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Data Sheet PD-6.032C IR2131 HIGH SIDE SIDE DRIVER Featu


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Data Sheet PD-6.032C
IR2131
HIGH SIDE SIDE DRIVER
Features
Floating channel designed bootstrap operation Fully operational +600V Tolerant negative transient voltage dV/dt immune Gate drive supply range from Undervoltage lockout channels Over-current shutdown turns drivers Independent high side side drivers Matched propagation delay channels Outputs phase with inputs
Product Summary
VOFFSET IO+/VOUT ton/off (typ.) Deadtime (typ.) 600V max.
Description
IR2131 high voltage, high speed power MOSFET IGBT driver with three independent high side referenced output channels. Proprietary HVIC technology enables ruggedized monolithic construction. Logic inputs compatible with CMOS LSTTL outputs. current trip function which terminates outputs derived from external current sense resistor. shutdown input provided customized shutdown function. open drain FAULT signal provided indicate that shutdowns occurred. output drivers feature high pulse current buffer stage designed minimum driver cross-conduction. Propagation delays matched simplify high frequency applications. floating channels used drive N-channel power MOSFETs IGBTs high side configuration which operate volts.
Packages
Typical Connection
Order
CONTROL NTEGRATED CIRCUIT DESIGNERS MANUAL
B-157
IR2131
Absolute Maximum Ratings
Absolute Maximum Ratings indicate sustained limits beyond which damage device occur. voltage parameters absolute voltages referenced COM. Thermal Resistance Power Dissipation ratings measured under board mounted still conditions. Additional Information shown Figures through
Symbol
VB1,2,3 VS1,2,3 VHO1,2,3 VLO1,2,3 VFLT dVS/dt
Parameter Definition
High Side Floating Supply Voltage High Side Floating Offset Voltage High Side Floating Output Voltage Side Logic Fixed Supply Voltage Logic Ground Side Output Voltage Logic Input Voltage (HIN1,2,3 ,LIN1,2,3 ,FLT ITRIP) FAULT Output Voltage Allowable Offset Supply Voltage Transient Package Power Dissipation +25°C Lead DIP) Lead SOIC) Lead PLCC) Thermal Resistance, Junction Ambient Lead DIP) Lead SOIC) Lead PLCC) Junction Temperature Storage Temperature Lead Temperature (Soldering, seconds)
Value Min.
-0.3 VB1,2,3 VS1,2,3 -0.3 -0.3
Max.
VB1,2,3 VB1,2,3
Units
V/ns
°C/W
Recommended Operating Conditions
Input/Output logic timing diagram shown Figure proper operation device should used within recommended conditions. voltage parameters absolute voltages referenced COM. offset rating tested with supplies biased differential.
Symbol
VB1,2,3 VS1,2,3 VHO1,2,3 VLO1,2,3 VFLT
Parameter Definition
High Side Floating Supply Voltage High Side Floating Offset Voltage High Side Floating Output Voltage Side Logic Fixed Supply Voltage Logic Ground Side Output Voltage Logic Input Voltage (HIN1,2,3 LIN1,2,3 ,FLT ITRIP) FAULT Output Voltage Ambient Temperature
Value Min.
VS1,2,3 Note VS1,2,3
Max.
VS1,2,3 VB1,2,3
Units
Note Logic operational +600V. Logic state held -VBS.
B-158 CONTROL INTEGRATED CIRCUIT DESIGNERS MANUAL
Order
IR2131
Dynamic Electrical Characteristics
VBIAS (VCC, VBS1,2,3) 15V, VS1,2,3 COM, 1000 25°C unless otherwise specified. dynamic electrical characteristics defined Figures through
Symbol
toff itrip tflt tflt,in tfltclr
Parameter Definition
Turn-On Propagation Delay Turn-Off Propagation Delay Turn-On Rise Time Turn-Off Fall Time ITRIP Output Shutdown Propagation Delay ITRIP Blanking Time ITRIP FAULT Indication Delay Input Filter Time (All Inputs) FAULT Clear Time Output Shutdown Propagation Delay Deadtime
Value Min. Typ. Max. Units Test Conditions
1000 1000 1000 1000 1200 VS1,2,3 600V VITRIP VITRIP VIN, VITRIP VIN, 0&5V VIN,
Static Electrical Characteristics
VBIAS (VCC VBS1,2,3) 15V, VS1,2,3 25°C unless otherwise specified. VIN, parameters referenced applicable logic input leads: HIN1,2,3 LIN1,2,3 parameters referenced VS1,2,3 applicable respective output leads: HO1,2,3 LO1,2,3.
