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5GHz Low-Noise Amplifier with Shutdown MAX2649 high-linearity, si


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19-2492; 8/03
5GHz Low-Noise Amplifier with Shutdown
MAX2649 high-linearity, silicon-germanium (SiGe) low-noise amplifier (LNA) designed 5GHz wireless systems based IEEE802.11a HiperLAN2 standards. MAX2649 achieves 2.1dB noise figure, 17dB gain, 0dBm IIP3, making ideal firststage 5GHz OFDM WLAN radio systems. This device operates over +2.7V +3.6V supply range features overall current consumption (12.5mA). MAX2649 also includes shutdown mode save power when receiver inactive. designed low-noise, advanced SiGe process optimized high-frequency applications. device available tiny chip-scale package (UCSPTM) (1mm 1.5mm). Low-Noise Figure: 2.1dB High Gain: 17dB High IIP3: 0dBm Shutdown Mode +2.7V +3.6V Single-Supply Operation 1.5mm UCSP
Features
4.9GHz 5.9GHz Wideband Operation
MAX2649
Applications
IEEE802.11a Wireless ETSI HiperLAN2 WLAN 5GHz Radios 5GHz Cordless Phones
UCSP trademark Maxim Integrated Products, Inc. Configuration appears data sheet.
PART MAX2649EBT-T
Ordering Information
TEMP RANGE
PIN-PACKAGE UCSP*
*Requires special solder temperature profile described Absolute Maximum Ratings section.
Functional Diagram/Typical Operating Circuit
SHUTDOWN CONTROL TRANSMISSION LINE INPUT RFIN BIAS MAX2649
RFOUT OUTPUT
LAYOUT DESIGN DETAILS, PLEASE REFER MAX2649 KIT.
Maxim Integrated Products
pricing, delivery, ordering information, please contact Maxim/Dallas Direct! 1-888-629-4642, visit Maxim's website www.maxim-ic.com.
5GHz Low-Noise Amplifier with Shutdown MAX2649
ABSOLUTE MAXIMUM RATINGS
.-0.3V +4.2V SHDN GND.-0.3V (VCC 0.3V) RFIN GND.-0.3V +0.9V RFOUT GND.-0.3V (VCC 0.3V) Input Power Source) .+5dBm Continuous Power Dissipation +70°C) UCSP (derate 24mW/°C above +70°C) .500mW Operating Temperature Range .-40°C +85°C Junction Temperature .+150°C Storage Temperature Range .-65°C +150°C Bump Temperature (soldering) (Note Infrared (15s) .+220°C Vapor Phase (60s) .+215°C
Note This device constructed using unique packaging techniques that impose limit thermal profile device exposed during board-level solder attach rework. This limit permits only solder profiles recommended industry-standard specification, JEDEC 020A, paragraph 7.6, Table IR/VPR convection reflow. Preheating required. Hand wave soldering recommended.
