Pentium processor with MMXtechnology family. embedded Pentium processor with technology, with core voltage volts, always drives VCC2DET# low. low-power embedded Pentium processor with technology leaves this floating. This used select proper core voltage from voltage regulator system supply. VCC2DET# system trace pull-up proper use. Socket power supply pins defined core voltage processors with separate power inputs. Socket power supply pins defined voltage processors with separate power inputs.
VCC2DET#
VCC2 VCC3
Embedded Pentium® Processor with MMXTechnology Flexible Motherboard Design Guidelines
Heat Transfer Fundamentals
objective thermal control programs electronic packaging efficient removal heat from semiconductor junction ambient environment. Thermal management separated into three major phases: Heat transfer processes within semiconductor device. Heat transfer from device heat sink. Heat transfer from heat sink ambient environment. first phase usually beyond control packaging engineer because heat transfer characteristics determined manufacturer device. optimize heat transfer second third phases, essential understand fundamental heat transfer processes have knowledge material properties.
Thermal Theory
rate which heat flows through material proportional area normal heat flow temperature gradient along flow path. one-dimensional, steady-state heat flow, rate expressed Fourier's Law: (q/A) (d/T) where: thermal conductivity heat flux (watts unit area) length heat flow path temperature gradient
Thermal conductivity, intrinsic property homogeneous material that describes ability that material conduct heat. higher value means that material conduct greater heat flux given temperature gradient. Inspection Fourier's leads another thermal property, thermal impedance temperature gradient caused unit rate heat flow through material given size. Thermal impedance equal T/(q/A) Thermal impedance related thermal conductivity rearrangement Fourier's Law: Unlike thermal conductivity, thermal impedance proportional distance heat must travel. Fourier's describes heat flow within solid. Suppose solids brought into contact heat conducted from solid into other. addition normal temperature gradients within solids, significant temperature gradient observed interface between solids. Figure This referred thermal interfacial impedance, thermal contact resistance.
Embedded Pentium® Processor with MMXTechnology Flexible Motherboard Design Guidelines
Figure Thermal Flow Ambient Environment
Source
Ambient
Thermal Interface Impedance
001030
Contact resistance caused inherent irregularities contacting surfaces. Each surface, matter well polished, consists peaks valleys. actual metal-to-metal contact area small fraction total contact area. Voids formed valleys filled with contribute little conduction heat. majority heat flow constricted small areas metal-to-metal contact. This accounts observed temperature gradient across interface. thermal interfacial resistance solids minimized increasing normal pressure between adjoining surfaces solids. This action minimizes gaps surface valleys. Theoretically, enough pressure were applied, adjoining metal surfaces solids would eventually become metal-to-metal contact. Figure example, pounds square inch (PSI) pressure would have applied metal solids form metal-to-metal contact that provides acceptable thermal interfacial resistance. However, from manufacturing view, applying high pressure creating devices that maintain this high pressure between solids very expensive. Thus, other options using thermal interface materials must utilized. Figure Pressure Applied Solids Equal Thermal Resistance Single Solid
Thermal Resistance °C/W
With Thermal Interface
Without Thermal Interface
Solid Material Thermal Resistance 8-10 Pressure (PSI)
Embedded Pentium® Processor with MMXTechnology Flexible Motherboard Design Guidelines
Thermal Interface Material Basics
Heat generated semiconductor device must removed ambient environment ensure device's reliable operation. Unless space available provide sufficient forced convection cooling, this requires series physical interfaces provide thermally conductive path. only must these interfaces offer minimum resistance heat flow, they often must also provide electrical isolation. Such requirements using conventional insulators coated with thermal grease, with one-component thermal interface materials. thermally conductive insulating material should provide electrical isolation because metal surfaces separated dielectric material. Thermal contact resistance been minimized because gaps have been eliminated replaced with material whose thermal conductivity much greater than that air. perform successfully, thermal interface materials must have high dielectric strength, high thermal conductivity sufficient pliancy conform both microscopic macroscopic surface irregularities. They must also sufficiently durable survive variety assembly, use, environmental conditions. Composition Thermal interface materials generally consist thermo-set elastomeric binder containing dispersed, highly thermally conductive ceramic filler. This mixture generally reinforced