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November 1999 PRELIMINARY FDS6576 P-Channel 2.5V Specified P
Top Searches for this datasheetFDS6576 November 1999 PRELIMINARY FDS6576 P-Channel 2.5V Specified PowerTrenchMOSFET General Description This P-Channel 2.5V specified MOSFET rugged gate version Fairchild Semiconductor's advanced PowerTrench process. been optimized power management applications with wide range gate drive voltage (2.5V 12V). Features RDS(ON) 0.014 -4.5 RDS(ON) 0.020 -2.5 Extended VGSS range (±12V) battery applications. gate charge (44nC typical). Fast switching speed. High performance trench technology extremely RDS(ON). High power current handling capability. Applications Load switch Battery protection Power management 6\PERO $EVROXWH 0D[LPXP 5DWLQJV 3DUDPHWHU 5DWLQJV 8QLWV 7KHUPDO &KDUDFWHULVWLFV 3DFNDJH 2XWOLQHV 2UGHULQJ ,QIRUPDWLRQ 'HYLFH 0DUNLQJ A9T%$&% 'HYLFH 5HHO 6L]H 7DSH :LGWK 4XDQWLW\ A9T%$&% ©1999 Fairchild Semiconductor Corporation FDS6576 Rev. FDS6576 (OHFWULFDO &KDUDFWHULVWLFV 6\PERO 3DUDPHWHU &KDUDFWHULVWLFV 7W'66 8rssvpvr 7HVW &RQGLWLRQV 8QLWV 7W'66 UD'66 D*66) D*665 &KDUDFWHULVWLFV W*6WK PSrvhpr W*6WK US'6RQ D'RQ '\QDPLF &KDUDFWHULVWLFV 8LVV 8RVV 8UVV 6ZLWFKLQJ &KDUDFWHULVWLFV GRII 'UDLQ6RXUFH 'LRGH &KDUDFWHULVWLFV 0D[LPXP 5DWLQJV Notes: junction-to-case case-to-ambient resistance where case thermal reference defined solder mounting surface drain pins. guaranteed design while determined user's board design. when mounted copper. 105° when mounted 0.04 copper. 125° minimum mounting copper. Scale letter size paper Pulse Test: Pulse Width Duty Cycle 2.0% FDS6576 Rev. FDS6576 Typical Characteristics Figure On-Region Characteristics Figure On-Resistance Variation with Drain Current Gate Voltage Figure On-Resistance Variation with Temperature Figure On-Resistance Variation with Gate-to-Source Voltage Figure Transfer Characteristics Figure Body Diode Forward Voltage Variation with Source Current Temperature FDS6576 Rev. FDS6576 Typical Characteristics (continued) Figure Gate-Charge Characteristics Figure Capacitance Characteristics Figure Maximum Safe Operating Area Figure Single Pulse Maximum Power Dissipation Figure Transient Thermal Response Curve. Thermal characterization performed using conditions described Note Transient themal response will change depending circuit board design. FDS6576 Rev. SO-8 Tape Reel Data Package Dimensions SOIC(8lds) Packaging Configuration: Figure Packaging Description: ROST DEVICES ROST ADIO NUMB PEEL STREN _gms Antistatic Cover Tape Label SOIC-8 parts shipped tape. carrier tape made from dissipative (carbon filled) polycarbonate resin. cover tape multilayer film (Heat Activated Adhesive nature) primarily composed polyester film, adhesive layer, sealant, anti-static sprayed agent. These reeled parts standard option shipped with 2,500 units 330cm diameter reel. reels dark blue color made polystyrene plastic (antistatic coated). Other option comes units 177cm diameter reel. This some other options further described Packaging Information table. These full reels individually barcode labeled placed inside standard intermediate (illustrated figure 1.0) made recyclable corrugated brown paper. contains reels maximum. these boxes placed inside barcode labeled shipping which comes different sizes depending number parts shipped. Static Dissipative Embossed Carrier Tape F63TNR Label Customized Label F852 9959 F852 9959 F852 9959 F852 9959 SOIC (8lds) Packaging Information Packaging Option Packaging type Reel/Tube/Bag Reel Size Dimension (mm) Weight unit (gm) Weight Reel (kg) Note/Comments Standard flow code) 2,500 343x64x343 5,000 0.0774 0.6060 L86Z Rail/Tube 530x130x83 30,000 0.0774 F011 4,000 343x64x343 8,000 0.0774 0.9696 D84Z 184x187x47 1,000 0.0774 0.1182 F852 9959 SOIC-8 Unit Orientation 343mm 342mm 64mm Standard Intermediate Label F63TNR Label sample LOT: CBVK741B019 FSID: FDS9953A QTY: 2500 SPEC: F63TNLabel F63TN Label Label (F63TNR)3 D/C1: D9842 D/C2: QTY1: