Data Sheet PD-6.043C IR2101 HIGH SIDE DRIVER Features

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Data Sheet PD-6.043C IR2101 HIGH SIDE DRIVER Features

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Data Sheet PD-6.043C
IR2101
HIGH SIDE DRIVER
Features
Floating channel designed bootstrap operation Fully operational +600V Tolerant negative transient voltage dV/dt immune Gate drive supply range from Undervoltage lockout Schmitt-triggered input logic Matched propagation delay both channels Outputs phase with inputs
Product Summary
VOFFSET IO+/VOUT ton/off (typ.) Delay Matching 600V max.
Description
IR2101 high voltage, high speed power MOSFET IGBT driver with independent high side referenced output channels. Proprietary HVIC latch immune CMOS technologies enable ruggedized monolithic construction. logic input compatible with standard CMOS LSTTL outputs. output drivers feature high pulse current buffer stage designed minimum driver cross-conduction. floating channel used drive N-channel power MOSFET IGBT high side configuration which operates volts.
Packages
Typical Connection
600V
LOAD
Order
ONTROL NTEGRATED IRCUIT ESIGNERS ANUAL
IR2101
Absolute Maximum Ratings
Absolute Maximum Ratings indicate sustained limits beyond which damage device occur. voltage parameters absolute voltages referenced COM. Thermal Resistance Power Dissipation ratings measured under board mounted still conditions.
Symbol
dVs/dt
Parameter Definition
High Side Floating Supply Voltage High Side Floating Supply Offset Voltage High Side Floating Output Voltage Side Logic Fixed Supply Voltage Side Output Voltage Logic Input Voltage (HIN LIN) Allowable Offset Supply Voltage Transient Package Power Dissipation +25°C Thermal Resistance, Junction Ambient Junction Temperature Storage Temperature Lead Temperature (Soldering, seconds) Lead DIP) Lead SOIC) Lead DIP) Lead SOIC)
Value Min.
-0.3 -0.3 -0.3 -0.3
Max.
0.625
Units
V/ns °C/W
Recommended Operating Conditions
Input/Output logic timing diagram shown Figure proper operation device should used within recommended conditions. offset rating tested with supplies biased differential.
Symbol
Parameter Definition
High Side Floating Supply Absolute Voltage High Side Floating Supply Offset Voltage High Side Floating Output Voltage Side Logic Fixed Supply Voltage Side Output Voltage Logic Input Voltage (HIN LIN) Ambient Temperature
Value Min.
Note
Max.
Units
Note Logic operational +600V. Logic state held -VBS.
CONTROL INTEGRATED CIRCUIT DESIGNERS MANUAL
Order
IR2101
Dynamic Electrical Characteristics
VBIAS (VCC, VBS) 15V, 1000 25°C unless otherwise specified.
Symbol
toff
Parameter Definition
Turn-On Propagation Delay Turn-Off Propagation Delay Turn-On Rise Time Turn-Off Fall Time Delay Matching, Turn-On/Off
Min.
Value Typ. Max. Units Test Conditions
600V
Static Electrical Characteristics
VBIAS (VCC, VBS) 25°C unless otherwise specified. VIN, parameters referenced COM. parameters referenced applicable respective output leads:
Symbol
IQCC IIN+ IINVCCUV+ VCCUVI
Parameter Definition
Logic Input Voltage Logic Input Voltage High Level Output Voltage, VBIAS Level OutputVoltage, Offset Supply Leakage Current Quiescent Supply Current QuiescentVCC Supply Current Logic Input Bias Current Logic Input Bias Current Supply Undervoltage Positive Going Threshold Supply Undervoltage Negative Going Threshold Output High Short Circuit Pulsed Current Output Short Circuit Pulsed Current
Min.
Value Typ. Max. Units Test Conditions
600V
0V,VIN 15V,
Order
CONTROL INTEGRATED IRCUIT DESIGNERS MANUAL
IR2101
Functional Block Diagram
LEVEL SHIFT
PULSE FILTER
PULSE DETECT
Lead Definitions
Lead Symbol Description
Logic input high side gate driver output (HO), phase Logic input side gate driver output (LO), phase High side floating supply High side gate drive output High side floating supply return side logic fixed supply side gate drive output side return
Lead Assignments
Lead
SO-8
IR2101
CONTROL INTEGRATED CIRCUIT DESIGNERS MANUAL
IR2101S
Order
IR2101
Device Information
Process Design Rule Transistor Count Size Outline HVDCMOS (mil)
Thickness Gate Oxide Connections First Layer
Second Layer Contact Hole Dimension Insulation Layer Passivation Method Method Bond Wire Bond Leadframe
Material Width Spacing Thickness Material Width Spacing Thickness Material Thickness Material Thickness
Package Remarks:
Method Material Material Area Lead Plating Types Materials
Poly Silicon (Si: 1.0% ±0.1%) (SiO2) (SiO2) Full Ablebond Thermo Sonic (1.0 mil) Lead PDIP SO-8 EME6300 MP150 MP190
Order
CONTROL INTEGRATED IRCUIT DESIGNERS MANUAL
IR2101
Figure Input/Output Timing Diagram
Figure Switching Time Waveform Definitions
Figure Delay Matching Waveform Definitions
CONTROL INTEGRATED CIRCUIT DESIGNERS MANUAL
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Data Sheet PD-6.043C IR2101 HIGH SIDE DRIVER Features

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