Stresses beyond those listed under "Absolute Maximum Ratings" cause permanent damage device. These stress ratings only, functional operation device these other conditions beyond those indicated operational sections specifications implied. Exposure absolute maximum rating conditions extended periods affect device reliability. CAUTION! SENSITIVE DEVICE
ELECTRICAL CHARACTERISTICS
(VCC +2.7V +3.6V, signal applied, +2.0V, +0.4V, RFIN RFOUT terminated through DC-blocking caps, -40°C +85°C. Typical values +3.0V +25°C, unless otherwise noted.) (Note
PARAMETER Supply Voltage Active Supply Current Shutdown Supply Current Digital Input Logic High Digital Input Logic Digital Input Current SYMBOL SHDN CONDITIONS 12.5 UNITS
ELECTRICAL CHARACTERISTICS
(MAX2649 kit, +3.0V, -30dBm, RFIN RFOUT terminated through DC-blocking caps, +2.0V, +0.4V, +25°C. Typical values 5250MHz, unless otherwise noted.) (Note
PARAMETER Frequency Range Power Gain Gain Variation Over Temperature Noise Figure Input Third-Order Intercept Point Input Return Loss Output Return Loss Reverse Isolation Turn-On Time Turn-Off Time IIP3 tOFF 5150MHz 5350MHz (Note tones 5250MHz 5251MHz, -30dBm tone (Note -3.5 SYMBOL (Note 5150MHz 5350MHz (Note CONDITIONS 4900 5900 UNITS
5GHz Low-Noise Amplifier with Shutdown
ELECTRICAL CHARACTERISTICS (continued)
(MAX2649 kit, +3.0V, -30dBm, RFIN RFOUT terminated through DC-blocking caps, +2.0V, +0.4V, +25°C. Typical values 5250MHz, unless otherwise noted.) (Note Note characteristics production tested +85°C. specifications over temperature guaranteed design characterization. Note Specifications guaranteed design characterization. Note Recommended band operation. Note Specifications corrected board losses MAX2649 (0.5dB input, 0.5dB output). Note Specifications corrected board losses MAX2649 (0.5dB input).
MAX2649
Typical Operating Characteristics
(Data taken board optimized 5150MHz 5350MHz.) (VCC +3.0V, 5250MHz, -30dBm, +25°C, unless otherwise noted.)
SUPPLY CURRENT SUPPLY VOLTAGE
MAX2649 toc01
GAIN TEMPERATURE
MAX2649 toc02
GAIN SUPPLY VOLTAGE
GAIN (dB)
MAX2649 toc03
SUPPLY CURRENT (mA) -40°C +25°C +85°C
GAIN (dB)
SUPPLY VOLTAGE
SUPPLY VOLTAGE
TEMPERATURE (°C)
P(1dB) SUPPLY VOLTAGE
MAX2649 toc04
IIP3 SUPPLY VOLTAGE
MAX2649 toc05
|S11|, |S12|, |S22| FREQUENCY
MAGNITUDE (dB) |S12| 4900 5100 5300 5500 5700 5900 |S22| |S11|
MAX2649 toc06
-9.50 OUTPUT COMPRESSION POINT (dBm) -9.55 -9.60
IIP3 (dBm)
-9.65 -9.70 -9.75 -9.80 -9.85 -9.90 SUPPLY VOLTAGE
-0.2 -0.4 -0.6 -0.8 -1.0 SUPPLY VOLTAGE
FREQUENCY (MHz)
5GHz Low-Noise Amplifier with Shutdown MAX2649
Typical Operating Characteristics (continued)
(Data taken board optimized 5150MHz 5350MHz.) (VCC +3.0V, 5250MHz, -30dBm, +25°C, unless otherwise noted.)
|S21| FREQUENCY
MAX2649 toc07
NOISE FIGURE FREQUENCY
4900 5100 5300 5500 5700 OPERATING FREQUENCY (MHz)
MAX2649 toc08
NOISE FIGURE TEMPERATURE
MAX2649 toc09
|S21| (dB) 4900 5100 5300 5500 5700
(dB)
5900
5900
(dB)
OPERATING FREQUENCY (MHz)
TEMPERATURE (°C)
TURN-ON TIME
MAX2649 toc10
TURN-OFF TIME
MAX2649 toc11
OUTPUT POWER (dBm)
OUTPUT POWER (dBm)
1000
1000
TIME (ns)
TIME (ns)
5GHz Low-Noise Amplifier with Shutdown
Description
NAME RFIN SHDN RFOUT FUNCTION Input. Requires shunt capacitor transmission line input matching. (See Typical Operating Circuit refer MAX2649 data sheet details.) Ground. optimum performance, provide low-inductance connection ground plane. Shutdown. Apply logic signal through resistor with 20pF shunt capacitor ground. SHDN high active operation. SHDN place part shutdown mode. +2.7V +3.6V Supply Pin. Bypass with 100pF capacitor. (See Typical Operating Circuit refer MAX2649 data sheet details.) Output. Requires external matching network optimal performance. (See Typical Operating Circuit refer MAX2649 data sheet details.)
