9&;2 &ORFN *HQHUDWRU April 2000 Features Description

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9&;2 &ORFN *HQHUDWRU April 2000 Features Description

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9&;2 &ORFN *HQHUDWRU
April 2000
Features
Description
On-chip tunable voltage-controlled crystal oscillator circuitry (VCXO) allows precise system frequency tuning (pull range typically 300ppm) Uses inexpensive fundamental-mode crystals Integrated phase-locked loops (PLL) multiply VCXO frequency higher system frequencies needed 3.3V supply voltage available (contact factory volt versions) Small circuit board footprint (8-pin 0.150 SOIC) Custom frequency selections available contact your local Sales Representative more information
FS6205 monolithic CMOS clock generator designed minimize cost component count digital video/audio systems. on-chip voltage-controlled crystal oscillator (VCXO) permits reference frequency output frequency) tuned match other frequencies present system. Phase-locked loops used generate precise output reference frequency ratios. Table information frequency ratios programmed into each version FS6205.
Table Version Information Figure Configuration
XTUNE
DEVICE
(nom)
FREF (MHz)
(MHz) 27.000 (REF 74.175824175. (REF 27.027 (REF 74.580835443. (REF
XOUT
FS6205-01
13.500 13.5135
FS6205
8-pin (0.150) SOIC
NOTE: Contact custom versions
Figure Block Diagram
VCXO XOUT XTUNE
FS6205
American Microsystems, Inc. reserves right change detail specifications required permit improvements design products.
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9&;2 &ORFN *HQHUDWRU
April 2000
Table Descriptions
Key: Analog Input; Analog Output; Digital Input; Input with Internal Pull-Up; Input with Internal Pull-Down; Digital Input/Output; DI-3 Three-Level Digital Input, Digital Output; Power/Ground; Active
TYPE
NAME XTUNE XOUT VCXO Crystal Feedback Power Supply (+3.3V nominal) VCXO Tune Ground Clock Output
DESCRIPTION
Frequency Select Input (changes Frequencies) Multiplexer Select Input (chooses VCXO Crystal Drive
Functional Block Description
Phase-Locked Loops (PLL)
simple formula obtain pulling capability crystal oscillator
ppm)
on-chip PLLs standard frequency- phaselocked loop architecture. multiplies reference oscillator desired frequency ratio integers. frequency multiplication exactly that specified integer ratios.
Voltage-Controlled Crystal Oscillator (VCXO)
where extremes applied load capacitance. EXAMPLE: crystal with following parameters used. With 0.02pF, 5pF, 13pF, 35pF, tuning range between extreme settings XTUNE voltage
VCXO provides tunable, low-jitter frequency reference rest FS6205 system components. Loading capacitance crystal internal FS6205. external components (other than crystal resonator itself) required operation VCXO. Continuous fine-tuning VCXO frequency accomplished varying voltage XTUNE pin. total change (from extreme other) effective loading capacitance 12pF nominal (i.e from 35pF 13pF). "Pulling" crystal oscillation frequency, accomplished altering effective load capacitance presented crystal oscillator circuit. actual amount that changing load capacitance alters oscillator frequency will dependent characteristics crystal well oscillator circuit itself. Specifically, motional capacitance crystal (usually referred crystal manufacturers static capacitance crystal load capacitance (CL) oscillator determine "warping" "pulling" capability crystal oscillator circuit.
0.02
Deviation -100 -150 -200 -250 V(XTUNE) volts
Figure Typical VCXO Characteristic
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9&;2 &ORFN *HQHUDWRU
April 2000
Electrical Specifications
Table Absolute Maximum Ratings
Stresses above those listed under Absolute Maximum Ratings cause permanent damage device. These conditions represent stress rating only, functional operation device these other conditions above operational limits noted this specification implied. Exposure maximum rating conditions extended conditions affect device performance, functionality, reliability.
PARAMETER Supply Voltage (VSS ground) Input Voltage, Output Voltage, Input Clamp Current, VDD) Output Clamp Current, VDD) Storage Temperature Range (non-condensing) Ambient Temperature Range, Under Bias Junction Temperature Lead Temperature (soldering, 10s) Input Static Discharge Voltage Protection (MIL-STD 883E, Method 3015.7)
SYMBOL
MIN. VSS-0.5 VSS-0.5 VSS-0.5
MAX. VDD+0.5 VDD+0.5
UNITS
CAUTION: ELECTROSTATIC SENSITIVE DEVICE