with glass fiber, metal foil, dielectric film. elastomer binder typically silicone molding resin cured high temperatures high pressure. Urethane elastomers have been introduced where silicone cannot tolerated possible contamination. Ceramic fillers added elastomer increase thermal conductivity. Typical fillers boron nitride, aluminum oxide magnesium oxide. Thermal Conductivity Thermal conductivity measure ability material conduct heat only after heat entered material. This ability determined material's composition (i.e., type ratio thermal filler elastomeric binder) relative amount reinforcing metal foil, glass fiber, dielectric film. Thermal conductivity usually expressed units Watt/m-K, where, W/m-K (Cal/s-cm-°C 420) (BTU-in/hr-ft2-°F 0.14). Values reported different literature must used with caution unless test method clearly stated. Thermal conductivity difficult measure thin, resilient interface materials. Many test methods cannot distinguish between contact resistance sample resistance, leading unrealistically values. Other methods based calculations from "TO-3 Thermal Impedance Data" overestimate thermal conductivity. homogeneous materials, thermal conductivity independent physical dimensions. Unreinforced materials considered homogeneous their thermal conductivity independent thickness. reinforced materials non-homogeneous that reinforcing layer poor thermal conductor compared outer elastic layers, which good thermal conductors. sample thickness increased, reinforcing layer remains constant while elastomeric layer expands. ratio good conductor poor conductor increases, apparent, total, thermal conductivity increases. When making thermal calculations based thermal conductivity, care must exercised take into account contact resistances that present thermal path. Other complications resulting from non-uniform heat flow, such spots thin heat spreader plates, cause underestimated temperature differential between junction ambient, lead unsafe operating temperatures.
Embedded Pentium® Processor with MMXTechnology Flexible Motherboard Design Guidelines
Thermal Impedance Like thermal conductivity, thermal impedance measure material's ability conduct heat. addition, thermal impedance describes material's ability conform irregular surfaces minimize contact resistance. Thermal interface materials reduce contact resistance conforming rough mating surfaces eliminating gaps. Most these elastomeric materials highly loaded with hard ceramic fillers. They require pressure make them "flow" into surface irregularities reduce contact resistance. contact resistance high pressures poor mating. pressure increased, material begins flow into surface irregularities contact resistance decreases. psi, contact resistance essentially eliminated because thermal impedance influenced further pressure increase. illustrate, thermal impedance contact resistance three times great resistance material itself. pressure needed achieve minimum thermal impedance easily accommodated most packages. fact, secure attachment components heat sinks usually requires same magnitude force holding component sink. However, recent developments, such surface mount applications heat sinking microprocessors, require that good thermal contacts made with minimum applied pressure. approach required applications which interface material must conform very pressure. Suitable materials such applications have been developed based precise balance pliancy thermal conductivity. careful adjustment filler level binder elasticity, they made with essentially contact resistance below psi. Dielectric Strength Measured according ASD149, dielectric strength defined voltage required cause breakdown insulating material being tested. results reported Dielectric Breakdown Voltage given thickness Dielectric Strength volts/mil. Measurements using ASD149 yield values obtained under controlled test conditions accurately reflect actual field performance. Factors such corona discharge, frequency, temperature humidity significantly affect long-term insulating characteristics material. Allowances creep strike distance must often made meet electrical requirements. effective technique interface insulator slightly larger than base device case. Volume Resistivity Volume resistivity determined ASD257 measure bulk electrical resistance. This property shows strong inverse dependence humidity temperature. unusual volume resistivity change factor 105-106 when material exposed more than humidity. Increasing temperatures yield similar, though such drastic, changes. These changes completely reversible. When conditions returned normal, volume resistivity also returns original value. Elastomeric Properties Thermal interface materials exhibit properties consistent with highly filled elastomers, such compression deflection, stress relaxation, compression set. Each property major impact long-term effectiveness interface material. Compression Deflection solid elastomer, opposed foam, compressible, will yield when load applied. Under compressive load, material undergoes deflection. magnitude deformation proportional load elastic limit point which material ruptures longer recover.
