µPD78P322 16/8-BIT SINGLE-CHIP MICROCONTROLLER µPD78P322 ver

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µPD78P322 16/8-BIT SINGLE-CHIP MICROCONTROLLER µPD78P322 ver

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Integrated Circuit
µPD78P322
16/8-BIT SINGLE-CHIP MICROCONTROLLER
µPD78P322 version provided replacing µPD75322's internal mask with one-time PROM EPROM. Because one-time PROM version programmable only once users, ideally suited small-scale production many different products, rapid development time-to-market application sets. EPROM version reprogrammable, suited evaluation systems. µPD78P322K, which EPROM version, does maintain planned reliability when used mass-produced products. Please only experimentally evaluating functions during trial manufacture. Functions described detail following user's manual. sure read designing.
µPD78322 User's Manual: IEU-1248
FEATURES
µPD78322 compatible
mass-production, µPD78P322 replaced with µPD78322 which incorporates mask
Internal PROM: 16,384 bits Programmable once only (one-time PROM version without window) Erasable with ultraviolet rays electrically programmable (EPROM version with window)
PROM programming characteristics: µPD27C256A compatible µPD78P328 QTOPmicrocontroller
Remark QTOP microcontroller general term microcontrollers which incorporate one-time PROM, totally supported NEC's programming service (from programming marking, screening, verification).
ORDERING INFORMATION
Part Number Package 80-pin plastic 74-pin plastic 68-pin plastic (950 mils) 80-pin ceramic WQFN 68-pin ceramic WQFN 74-pin ceramic WQFN Internal One-time PROM One-time PROM One-time PROM EPROM EPROM EPROM Quality Grade Standard Standard Standard applicable Standard Standard
µPD78P322GF-3B9 µPD78P322GJ-5BJ µPD78P322L µPD78P322K µPD78P322KC µPD78P322KD
Please refer "Quality grade Semiconductor Devices" (Document number IEI-1209) published Corporation know specification quality grade devices recommended applications.
Functions common one-time PROM EPROM versions referred PROM functions throughout this document. information this document subject change without notice. Document U10435EJ5V0DS00 (5th edition) (Previous IC-2485) Date Published December 1995 Printed Japan mark
shows revised points.
1991 1994
µPD78P322
CONFIGURATIONS (Top View)
Normal operating mode 80-pin plastic
µPD78P322GF-3B9
80-pin ceramic WQFN
µPD78P322K
P26/INTP5 P25/INTP4 P24/INTP3 P23/INTP2 P22/INTP1 P21/INTP0 P20/NMI AVDD AVREF P77/AN7 P76/AN6 P75/ANI5 P74/AN4 P73/AN3
P27/INTP6/ P30/TxD P31/RxD P32/SO/SB0 P33/S1/SB1 P34/SCK P80/TO00 P81/TO01 P82/TO02 P83/TO03 P84/TO10 P85/TO11 RESET WDTO RTP0/P00 TRP1/P01
P72/ANI2 P71/ANI1 P70/ANI0 AVSS P57/A15 P56/A14 P55/A13 P54/A12 P53/A11 P52/A10 P51/A9 P50/A8 P47/AD7 P46/AD6 P45/AD5 P44/AD4 P43/AD3 P42/AD2
Caution Connect pins measure against noise (can leave open). Remark These pins compatible with µPD78322GF pins. µPD78P322K does maintain planned reliability when used mass-produced products. Please only experimentally evaluating functions during trial manufacture.
RTP2/P02 RTP3/P03 RTP4/P04 RTP5/P05 RTP6/P06 RTP7/P07 P93/TMD P92/TAS P91/WR P90/RD ASTB P40/AD0 P41/AD1
µPD78P322
74-pin plastic
µPD78P322GJ-5BJ
74-pin ceramic WQFN
µPD78P322KD
P42/AD2 P41/AD1 P40/AD0 ASTB P90/RD P91/WR P92/ P93/ P07/RTP7 P06/RTP6 P05/RTP5 P04/RTP4 P03/RTP3 P02/RTP2 P01/RTP1
P43/AD3 P44/AD4 P45/AD5 P46/AD6 P47/AD7 P50/A8 P51/A9 P52/A10 P53/A11 P54/A12 P55/A13 P56/A14 P57/A15 AVSS P70/AN0 P71/AN1
P00/RTP0 WDTO RESET P85/TO11 P84/TO10 P83/TO03 P82/TO02 P81/TO01 P80/TO00 P34/SCK P33/SI/SBI P32/SO/SB0 P31/RxD P30/TxD
Caution Connect pins measures against noise (can leave open). Remark These pins compatible with µPD78322GJ pins.
P72/AN2 P73/AN3 P74/AN4 P75/AN5 P76/AN6 P77/AN7 AVREF AVDD P20/NMI P21/INTP0 P22/INTP1 P23/INTP2 P24/INTP3 P25/INTP4 P26/INTP5 P27/INTP6
µPD78P322
68-pin plastic (950 mils)
µPD78P322L
68-pin ceramic WQFN
µPD78P322KC
P27/INTP6/TI
P26/INTP5
P25/INTP4
P24/INTP3
P23/INTP2
P22/INTP1
P21/INTP0
P77/AN7
P76/AN6
P75/AN5
P74/AN4
P73/AN3
P30/TxD P31/RxD P32/SO/SB0 P33/SI/SB1 P34/SCK P80/TO00 P81/TO01 P82/TO02 P83/TO03 P84/TO10 P85/TO11 RESET WDTO RTP0/P00
P72/AN2
P20/NMI
AVREF
AVDD
P71/AN1 P70/AN0 AVSS P57/A15 P56/A14 P55/A13 P54/A12 P53/A11 P52/A10 P51/A9 P50/A8 P47/AD7 P46/AD6 P45/AD5 P44/AD4 P43/AD3
P04/RTP4
P91/WR
P93/TMD
P01/RTP1
P02/RTP2
P03/RTP3
P05/RTP5
P06/RTP6
P07/RTP7
P92/TAS
P90/RD
P40/AD0
P41/AD1
Remark These pins compatible with µPD78322L pins.
P42/AD2
ASTB
µPD78P322
P00-P07 P20-P27 P30-P34 P40-P47 P50-P57 P70-P77 P80-P85 P90-P93 INTP0-INTP6 RTP0-RTP7 SB0/SO SB1/SI TO00-TO03 TO10, TO11 Port Port Port Port Port Port Port Port Nonmaskable Interrupt Interrupt From Peripherals Real-Time Port Timer Input Transmit Data Receive Data Serial Bus/Serial Output Serial Bus/Serial Input Serial Clock RESET WDTO ASTB AD0-AD7 A8-A15 AN0-AN7 AVREF AVSS AVDD Reset Crystal Watchdog Timer Output External Access Turbo Mode Turbo Access Strobe Write Strobe Read Strobe Address Strobe Address/Data Address Analog Input Analog Reference Voltage Analog Analog Power Supply Ground Connection
Timer Output
µPD78P322
PROM programming mode (RESET AVDD 80-pin plastic
µPD78P322GF-3B9
80-pin ceramic WQFN
µPD78P322K
RESET (Open) (Open)
AVDD
(Open)
Cautions
recommended connection unused pins PROM programming mode indicated parentheses. Open Connect each resistor. Connect VSS. Leave unconnected.