QTY2: SPEC REV: CPN: N/F: SOIC(8lds) Tape Leader Trailer Configuration: Figure Carrier Tape Cover Tape Components Trailer Tape 640mm minimum empty pockets Leader Tape 1680mm minimum empty pockets July 1999, Rev. SO-8 Tape Reel Data Package Dimensions, continued SOIC(8lds) Embossed Carrier Tape Configuration: Figure User Direction Feed Dimensions millimeter type SOIC(8lds) (12mm) 6.50 +/-0.10 5.30 +/-0.10 12.0 +/-0.3 1.55 +/-0.05 1.60 +/-0.10 1.75 +/-0.10 10.25 5.50 +/-0.05 +/-0.1 +/-0.1 +/-0.10 0.450 +/0.150 +/-0.3 0.06 +/-0.02 Notes: dimensions determined with respect EIA/Jedec RS-481 rotational lateral movement requirements (see sketches maximum Typical component cavity center line 0.5mm maximum maximum component rotation 0.5mm maximum Sketch (Side Front Sectional View) Component Rotation Sketch (Top View) Typical component center line Sketch (Top View) Component lateral movement SOIC(8lds) Reel Configuration: Figure Component Rotation Measured detail Diameter Option detail Diameter Option Measured DETAIL Dimensions inches millimeters Tape Size 12mm Reel Option 7.00 177.8 13.00 0.059 0.059 +0.020/-0.008 +0.5/-0.2 +0.020/-0.008 +0.5/-0.2 0.795 20.2 0.795 20.2 2.165 7.00 0.488 +0.078/-0.000 12.4 +2/0 0.488 +0.078/-0.000 12.4 +2/0 0.724 18.4 0.724 18.4 (LSL-USL) 0.469 0.606 11.9 15.4 0.469 0.606 11.9 15.4 12mm 1998 Fairchild Semiconductor Corporation July 1999, Rev. SO-8 Tape Reel Data Package Dimensions, continued SOIC-8 Code Scale letter size paper Dimensions shown below inches [millimeters] Part Weight unit (gram): 0.0774 September 1998, Rev. TRADEMARKS following registered unregistered trademarks Fairchild Semiconductor owns authorized intended exhaustive list such trademarks. Quiet SeriesFAST® FASTrGTOHiSeCDISCLAIMER QFETQSQuiet SeriesSuperSOTTM-3 SuperSOTTM-6 SuperSOTTM-8 SyncFETTinyLogicUHCVCX FAIRCHILD SEMICONDUCTOR RESERVES RIGHT MAKE CHANGES WITHOUT FURTHER NOTICE PRODUCTS HEREIN IMPROVE RELIABILITY, FUNCTION DESIGN. FAIRCHILD DOES ASSUME LIABILITY ARISING APPLICATION PRODUCT CIRCUIT DESCRIBED HEREIN; NEITHER DOES CONVEY LICENSE UNDER PATENT RIGHTS, RIGHTS OTHERS. LIFE SUPPORT POLICY FAIRCHILD'S PRODUCTS AUTHORIZED CRITICAL COMPONENTS LIFE SUPPORT DEVICES SYSTEMS WITHOUT EXPRESS WRITTEN APPROVAL FAIRCHILD SEMICONDUCTOR CORPORATION. used herein: Life support devices systems devices critical component component life support device system whose failure perform systems which, intended surgical implant into reasonably expected cause failure life body, support sustain life, whose support device system, affect safety failure perform when properly used accordance with instructions provided labeling, effectiveness. reasonably expected result significant injury user. PRODUCT STATUS DEFINITIONS Definition Terms Datasheet Identification Advance Information Product Status Formative Design Definition This datasheet contains design specifications product development. Specifications change manner without notice. This datasheet contains preliminary data, supplementary data will published later date. Fairchild Semiconductor reserves right make changes time without notice order improve design. This datasheet contains final specifications. Fairchild Semiconductor reserves right make changes time without notice order improve design. Preliminary First Production Identification Needed Full Production Obsolete Production This datasheet contains specifications product that been discontinued Fairchild semiconductor. datasheet printed reference information only. Rev. Other recent searchesTM3090 - TM3090 TM3090 Datasheet TN3090 - TN3090 TN3090 Datasheet FP3090 - FP3090 FP3090 Datasheet BX3090 - BX3090 BX3090 Datasheet RN152G - RN152G RN152G Datasheet Q23SP6DL - Q23SP6DL Q23SP6DL Datasheet IRFS654B - IRFS654B IRFS654B Datasheet GP-1575-25-4-A-14 - GP-1575-25-4-A-14 GP-1575-25-4-A-14 Datasheet CYWUSB6935 - CYWUSB6935 CYWUSB6935 Datasheet AA3022SGC-4 - AA3022SGC-4 AA3022SGC-4 Datasheet
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