Embedded Pentium® Processor with MMXTechnology Flexible Motherboard Design Guidelines
Stress Relaxation When elastomer subject compressive load, first undergoes deflection while load applied. This followed slow relaxation process whereby initial stress begins decay. natural rubber process, this stress decay brought about macromolecular rearrangement within elastomer. initial load causes rubber fill gaps. There then further need such high pressure. time, stress decays level which insufficient cause further rearrangement. This point, percent stress loss, dependent several factors, including nature elastomer level loading. Compression When elastomer subject compressive load extended time, part deflection becomes permanent recoverable when load removed. This behavior important only designs which interface material must unloaded reloaded occasionally during service life. Chemical Resistance Interface materials come into short-term contact with solvents either solder-flux cleaning operations through unintentional exposure coolants, fluids, lubricants. Contact with number solvents causes swelling exposed areas elastomer interface materials. severity swelling depends type solvent, duration exposure, type elastomer. Generally, solvents such ketones, halogenated hydrocarbons esters cause more swelling than alcohols aromatics. While elastomer swollen, resistance abrasion reduced care should taken damage material. swelling phenomenon reversible interface material returns normal state solvent evaporates. physical, electrical, thermal properties remain same before exposure. "Vendors Device Suppliers" page thermal interface material manufacturers.
Embedded Pentium® Processor with MMXTechnology Flexible Motherboard Design Guidelines
Vendors Device Suppliers
Device Suppliers Design Conversion
This section contains list suppliers devices1 support conversion existing Pentium processors with technology designs designs that also support low-power embedded Pentium processor with technology. list comprehensive allinclusive accurate vendor solutions. list intended provide reference known suppliers solutions. components suppliers included. Omissions indicate imply incompatibilities.
Table Design Conversion Device Suppliers
Embedded Pentium® Processors with MMXTechnology VCC3 ICC3 VCC2 ±100 ICC2 Low-Power Embedded Pentium Processor with Technology VCC3 ICC3 VCC2 ±142 ICC2 CKDM-66 specifications Supplier Part Number
Switching Type Voltage Regulators
Linear Technology Maxim Cypress ICWI Cypress Hitachi Mitsubishi Mbit) Motorola Samsung Sony Toshiba Cypress Mitsubishi Toshiba CY2277 9148F-02 W48S67-01H SC671D
Clock Drivers
SRAM/Cache Mbit)
PB1.0 SRAM
PB1.5 SRAM
TagRAMs
Other brands names property their respective owners.
Embedded Pentium® Processor with MMXTechnology Flexible Motherboard Design Guidelines
Vendor Contact List
Table Voltage Regulators
Vendor Cherry Tel: (919) 405-3603 Fax: (919) 405-3651 Tel: (408) 432-1900 Fax: (408) 434-0507 North America Europe Asia Japan
Tel: (401) 886-3305 Fax: (401) 885-5786 Tel: (33) 54046 Fax: (33) 39464054 Tel: (49) 9642550 Fax: (49) 963147 Tel: (886) 9310 Fax: (886) 3029 Tel: (65) 2692 Fax: (65) 4112 Tel: (81) 3265 7571 Fax: (81) 3265 7575
Harris Linear Tech Linfinity
Tel: (714) 898-8121 Fax: (714) 893-2570 Tel: (408) 737-7600 Fax: (408) 737-7194 Tel: (44) 3430 3388 Fax: (44) 3430 5511 Tel: (49) 4135 1331 Fax: (49) 4135 1220 Tel: (44) 0566 5555 Fax: (44) 0566 3355 Tel: (44) 592-773520 Fax: (44) 592-774781 Tel: (44) 485757 Fax: (44) 427371 Tel: (44) 1431 Fax: (44) 2549 Tel: (714) 453-1008 Fax: (714) 453-8748 Tel: (886) 2558 6801 Fax: (886) 2555 6348 Tel: (81) 3232 6141 Fax: (81) 3232 6149
Maxim
National
Tel: (408) 721-3753 Fax: (408) 721-8763
Tel: (852) 2737 1616 Fax: (852) 2736 9931
Tel: (81) 2373
Raytheon
Tel: (415) 9667734 Fax: (415) 966-7742 Tel: (805) 498-2111 Fax: (805) 498-3804 Tel: (408)-970-5543 Fax: (408)-567-8910 Tel: (603) 429-8504 Fax: (603) 429-8963