Connect pins measures against noise (can leave open).
µPD78P322K does maintain planned reliability when used mass-produced products. Please only experimentally evaluating functions during trial manufacture.
(Open)
µPD78P322
74-pin plastic
µPD78P322GJ-5BJ
74-pin ceramic WQFN
µPD78P322KD
(Open)
(Open) (Open) RESET
AVDD
Cautions
recommended connection unused pins PROM programming mode indicated parentheses. Open Connect each resistor. Connect VSS. Leave unconnected.
Connect pins measure against noise.
µPD78P322
68-pin plastic (950 mil)
µPD78P322L
68-pin ceramic WQFN
µPD78P322KC
RESET (Open) (Open)
AVDD
(Open)
Caution recommended connection unused pins PROM programming mode indicated parentheses. Open A0-A14 D0-D7 Connect each resistor. Connect VSS. Leave unconnected. Address Data Chip Enable Output Enable RESET
Programming Mode
Programming Power Supply Connection
BLOCK DIAGRAM
Main (P20) INTP0-INTP5 (P21-P26) PROGRAMMABLE INTERRUPT CONTROLLER
GENERAL REGISTERS bytes DATA MEMORY bytes
PROM/RAM
RESET ASTB EA/VPP Note A8-A15 (P50-P57) AD0-AD7 (P40-P47) A0-A14 D0-D7
Note
PROM Kbytes Peripheral bytes
SYSTEM CONTROL CONTROL PREFETCH CONTROL
(P80) TO00 (P81) TO01 (P82) TO02 (P83) TO03 (P84) TO10 (P85) TO11 (P27) TI/INTP6
TIMER/COUNTER UNIT (REALTIME PULSE UNIT)
MICRO SEQUENCE CONTROL MICRO
(P34) (P32) SO/SB0 (P33) SI/SB1 (P30) (P31) AVDD AVSS AVREF ANI0-ANI7 (P70-P77) SERIAL INTERFACE (SBI) (UART)
CONVERTER bits)
PORT
WDTO P90-P93 P50-P57 P70-P77 P80-P85 P40-P47 P20-P27 P30-P34 P00-P07 (REALTIME PORT)
Note
During PROM programming mode
µPD78P322
µPD78P322
CONTENTS
FUNCTIONS Normal Operating Mode PROM Programming Mode (RESET AVDD Input/Output Circuits Recommended Connection Unused Pins DIFFERENCES BETWEEN µPD78P322 µPD78322 PROM PROGRAMMING Operation Mode PROM Write Procedure PROM Read Procedure ERASURE CHARACTERISTICS (FOR µPD78P322K/KC/KD ONLY) OPAQUE FILM ERASURE WINDOW (FOR µPD78P322K/KC/KD ONLY) ONE-TIME PROM VERSION SCREENING ELECTRICAL SPECIFICATIONS PACKAGE DRAWINGS RECOMMENDED SOLDERING CONDITIONS DRAWINGS CONVERSION SOCKETS RECOMMENDED FOOTPRINTS
APPENDIX
APPENDIX TOOLS Development Tools Evaluation Tools Embedded Software
µPD78P322
FUNCTIONS
Normal Operating Mode Port Pins
Name Input/Output Function Alternate Function P00-P07 Input/Output (Output) PORT0 8-bit input/output port Input output mode specified bit-wise. port also operate real-time output port. P40-P47 Input/Output PORT 8-bit input/output port Input output mode specified 8-bit units. P50-P57 Input/Output PORT 8-bit input/output port Input output mode specified bit-wise. P70-P77 Input PORT 8-bit input-only port Input/Output PORT 4-bit input/output port Input output mode specified bit-wise. Input/Output PORT 6-bit input/output port Input output mode specified bit-wise. TO00 TO01 TO02 TO03 TO10 TO11 AN0-AN7 A8-A15 Input/Output PORT 5-bit input/output port Input output mode specified bit-wise. Input PORT 8-bit input-only port INTP0 INTP1 INTP2 INTP3 INTP4 INTP5 INTP6/TI SO/SB0 SI/SB1 AD0-AD7 RTP0-RTP7
µPD78P322
Non-Port Pins (1/2)
Name Input/Output Function Alternate Function
RTP0-RTP7 Output
Real-time output port which outputs pulse synchronization with trigger signal from P00-P07 real-time pulse unit (RPU).
INTP0 INTP1 INTP2 INTP3 INTP4 INTP5 INTP6
Input
Edge-detected external interrupt request input. valid edge specified mode register.
P27/TI
Input
Edge-detected nonmaskable interrupt request input. rising falling edge selected valid edge setting mode register.
AD0-AD7 A8-A15
Input Input Output Input Output Input/Output
External count clock input timer (TM1). Serial data input asynchronous serial interface (UART). Serial data output from asynchronous serial interface (UART). Serial data input clocked serial interface 3-wire mode. Serial data output from clocked serial interface 3-wire mode. Serial data input/output pins to/from clocked serial interface mode.
P27/INTP6 P33/SB1 P32/SB0 P32/SO P33/SI
Input/Output Input/Output Output Output
Serial clock input/output to/from clocked serial interface. Multiplexed address/data used when external memory added. Address used when external memory added. Strobe signal output external memory read operation. Strobe signal output external memory write operation. Control signal output pins access turbo access manager (µPD71P301). Note Pulse output from real-time pulse unit.
P40-P47 P50-P57
TO00 TO01 TO02 TO03 TO10 TO11 ASTB
Output
Output
Output
Timing signal output externally latch low-order address information output from AD0-AD7 external memory access.
WDTO
Output Input
Signal output which indicates that watchdog timer generated non-maskable interrupt. µPD78P322, normally connect VDD. When connected VSS, µPD78P322 enters ROMless mode external memory accessed. level cannot changed during operation.
Note Turbo access manager (µPD71P301) available maintenance purposes only.
µPD78P322
Non-Port Pins (2/2)
Name Input/Output Function Alternate Function AN0-AN7 AVREF AVDD AVSS RESET Input Input Input Input Analog input converter. converter reference voltage input. converter analog power supply. converter GND. System reset input. Crystal resonator connection system clock generation. supply external clock, input input inverted signal unconnected.) Positive power supply pin. pin. internal connection. Connect (can leave open). P70-P77
PROM Programming Mode (RESET AVDD
Name Input/Output AVDD RESET A0-A14 D0-D7 Input Input/Output Input Input Address bus. Data bus. PROM enable PROM. Read strobe PROM. Write power supply. Positive power supply. GND. internal connection. Connect (can leave open). Input Function PROM programming mode setting.
