Build Biasing Circuit UHF/VHF Amplifier ADE-208-607C 4th. Edition
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BB305M
Build Biasing Circuit UHF/VHF Amplifier
ADE-208-607C 4th. Edition 1998 Features
Build Biasing Circuit; reduce using parts cost board space. Superior cross modulation characteristics. High gain; typ. MHz) Wide supply voltage range; Applicable with supply voltage. Withstanding ESD; Build absorbing diode. Withstand 200V C=200pF, Rs=0 conditions. Provide mini mold packages; MPAK-4(SOT-143mod)
Outline
MPAK-4
Source Gate1 Gate2 Drain
Note: Marking "EW-". BB305M individual type number HITACHI BBFET.
BB305M
Absolute Maximum Ratings 25°C)
Item Drain source voltage Gate1 source voltage Symbol VG1S VG2S Tstg Ratings Gate2 source voltage Drain current Channel power dissipation Channel temperature Storage temperature +150 Unit
BB305M
Electrical Characteristics 25°C)
Item Drain source breakdown voltage Gate1 source breakdown voltage Gate2 source breakdown voltage Symbol V(BR)DSS V(BR)G1SS V(BR)G2SS +100 ±100 Unit Test Conditions 200µA, VG1S VG2S +10µA, VG2S ±10µA, VG1S VG1S +9V, VG2S ±9V, VG1S VG2S 100µA VG1S 100µA VG2S =4V, 1MHz VG2S VG2S 220k VG2S =82k, 1kHz VG2S 220k, 1kHz VG2S 82k, 200MHz VG2S 220k, 200MHz VG2S 82k, 200MHz VG2S 220k, 200MHz
Gate1 source cutoff current G1SS Gate2 source cutoff current G2SS Gate1 source cutoff voltage VG1S(off) Gate2 source cutoff voltage VG2S(off) Input capacitance Output capacitance
Reverse transfer capacitance Drain current D(op) D(op) Forward transfer admittance |yfs|1 |yfs|2 Power gain Noise figure
0.017 0.04
BB305M
Main Characteristics
Test Circuit Operating Items |yfs|, Ciss, Coss, Crss, D(op)
Gate Gate
Drain
Source
Power Gain, Noise Figure Test Circuit
1000p
1000p
1000p
Input(50 1000p
1000p
BBFET 1000p
Output(50
1000p 1SV70
1SV70
1000p Unit @Resistance Capacitance @(F)
Enameled Copper Wire,Inside 10mm, 2Turns Enameled Copper Wire,Inside 10mm, 2Turns Enameled Copper Wire,Inside 5mm, 2Turns
BB305M
Maximum Channel Power Dissipation Curve
(mW)
Typical Output Characteristics
(mA)
Channel Power Dissipation
Drain Current
(°C)
Ambient Temperature
Drain Source Voltage
Drain Current Gate2 Source Voltage
(mA)
Drain Current Gate1 Voltage
(mA)
Drain Current
Drain Current
Gate1 Voltage
Gate2 Source Voltage
VG2S
BB305M
Drain Current Gate1 Voltege Drain Current Gate1 Voltege
(mA)
(mA) Drain Current
Drain Current
Gate1 Voltage
Gate1 Voltage
Forward Transfer Admittance (mS)
Forward Transfer Admittance Gate1 Voltage
Forward Transfer Admittance Gate1 Voltage
Forward Transfer Admittance (mS)
Gate1 Voltage
Gate1 Voltage
BB305M
Forward Transfer Admittance Gate1 Voltage
Power Gain Gate Resistance
Forward Transfer Admittance (mS)
Power Gain (dB)
1000 Gate Resistance
Gate1 Voltage
Noise Figure Gate Resistance
Power Gain Drain Current
Noise Figure (dB)
Power Gain (dB)
variable
1000 Gate Resistance
Drain Current
(mA)
BB305M
Noise Figure Drain Current
Noise Figure (dB)
Drain Current Gate Resistance
Drain Current
variable
(mA)
1000
Drain Current
(mA)
Gate Resistance
Gain Reduction Gate2 Source Voltage
Input Capacitance Ciss (pF) Gain Reduction (dB)
Input Capacitance Gate2 Source Voltage Gate2 Source Voltage VG2S
Gate2 Source Voltage VG2S
BB305M
Parameter Frequency
-1.5 -120° -90° -60° 180° 150°
Parameter Frequency
120°
Scale: div.
-150°
-30°
Test Condition 1000 step)
Test Condition 1000 step)
Parameter Frequency
120°
Parameter Frequency
Scale: 0.002 div.
