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Features on-resistance High speed switching drive current seconda


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2SK1403, 2SK1403A
Features
on-resistance High speed switching drive current secondary breakdown Suitable switching regulator DC-DC converter
Outline
TO-3P
Gate Drain (Flange) Source
2SK1403, 2SK1403A
Absolute Maximum Ratings 25°C)
Item Drain source voltage 2SK1403 2SK1403A Gate source voltage Drain current Drain peak current Body drain diode reverse drain current Channel dissipation Channel temperature Storage temperature Notes: duty cycle Value 25°C VGSS D(pulse)* Pch* Tstg
Symbol VDSS
Ratings +150
Unit
2SK1403, 2SK1403A
Electrical Characteristics 25°C)
Item Drain source breakdown voltage K1403 K1403A V(BR)GSS Symbol V(BR)DSS ±100 VGS(off) RDS(on) |yfs| Ciss Coss Crss d(on) d(off) 1180 0.95 diF/dt A/µs Unit Test conditions
Gate source breakdown voltage Gate source leak current Zero gate voltage drain current K1403 K1403A
Gate source cutoff voltage Static drain source K1403 state resistance K1403A
Forward transfer admittance Input capacitance Output capacitance Reverse transfer capacitance Turn-on delay time Rise time Turn-off delay time Fall time Body drain diode forward voltage Body drain diode reverse recovery time Note: Pulse test
2SK1403, 2SK1403A
Power Temperature Derating Channel Dissipation Drain Current
Maximum Safe Operation Area
0.05
25°C
2SK1403 2SK1403A
Case Temperature (°C)
1,000 Drain Source Voltage
Typical Output Characteristics Drain Current Pulse Test Drain Current
Typical Transfer Characteristics Pulse Test
Drain Source Voltage
75°C 25°C -25°C
Gate Source Voltage
2SK1403, 2SK1403A
Drain Source Saturation Voltage (on) Drain Source Saturation Voltage Gate Source Voltage Pulse Test Static Drain Source State Resistance Drain Current Static Drain Source State Resistance (on) Pulse Test
Gate Source Voltage
0.05
Drain Current
Static Drain Source State Resistance Temperature Static Drain Source State Resistance (on) Forward Transfer Admittance Pulse Test
Forward Transfer Admittance Drain Current Pulse Test 75°C 25°C -25°C
Case Temperature (°C)
Drain Current
2SK1403, 2SK1403A
Body Drain Diode Reverse Recovery Time Reverse Recovery Time (ns) 5,000 Ciss Capacitance (pF) 1,000 Typical Capacitance Drain Source Voltage
di/dt A/µs, 25°C Reverse Drain Current
Coss
Crss Drain Source Voltage
Dynamic Input Characteristics 1,000 Drain Source Voltage Gate Charge (nc) Gate Source Voltage
Switching Characteristics Switching Time (ns) (on) duty (off)
Drain Current
2SK1403, 2SK1403A
Reverse Drain Current Source Drain Voltage Reverse Drain Current Pulse Test
Source Drain Voltage
Normalized Transient Thermal Impedance
Normalized Transient Thermal Impedance Pulse Width 25°C
0.05
ch-c ch-c ch-c 1.25°C/W, 25°C
0.02
0.03
0.01
0.01 Pulse
Pulse Width
Switching Time Test Circuit Monitor Vout Monitor D.U.T. Vout (on)
Waveforms
(off)
Unit:
15.6
14.9
19.9
18.0
5.45
5.45
Hitachi Code JEDEC EIAJ Weight (reference value) TO-3P Conforms
Cautions
Hitachi neither warrants grants licenses rights Hitachi's third party's patent, copyright, trademark, other intellectual property rights information contained this document. Hitachi bears responsibility problems that arise with third party's rights, including intellectual property rights, connection with information contained this document. Products product specifications subject change without notice. Confirm that have received latest product standards specifications before final design, purchase use. Hitachi makes every attempt ensure that products high quality reliability. However, contact Hitachi's sales office before using product application that demands especially high quality reliability where failure malfunction directly threaten human life cause risk bodily injury, such aerospace, aeronautics, nuclear power, combustion control, transportation, traffic, safety equipment medical equipment life support. Design your application that product used within ranges guaranteed Hitachi particularly maximum rating, operating supply voltage range, heat radiation characteristics, installation conditions other characteristics. Hitachi bears responsibility failure damage when used beyond guaranteed ranges. Even within guaranteed ranges, consider normally foreseeable failure rates failure modes semiconductor devices employ systemic measures such failsafes, that equipment incorporating Hitachi product does cause bodily injury, fire other consequential damage operation Hitachi product. This product designed radiation resistant. permitted reproduce duplicate, form, whole part this document without written approval from Hitachi. Contact Hitachi's sales office questions regarding this document Hitachi semiconductor products.
Hitachi, Ltd.
Semiconductor Integrated Circuits. Nippon Bldg., 2-6-2, Ohte-machi, Chiyoda-ku, Tokyo 100-0004, Japan Tel: Tokyo (03) 3270-2111 Fax: (03) 3270-5109
NorthAmerica http:semiconductor.hitachi.com/ Europe Asia (Singapore) Asia (Taiwan) Asia (HongKong) Japan further information write
Hitachi Semiconductor (America) Inc. East Tasman Drive, Jose,CA 95134 Tel: (408) 433-1990 Fax: <1>(408) 433-0223 Hitachi Europe GmbH Electronic components Group Dornacher D-85622 Feldkirchen, Munich Germany Tel: <49> (89) 9180-0 Fax: <49> (89) Hitachi Europe Ltd. Electronic Components Group. Whitebrook Park Lower Cookham Road Maidenhead Berkshire 8YA, United Kingdom Tel: <44> (1628) 585000 Fax: <44> (1628) 778322 Hitachi Asia Pte. Ltd. Collyer Quay #20-00 Hitachi Tower Singapore 049318 Tel: 535-2100 Fax: 535-1533 Hitachi Asia Ltd. Taipei Branch Office Hung Building. No.167, Tun-Hwa North Road, Taipei (105) Tel: <886> 2718-3666 Fax: <886> 2718-8180 Hitachi Asia (Hong Kong) Ltd. Group (Electronic Components) 7/F., North Tower, World Finance Centre, Harbour City, Canton Road, Tsim Tsui, Kowloon, Hong Kong Tel: <852> 9218 Fax: <852> 0281 Telex: 40815 HITEC
Copyright Hitachi, Ltd., 1999. rights reserved. Printed Japan.

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