µPD78P322
Input/Output Circuits Recommended Connection Unused Pins Table Figure show input/output circuit schematically.
Table 1-1. Input/Output Circuits Recommended Connection Unused Pins
Input/Output circuit type P00/RTP0-P07/RTP7 Input state: Independently connect resistor. Output state: Leave Open. P20/NMI P21/INTP0-P26/INTP5 P27/INTP6/TI P30/TxD P31/RxD P32/SO/SB0 P33/SI/SB1 P34/SCK P40/AD0-P47/AD7 P50/A8-P57/A15 P70/AN0-P77/AN7 P80/TO00-P83/TO03 P84/TO10, P85/TO11 P90/RD P91/WR P92/TAS P93/TMD WDTO ASTB RESET AVDD AVREF AVSS Connect VDD. Connect (can leave open). Connect VDD. Connect VSS. Leave Open. Connect VSS. Input state: Independently connect resistor. Output state: Leave Open. Input state: Independently connect resistor. Output state: Leave Open. Connect VSS. Recommended connection unused pins
µPD78P322
Figure 1-1. Input/Output Circuits
TYPE P-ch TYPE data output disable P-ch N-ch IN/OUT
N-ch input disable
TYPE
TYPE data output disable P-ch N-ch IN/OUT
Schmitt-triggerred input with hysteresis characteristics
TYPE P-ch
TYPE Comparator VREF (Threshold voltage)
P-ch N-ch
N-ch
input enable
TYPE data P-ch
output disable
N-ch
Push-pull output that placed high impedance (both P-ch N-ch off).
µPD78P322
DIFFERENCES BETWEEN µPD78P322 µPD78322
µPD78P322 version provided replacing µPD78322's on-chip mask with one-time PROM EPROM. Thus, µPD78P322 µPD78322 same function except specifications such write verify. Table lists differences between these products. This Data Sheet describes PROM specification function. Refer µPD78322 documents details other functions.
Table 2-1. Differences between µPD78P322 µPD78322
Item Part Number µPD78P322 One-time PROM (programmable only once) Contained 68-pin plastic 74-pin plastic 80-pin plastic 68-pin ceramic WQFN 74-pin ceramic WQFN 80-pin ceramic WQFN EPROM (reprogrammable)
µPD78322
Mask (nonprogrammable) contained 68-pin plastic 74-pin plastic 80-pin plastic
Internal program memory (electrical program) PROM programming Package
Electrical specifications Others
Current dissipations different. Noise immunity noise radiation differ because circuit complexity mask layout different.
Caution noise immunity noise radiation differ between PROM mask versions. replace PROM version with mask version when shifting from experimental production mass production, evaluate your system using version (not version) mask version.
µPD78P322
PROM PROGRAMMING
PROM incorporated µPD78P322 16,384 8-bit electrically writable PROM. programming, PROM programming mode using RESET AVDD pins. programming characteristics compatible with µPD27C256A programming characteristics.
Table 3-1. Function Programming Mode
Function Address input Data input Chip enable/program pulse Output enable Program voltage Mode control Normal Operating Mode P00-P07, P80, P20, P81-P85 P40-P47 RESET, AVDD Programming Mode A0-A14 D0-D7
Operation Mode program write/verify mode, RESET AVDD mode, operation mode selected setting pins, listed Table 3-2. read PROM contents, read mode. Connect unused pins exactly indicated Configuration.
Table 3-2. PROM Programming Operation Mode
Mode Program write Program verify Program inhibit Read Output disable Standby RESET AVDD +12.5 D0-D7 Data input Data output High impedance Data output High impedance High impedance
Caution When +12.5 +6V, setting both prohibited.
µPD78P322
PROM Write Procedure write procedure into PROM follows: RESET AVDD Connect other unused pins exactly indicated section "Pin Configuration." Supply +12.5 pin. Supply initial address. Supply write data. Supply program pulse (active low) pin. Execute verify mode. Check whether write data written normally. When written normally: Proceed step (8). When written normally: Repeat steps (6). data written normally after repetitions steps, proceed step (7). Assume device defective. Stop write operation. Supply write data (number steps repetitions) program pulses (additional write). Increment address. (10) Repeat steps last address. Figure shows PROM Write/Verify Timing Steps above.
Figure 3-1. PROM Write/Verify Timing
X-time repetition Write Verify Additional data write
A0-A14
Address input
Hi-Z D0-D7 Data input
Hi-Z
Data output
Hi-Z Data input
Hi-Z
+12.5
(input)
(input)
µPD78P322
Figure 3-2. Write Procedure Flowchart
WRITE START
Supply power
Supply initial address
Supply write data
Write (after repetition less)
Supply program pulse
Verify mode Write
Write 25th repetition)
Make additional write pulses)
Number write repetitions
Increment address
(10) address address Defective device
address WRITE
µPD78P322
PROM Read Procedure read procedure PROM contents into external data (D0-D7) follows. RESET AVDD Connect other unused pins exactly indicated Configuration. Supply pins. Input address data read A0-A14 pins. Execute read mode. data output D0-D7 pins. Figure shows PROM read timing steps above.
Figure 3-3. PROM Read Timing
A0-A14
Address input
(input)
(input)
D0-D7
Hi-Z
Data output
Hi-Z
µPD78P322
ERASURE CHARACTERISTICS (FOR µPD78P322K/KC/KD ONLY)
data written into µPD78P322K/KC/KD program memory erased (FFH) data rewritten into memory. erase data, apply light with wavelength shorter than window. Normally, apply ultraviolet rays having 254-nm wavelength. radiation amount required completely erase data follows: Ultraviolet strength erasure time: more Erasure time: minutes when 12,000 µW/cm2 ultraviolet lamp used. However, time prolonged ultraviolet lamp performance deterioration, dirty window, etc. erasure, place ultraviolet lamp position within from window. filter attached ultraviolet lamp, remove filter before applying ultraviolet rays.
OPAQUE FILM ERASURE WINDOW (FOR µPD78P322K/KC/KD ONLY)
µPD78P322K/KC/KD window exposed sunlight fluorescent lamp light hours, EPROM data
erased internal circuit operate erroneously. prevent such accidents from occurring, protective seal window. protective seal whose quality guaranteed attached every EPROM version with window shipment.
ONE-TIME PROM VERSION SCREENING
one-time PROM versions (µPD78P322GF-3B9, 78P322GJ-5BJ, 78P322L) cannot completely tested
shipment because their structure. screening, recommended verify PROM after storing necessary data under following conditions:
Storage temperature 125°C
Storage time hours
provides chargeable services ranging from one-time PROM writing marking, screening verification QTOP microcontroller products. details, contact sales representative.