150°
180°
-150° -30° -120° -90° -60° -1.5
Test Condition 1000 step)
Test Condition 1000 step)
BB305M
Sparameter (VDS VG2S 82k,
(MHz) 1000 0.991 0.991 0.982 0.975 0.972 0.956 0.942 0.928 0.920 0.906 0.894 0.880 0.868 0.854 0.842 0.835 0.820 0.802 0.801 0.789 -4.8 -9.9 -15.4 -20.7 -25.6 -30.6 -35.5 -40.1 -44.9 -49.2 -53.6 -57.8 -62.1 -66.2 -70.3 -73.9 -77.7 -81.5 -84.7 -87.9 2.69 2.68 2.66 2.62 2.60 2.54 2.47 2.42 2.38 2.32 2.25 2.18 2.12 2.06 2.00 1.94 1.89 1.83 1.78 1.73 174.9 169.3 163.4 157.5 152.0 146.3 140.9 135.7 130.5 125.7 120.8 116.2 111.5 106.8 102.5 98.4 94.0 89.6 85.6 82.1 0.00090 0.00153 0.00243 0.00293 0.00370 0.00444 0.00478 0.00535 0.00551 0.00549 0.00584 0.00542 0.00562 0.00509 0.00465 0.00427 0.00416 0.00289 0.00288 0.00241 91.4 90.5 73.8 74.9 70.1 69.0 63.7 64.8 56.8 58.6 54.4 53.3 49.5 48.6 49.7 51.6 53.3 57.9 72.9 78.9 0.991 0.992 0.991 0.989 0.985 0.981 0.977 0.973 0.967 0.962 0.957 0.952 0.944 0.939 0.933 0.927 0.921 0.915 0.909 0.904 -2.2 -4.8 -7.5 -9.9 -12.6 -15.0 -17.3 -19.7 -22.0 -24.5 -26.9 -29.2 -31.5 -33.8 -36.1 -38.3 -40.5 -42.7 -44.9 -47.1
BB305M
Package Dimensions
Unit:
0.65
0.95 0.95 0.05
0.05
0.16
0.06
0.05 0.95
0.05 0.85 0.65
Hitachi Code EIAJ JEDEC
MPAK-4 SC-61AA
Cautions
Hitachi neither warrants grants licenses rights Hitachi's third party's patent, copyright, trademark, other intellectual property rights information contained this document. Hitachi bears responsibility problems that arise with third party's rights, including intellectual property rights, connection with information contained this document. Products product specifications subject change without notice. Confirm that have received latest product standards specifications before final design, purchase use. Hitachi makes every attempt ensure that products high quality reliability. However, contact Hitachi's sales office before using product application that demands especially high quality reliability where failure malfunction directly threaten human life cause risk bodily injury, such aerospace, aeronautics, nuclear power, combustion control, transportation, traffic, safety equipment medical equipment life support. Design your application that product used within ranges guaranteed Hitachi particularly maximum rating, operating supply voltage range, heat radiation characteristics, installation conditions other characteristics. Hitachi bears responsibility failure damage when used beyond guaranteed ranges. Even within guaranteed ranges, consider normally foreseeable failure rates failure modes semiconductor devices employ systemic measures such failsafes, that equipment incorporating Hitachi product does cause bodily injury, fire other consequential damage operation Hitachi product. This product designed radiation resistant. permitted reproduce duplicate, form, whole part this document without written approval from Hitachi. Contact Hitachi's sales office questions regarding this document Hitachi semiconductor products.
Hitachi, Ltd.
Semiconductor Integrated Circuits. Nippon Bldg., 2-6-2, Ohte-machi, Chiyoda-ku, Tokyo 100-0004, Japan Tel: Tokyo (03) 3270-2111 Fax: (03) 3270-5109
NorthAmerica http:semiconductor.hitachi.com/ Europe Asia (Singapore) Asia (Taiwan) Asia (HongKong) Japan further information write
Hitachi Semiconductor (America) Inc. East Tasman Drive, Jose,CA 95134 Tel: (408) 433-1990 Fax: <1>(408) 433-0223 Hitachi Europe GmbH Electronic components Group Dornacher D-85622 Feldkirchen, Munich Germany Tel: <49> (89) 9180-0 Fax: <49> (89) Hitachi Europe Ltd. Electronic Components Group. Whitebrook Park Lower Cookham Road Maidenhead Berkshire 8YA, United Kingdom Tel: <44> (1628) 585000 Fax: <44> (1628) 778322 Hitachi Asia Pte. Ltd. Collyer Quay #20-00 Hitachi Tower Singapore 049318 Tel: 535-2100 Fax: 535-1533 Hitachi Asia Ltd. Taipei Branch Office Hung Building. No.167, Tun-Hwa North Road, Taipei (105) Tel: <886> 2718-3666 Fax: <886> 2718-8180 Hitachi Asia (Hong Kong) Ltd. Group (Electronic Components) 7/F., North Tower, World Finance Centre, Harbour City, Canton Road, Tsim Tsui, Kowloon, Hong Kong Tel: <852> 9218 Fax: <852> 0281 Telex: 40815 HITEC
Copyright Hitachi, Ltd., 1999. rights reserved. Printed Japan.
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