Tel: (81) 3406 5998 Fax: (81) 3406 5998 Tel: (886) 3389 Fax: (886) 0282 Tel: (852) 2378 9715 Fax: (852) 2375 5733 Tel: (81) 5562 3321 Fax: (81) 5562 3316
Semtech Siliconix
Unitrode
Tel: 8522-722-1101 Fax: 8522-369-7596
Unisem
Embedded Pentium® Processor with MMXTechnology Flexible Motherboard Design Guidelines
Table Socket Vendors
Vendor Appros Augat Foxconn Tel: (508) 699-9890 Fax: (508) 695-8111 North America Tel: (910) 855-2247 Fax: (910) 855-2224 Europe Tel: (44) 753-67-6892 Fax: (44) 753-67-6808 Tel: (81) 45-941-4080 Tel: (44) 952-670-281 Fax: (44) 952-670-342 Tel: (81) 44-853-5400 Fax: (81) 44-853-1113 Tel: (886) 2-268-3466 Fax: (886) 2-268-3225 Tel: (81) 3-3778-6161 Fax: (81) 3-3778-6181 APAC Japan
Tel: (81) 44-844-8086 Fax: (81) 44-812-3203
Tel: (408) 749-1228 Fax: (408) 749-1266 Tel: (408) 456-0797 Fax: (408) 456-0779
Yamaichi
Tel: (886) 02-546Tel: (49) 89-451021-43 0507 Fax: (49) 89-451021Fax: (886) 02-54610 0509 Tel: (510) 651-2700 Fax: (510) 651-1020
Berg/ McKenie
Table Decoupling Capacitor Vendors
Vendor Part 1206YZ105KAT1A TPSD107K010R0100 Type Tantalum North America Tel: (803) 946-0616 Fax: (803) 946-6678 Tel: (818) 364-9800 Fax: (818) 364-6100 Johanson Dielectrics 160R18W105K4 NCTR (California only) Tel: (510) 624-8900 Fax: (510) 624-8905 Richey-Cypress Elect. Tel: (408) 654-9100 Fax: (408) 566-0160 APAC Tel: (65) 258-2833 Fax: (65) 258-8221 Tel: (82) 2-785-6504 Fax: (82) 2-784-5411 Nanco Electronics Tel: (886) 2-758-4650 Fax: (886) 2-729-4209 Sales Dept (Hong Kong) Tel: (852) 765-3029 Fax: (852) 330-2560 Tel: (800) 421-7258 Fax: (714) 713-0129 Taiwan Tel: (886) 2-562-4218 Fax: (886) 2-536-6721 Murata Electronics GRM40X7R105J016 Sales Department Tel: (770) 436-1300 Fax: (770) 436-3030 Hong Kong Tel: (852) 782-2618 Fax: (852) 782-1545 Korea Tel: (82) 2-730-7605 Fax: (82) 2-739-5483 Korea Tel: (82) 2-554-6633 Fax: (82) 2-712-6631 CC1206HX7R105K X7R/X7S Sales Department Tel: (847) 803-6100 Fax: (847) 803-6296 Taiwan Tel: (886) 2-712-5090 Fax: (886) 2-712-3090 Hong Kong Tel: (852) 736-2238 Fax: (852) 736-2108
KEMET Electronics
T495X107K010AS
Tantalum
Embedded Pentium® Processor with MMXTechnology Flexible Motherboard Design Guidelines
Table Resistor Vendors
Vendor Thin Film Technology Size 1208 Type Thin Accuracy/Value 0.1%, 100-250 0.5%, 10-250 0.1%, 100-100 0.5%, 10-1M 0.1%, 100-33 0.5%, 10-330 Contact (507) 625-8445 Region Sales Mgrs West Mississippi (except Texas Calif.) Southern east Mississippi (inc. Texas) Northern U.S., east Mississippi Canada (310) 768-8923 Southern California (402) 371-0080
0805
Thin
0803
Thin
0402
Thin
0.5%, 10-100
Dale Electronics
0603
Thin Thick
0.5%, 10-100 1%,2%, 10-1 0.1%, 100-100 0.1%, 100-100 0.5-5%, 10-1 0.1%, 10K-100 1-5%, 10-1 1-5%, 10-1
Spear
Thin Thin Thick
(814) 362-5536
Beckman Industrial
0805
Thin Thick
(214) 392-7616
0603
Thick
Table Clock Driver Suppliers
Supplier National Semiconductor Cypress Semiconductor Texas Instruments AMCC Motorola Triquint Semiconductor Phone 408-925-9493 408-922-0202 1131 408-721-2990 206-821-9202 903-868-5694 408-492-8366 619-535-6526 602-952-3046 503-644-3535 408-263-6300 408-925-9460 408-922-0833 408-732-6017 206-820-8959 903-868-5962 408-492-8362 619-450-9885 602-952-3682 503-644-3198 408-263-6571
Embedded Pentium® Processor with MMXTechnology Flexible Motherboard Design Guidelines
Table SRAM/TagRAM
U.S. Sales Office SRAM Cypress Semiconductor Hitachi America Mitsubishi Electric Motorola Samsung 3566 North First Street Jose, 95134 3300 Zanker Road, SJ-3C4 Jose, 95134 2460 First Street, Suite Jose, 95131 1050 East Arques Avenue Sunnyvale, 94086 2000 Sierra Point Parkway Brisbane, 94005 (206) 821-9202 x325 (800) 285-1601 (408) 492-8366 (408) 730-5900 (602) 952-3046 (408) 954-6957 (206) 820-8959 (303) 297-0447 (408) 492-8362 (408) 732-9382 (602) 952-3682 (408) 954-7441 Address Phone
Sony Toshiba America Electronic Components, Inc. TagRAM Cypress Semiconductor Mitsubishi Toshiba America Electronic Components, Inc.