µPD78P322
ELECTRICAL SPECIFICATIONS
Absolute Maximum Ratings
Parameter Power supply voltage Symbol AVDD AVSS Input voltage Output voltage Output current, output pins Total pins Output current, high output pins Total pins Analog input voltage VIAN Note AVDD AVDD converter reference input voltage Operating ambient temperature Storage temperature Tstg AVREF AVDD AVDD Note P20/NIM (A9) Test Conditions Ratings -0.5 +7.0 -0.5 +0.5 -0.5 +13.5 -0.5 +0.5 -0.5 +0.5 -0.5 +13.5 -0.5 +0.5 -1.0 -0.5 +0.5 -0.5 AVDD +0.5 -0.5 +0.3 -0.5 AVDD +0.3 +150 Unit
Notes Pins except P20/NMI (A9), P70/AN0-P77/AN7 P70/AN0-P77/AN7
Caution Product quality suffer absolute maximum rating exceeded even single parameter, even momentarily. other words, absolute maximum ratings rated values which product verge suffering physical damage, therefore product must used under conditions which ensure that absolute maximum ratings exceeded.
Recommended Operating Conditions
Oscillation frequency +5.0
Capacitance
Parameter Input capacitance Output capacitance capacitance Symbol Test Conditions Unmeasured pins returned MIN. TYP. MAX. Unit
µPD78P322
Oscillator Characteristics V±5%,
Resonator Ceramic crystal resonator Recommended Circuit Parameter Oscillation frequency (fXX) MIN. MAX. Unit
External clock
input frequency (fX)
HCMOS Inverter Open HCMOS Inverter
input rise, fall time (fXR, tXF)
input high, level width (tWXH, tWXL)
Caution When using system clock oscillator, wire portion enclosed broken lines figure follows avoid adverse influences wiring capacitance: Keep wiring length short possible. cross wiring over other signal lines. route wiring vicinity lines through which high fluctuating current flows. Always keep ground point capacitor oscillator circuit same potential VSS. connect power source pattern through which high current flows. extract signals from oscillator.
µPD78P322
Recommended Oscillator Constants
Ceramic resonator
Manufacturer Name
Part Number
Frequency [MHz]
Recommended Constants [pF] [pF]
MURATA
CSA8.00MT CSA12.0MT CSA14.74MXZ040 CSA16.00MX040 CST8.00MTW CST12.0MTW CST14.74MXW0C3 CST16.00MXW0C3
12.0 14.74 16.0 12.0 14.74 16.0
Internal
Internal
Crystal resonator
Manufacturer Name
Part Number
Frequency [MHz]
Recommended Constants [pF] [pF]
KINSEKI
HC49/U-S HC49/U
µPD78P322
Characteristics ±5%,
Parameter Input voltage, Input voltage, high Symbol VIH1 VIH2 Output voltage, Output voltage, high Input leakage current Output leakage current power supply current IDD1 IDD2 Data retention voltage Data retention current VDDDR IDDDR Note Note -400 Operation mode HALT mode STOP mode STOP mode VDDDR VDDDR VDD-1.0 Test Conditions MIN. 0.8VDD 0.45 TYP. MAX. Unit
Notes Pins other than mentioned Note RESET, P20/NMI, P21/INTP0, P22/INTP1, P23/INTP2, P24/INTP3, P25/INTP4, P26/INTP5, P27/ INTP6/TI, P32/SO/SB0, P33/SI/SB1, P34/SCK pins.
µPD78P322
Characteristics ±5%,
Discontinuous read/write operation (when general-purpose memory connected)
Parameter System clock cycle time Address setup time ASTB Address hold time (from ASTB Address delay time address float time Address data input time data input time ASTB delay time Data hold time (from address active time level width ASTB high level width Address delay time ASTB data output time data output time ASTB delay time Data setup time Data hold time (from ASTB delay time level width Symbol tCYK tSAST tHSTA tDAR tFRA tDAID tDRID tDSTR tHRID tDRA tWRL tWSTH tDAW tDSTOD tDWOD tDSTW tSODW tHWOD tDWST tWWL Test Conditions MIN. MAX. Unit
µPD78P322
tCYK-Dependent Timing Definition
Parameter tSAST tHSTA tDAR tDAID tDRID tDSTR tDRA tWRL tWSTH tDAW tDSTOD tDSTW tSODW tHWOD tDWST tWWL Calculation expression 0.5T 0.5T (2.5 (1.5 0.5T 0.5T (1.5 0.5T 0.5T 0.5T 1.5T 0.5T 0.5T (1.5 MIN./MAX. MIN. MIN. MIN. MAX. MAX. MIN. MIN. MIN. MIN. MIN. MAX. MIN. MIN. MIN. MIN. MIN. Unit
Remarks tCYK 1/fCLK (fCLK internal system clock frequency). number wait cycles defined user software. Only parameters listed table dependent tCYK.
µPD78P322
Serial Operation ±5%,
Parameter Serial clock cycle time Symbol tCYSK Test Conditions Output Input Serial clock high-level width tWSKL Output Input Serial clock high-level width tWSKH Output Input setup time hold time (from delay time tSRXSK tHSKRX tDSKTX Internal divide External clock Internal divide External clock Internal divide External clock MIN. MAX. Unit
Other operations +70°C, V±5%,
Parameter high, low-level width Symbol tWNIH, tWNIL INTP0 high, low-level width tWI0H, tWI0L INTP1 high, low-level width tWI1H, tWI1L INTP2 high, low-level width tWI2H, tWI2L INTP3 high, low-level width tWI3H, tWI3L INTP4 high, low-level width tWI4H, tWI4L INTP5 high, low-level width tWI5H, tWI5L INTP6 high, low-level width tWI6H, tWI6L RESET high, low-level width tWRSH, tWRSL high, low-level width tWTIH, tWTIL event counter mode tCYK tCYK tCYK tCYK tCYK tCYK tCYK tCYK Test Conditions MIN. MAX. Unit
µPD78P322
Converter +70°C, V±5%, AVSS -0.5 AVDD VDD)
Parameter Resolution Total error
Note1
Symbol
Test Conditions
MIN.
TYP.
MAX.
Unit
AVREF AVDD AVREF AVDD
±0.4 ±0.7 ±1/2
%FSR %FSR tCYK tCYK
Quantization error Conversion time Sampling time Zero scale error
Note1
tCONV tSAMP AVREF AVDD AVREF AVDD
+1.5 +1.5 +1.5 +1.5 +1.5 +1.5 -0.3 STOP mode AVDDDR AVDDDR V±5% ±2.5 ±4.5 ±2.5 ±4.5 ±2.5 ±4.5 AVDD AVDD
Fullscale error
Note1
AVREF AVDD AVREF AVDD
Nonlinear error
Note1
AVREF AVDD AVREF AVDD
Analog input voltage Basic voltage AVREF current AVDD supply current converter data retention current
Note2
AVREF AIDD DDDR
Notes Quantization error excluded. When -0.3 VIAN conversion result 000H. When VIAN AVREF, conversion executed with 10-bit resolution. When AVREF AVDD, conversion result 3FFH.