Symbol
VFCLR,IH VFCLR,IL VSD,TH+ VSD,THVIT,TH+ VIT,THVOH IQBS IQCC IIN+ IINI ITRIP+ IITRIPIFCLR+ FCLRISD+
Parameter Definition
Logic Input Voltage (OUT Logic Input Voltage (OUT Logic Fault Clear Input Voltage Logic Fault Clear Input Voltage Shutdown Input Positive Going Threshold Shutdown Input Negative Going Threshold ITRIP Input Positive Going Threshold ITRIP Input Negative Going Threshold High Level Output Voltage, VBIAS Level Output Voltage, Offset Supply Leakage Current Quiescent Supply Current Quiescent Supply Current Logic Input Bias Current (OUT Logic Input Bias Current (OUT "High" ITRIP Bias Current "Low" ITRIP Bias Current Logic Fault Clear Bias Current Logic Fault Clear Bias Current Logic Shutdown Bias Current Logic Shutdown Bias Current
Min.
Value Typ. Max. Units Test Conditions
600V ITRIP ITRIP
Order
CONTROL INTEGRATED CIRCUIT DESIGNERS MANUAL B-159
IR2131
Static Electrical Characteristics Continued
VBIAS (VCC, VBS1,2,3) 15V, VS1,2,3 25°C unless otherwise specified. VIN, parameters referenced applicable logic input leads: HIN1,2,3 LIN1,2,3 parameters referenced VS1,2,3 applicable respective output leads: HO1,2,3 LO1,2,3.
Symbol
VBSUV+ VBSUVVCCUV+ VCCUVRon,FLT
Parameter Definition
Supply Undervoltage Positive Going Threshold Supply Undervoltage Negative Going Threshold Supply Undervoltage Positive Going Threshold Supply Undervoltage Negative Going Threshold FAULT On-Resistance Output High Short Circuit Pulsed Current Output Short Circuit Pulsed Current
Min.
Value Typ. Max. Units Test Conditions
Lead Assignments
Lead
Lead PLCC Leads
Lead SOIC (Wide Body)
IR2131
IR2131J Part Number
IR2131S
B-160 CONTROL INTEGRATED CIRCUIT DESIGNERS MANUAL
Order
IR2131
Functional Block Diagram
Lead Definitions
Lead Symbol Description
HIN1,2,3 LIN1,2,3 Logic inputs high side gate driver outputs (HO1,2,3), phase Logic inputs side gate driver output (LO1,2,3), phase
Logic input fault clear Logic input shutdown FAULT ITRIP VB1,2,3 HO1,2,3 VS1,2,3 LO1,2,3 Indicates over-current undervoltage lockout (low side) occurred, negative logic side logic fixed supply Input over-current shutdown Logic ground High side floating supplies High side gate drive outputs High side floating supply returns side gate drive outputs side return
Order
CONTROL INTEGRATED CIRCUIT DESIGNERS MANUAL B-161
IR2131
Device Information
Process Design Rule Transistor Count Size Outline HVDCMOS (mil)
Thickness Gate Oxide Connections First Layer
Second Layer Contact Hole Dimension Insulation Layer Passivation Method Method Bond Wire Bond Leadframe
Material Width Spacing Thickness Material Width Spacing Thickness Material Thickness Material Thickness
Package Remarks:
Method Material Material Area Lead Plating Types Materials
Poly Silicon (Si: 1.0% ±0.1%) (SiO (SiO Full Ablebond Thermo Sonic (1.0 mil) Lead PDIP SOIC Lead PLCC EME6300 MP150 MP190
B-162 CONTROL INTEGRATED CIRCUIT DESIGNERS MANUAL
Order
IR2131
HIN1,2,3 LIN1,2,3 ITRIP
FAULT
LO1,2,3 HO1,2,3
Figure Input/Output Timing Diagram
Figure Floating Supply Voltage Transient Test Circuit
HIN1,2,3
LIN1,2,3
FLT-CLR
toff
HO1,2,3 LO1,2,3
Figure Switching Time Test Circuit
Figure Switching Time Waveform Definitions
LIN1,2,3
HIN1,2,3 ITRIP
LIN1,2,3
LO1,2,3
FAULT
LO1,2,3 HO1,2,3
tflt
tfltclr titrip
Figure Deadtime Waveform Definitions
Figure Shutdown Waveform Definitions
Order
CONTROL INTEGRATED CIRCUIT DESIGNERS MANUAL B-163
IR2131
480V
480V
Junction Temperature (°C) Junction Temperature (°C)
320V
320V
160V
160V
1E+2
1E+3 Frequency (Hz)
1E+4
1E+5
1E+2
1E+3 Frequency (Hz)
1E+4
1E+5
Figure IR2131 Frequency (IRF820) RGATE
Figure IR2131 Frequency (IRF830) RGATE
480V
Junction Temperature (°C) Junction Temperature (°C)
320V
480V 320V
160V
160V
1E+2
1E+3 Frequency (Hz)
1E+4
1E+5
1E+2
1E+3 Frequency (Hz)
1E+4
1E+5
Figure IR2131 Frequency (IRF840) RGATE
Figure IR2131 Frequency (IRF450) RGATE
B-164 CONTROL INTEGRATED CIRCUIT DESIGNERS MANUAL
Order

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