(408) 955-4397
(408) 955-5176
(408) 965-4200
(408) 432-8566
(206) 821-9202 x325 (408) 492-8366 1050 East Arques Avenue Sunnyvale, 94086 2460 First Street, Suite Jose, 95131 (408) 730-5900 (408) 965-4200
(206) 820-8959 (408) 492-8362 (408) 732-9382 (408) 432-8566
Embedded Pentium® Processor with MMXTechnology Flexible Motherboard Design Guidelines
Thermal Interface, Heatsink, Socket Suppliers
Table Thermal Interface, Heatsink, Socket Suppliers
Supplier Thermal Interface Material Chomerics, Div. Parker Hannifin Heatsink/Fansink Aavid Kool Path P.O.Box Laconia, 03247 463, Kang Ning Street Chih Chen Taipei 22121, Taiwan Tri-State International Suite Lincolnshire, 60069 366, Tanan Road Shih Lin, Taipei, Taiwan Magnolia Blvd. Burbank, 91502 15128 East Euclid Ave. Spokane, 99216 4962 Camino Real Suite #109 Altos, 94022 1-15 Kita Ohtsuka Toshima Tokyo 170, Japan 2021 Valley View Lane Dallas, 75234 Strawberry Field Road Warwick, 02886 Audubon Road Wakefield, 01880 (603) 528-3400 (603) 528-1478 Dragon Court Woburn, 01888 (617) 939-4163 (617) 938-6131 Address Phone
Tech
886-6-695-0462
886-2-695-0462
Evox Rifa
(847) 948-9511
(847) 948-9320
Global Technology IERC Johnson Matthey
886-2-891-7388 (818) 842-7277 (509) 922-8702
886-2-881-7219 (818) 848-8872
Megaland, Inc.
(415) 967-2800
(415) 967-2878
Sanyo-Denki (Keymarc) Thermalloy Chip Coolers, Inc. EG&G Wakefield Engineering Sockets Andon Bergquist
(310) 212-7724 (214) 243-4321 (800) 227-0254 (617) 245-5900
813-3-917-4521 (214) 241-4656 (401) 732-6119 (617) 246-0874
19200 Stevens Creek Blvd. Cupertino, 95014 Court Drive Lincoln, 02865 5300 Edina Industrial Blvd. Edina, 55435 Richards Ave. P.O.Box 5200 Norwalk, 06856 3000 Scott Blvd. Santa Clara, 95050 Pine Hollow Oyster Bay, 11771
(408) 725-4984 (410) 333-0388 (612) 835-9096 x172
(408) 725-4997 (410) 333-0287 (612) 835-4156
Burndy
(203) 852-8553
(203) 852-8556
Loranger Mill
(408) 727-4234 (516) 922-6000 x209
(408) 727-5842 (516) 922-0023
Embedded Pentium® Processor with MMXTechnology Flexible Motherboard Design Guidelines
Related Resources
Table Related Resources
Document Title Order Number 273204 243190 243191 243185 242480 243286 290559 241618 243103 243187 243186
Embedded Pentium® Processor Family Developer's Manual Intel Architecture Software Developer's Manual, Volume Basic Architecture Intel Architecture Software Developer's Manual, Volume Instruction Reference Pentium® Processor with MMXTechnology datasheet Pentium® Pentium® Processor Specification Update Processor with MMXTechnology performance brief
Intel 430TX PCIset: 82439TX System Controller (MTXC) datasheet AP-485: Intel Processor Identification with CPUID Instruction AP-577: Introduction PPGA Packaging AP-579: Pentium® Processor Flexible Motherboard Design Guidelines
AP-580: Voltage Guidelines Pentium® Processors with MMXTechnology
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