µPD78P322
Discontinuous Read Operation
tCYK (CLK)
P50-P57 (output) tSAST P40-P47 (input/output)
Hi-Z
High-order address tDAID
Hi-Z
High-order address
Low-order address (output)
Data (input) tHRID
Hi-Z
Low-order address (output)
Hi-Z
tWSTH ASTB (output) tHSTA tFRA (output) tDSTR tDAR tDRID tWRL
tDRA
Discontinuous Write Operation
(CLK)
P50-P57 (output) tSAST P40-P47 (input/output)
Low-order address (output)
High-order address
High-order address
Undefined
Data (output)
Low-order address (output)
tWSTH ASTB (output)
tHWOD
tHSTA tDSTOD
tDWST
(output) tDSTW tDWOD tDAW tWWL tSODW
µPD78P322
Serial Operation
tCYSK tWSKL tDSKTX tWSKH
tSRXSK tHSKRX
Interrupt Input Timing
tWNIH 0.8VDD
tWNIL
tWInH
tWInL
INTPn
Remark
µPD78P322
Reset Input Timing
tWRSH 0.8VDD tWRSL
RESET
Input Timing
tWTIH
tWTIL
µPD78P322
Programming Characteristics
Parameter Symbol Symbol Test conditions
Note1
MIN.
TYP.
MAX.
Unit
Input voltage, high
VDDP +0.3
Input voltage, Input leakage current Output voltage, high Output voltage, Input current Output leakage current PROG high voltage input current power supply voltage
ILIP
VDDP (P20/NMI) VDDP,
Note
-0.3 -400
0.45
VDDP
Program memory write mode Program memory read mode
5.75 12.2
12.5
6.25 12.8
power supply voltage
Program memory write mode Program memory read mode
VDDP
power supply current
Program memory write mode Program memory read mode VIL,
power supply current
Program memory write mode VIL, Program memory read mode
Notes Corresponding µPD27C256A symbols. VDDP during programming mode.
µPD78P322
Programming Characteristics
Parameter Address setup time Data delay time Input data setup time Address hold time (from Input data hold time (from Output data hold time (from setup time VDDP setup time Initial program pulse width Additional program pulse width Address data output time data output time Data hold time (from Data hold time (from address) Symbol Symbol Test conditions
Note
MIN.
TYP.
MAX.
Unit
tSAC tDDOO tSIDC tHCA tHCID tHOOD tSVPC tSVDC tWL1 tWL2 tDAOD tDOOD tHCOD tHAOD
tOES tVPS tVDS tOPW tACC
0.95 2.85 1.05 78.75
Note
Corresponding µPD27C256A symbols.
µPD78P322
PROM Write Mode Timing
A12-A0 tSAC D7-D0
Hi-Z
Effective address tHOOD
Hi-Z
tHCA Data input tSIDC
Hi-Z
Data input tSIDC
Data output
Hi-Z
tHCID
tHCID
VDDP VDDP VDDP tSVDC tWL1
tDDOO
tSVPC
VDDP
tDOOD
tWL2
Cautions Apply VDDP before remove after VPP. must exceed including overshoot.
PROM Read Mode Timing
A12-A0
Effective address
tDAOD D7-D0 Hi-Z tDOOD
tHCOD
tHAOD Data output Hi-Z
µPD78P322
PACKAGE DRAWINGS
PLASTIC
detail lead
NOTE Each lead centerline located within 0.15 (0.006 inch) true position (T.P.) maximum material condition.
P80GF-80-3B9-2 ITEM MILLIMETERS 23.6 20.0 14.0 17.6 0.35 0.10 0.15 (T.P.) 0.15+0.10 -0.05 0.15 MAX. INCHES 0.929 0.016 0.795 +0.009 -0.008 0.551+0.009 -0.008 0.693 0.016 0.039 0.031 0.014 +0.004 -0.005 0.006 0.031 (T.P.) 0.071 -0.009
+0.008
0.031+0.009 -0.008 0.006+0.004 -0.003 0.006 0.106 0.004 0.004 0.119 MAX.
5°±5°
µPD78P322
PLASTIC
detail lead
NOTE
ITEM MILLIMETERS 23.2±0.4 20.0±0.2 20.0±0.2 23.2±0.4 0.40±0.10 0.20 (T.P.) 1.6±0.2 0.8±0.2 0.15 +0.10 -0.05 0.10 0.1±0.1 5°±5° MAX. INCHES 0.913 +0.017 -0.016 0.787 +0.009 -0.008 0.787 +0.009 -0.008 0.913 +0.017 -0.016 0.079 0.039 0.079 0.039 0.016 +0.004 -0.005 0.008 0.039 (T.P.) 0.063±0.008 0.031 +0.009 -0.008 0.006 +0.004 -0.003 0.004 0.146 0.004±0.004 5°±5° 0.158 MAX. S74GJ-100-5BJ-3
Each lead centerline located within 0.20 (0.008 inch) true position (T.P.) maximum material condition.
