EMIF4100 Only Name Means ProT ek'Tion TER/TVS ARRA APPL
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05193
EMIF4100
Only Name Means ProT ek'Tion
TER/TVS ARRA
APPLICA TIONS Cellular Phones Color Display Panel Notebooks Personal Digital Assistant (PDA) Ground Positioning System (GPS) SMART Cards COMPA TIBILITY (EN61000-4) 61000-4-2 (ESD): 15kV, Contact 61000-4-4 (EFT): 5/50ns TURES Protection kilovolts Bidirectional Filtering/TVS Pass Filters Insertion Loss: -3db Roll-Off 132MHz Protects Four(4) Data Lines MECHANICAL CHARACTERISTICS Flip Chip Package Weight 0.73 milligrams (Approximate) Flammability rating 94V-0 Tape Reel Standard
CONFIGURA TION
05193.R0 8/03
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EMIF4100
DEVICE CHARACTERISTICS MAXIMUM RATINGS 25°C Unless Otherwise Specified
PARAMETER Operating Temperature Storage Temperature Power Resistor Typical Resistance SYMBOL TSTG VALUE -40°C 85°C -55°C 150°C UNITS OHMS
ELECTRICAL CHARACTERISTICS LINE 25°C Unless Otherwise Specified
PART NUMBER RATED STAND-OFF VOLTAGE MINIMUM BREAKDOWN VOLTAGE MAXIMUM REVERSE LEAKAGE CURRENT TYPICAL FORWARD VOLTAGE MINIMUM ATTENUATION CUT-OFF TYPICAL FREQUENCY CAPACITANCE Ohms LINE ZERO BIAS) (See Note @2.5V,
VOLTS EMIF4100
V(BR) VOLTS
@10mA VOLTS
800-3000
Note 42pF 1MHz, ±20% tolerance.
1.100
FIGURE RESISTANCE TEMPERATURE (Normalized Resistance 25°C)
Normalized Resistance
1.060
1.020
0.980
0.940
0.900 Temperature
05193.R0 8/03
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EMIF4100
GRAPHS
Capacitance (Normalized)
FIGURE CAPACITANCE REVERSE VOLTAGE (Normalized Capacitance 2.5V 25°C
Reverse Voltage Volts
Gain (dB)
FIGURE INSERTION LOSS EMIF4100 25°C, Bias Environment)
1000 10000
Frequency (MHz)
05193.R0 8/03
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EMIF4100
APPLICA TION INFORMA TION PRINTED CIRCUIT BOARD RECOMMENDATIONS
PARAMETER
Size Shape Definition Solder Mask Opening Solder Stencil Thickness Solder Stencil Aperture Opening (laser cut, tapered walls) Solder Flux Ratio Solder Paste Type Protective Finish Tolerance Edge Corner Ball Solder Ball Side Coplanarity Maximum Dwell Time Above Liquidous (183°C) Soldering Maximum Temperature 0.275mm Round Non-Solder Mask Defined Pads 0.325mm Round 0.150mm 0.330mm Round 50/50 Volume Clean OSP(Entek Plus 106A) ±50µm ±20µm Seconds 240°C
VALUE
FIGURE RECOMMENDED NON-SOLDER MASK DEFINED ILLUSTRATION
Non-Solder Mask Defined 0.275mm DIA.
Solder Mask Opening 0.325mm DIA.
Solder Stencil Opening 0.330mm DIA.
FIGURE SOLDER REFLOW PROFILE
Note: This reflow profile does take into account printed circuit board (PCB) material heating time. Additional time required preheat time cool down time upon board material.
225°C 5-10 200°C Instantaneous 200°C
Minutes 150°C 100°C
Minutes 25°C
Pre-Heat Time
Soldering Time
Cool Down Time
05193.R0 8/03
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EMIF4100
PACKAGE OUTLINE DIMENSIONS
PACKAGE OUTLINE
BOTTOM VIEW SIDE VIEW
PACKAGE DIMENSIONS
MILLIMETERS 2.362 1.173 0.495 0.180 0.495 0.064 0.356 2.413 1.250 0.505 0.280 0.505 0.102 0.457 INCHES 0.093 0.0462 0.0195 0.0071 0.0195 0.0025 0.014 0.095 0.0492 0.0199 0.0110 0.0199 0.004 0.018
0.30 DIA. 63/37 Sn/Pb Solder Bumps
NOTE: Controlling dimensions millimeters.
REEL SPECIFICA TIONS
POCKET SIZE (mm) 3.18 1.52 0.76 TAPE WIDTH REEL DIAMETER REEL 5,000
PART NUMBER EMIF4100
CHIP SIZE (mm) 2.96 1.33
Cover Tape
Pitches Cumulative Tolerance Tape ±0.2mm
Tape Feeder Reference Only Including Draft Concentric Around TAPE REEL ORDERING NOMENCLATURE
Embossment
Direction Feed Outline Dimensions: 8/03, 60xx
Surface mount product taped reeled accordance with EIA-481. Suffix-T75-1 Inch Reel 5,000 pieces reel, i.e., EMIF4100-T7.
COPYRIGHT ProTek Devices 2003 SPECIFICATIONS: ProTek reserves right change electrical mechanical characteristics described herein without notice (except JEDEC). DESIGN CHANGES: ProTek reserves right discontinue product lines without notice, that final judgement concerning selection specifications buyer's that furnishing engineering technical assistance, ProTek assumes responsibility with respect selection specifications such products.
ProTek Devices 2929 South Fair Lane, Tempe, 85282 Tel: 602-431-8101 Fax: 602-431-2288 E-Mail: sales@protekdevices.com Site: www.protekdevices.com
05193.R0 8/03
www.protekdevices.com
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