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Features on-resistance High speed switching drive current seconda
Top Searches for this datasheet2SK1404 Features on-resistance High speed switching drive current secondary breakdown Suitable switching regulator DC-DC converter Outline TO-220FM Gate Drain Source 2SK1404 Absolute Maximum Ratings 25°C) Item Drain source voltage Gate source voltage Drain current Drain peak current Body drain diode reverse drain current Channel dissipation Channel temperature Storage temperature Notes: duty cycle Value 25°C Symbol VDSS VGSS D(pulse)* Pch* Tstg Ratings +150 Unit 2SK1404 Electrical Characteristics 25°C) Item Drain source breakdown voltage Gate source breakdown voltage Gate source leak current Symbol V(BR)DSS V(BR)GSS 1000 Unit diF/dt A/µs Test conditions ±100 Zero gate voltage drain current Gate source cutoff voltage Static drain source state resistance Forward transfer admittance Input capacitance Output capacitance Reverse transfer capacitance Turn-on delay time Rise time Turn-off delay time Fall time Body drain diode forward voltage Body drain diode reverse recovery time Note: Pulse test VGS(off) RDS(on) |yfs| Ciss Coss Crss d(on) d(off) 2SK1404 Power Temperature Derating Channel Dissipation Maximum Safe Operation Area Drain Current 25°C 0.05 Case Temperature (°C) 1,000 Drain Source Voltage Typical Output Characteristics Drain Current Drain Current Pulse Test Typical Transfer Characteristics Pulse Test 75°C 25°C -25°C Drain Source Voltage Gate Source Voltage 2SK1404 Drain Source Saturation Voltage (on) Drain Source Saturation Voltage Gate Source Voltage Pulse Test Static Drain Source State Resistance Drain Current Static Drain Source State Resistance (on) Pulse Test Drain Current Gate Source Voltage Static Drain Source State Resistance Temperature Static Drain Source State Resistance (on) Forward Transfer Admittance Pulse Test Forward Transfer Admittance Drain Current Pulse Test 0.05 75°C -25°C 25°C Case Temperature (°C) Drain Current 2SK1404 Body Drain Diode Reverse Recovery Time 1,000 Reverse Recovery Time (ns) Capacitance (pF) 1,000 10,000 Ciss Typical Capacitance Drain Source Voltage 0.05 di/dt A/µs, 25°C Pulse Test Reverse Drain Current Coss Crss Drain Source Voltage Dynamic Input Characteristics 1,000 Drain Source Voltage Gate Source Voltage Switching Characteristics duty 0.1% (off) (on) Switching Time (ns) Gate Charge (nc) Drain Current 2SK1404 Reverse Drain Current Source Drain Voltage Reverse Drain Current Pulse Test Source Drain Voltage Normalized Transient Thermal Impedance Normalized Transient Thermal Impedance Pulse Width 25°C 0.05 ch-c ch-c ch-c 3.57°C/W, 25°C 0.03 0.02 0.01 ulse Pulse Width 0.01 Switching Time Test Circuit Monitor Waveforms Vout Monitor D.U.T. Vout (on) (off) 10.0 Unit: 12.0 4.45 14.0 Hitachi Code JEDEC EIAJ Weight (reference value) TO-220FM Conforms 2.54 2.54 17.0 Cautions Hitachi neither warrants grants licenses rights Hitachi's third party's patent, copyright, trademark, other intellectual property rights information contained this document. Hitachi bears responsibility problems that arise with third party's rights, including intellectual property rights, connection with information contained this document. Products product specifications subject change without notice. Confirm that have received latest product standards specifications before final design, purchase use. Hitachi makes every attempt ensure that products high quality reliability. However, contact Hitachi's sales office before using product application that demands especially high quality reliability where failure malfunction directly threaten human life cause risk bodily injury, such aerospace, aeronautics, nuclear power, combustion control, transportation, traffic, safety equipment medical equipment life support. Design your application that product used within ranges guaranteed Hitachi particularly maximum rating, operating supply voltage range, heat radiation characteristics, installation conditions other characteristics. Hitachi bears responsibility failure damage when used beyond guaranteed ranges. Even within guaranteed ranges, consider normally foreseeable failure rates failure modes semiconductor devices employ systemic measures such failsafes, that equipment incorporating Hitachi product does cause bodily injury, fire other consequential damage operation Hitachi product. This product designed radiation resistant. permitted reproduce duplicate, form, whole part this document without written approval from Hitachi. Contact Hitachi's sales office questions regarding this document Hitachi semiconductor products. Hitachi, Ltd. Semiconductor Integrated Circuits. Nippon Bldg., 2-6-2, Ohte-machi, Chiyoda-ku, Tokyo 100-0004, Japan Tel: Tokyo (03) 3270-2111 Fax: (03) 3270-5109 NorthAmerica http:semiconductor.hitachi.com/ Europe Asia (Singapore) Asia (Taiwan) Asia (HongKong) Japan further information write Hitachi Semiconductor (America) Inc. East Tasman Drive, Jose,CA 95134 Tel: (408) 433-1990 Fax: <1>(408) 433-0223 Hitachi Europe GmbH Electronic components Group Dornacher D-85622 Feldkirchen, Munich Germany Tel: <49> (89) 9180-0 Fax: <49> (89) Hitachi Europe Ltd. Electronic Components Group. Whitebrook Park Lower Cookham Road Maidenhead Berkshire 8YA, United Kingdom Tel: <44> (1628) 585000 Fax: <44> (1628) 778322 Hitachi Asia Pte. Ltd. Collyer Quay #20-00 Hitachi Tower Singapore 049318 Tel: 535-2100 Fax: 535-1533 Hitachi Asia Ltd. Taipei Branch Office Hung Building. No.167, Tun-Hwa North Road, Taipei (105) Tel: <886> 2718-3666 Fax: <886> 2718-8180 Hitachi Asia (Hong Kong) Ltd. Group (Electronic Components) 7/F., North Tower, World Finance Centre, Harbour City, Canton Road, Tsim Tsui, Kowloon, Hong Kong Tel: <852> 9218 Fax: <852> 0281 Telex: 40815 HITEC Copyright Hitachi, Ltd., 1999. rights reserved. Printed Japan. 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