µPD78P322
PLASTIC
mil)
P68L-50A1-2 NOTE Each lead centerline located within 0.12 (0.005 inch) true position (T.P.) maximum material condition. ITEM MILLIMETERS 25.2 24.20 24.20 25.2 1.94 0.15 MIN. 1.27 (T.P.) 0.40 0.12 23.12 0.20 0.15 0.20 +0.10 -0.05 INCHES 0.992 0.008 0.953 0.953 0.992 0.008 0.076+0.007 -0.006 0.024 0.173+0.009 -0.008 0.110+0.009 -0.008 0.035 MIN. 0.134 0.050 (T.P.) 0.016+0.004 -0.005 0.005 0.910+0.009 -0.008 0.006 0.031 0.008+0.004 -0.002
µPD78P322
CERAMIC WQFN
X80KW-80A-1 NOTE Each lead centerline located within 0.08 (0.003 inch) true position (T.P.) maximum material condition. ITEM MILLIMETERS 20.0 19.0 13.2 14.2 1.64 2.14 4.064 MAX. 0.51 0.10 0.08 (T.P.) 12.0 0.75 INCHES 0.787+0.017 -0.016 0.748 0.520 0.559 0.016 0.065 0.084 0.160 MAX. 0.020 0.004 0.003 0.031 (T.P.) 0.039 -0.008 0.020 0.031 0.043 0.118 0.472 0.030 -0.009
+0.008 +0.009
µPD78P322
CERAMIC WQFN
X74KW-100A-1 NOTE Each lead centerline located within 0.10 (0.004 inch) true position (T.P.) maximum material condition. ITEM MILLIMETERS 20.0 18.0 18.0 20.0 1.94 2.14 MAX. 0.51 0.10 0.10 (T.P.) 10.0 INCHES 0.787+0.017 -0.016 0.709 0.709 0.787+0.017 -0.016 0.076 0.084 0.158 MAX. 0.020 0.004 0.004 0.039 (T.P.) 0.039 -0.008 0.012 0.079 0.079 0.079 0.394 0.028 -0.009 0.059
+0.008 +0.009
µPD78P322
CERAMIC WQFN
X68KW-50A-1 NOTE Each lead centerline located within 0.12 (0.005 inch) true position (T.P.) maximum material condition. ITEM MILLIMETERS 24.13 21.5 21.5 24.13 1.65 2.03 3.50 MAX. 0.64 0.10 0.12 1.27 (T.P.) 1.27 2.16 1.02 1.905 1.905 12.0 INCHES 0.950 0.016 0.846 0.846 0.950 0.016 0.065 0.080 0.138 MAX. 0.025+0.005 -0.004 0.005 0.05 (T.P.) 0.05 0.008 0.085 0.008 0.008 0.04 0.075 0.075 0.118 0.472 0.020
µPD78P322
RECOMMENDED SOLDERING CONDITIONS
recommended that this device soldered under following conditions. details recommended soldering conditions, refer information document "Semiconductor Devices Mounting Technology Manual" (IEI-1207). soldering methods conditions other than those recommended, please contact your sales representative.
Table 9-1. Soldering Conditions Surface Mount Devices (1/2)
µPD78P322GF-3B9: 80-pin plastic
Soldering Method Infrared reflow Soldering Conditions Package peak temperature: 235°C, Time: seconds max. (210°C min.), Number times: max., Maximum number days: daysNote (thereafter, hours prebaking required 125°C) Cautions Wait device temperature return normal after first reflow before starting second reflow. perform flux cleaning with water after first reflow. Package peak temperature: 215°C, Time: seconds max. (200°C min.), Number times: max., Maximum number days: daysNote (thereafter, hours prebaking required 125°C) Cautions Wait device temperature return normal after first reflow before starting second reflow. perform flux cleaning with water after first reflow. Soldering bath temperature: 260°C max., Time: seconds max., Number times: Preheating temperature: 120°C max. (package surface temperature), Maximum number days: daysNote (thereafter, hours prebaking required 125°C). temperature: 300°C max., Time: seconds max. (per pin) VP15-207-2 Recommended Soldering Code IR35-207-2
Wave soldering
WS60-207-1
Partial heating
µPD78P322GJ-5BJ: 74-pin plastic
Soldering Method Infrared reflow Soldering Conditions Package peak temperature: 230°C, Time: seconds max. (210°C min.), Number times: Maximum number days: daysNote (thereafter, hours prebaking required 125°C) Package peak temperature: 215°C, Time: seconds max. (200°C min.), Number times: Maximum number days: daysNote (thereafter, hours prebaking required 125°C) temperature: 300°C max., Time: seconds max. (per pin) Recommended Soldering Code IR30-107-1
VP15-107-1
Partial heating
Note Number days after unpacking pack. Storage conditions 25°C max. Caution different soldering methods together (except partial heating method).
µPD78P322
Table 9-1. Soldering Conditions Surface Mount Devices (2/2)
µPD78P322L: 68-pin plastic (950 mils)
Soldering Method Infrared reflow Soldering Conditions Package peak temperature: 235°C, Time: seconds max. (210°C min.), Number times: max., Maximum number days: daysNote (thereafter, hours prebaking required 125°C) Cautions Wait device temperature return normal after first reflow before starting second reflow. perform flux cleaning with water after first reflow. Package peak temperature: 215°C, Time: seconds max. (200°C min.), Number times: max., Maximum number days: daysNote (thereafter, hours prebaking required 125°C) Cautions Wait device temperature return normal after first reflow before starting second reflow. perform flux cleaning with water after first reflow. Partial heating temperature: 300°C max., Time: seconds max. (per pin) Recommended Soldering Code IR35-367-2
VP15-367-2
Note Number days after unpacking pack. Storage conditions 25°C max. Caution different soldering methods together (except partial heating method).
µPD78P322
APPENDIX DRAWINGS CONVERSION SOCKETS RECOMMENDED FOOTPRINTS
EV-9200G-74
Figure A-1. Drawing Conversion Socket (EV-9200G-74) (For reference only)
INCHES 0.984 0.801 0.801 0.984 0.11 0.039 0.433 0.866 0.972 0.197 0.866 0.972 0.315 0.307 0.098 0.079 0.053 0.014+0.004 -0.005
EV-9200G-74
No.1 index
EV-9200G-74-G0 ITEM MILLIMETERS 25.0 20.35 20.35 25.0 11.0 22.0 24.7 22.0 24.7 1.35 0.35
0.091 0.059
µPD78P322
Figure A-2. Recommended Footprint Conversion Socket (EV-9200G-74) (For reference only)
EV-9200G-74-P0 ITEM Caution MILLIMETERS 25.7 21.0 1.0±0.02 18=18.0±0.05 INCHES 1.012 0.827 0.039+0.002 -0.001 0.709=0.709 +0.002 -0.003
1.0±0.02 18=18.0±0.05 0.039+0.002 0.709=0.709 +0.002 -0.001 -0.003 21.0 25.7 11.00 0.08 5.00 0.08 0.02 0.827 1.012 0.433+0.004 -0.003 0.197+0.003 -0.004 0.024+0.001 -0.002
2.36 0.03 1.57 0.03
0.093+0.001 -0.002 0.062+0.001 -0.002
Dimensions mount EV-9200 that target device (QFP) different some parts. recommended mount dimensions QFP, refer "SEMICONDUCTOR DEVICE MOUNTING TECHNOLOGY MANUAL" (IEI-1207).