Permanent damage resulting loss functionality performance occur this device subjected high-energy electrostatic discharge.
Table Operating Conditions
PARAMETER Supply Voltage (3.3 volt system) Ambient Operating Temperature Range SYMBOL CONDITIONS/DESCRIPTION MIN. TYP. MAX. UNITS
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9&;2 &ORFN *HQHUDWRU
April 2000
Table Electrical Specifications
Unless otherwise stated, 3.3V 10%, load output, ambient temperature range 70°C. Parameters denoted with asterisk represent nominal characterization data production tested specific limits. Where given, characterization data from typical. Negative currents indicate current flows device.
PARAMETER Overall Supply Current, Dynamic, with Loaded Outputs Clock Outputs (CLKx) High-Level Output Source Current Low-Level Output Sink Current Output Impedance Short Circuit Source Current Short Circuit Sink Current
SYMBOL
CONDITIONS/DESCRIPTION
MIN.
TYP.
MAX.
UNITS
fXTAL 13.5MHz; 10pF, 3.3V
IOSH IOSL
2.0V 0.4V 0.5VDD; output driving high 0.5VDD; output driving shorted 30s, max. 3.3V; shorted 30s, max.
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9&;2 &ORFN *HQHUDWRU
April 2000
Table Timing Specifications
Unless otherwise stated, 3.3V 10%, load output, ambient temperature range 70°C. Parameters denoted with asterisk represent nominal characterization data production tested specific limits. Where given, characterization data from typical.
PARAMETER Overall Synthesis Error Crystal Oscillator Center Frequency Tuning Voltage Center Frequency Crystal Loading Capacitance Crystal Drive Level Clock Output (CLK) Duty Cycle Jitter, Period (peak-peak) Jitter, Long Term (y()) Jitter, Long Term (y()) Rise Time Fall Time
SYMBOL
CONDITIONS/DESCRIPTION
MIN.
TYP.
MAX.
UNITS
(unless otherwise noted Frequency Table)
VCENTER
crystal with specified CL(xtal) seen crystal connected XOUT (@VXTUNE=VCENTER). Crystal loading capacitance nominal center frequency should specified this value. RXTAL=20;
CL(xtal)
Ratio high pulse width measured from rising edge next falling edge VDD/2) clock period
tj(P) tj(LT) tj(LT)
From rising edge next rising edge VDD/2 From 0-500µs VDD/2 compared ideal clock source (CLK =27MHz 27.027MHz) From 0-500µs VDD/2 compared ideal clock source (CLK 74.175MHz 74.58MHz) 3.3V; 0.3V 3.0V; 10pF 3.3V; 3.0V 0.3V; 10pF
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9&;2 &ORFN *HQHUDWRU
April 2000
Package Information
Table 8-pin SOIC (0.150") Package Dimensions
DIMENSIONS INCHES MIN. 0.061 0.004 0.055 0.013 0.0075 0.189 0.150 0.230 0.010 0.016 MAX. 0.068 0.0098 0.061 0.019 0.0098 0.196 0.157 0.244 0.016 0.035 MILLIMETERS MIN. 1.55 0.102 1.40 0.33 0.191 4.80 3.81 5.84 0.25 0.41 MAX. 1.73 0.249 1.55 0.49 0.249 4.98 3.99 6.20 0.41 0.89
BASE PLANE RADII: 0.005" 0.01"
SEATING PLANE
typ.
0.050
1.27
Table 8-pin SOIC (0.150") Package Characteristics
PARAMETER Thermal Impedance, Junction Free-Air 8-pin 0.150" SOIC Lead Inductance, Self Lead Inductance, Mutual Lead Capacitance, Bulk SYMBOL CONDITIONS/DESCRIPTION flow Corner lead Center lead lead adjacent lead lead TYP. 0.27 UNITS °C/W
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9&;2 &ORFN *HQHUDWRU
April 2000
Ordering Information
DEVICE NUMBER PACKAGE TYPE 8-pin (0.150") SOIC (Small Outline Package) 8-pin (0.150") SOIC (Small Outline Package) OPERATING TEMPERATURE RANGE 70°C (Commercial) 70°C (Commercial) SHIPPING CONFIGURATION Tape Reel Tubes
ORDERING CODE
11640-822 11640-832
FS6205-01 FS6205-01
Copyright 1999, 2000 American Microsystems, Inc.
Devices sold covered warranty patent indemnification provisions appearing Terms Sale only. makes warranty, express, statutory implied description, regarding information forth herein regarding freedom described devices from patent infringement. makes warranty merchantability fitness purposes. reserves right discontinue production change specifications prices time without notice. AMI's products intended commercial applications. Applications requiring extended temperature range, unusual environmental requirements, high reliability applications, such military, medical life-support life-sustaining equipment, specifically recommended without additional processing such applications.
American Microsystems, Inc., 2300 Buckskin Rd., Pocatello, 83201, (208) 233-4690, (208) 234-6796, Address: http://www.amis.com E-mail: tgp@amis.com
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9&;2 &ORFN *HQHUDWRU April 2000 Features Description

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