MAX2649
Detailed Description
MAX2649 operates with frequencies 4.9GHz 5.9GHz. This device ideal IEEE802.11a HiperLAN2 applications. This device available 6-bump UCSP package contains internal bias circuitry shutdown circuitry minimize number required external components.
input. Because noise figure design severely degraded low-Q matching components, always design with high-Q wire-wound inductors low-loss capacitors. Remember that package parasitics must taken into consideration; always components with self-resonant frequencies higher than intended frequency operation.
Applications Information
Optimal gain noise-figure performance require input- output-matching circuits tuned band interest. electrical specifications typical operating characteristics measured MAX2649 evaluation kit), which tuned operation 5.15GHz 5.35GHz band. Referencing application circuit, board layout, components specified MAX2649 data sheet reduces evaluation design time five system designs. applications other bands, refer MAX2649 S-parameters, noise parameters, following comments design. S-parameters noise parameters available www.maxim-ic.com.
Output Matching
output MAX2649 open-collector transistor; bias matching network off-chip, illustrated Typical Operating Circuit. Bias output stage with through choke. collector series with small inductor then AC-coupled output. necessary, place shunt capacitor ground inductor provide better matching. S-parameters noise parameters found www.maxim-ic.com.
Power-Supply Bypassing
Proper power-supply bypassing essential highfrequency circuit stability. Place small-value capacitor close possible decouple high-frequency noise. Place larger-value capacitor near supply decouple low-frequency noise. Whenever possible, place ground-connected side bypass capacitors within millimeters IC's ground connections.
Input Matching
input stage internally biased, external bias circuitry required RFIN. sure AC-couple
5GHz Low-Noise Amplifier with Shutdown MAX2649
Layout information
properly designed board essential part RF/microwave circuit. Keep signal lines short possible reduce losses, EMI, stray inductance. multiple, separate low-inductance-plated vias ground plane each ground bump. chip-scale package (UCSP) bump pitch 0.5mm (19.7mil) bump diameter 0.3mm (12mil). Therefore, solder spacing 0.5mm (19.7mil) centers, size 0.25mm (10mil), solder mask opening 0.33mm (13mil). Round square pads permissible. Refer Maxim application note, Wafer Level Chip-Scale Packaging, additional detailed information UCSP layout handling.
UCSP Reliability
chip-scale package (UCSP) represents unique package that greatly reduces board space compared other packages. UCSP reliability integrally linked user's assembly methods, circuit board material, usage environment. Operating life test moisture resistance remains uncompromised, primarily determined wafer-fabrication process. Mechanical stress performance greater consideration UCSP. UCSP solder-joint contact integrity must considered because package attached through direct solder contact user's board. Testing done characterize UCSP reliability performance shows that capable performing reliably through environmental stresses. Results environmental stress tests additional usage data recommendations detailed UCSP application note, which found Maxim's website, www.maxim-ic.com/ 1st_pages/UCSP.htm.
Configuration
TRANSISTOR COUNT:
VIEW RFIN
Chip Information
RFOUT
SHDN
5GHz Low-Noise Amplifier with Shutdown
Package Information
(The package drawing(s) this data sheet reflect most current specifications. latest package outline information, www.maxim-ic.com/packages.)
UCSP.EPS
MAX2649
PACKAGE OUTLINE, UCSP 21-0097
Maxim cannot assume responsibility circuitry other than circuitry entirely embodied Maxim product. circuit patent licenses implied. Maxim reserves right change circuitry specifications without notice time.
_Maxim Integrated Products, Gabriel Drive, Sunnyvale, 94086 408-737-7600 2003 Maxim Integrated Products Printed registered trademark Maxim Integrated Products.

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