µPD78P322
EV-9200G-80
Figure A-3. Drawing Conversion Socket (EV-9200G-80) (For reference only)
EV-9200G-80-G0 INCHES 0.984 0.799 0.157 0.569 0.748 0.11 0.031 0.433 0.866 0.972 0.197 0.638 0.744 0.315 0.307 0.098 0.079 0.053 0.014+0.004 -0.005
0.091 0.059
EV-9200G-80
No.1 index
ITEM MILLIMETERS 25.0 20.30 14.45 19.0 11.0 22.0 24.7 16.2 18.9 1.35 0.35
µPD78P322
Figure A-4. Recommended Footprint Conversion Socket (EV-9200G-80) (For reference only)
EV-9200G-80-P0 INCHES 1.012 0.827 0.031+0.002 -0.001 0.906=0.724 +0.003 -0.002 0.598 0.783 0.433+0.004 -0.003 0.217+0.001 -0.002 0.197+0.003 -0.004 0.098+0.002 -0.001 0.02+0.001 -0.002
ITEM Caution
MILLIMETERS 25.7 21.0 0.8±0.02 23=18.4±0.05
0.8±0.02 15=12.0±0.05 0.031+0.002 0.591=0.472 +0.003 -0.001 -0.002 15.2 19.9 11.00 0.08 5.50 0.03 5.00 0.08 2.50 0.03 0.02
2.36 0.03 1.57 0.03
0.093+0.001 -0.002 0.062+0.001 -0.002
Dimensions mount EV-9200 that target device (QFP) different some parts. recommended mount dimensions QFP, refer "SEMICONDUCTOR DEVICE MOUNTING TECHNOLOGY MANUAL" (IEI-1207).
µPD78P322
APPENDIX TOOLS
Development Tools following development tools readily available support development systems using µPD78P322: Language Processor
78K/III Series relocatable assembler (RA78K/III) Relocatable assembler common 78K/III series. Since contains macro function, development efficiency improved. structured assembler which enables explicity describe program control structure also attached program productivity maintenance improved. Host machine PC-9800 series MS-DOS
Ordering code Supply medium 3.5-inch 5-inch (product name)
µS5A13RA78K3 µS5A10RA78K3 µS7B13RA78K3 µS7B10RA78K3 µS3P16RA78K3 µS3K15RA78K3 µS3R15RA78K3
PC/AT
3.5-inch 5-inch
compatible machine HP9000 series 700SPARCstationNEWS 78K/III Series compiler (CC78K/III)
HP-UXSunOSNEWS-OS
Cartridge tape (QIC-24)
compiler common 78K/III series. This program convert program written language into object code executable with microcontroller. When using compiler, 78K/III series relocatable assembler (RA78K/III) necessary. Host machine PC-9800 series MS-DOS Supply medium 3.5-inch 5-inch PC/AT
Ordering code (product name)
µS5A13CC78K3 µS5A10CC78K3 µS7B13CC78K3 µS7B10CC78K3 µS3P16CC78K3 µS3K15CC78K3 µS3R15CC78K3
3.5-inch 5-inch
compatible machine HP9000 series SPARCstation NEWS HP-UX SunOS NEWS-OS
Cartridge tape (QIC-24)
Remark operation relocatable assembler compiler guaranteed only host machine under operating systems listed above.
µPD78P322
PROM Write Tools
Hardware PG-1500 PG-1500 PROM programmer which enables program single chip microcontrollers containing PROM stand-alone host machine operation connecting attached board optional programmer adapter PG-1500. also enables program typical PROM devices 256K bits bits. UNISITE 2900 PA-78P322GF PA-78P322GJ PA-78P322K PA-78P322KC PA-78P322KD PA-78P322L PROM programmer adapters write programs onto µPD78P322 general purpose PROM programmer such PG-1500. PA-78P322GF µPD78P322GF PA-78P322GJ µPD78P322GJ PA-78P322K µPD78P322K PA-78P322KC µPD78P322KC PA-78P322KD µPD78P322KD PA-78P322L µPD78P322L Software PG-1500 controller Connects PG-1500 host machine serial parallel interface controlls PG-1500 host machine. Host machine PC-9800 series MS-DOS Supply medium 3.5-inch 5-inch PC/AT compatible machine 3.5-inch 5-inch Ordering code (product name) PROM programmer manufactured Data Japan.
µS5A13PG1500 µS5A10PG1500 µS7B13PG1500 µS7B10PG1500
Remark operation PG-1500 controller guaranteed only host machine under operating systems listed above.
µPD78P322
Debugging Tools
Hardware IE-78327-R IE-78320-R
Note
IE-78327-R IE-78320-R in-circuit emulators that used application system development debugging. Connect host machine debugging. IE-78327-R used common µPD78322 subseries µPD78328 subseries. IE-78320-R used µPD78322 subseries.
EP-78320GF-R EP-78320GJ-R EP-78320L-R
Emulation probe connect IE-78327-R IE-78320-R target system. EP-78320GF-R 80-pin plastic EP-78320GJ-R 74-pin plastic EP-78320L-R 68-pin plastic
Software
IE-78327-R control program controller)
Program control IE-78327-R host machine. Automatic execution commands, etc., enabled more efficient debugging. Host machine PC-9800 series MS-DOS Supply medium 3.5-inch 5-inch PC/AT compatible machine 3.5-inch 5-inch Ordering code (product name)
µS5A13IE78327 µS5A10IE78327 µS7B13IE78327 µS7B10IE78327
IE-78320-R control program Note controller)
Program control IE-78320-R host machine. Automatic execution commands, etc., enabled more efficient debugging. Host machine PC-9800 series MS-DOS Supply medium 3.5-inch 5-inch PC/AT compatible machine 5-inch Ordering code (product name)
µS5A13IE78320 µS5A10IE78320 µS7B10IE78320
Remarks
operation controller guaranteed only host machine under operating systems listed above.
µPD78322 subseries:
µPD78320, 78322, 78P322, 78323, 78324, 78P324, 78320(A), 78320(A1),
78320(A2), 78322(A), 78322(A1), 78322(A2), 78323(A), 78323(A1), 78323(A2), 78324(A), 78324(A1), 78324(A2), 78P324(A), 78P324(A1), 78P324(A2)
µPD78328 subseries:
µPD78327, 78328, 78P328, 78327(A), 78328(A)
Note Conventional IE-78320-R maintenance product. When purchasing incircuit emulator, alternative product IE-78327-R.
Development Tool Configuration
Host machine PC-9800 series PC/AT
RS-232-C
Emulation probe
Software
IE-78327-R In-circuit emulator
RS-232C PROM programmer EP-78320GF-R EP-78320L-R EP-78320GJ-R Socket connect emulation probe target systemNote EV-9200G-80 EV-9200G-74
Relocatable assembler PG-1500 controller controller (with structured assembler)
On-chip PROM version
PG-1500
Socket plastic
µPD78P322GF µPD78P322GJ µPD78P322L
µPD78P322K µPD78P322KC µPD78P322KD
Programmer adapter
Target system
PA-78P322GF PA-78P322GJ
PA-78P322L
µPD78P322K µPD78P322KC µPD78P322KD
µPD78P322
Note
socket attached emulation probe.
Remarks host machine PG-1500 connected directly RS-232-C.
µPD78P322
Evaluation Tools following evaluation tools provided evaluate µPD78P322 function:
Ordering Code (product name) EB-78320-98 PC-9800 series µPD78P322 function easily evaluated connecting evaluation tool host machine. EB-78320-98/PC command system basically compliant with EB-78320-PC PC/AT compatible machine IE-78327-R IE-78320-R command system. Thus, easy transition application system development process IE-78327-R IE-78320-R made. evaluation tools enable turbo access manager (µPD71P301)Note mounted printed circuit board. Host Machine Function
Note Turbo access manager (µPD71P301) available maintenance purpose only. Cautions EB-78320-98/PC µPD78P322 application system development tool. EB-78320-98/PC does contain emulation function internal PROM execution
µPD78P322.
Embedded Software following embedded software products readily available support more efficient program development maintenance: Real-time
Real-time (RX78K/III) purpose RX78K/III realize multi-task environment control area which requires real-time processing. RX78K/III allocates idle times other processing improve overall performance system. RX78K/III provides system call based µITRON specification. RX78K/III assembler package provides RX78K/III nucleus tool (configurator) prepare multiple information tables. Host machine PC-9800 series MS-DOS Supply medium 3.5-inch 5-inch PC/AT compatible machine 3.5-inch 5-inch Ordering code (product name)
µS5A13RX78320 µS5A10RX78320 µS7B13RX78320 µS7B10RX78320
Caution When purchasing RX78K/III, fill purchase application form advance, sign User's Agreement. Remark When using RX78K/III Real-time RA78K/III assembler package (option) necessary.
µPD78P322
Fuzzy Inference Development Support System
Fuzzy Knowledge Data Preparation Tool (FE9000, FE9200) Program supporting input fuzzy knowledge data (fuzzy rule membership function), input/editing (edit), evaluation (simulation). Host machine PC-9800 series MS-DOS Supply medium 3.5-inch 5-inch PC/AT compatible machine Translator (FT78K3)
Note
Ordering code (product name)
µS5A13FE9000 µS5A10FE9000 µS7B13FE9200 µS7B10FE9200
Windows3.5-inch 5-inch
Program converting fuzzy knowledge data obtained using fuzzy knowledge data preparation tool assembler source program RA78K/III. Host machine PC-9800 series MS-DOS Supply medium 3.5-inch 5-inch PC/AT compatible machine 3.5-inch 5-inch Ordering code (product name)
µS5A13FT78K3 µS5A10FT78K3 µS7B13FT78K3 µS7B10FT78K3
Fuzzy Inference Module (FI78K/III)Note
Program executing fuzzy inference. Fuzzy inference executed linking fuzzy knowledge data converted translator. Host machine PC-9800 series MS-DOS Supply medium 3.5-inch 5-inch PC/AT compatible machine 3.5-inch 5-inch Ordering code (product name)
µS5A13FI78K3 µS5A10FI78K3 µS7B13FI78K3 µS7B10FI78K3
Fuzzy Inference Debugger (FD78K/III)
Support software evaluating adjusting fuzzy knowledge data hardware level using in-circuit emulator. Host machine PC-9800 series MS-DOS Supply medium 3.5-inch 5-inch PC/AT compatible machine 3.5-inch 5-inch Ordering code (product name)
µS5A13FD78K3 µS5A10FD78K3 µS7B13FD78K3 µS7B10FD78K3
Note Under development
µPD78P322
[MEMO]
µPD78P322
NOTES CMOS DEVICES PRECAUTION AGAINST SEMICONDUCTORS
Note: Strong electric field, when exposed device, cause destruction gate oxide ultimately degrade device operation. Steps must taken stop generation static electricity much possible, quickly dissipate once, when occurred. Environmental control must adequate. When dry, humidifier should used. recommended avoid using insulators that easily build static electricity. Semiconductor devices must stored transported anti-static container, static shielding conductive material. test measurement tools including work bench floor should grounded. operator should grounded using wrist strap. Semiconductor devices must touched with bare hands. Similar precautions need taken boards with semiconductor devices
HANDLING UNUSED INPUT PINS CMOS
Note: connection CMOS device inputs cause malfunction. connection provided input pins, possible that internal input level generated noise, etc., hence causing malfunction. CMOS devices behave differently than Bipolar NMOS devices. Input levels CMOS devices must fixed high using pull-up pull-down circuitry. Each unused should connected with resistor, considered have possibility being output pin. handling related unused pins must judged device device related specifications governing devices.
STATUS BEFORE INITIALIZATION DEVICES
Note: Power-on does necessarily define initial status device. Production
process does define initial operation status device. Immediately after power source turned devices with reset function have been initialized. Hence, power-on does guarantee out-pin levels, settings contents registers. Device initialized until reset signal received. Reset operation must executed immediately after power-on devices having reset function.
QTOP trademark Corporation. MS-DOS Windows trademarks Microsoft Corporation. PC/AT trademarks Corporation. HP9000 series HP-UX trademarks Hewlett-Packard Company. SPARCstation trademark SPARC International, Inc. SunOS trademark Microsystems, Inc. NEWS NEWS-OS trademarks Sony Corporation. TRON abbreviation Realtime Operating system Nucleus. ITRON abbreviation Industrial TRON.
µPD78P322
export these products from Japan regulated Japanese government. export some these products prohibited without governmental license. export re-export some these products from country other than Japan also prohibited without license from that country. Please call sales representative. License needed: µPD78P322K, 78P322KC, 78P322KD customer must judge need license: µPD78P322GF-3B9, 78P322GJ-5BJ, 78P322L
part this document copied reproduced form means without prior written consent Corporation. Corporation assumes responsibility errors which appear this document. Corporation does assume liability infringement patents, copyrights other intellectual property rights third parties arising from device described herein other liability arising from such device. license, either express, implied otherwise, granted under patents, copyrights other intellectual property rights Corporation others. While Corporation been making continuous effort enhance reliability semiconductor devices, possibility defects cannot eliminated entirely. minimize risks damage injury persons property arising from defect semiconductor device, customer must incorporate sufficient safety measures design, such redundancy, fire-containment, anti-failure features. devices classified into following three quality grades: "Standard", "Special", "Specific". Specific quality grade applies only devices developed based customer designated "quality assurance program" specific application. recommended applications device depend quality grade, indicated below. Customers must check quality grade each device before using particular application. Standard: Computers, office equipment, communications equipment, test measurement equipment, audio visual equipment, home electronic appliances, machine tools, personal electronic equipment industrial robots Special: Transportation equipment (automobiles, trains, ships, etc.), traffic control systems, anti-disaster systems, anti-crime systems, safety equipment medical equipment (not specifically designed life support) Specific: Aircrafts, aerospace equipment, submersible repeaters, nuclear reactor control systems, life support systems medical equipment life support, etc. quality grade devices "Standard" unless otherwise specified NEC's Data Sheets Data Books. customers intend devices applications other than those specified Standard quality grade, they should contact Sales Representative advance. Anti-radioactive design implemented this product.
94.11

µPD78P322 16/8-BIT SINGLE-CHIP MICROCONTROLLER µPD78P322 ver

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